CN108437370A - A kind of embedded cooling device of injection mold - Google Patents

A kind of embedded cooling device of injection mold Download PDF

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Publication number
CN108437370A
CN108437370A CN201810404921.2A CN201810404921A CN108437370A CN 108437370 A CN108437370 A CN 108437370A CN 201810404921 A CN201810404921 A CN 201810404921A CN 108437370 A CN108437370 A CN 108437370A
Authority
CN
China
Prior art keywords
flow path
hot flow
path set
injection mold
coolant jacket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810404921.2A
Other languages
Chinese (zh)
Inventor
陈伙
谭升洪
叶福源
陈志平
周振
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGDONG KELON MOULD CO Ltd
Original Assignee
GUANGDONG KELON MOULD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANGDONG KELON MOULD CO Ltd filed Critical GUANGDONG KELON MOULD CO Ltd
Priority to CN201810404921.2A priority Critical patent/CN108437370A/en
Publication of CN108437370A publication Critical patent/CN108437370A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737Heating or cooling means therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C45/7312Construction of heating or cooling fluid flow channels

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to the technical fields of injection mold, more particularly, to a kind of embedded cooling device of injection mold, injection mold includes die ontology, hot flow path set and cast gate, the cast gate is set to the bottom of hot flow path set, and coolant jacket is embedded in the hot flow path set;It is formed with annular coolant flow channel between the hot flow path set and coolant jacket, the hot flow path is put on equipped with the inlet and outlet being connected to annular coolant flow channel;The coolant jacket is detachably connected with hot flow path set, and is installed on the die ontology.The present invention assembles complete middle nested structure by embedded coolant jacket in being covered in hot flow path, is cooled down by annular coolant flow channel annular, achievees the effect that glue-feeder conformal cooling, the injection temperature at easily controllable sprue gate;And the cooling device of the present invention reduces the cleaning difficulty of coolant flow channel convenient for assembly and disassembly, the requirement to cooling medium is relatively low and compact-sized, it is easy to accomplish miniaturization reduces the manufacturing cost of hot flow path set.

Description

A kind of embedded cooling device of injection mold
Technical field
The present invention relates to the technical fields of injection mold, more particularly, to a kind of embedded cooling dress of injection mold It sets.
Background technology
PET plastic is widely used in the sizing of storing chest, lid, bottle-type product, the control to injection molding temperature Compare sensitive, theoretical injection temperature range is small, is 260 DEG C ~ 300 DEG C, the range of practical application example is generally at 270 DEG C ~ 290 DEG C Between.Injection molding temperature is too low, and material is easy condensation, and injection molding is difficult to be filled with cavity;Injection molding temperature is too high, and material holds Product yellowing that is degradable, being molded, influences product appearance.
Current solution is to increase hot flow path set size to drill out cooling water channel to heat with the method that tradition machinery is processed Flowing channel sleeve is cooled down.But this method is since cooling water channel is linear, to the inhomogeneous cooling at hot flow path sprue gate Even, cooling effect is difficult to reach expected design, and injection temperature regulating effect is undesirable.Ye You producers pass through laser sintered at present Mode is attempted to print the overall thermal flowing channel sleeve part with annular cooling water road by 3D printing technique.However, 3D printing skill The design and forming technique of the molding cooling water channel cross sectional shape of art are not mature enough:On the one hand, integral ring-shaped cooling water channel is printed Cleaning need special cleaning mode to safeguard, cooling medium needs special filter plant to be filtered could be smooth into becoming a mandarin Road, maintenance cost are high;On the one hand, the metal parts intensity printed is unstable, there is the risk of cracking, and printable metal Dusty material type is few, and manufacture and application cost are high, and technology application is difficult to extensive use.
Invention content
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of injection molds using " being covered in set " structure With embedded cooling device, it can overcome PET engineering plastics injection molding temperature ranges are small, injection temperature is uncontrollable to ask Topic.
In order to solve the above technical problems, the technical solution adopted by the present invention is:
There is provided a kind of injection mold embedded cooling device, the injection mold includes die ontology, hot flow path set and pours Mouthful, the cast gate is set to the bottom of hot flow path set, and coolant jacket is embedded in the hot flow path set;The hot flow path set and coolant jacket Between be formed with annular coolant flow channel, the hot flow path is put on equipped with the inlet and outlet being connected to annular coolant flow channel; The coolant jacket is detachably connected with hot flow path set, and is installed on the die ontology.
The embedded cooling device of injection mold of the present invention, by the hierarchical design of hot flow path nested structure, in hot flow path Embedded coolant jacket, forms the cooling device in nested structure in set in set;Hot flow path covers and forms the cooling stream of annular between coolant jacket Road, cooling medium are entered by water inlet, are flowed out through water outlet after conformal cooling.Hot flow path set is set with what coolant jacket was detachably connected It sets and facilitates assembly and disassembly, reduce the difficulty that annular cooling water road is safeguarded and cleaned, the requirement to cooling medium reduces;It is compact-sized, easily It is minimized in realizing, reduces the manufacturing cost of cooling device.
Further, the section of the annular coolant flow channel is circle.Cooling medium is circular coolant flow channel in section In flowing it is more smooth, have preferable cooling effect.
Further, the hot flow path set medial surface is equipped with several step structures, and the coolant jacket is equipped with and ladder The mating surface of shape respective outer side edges.The setting of multiple ladder-like mating surfaces can improve the fitness of hot flow path set and coolant jacket, just In the assembly and disassembly of hot flow path set and coolant jacket.
Further, the coolant jacket is globoidal structure close to one end that hot flow path covers, and the hot flow path set sets for bottom It is the smooth non-round shape structure in surface to have the cavity structure of circular arc, the annular cooling water road.The section shape of cyclic annular cooling water channel For shape according to the Demand Design in cooling surface and formed product face at non-round shape structure, the contact area bigger of cooling medium stream warp is cold But face has preferable mobility and film-cooled heat for circular cooling water channel compared to section, has closer to formed product face Effect regulation and control injection temperature.
Further, the cast gate protrudes from the bottom surface of the hot flow path set, one end of the coolant jacket and the cast gate Socket;The socket place of the coolant jacket and cast gate is around equipped with sealing ring.Annular coolant flow channel is cold around the surrounding set on cast gate But medium is flowed in annular coolant flow channel around cast gate, to ensure cooling effect.
Further, hot flow path set at the contact surface of die ontology, contact of the coolant jacket with die ontology Several sealing elements are equipped at face.The setting of sealing element can compensate for the larger tolerance of fitting surface and angular deviation, improve cooling The sealing performance of device prevents cooling medium to outward leakage.
Further, the water outlet intersects with the center line of straight line and the annular channel where water inlet.It is cooling to be situated between Matter flows into annular coolant flow channel by water inlet and is uniformly divided into two strands, converges outflow in water outlet after conformal cooling, is arranged in this way The cooling effect of annular coolant flow channel can be maximized.
Further, the coolant jacket is the conductive structure being molded by beryllium copper material.According to the injection molding of product plastics The theoretical direction value of temperature, the manufacture material using beryllium copper material as coolant jacket improve the thermal conductivity of coolant jacket, optimization injection molding The effect of temperature regulation and control.
Compared with prior art, the beneficial effects of the invention are as follows:
(1)The embedded cooling device of injection mold of the present invention, by embedded coolant jacket assembling in being covered in hot flow path it is complete in Nested structure is cooled down by annular coolant flow channel annular, achievees the effect that glue-feeder conformal cooling, the injection molding at easily controllable sprue gate Temperature.
(2)The hot flow path set of the present invention is detachably connected with annular coolant flow channel so that cooling device reduces convenient for assembly and disassembly The cleaning difficulty of coolant flow channel, the requirement to cooling medium are relatively low and compact-sized, it is easy to accomplish miniaturization reduces hot flow path The manufacturing cost of set.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embedded cooling device of injection mold of the present invention.
Specific implementation mode
The present invention is further illustrated With reference to embodiment.Wherein, attached drawing only for illustration, What is indicated is only schematic diagram rather than pictorial diagram, should not be understood as the limitation to this patent;Reality in order to better illustrate the present invention Example is applied, the certain components of attached drawing have omission, zoom in or out, and do not represent the size of actual product;To those skilled in the art For, the omitting of some known structures and their instructions in the attached drawings are understandable.
The same or similar label correspond to the same or similar components in the attached drawing of the embodiment of the present invention;In retouching for the present invention In stating, it is to be understood that if it is based on attached drawing to have the orientation or positional relationship of the instructions such as term "upper", "lower", "left", "right" Shown in orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, do not indicate or imply the indicated Device or element must have a particular orientation, with specific azimuth configuration and operation, therefore position relationship described in attached drawing Term only for illustration, should not be understood as the limitation to this patent, for the ordinary skill in the art, can To understand the concrete meaning of above-mentioned term as the case may be.
Embodiment 1
It is as shown in Figure 1 the first embodiment of the embedded cooling device of injection mold of the present invention, injection mold includes mold Ontology 1, hot flow path set 2 and cast gate 3, cast gate 3 are set to the bottom of hot flow path set 2, coolant jacket 4 are embedded in hot flow path set 2;Heat It is formed with annular coolant flow channel 5 between flowing channel sleeve 2 and coolant jacket 4, hot flow path set 5 is equipped with to be connected to annular coolant flow channel 5 Water inlet 6 and water outlet 7;Coolant jacket 4 is detachably connected with hot flow path set 5, and is installed on die ontology 1.The present embodiment The section of annular coolant flow channel 5 according to cooling surface between formed product face at a distance from may be designed as round or non-round shape structure, When being designed as non-round shape structure, the contact area bigger of cooling medium stream warp, cooling surface is closer to formed product face, compared to cutting Face, which is circular cooling water channel, has preferable mobility and film-cooled heat, Effective Regulation injection temperature.The cooling of the present embodiment Set 4 is the conductive structure being molded by beryllium copper material.The present embodiment is when implementing, the embedded coolant jacket 4 in hot flow path set 2, Form the cooling device in nested structure in set;Form annular coolant flow channel 5 between hot flow path set 2 and coolant jacket 4, cooling medium by Water inlet 6 enters, and is flowed out through water outlet 7 after conformal cooling.
Specifically, hot flow path covers 2 medial surfaces equipped with several step structures, and coolant jacket 4 is equipped with matches with step structure The mating surface of conjunction improves the fitness of hot flow path set 2 and coolant jacket 4, convenient for the assembly and disassembly of hot flow path set 2 and coolant jacket 4;Coolant jacket 4 one end that 2 are covered close to hot flow path are globoidal structure, and hot flow path set 2 is equipped with the cavity structures of circular arc for bottom, and cast gate protrudes from heat The bottom surface of flowing channel sleeve 2, one end and the cast gate 3 of coolant jacket 4 are socketed;The socket place of coolant jacket 4 and cast gate 3, which is surround, is equipped with sealing ring 8, Annular coolant flow channel 5 flows around cast gate 3 in annular coolant flow channel 5, ensures cold around the surrounding set on cast gate 3, cooling medium But effect.
Wherein, hot flow path set 2 is all provided with at the contact surface of die ontology 1, at coolant jacket 4 and the contact surface of die ontology 1 There are several sealing elements 9, compensation fitting surface larger tolerance and angular deviation, improving the sealing performance of cooling device prevents cooling Jie Matter is to outward leakage;Water outlet 7 intersects with 6 place straight line of water inlet and the center line of annular coolant flow channel 5, and cooling medium is by intaking Mouthfuls 6 flow into annular coolant flow channels 5 and are divided into two strands up and down, converge outflow in water outlet 7 after conformal cooling.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this All any modification, equivalent and improvement etc., should be included in the claims in the present invention made by within the spirit and principle of invention Protection domain within.

Claims (8)

1. a kind of embedded cooling device of injection mold, which is characterized in that the injection mold includes die ontology(1), heat Flowing channel sleeve(2)And cast gate(3), the cast gate(3)Set on hot flow path set(2)Bottom, the hot flow path set(2)In be embedded with Coolant jacket(4);The hot flow path set(2)With coolant jacket(4)Between be formed with annular coolant flow channel(5), the hot flow path set(2) It is equipped with and annular coolant flow channel(5)The water inlet of connection(6)And water outlet(7);The coolant jacket(4)With hot flow path set(2) It is detachably connected, and is installed on the die ontology(1)On.
2. the embedded cooling device of injection mold according to claim 1, which is characterized in that the annular coolant flow channel (5)Section be circle.
3. the embedded cooling device of injection mold according to claim 1, which is characterized in that the hot flow path set(2) Medial surface is equipped with several step structures, the coolant jacket(4)It is equipped with the mating surface coordinated with step structure.
4. the embedded cooling device of injection mold according to claim 3, which is characterized in that the coolant jacket(4)It leans on Near-thermal flowing channel sleeve(2)One end be globoidal structure, the hot flow path set(2)The cavity structure of circular arc, the ring are equipped with for bottom Shape cooling water channel(5)For the non-round shape structure that surface is smooth.
5. the embedded cooling device of injection mold according to claim 3, which is characterized in that the cast gate(3)It is prominent In the hot flow path set(2)Bottom surface, the coolant jacket(4)One end and the cast gate(3)Socket;The coolant jacket(4)With Cast gate(3)Socket place around be equipped with sealing ring(8).
6. the embedded cooling device of injection mold according to claim 1, which is characterized in that the hot flow path set(2) With die ontology(1)Contact surface at, the coolant jacket(4)With die ontology(1)Contact surface at be equipped with several sealing elements (9).
7. the embedded cooling device of injection mold according to any one of claims 1 to 6, which is characterized in that it is described go out The mouth of a river(7)With water inlet(6)Place straight line and the annular coolant flow channel(5)Center line intersection.
8. the embedded cooling device of injection mold according to any one of claims 1 to 6, which is characterized in that described cold But it covers(4)For the conductive structure being molded by beryllium copper material.
CN201810404921.2A 2018-04-28 2018-04-28 A kind of embedded cooling device of injection mold Pending CN108437370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810404921.2A CN108437370A (en) 2018-04-28 2018-04-28 A kind of embedded cooling device of injection mold

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Application Number Priority Date Filing Date Title
CN201810404921.2A CN108437370A (en) 2018-04-28 2018-04-28 A kind of embedded cooling device of injection mold

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480967A (en) * 2019-08-01 2019-11-22 无锡宏杰丰淼模塑有限公司 A kind of thermoset plastic cooling device
CN114274461A (en) * 2021-11-30 2022-04-05 台州市黄岩海川模塑有限公司 Quick heat conduction injection mold based on conformal cooling technology

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06328537A (en) * 1993-05-20 1994-11-29 Sony Corp Hot runner mold for injection molding
CN102756464A (en) * 2012-07-23 2012-10-31 泰德兴精密电子(昆山)有限公司 Cooling device for hot runner
CN206170584U (en) * 2016-11-22 2017-05-17 深圳市麦士德福科技股份有限公司 Cooling device is chewed to hot runner system heat
CN206436491U (en) * 2016-12-27 2017-08-25 佛山市海龙德模具科技有限公司 Injection mold and its hot mouth cooling device
CN208410592U (en) * 2018-04-28 2019-01-22 广东科龙模具有限公司 A kind of embedded cooling device of injection mold

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06328537A (en) * 1993-05-20 1994-11-29 Sony Corp Hot runner mold for injection molding
CN102756464A (en) * 2012-07-23 2012-10-31 泰德兴精密电子(昆山)有限公司 Cooling device for hot runner
CN206170584U (en) * 2016-11-22 2017-05-17 深圳市麦士德福科技股份有限公司 Cooling device is chewed to hot runner system heat
CN206436491U (en) * 2016-12-27 2017-08-25 佛山市海龙德模具科技有限公司 Injection mold and its hot mouth cooling device
CN208410592U (en) * 2018-04-28 2019-01-22 广东科龙模具有限公司 A kind of embedded cooling device of injection mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480967A (en) * 2019-08-01 2019-11-22 无锡宏杰丰淼模塑有限公司 A kind of thermoset plastic cooling device
CN114274461A (en) * 2021-11-30 2022-04-05 台州市黄岩海川模塑有限公司 Quick heat conduction injection mold based on conformal cooling technology

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