CN108430611A - Film arrangement with bonding layer - Google Patents

Film arrangement with bonding layer Download PDF

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Publication number
CN108430611A
CN108430611A CN201680075114.XA CN201680075114A CN108430611A CN 108430611 A CN108430611 A CN 108430611A CN 201680075114 A CN201680075114 A CN 201680075114A CN 108430611 A CN108430611 A CN 108430611A
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CN
China
Prior art keywords
layer
film
middle layer
interconnecting piece
support substrate
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CN201680075114.XA
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Chinese (zh)
Inventor
马库斯·海顿
斯蒂芬·亨默尔
马尔科·布兰德纳
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PLANSEE (SHANGHAI) HIGH PERFORMANCE MATERIAL Ltd.
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Plansee SE
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Publication of CN108430611A publication Critical patent/CN108430611A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/003—Membrane bonding or sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
    • B01D63/06—Tubular membrane modules
    • B01D63/061—Manufacturing thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
    • B01D63/06—Tubular membrane modules
    • B01D63/062—Tubular membrane modules with membranes on a surface of a support tube
    • B01D63/065—Tubular membrane modules with membranes on a surface of a support tube on the outer surface thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/10—Supported membranes; Membrane supports
    • B01D69/108—Inorganic support material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/12—Composite membranes; Ultra-thin membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/12—Composite membranes; Ultra-thin membranes
    • B01D69/1213—Laminated layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/12—Composite membranes; Ultra-thin membranes
    • B01D69/1216—Three or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/02—Inorganic material
    • B01D71/022—Metals
    • B01D71/0223—Group 8, 9 or 10 metals
    • B01D71/02231—Palladium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2313/00—Details relating to membrane modules or apparatus
    • B01D2313/04—Specific sealing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2313/00—Details relating to membrane modules or apparatus
    • B01D2313/04—Specific sealing means
    • B01D2313/042—Adhesives or glues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2313/00—Details relating to membrane modules or apparatus
    • B01D2313/13—Specific connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2323/00—Details relating to membrane preparation
    • B01D2323/58—Fusion; Welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2325/00—Details relating to properties of membranes
    • B01D2325/02—Details relating to pores or porosity of the membranes
    • B01D2325/0283—Pore size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2325/00—Details relating to properties of membranes
    • B01D2325/04—Characteristic thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/22—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion
    • B01D53/228—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion characterised by specific membranes

Abstract

The present invention relates to a kind of film arrangements for the permeability and separation fluid from fluid mixture, and the film arrangement includes porous, fluid penetrable, metal support substrate (2)；Film (8), the film are located in support substrate (2) and selectable make fluid permeability to be separated；Interconnecting piece (6), the interconnecting piece are at least formed on the surface of Fluid Sealing；Metal material, wherein support substrate (2) are bonded to interconnecting piece (6) along the peripheral part (3) of metal material；Ceramic, fluid penetrable, porous first middle layer (10), first middle layer are located between support substrate (2) and film (8).Here, at least one ceramics bonding layer (14) and at least extends on the bonding part of adhesive portion (4) and interconnecting piece (6) on interconnecting piece (6) and adhesive portion (4).First middle layer (10) terminates on bonding layer (14), and the average cell size of the first middle layer is more than bonding layer (14).

Description

Film arrangement with bonding layer
The present invention relates to a kind of film arrangements for the permeability and separation fluid from fluid mixture, especially from gas mixing Permeability and separation gas in object, the film arrangement includes porous, fluid penetrable, especially gas-permeable, metal branch Support substrate；Film, the film are located in support substrate and selectable make fluid to be separated (especially gas) infiltration；Connection Portion, the interconnecting piece are at least formed on the surface of Fluid Sealing (especially airtight)；Metal material, wherein support substrate are along gold The peripheral part for belonging to material is bonded to interconnecting piece；And further include ceramics, fluid penetrable (especially gas-permeable ), porous first middle layer, first middle layer is between support substrate and film.The invention further relates to one kind Method for producing this film arrangement.
Such film arrangement is special commonly used in the selectable separation fluid (liquid, gas) from fluid mixture It is not the selectable separation gas from admixture of gas, especially from admixture of gas (such as the vapor weight comprising hydrogen Whole natural gas) in detach hydrogen.The mixture for belonging to fluid and referring to liquid, gas or liquids and gases of this paper. Know, can utilize only for special atom or molecule (such as H2) selectable infiltration SPECIAL MATERIAL property, by special material Material as thin slice (" film " use), for example, as on support element layer or as self-support film, come from stream to be separated for segmenting Fluid space (the especially gas space of the fluid mixture of the fluid space (the especially gas compartment) of body (especially gas) Between).For example, if the partial pressure with special gas to be separated is (such as with special H2Partial pressure) admixture of gas quilt Supplied to the side of film, the atom/molecule trial of gas to be separated is wanted with the other side for reaching film until both sides by film The partial pressure of the gas of separation is identical.The specific gas flow of gas to be separated can be appointed as so-called performance ginseng by diaphragm area Number.It is usually really that at least in the case of metal film, film is thinner, and operation temperature is higher, the gas of separation (such as H2) Specific gas flow is higher.When it is to be separated be liquid when, using substantially similar requirement.For this reason, it needs using non- Therefore often thin film to keep equipment small as far as possible under ideal air mass flow, and reduces the cost of equipment.Due to Film in the region of several μm (micron) has minimum a shape stability and rigidity, film be often configured as it is porous, Layer in (the especially gas-permeable) of fluid penetrable, tubulose or flat support substrate, it ensure that fluid supplies (especially gas transport) should be transmitted to the fluid of film and/or separate film and provides the plane surface applied for film.With Ceramic material is compared, and the metal material for being used to support substrate has low production cost and relatively simple (such as passes through welding Or soldering) metallic connection parts are bonded to, the metallic connection parts are at least Fluid Sealing (especially airtight) on the surface.This Sample, film arrangement can be integrated to via interconnecting piece module (with multiple films arrangement type) or be more generally integrated to wherein into The equipment of row fluid separation.There is ceramics, fluid penetrable (especially gas-permeable between support substrate and film ), porous first middle layer, first middle layer in several cases, is additionally operable to reality for avoiding diffusion effect Now gradually reducing from technical support substrate to the pore size of film.
From porous support substrate via the transition for the metal surface for being bonded to impermeable interconnecting piece in above-mentioned layer There are prodigious challenges in.In the transitional region, the stream for ensureing two fluid spaces (the especially gas compartment) is needed (especially airtight) separation of body sealing, in addition to fluid to be separated (especially gas), at least in fluid mixture (especially gas Body mixture) in without other fluid (especially gas).However, the stripping of layer persistently occurs due to multiple material transition and frequently It falls, which has mechanical weakness.
A kind of variation example for producing the impermeable transitional region is described in patent US8,753,433B2. This, film extend out on interconnecting piece from support substrate and directly terminates on interconnecting piece.It is arranged between support substrate and film Middle layer extend on the engaging zones between support substrate and interconnecting piece, but in advance of the membrane, in the direction of interconnecting piece On extension terminate.As described in patent JP2014-046229A, the impermeable barrier in film arrangement is in transitional region more Hole, extend on ceramic support substrate and airtight, ceramic joint, and before end, film extends on interconnecting piece.
The purpose of the present invention is to provide a kind of film of the above-mentioned type arrangement and a kind of sides for producing this film arrangement Method, wherein in long-term in use, the layer structure in transitional region between support substrate and interconnecting piece connects on its region It is bonded to respective substrate.
The purpose of the present invention is by the method for sound field film arrangement in the film arrangement and claim 19 in claim 1 It obtains.The favourable improvement of the present invention indicates in the dependent claims.
According to the present invention, a kind of film arrangement for the permeability and separation fluid from fluid mixture is provided, especially from gas Permeability and separation gas in body mixture (such as from including H2Admixture of gas in detach H2) (fluid separating film arrangement, especially Gas separation membrane is arranged).The film arrangement includes porous, fluid penetrable (especially gas-permeable), metal branch Support substrate；Permeable film (fluid separating film, especially gas separation membrane), permeable film are located in support substrate simultaneously And selectable make fluid to be separated (especially gas) infiltration；Interconnecting piece, the interconnecting piece are at least formed in Fluid Sealing On the surface of (especially airtight)；Metal material, wherein support substrate are bonded to interconnecting piece along the peripheral part of metal material；With And further include ceramics, fluid penetrable (especially gas-permeable), porous first middle layer, among described first Layer is between support substrate and film.At least one ceramics bonding layer is at least along the bonding on interconnecting piece and adhesive portion The subsegment of total bonding length in portion is arranged, and at least extends on the bonding part of adhesive portion and interconnecting piece.First middle layer Terminate on bonding layer or in bonding layer, and the average cell size of the first middle layer is more than bonding layer.By multiple layers it Between the interface that is usually formed and different pore sizes, multiple layers be distinguished from each other in the electron micrograph of polished cross-sections, this with It is particularly significant in the case of the layer of layered mode sintering.If with reference to " direct " pantostrat in specification and claims/ Component does not include then layer/the component being present between direct pantostrat/component.On the other hand, if without using additional " straight Connect ", may include the other layer/component being arranged between layer/component as long as technically feasible.When indicating range, including The limit value of expression in each case.Term " fluid " herein refers to liquid, the mixing of gas or liquids and gases Object.If with reference to corresponding " Fluid Sealing " or " fluid penetrable " property, according to advantageous embodiment, in each case, " gas It is close " or " gas-permeable " property be not clearly to refer to every time.
Film arrangement is related to the advantage that multiple functional interpretations according to single component are following.Term film, which refers to, may be selected Infiltration specific type fluid, especially gas type (especially H2) material thin slice.According to fluid to be separated, especially It is gas (such as H2), select the film of (material).It is present in corresponding fluids mixture (especially admixture of gas) in addition Fluid (especially gas) can be with selectable consideration in the design and selection of the material for the component that film is arranged, such as works as portion Part needs to be fabricated to fluid for all these fluids (especially gas) in fluid mixture (especially admixture of gas) When sealing.Film is configured as the layer in self-support film or (at least one) support substrate in principle.From very high performance parameter From the point of view of, usual planar support substrate is for the film in the film arrangement of the present invention, to be provided as thin layer on substrate is made Film.Since support substrate is used for the side (in the case of tubular structure, preferably on the inside of film) of film, support substrate is necessary It is porous, fluid penetrable, to ensure that fluid is transmitted supplied to film or fluid far from film.Tool is used there are two types of common It therefore simultaneously is additionally operable to film application, i.e., flat basic configuration and coronal basic configuration in the basic configuration of support substrate, for The concern of coronal or cast basic configuration is increasing.Metal and ceramic material can be used in support substrate, herein Metal support substrate has production relatively inexpensive relative to ceramic support substrate, is easy to seal to interconnecting piece and phase in transitional region The advantages of to being simply connected to interconnecting piece (such as passing through welding procedure).Especially by including molding and metal initial powder Sintering step powder metallurgical production technique, carry out porous, fluid penetrable, metal support substrate production, therefore Obtaining has the open support substrate for the micro-structure for being typically used for powder metallurgy production.This micro-structure is by cognizable metal powder Each particle at end is distinguished, and according to sintering degree, these each particles engage (example by more or less strong significant sintering neck It can such as be recognized from the electron micrograph of polishing part).However, substrate is made in porous, fluid penetrable, metal, especially The such support substrate produced by powder metallurgy, have relatively large pore size (sometimes to 50 μm), this make with The sealing of the typical only film with several micron thickness (thickness of gas separation membrane especially 5-15 μ ms) is more difficult.It is suitable It is based particularly on iron (Fe) (including the iron of at least 50% weight, the especially at least iron of 70% weight) in the material of support substrate Alloy, the alloy based on iron include a high proportion of chromium (chromium：Cr) (for example, at least Cr of 16% weight), additionally it is possible to be added Other additives, such as yttrium oxide (Y2O3) (increase inoxidizability), titanium (Ti) and molybdenum (Mo), the toatl proportion of these additives Pre-selection be less than 3% weight (such as be established as the material of ITM by Plansee SE and include the Fe of 71.2% weight, 26% weight The Cr and Ti, Y for being less than 3% weight in total2O3And Mo).In addition, metal support substrate and film (are used for H2Isolation be typically gold Belong to) between diffuse into one another effect in High Operating Temperature (model of the operation temperature at 450-900 DEG C in the separation of typical gas Enclose) when occur, this will lead to degrading over or destroying for film.In order to avoid these disadvantages, at least one ceramics, fluid Permeable, porous middle layer (such as be made of 8YSZ, that is, use the yttrium oxide (Y of 8mol%2O3) complete stability zirconium oxide) It is inserted between support substrate and film.This middle layer inhibits and diffuses into one another effect between support substrate and film.In addition, hole ruler It is very little to be subtracted by this middle layer, also optional substep (especially through multiple middle layers are applied, that is, passing through " graded bedding structure ") The average cell size for being suitable for gas separation of as low as several μm, especially 0.03-0.50 μm.First middle layer (and it is optional other Middle layer) preferably extend in the whole region that support substrate detaches (especially gas separation) for fluid with film.In tubulose In structure, this corresponds to the cylindrical outer surface (or being chosen as cylindrical form interior surface) of support substrate, at least one axial periphery Region is optional can be provided with recessed (such as the engagement for connecting component or sealed end).In the region of layer structure, pass through Film forms sealing (in addition to the permeability for fluid to be separated).In order to which perfect fluid seals supply or release process fluid (especially process gas), layer structure must be bonded to the connecting conduit of equipment appropriate (for example, reactor).For layer structure It is tightly connected with the perfect fluid of connecting conduit, what is used in this case is at least existed by what the metal material of Fluid Sealing formed Interconnecting piece on surface directly engages support substrate.Interconnecting piece can also execute other functions, such as combine or detach flower and connect Connect conduit.For this purpose, the part of appropriate functionalization can be molded on interconnecting piece and/or be bonded to interconnecting piece.Support substrate (such as passing through solder joints) is bonded to interconnecting piece along the peripheral part of interconnecting piece.The metallic region of the Fluid Sealing of interconnecting piece is excellent Choosing be arranged on the same side of the film engaged in support substrate.In the case of the basic configuration of tubulose, it is particularly provided at outer Side.Particularly, interconnecting piece is solid metallic component.In tubular structure, the connection at least in the region of engagement support substrate Portion be also tubulose and adhesive portion around joint element total circumference extend.
In addition to fluid to be separated, the transitional region between interconnecting piece and support substrate should at least mix fluid Other fluid present in object or gas are (following：" in addition fluid " is especially " in addition gas ") it is fabricated to Fluid Sealing (especially It is airtight).For this purpose, be possible especially for film itself, but as interchangeable mode, layer is mixed for fluid The other or whole fluid for closing object is Fluid Sealing, and junction film or Chong Die with film to extend on interconnecting piece, so as to Terminate in a fluid tight manner (for the other or whole fluid of fluid mixture) on interconnecting piece afterwards.However, in order to press down System diffuses into one another effect and reduces porosity, and the first middle layer should also at least extend to porous branch on the direction of interconnecting piece The end for supportting substrate, preferably up to the engaging zones of interconnecting piece.
The present invention is based on the peeling of the layer occurred in transitional region and the identification for causing film arrangement to fail, the failures of film arrangement It is attributed to following reason：The metal material of first middle layer and Fluid Sealing interconnecting piece (especially by metal solid material (such as Steel) be made) between there are unsatisfied bondings.This also appears in the region of bonding, this formed unstable transition and especially It is the uneven situation in soldered.In addition, for the Bu Tong hot of interconnecting piece, support substrate and the material of ceramic inter-layer The coefficient of expansion leads to the stress in layer structure, the validity period arranged especially during the sintering of layer structure or in film later Between.If since being happened in the first middle layer for peeling forms cracking, these crevasse crack propagations pass through the other layer of layer structure simultaneously The failure for causing film to be arranged.In order to increase bonding of first middle layer in problem transitional region, it is at least one (especially accurately It is one) ceramic bonding layer at least directly applies along the subsegment (preferably on entire bonding length) of total bonding length of adhesive portion To interconnecting piece and adhesive portion.Based on perpendicular to the direction of interconnecting piece, axial direction is corresponded in the case of tubular structure, is engaged Layer at least extends on the bonding part of adhesive portion and interconnecting piece.The average cell size of bonding layer is less than the first middle layer, institute The first middle layer is stated on bonding layer to terminate.With this, the first middle layer connects with the direct of region the problem of adhesive portion and interconnecting piece It touches and is reduced, or even be preferably eliminated.Since bonding layer is applied directly to interconnecting piece and adhesive portion, under the first middle layer or Directly on the side of the first middle layer, obtains and be significantly preferably bonded (due to low porosity).In this bonding layer form Interbed also reduces the stress caused by different heat expansion coefficient.Especially in the case where ceramic bonding layer is sintered, bonding layer Opposite fine ceramic particle and lower-lying metal surface between the sintering neck that is formed be significantly more than among metal surface and first The case where between layer.Therefore, bonding layer is improved to the bonding of metal surface.Since two ceramic materials are good opposite to each other Bonding, good can especially be sintered each other, and the application of the first middle layer is that there is no problem and good similar to causing Bonding.The use during and after sintering in process of production can avoid the generation peeled off.First middle layer is preferably even The side of socket part extends upwardly to the end of support substrate, optionally also extends on the engaging zones of interconnecting piece, to give it Rear layer provides good substrate, especially when after layer there is finer than the material of the first middle layer and substrate body When kernel structure, layer later optionally penetrates into the material of support substrate.First middle layer terminates on bonding layer, that is, makes, (correspond to radial direction in the case of the basic configuration of tubulose) on the direction of layer surface, in bonding layer and first Overlapping region (attached drawing 1, attached drawing 3) is formd between interbed.However, simultaneously due to axial direction of first middle layer on bonding layer It, may not in principle as long as not extending out or the first middle layer only stretching out very small degree and directly engages bonding layer (attached drawing 2) Overlapping region is formed, or only forms very small overlapping region.
In one embodiment, the average cell size of bonding layer deviates average cell size at least 0.10 μ of the first middle layer M, especially at least 0.15 μm, preferably even at least 0.20 μm.The notable more fine particle structure of bonding layer causes to promote to engage Layer is particularly good to be bonded to interconnecting piece.
In one embodiment, bonding layer is the ceramic layer of sintering.Ceramic frit layer shows typically micro-structure, wherein It may recognize and (in the case of this ceramic frit layer, burnt by more or less strong significant sintering neck according to the degree of sintering Knot neck also only can be very faint significant) each ceramic particle for being bonded to each other.For example, typically micro-structure is in polishing portion It is cognizable in the electron micrograph divided.Due to small particle size and pore size, during sintering operation, multiple sintering necks Similar slave bonding layer to lower-lying metal surface is formed, therefore the bonding between layer is improved.Particular advantage is to glue The region of socket part and engaged connection is easy to peel off.In one embodiment, the other centre of the first middle layer and optional setting Layer is sintering ceramic layer.Each ceramic layer, especially bonding layer and at least one middle layer preferably each pass through wet chemical technology (such as painting etc. is oozed in wire mark, wet powder coating) application, especially oozes painting and to be layered shape in the case of the basic configuration of tubulose Formula is sintered.For example, can be more aobvious by the co-sintering situation of the original existing whole layers than in base state of the interface between each layer It writes, the identification layering sintering in the electron micrograph of the polishing part of sinter layer structure, because in co-sintering produces path, Interface between layer becomes fuzzyyer due to diffusion effect.
In one embodiment, bonding layer directly extends to support substrate engagement adhesive portion from adhesive portion on the support substrate Part on.If bonding layer extends to both sides from adhesive portion, that is, the side of interconnecting piece and the side of support substrate are extended to, Unstability in the region of adhesive portion in two side directions is compensated by the generally continuous transition generated, and in first Interbed is provided with uniform substrate.Therefore, it improves the bonding of layer structure and reduces the risk that cracking is formed.
In one embodiment, bonding layer on interconnecting piece direction and/or on the direction of support substrate (in each situation In) from adhesive portion extend 0.2-3.0cm length.This length (moves in the axial direction in the case of tubulose or cylinder structure Length) from adhesive portion, (usual adhesive portion extends on certain bonding length, and region is in attached drawing 1-3 on the direction of interconnecting piece In indicated by " d ") abutting end in direction measures, and from the end of the interconnecting piece engaged in the direction on the direction of support substrate Portion measures.Particularly, in each case, this length is in 0.2-2.0cm ranges, even more preferably in 0.3-1.0cm models In enclosing.Obtain from the good bonding obtained first between layer and secondly the useful space that fluid detaches and (is especially gas separation) From the point of view of very efficient utilization, other range and narrow range are selected.
In one embodiment, the thickness of bonding layer is in 1-50 μ ms.Particularly, layer thickness is in 2-20 μ ms, very To preferably in 3-10 μ ms.In other range and especially relatively narrow range, acquisition layer to lower part is good first The good substrate of bonding and setting for the first middle layer, and secondly excessive injustice is introduced not over using bonding layer It is whole.Should be noted that the thickness in layer thickness, especially adhesive portion region can change (such as in soldered region, example It such as can be thicker).In addition, layer can become thinner on the direction of peripheral region and end and can also penetrate into support substrate Region.Therefore select the distance of end 1mm on the direction of interconnecting piece from adhesive portion as the reference of layer thickness (i.e. attached 1mm is moved from the region that " d " on the direction by interconnecting piece is indicated) in each situation of Fig. 1-3.From on interconnecting piece direction away from From the bonding layer preferably layer thickness with constant towards its end until then becoming thinner.In general, in each case The value to layer thickness being directed in serviceable condition, the value of pore size and the value of particle size these parameters, i.e., will quilt The case where layer of sintering to sintering state.
In one embodiment, bonding layer is porous and fluid penetrable, especially gas-permeable.Therefore, In engaging layer region so that may be transmitted fluid by bonding layer, especially gas transport is transmitted to film or from film.Engagement The porosity of layer is preferably at least 20%, but due to the general angular shape of small layer thickness and each ceramic particle, determining hole Gap rate will be subjected to relatively large measurement error.However, what porous and fluid penetrable bonding layer was not absolutely necessary to.It is special Not, the aperture that can be 0 μm with mean pore length in embodiment explained below.In one embodiment, bonding layer Average cell size in 0-0.50 μ ms, especially in 0.01-0.30 μ ms, even more preferably in 0.03-0.25 μm of model It encloses.Particularly, the pore size distribution of bonding layer is in 0.01-10.00 μm of region.In one embodiment, bonding layer has 0.01- The average ion size of 1.00 μ ms, especially in 0.01-0.75 μ ms, even more preferably in 0.03-0.50 μ ms. Particularly, the particle size distribution of bonding layer is in 0.01-25.00 μ ms.The other model in selection average hole and particle size Enclose with corresponding size distribution and especially relatively narrow range, to obtain first bonding layer to the good bonding of substrate and its It is secondary to generate to the good transition (in the first middle layer terminate) of the first middle layer, and the average cell size with bigger and can The average particle size of the bigger of choosing.According in one embodiment, the layer thickness of the first middle layer is in 5-120 μ ms, especially It is in 10-100 μ ms, it is even furthermore preferable that in 20-80 μ ms.Indicate the first middle layer and following second middle layers Layer thickness is related to the support substrate region of somewhat constant layer thickness, however due to out-of-flatness, it is connected in transitional region The fluctuation of layer thickness can occur for portion.
The pore size and hole length in each hole are determined by the following：The area that corresponding aperture is measured in polishing part is simultaneously then true Equivalent diameter (circular being obtained in the case that with of the same area) is determined.Particle size accordingly is determined.In order to determine hole Size and particle size are generated perpendicular to the section of the layer to be measured arranged by film, and in scanning electron microscope (SEM) the polishing part suitably prepared is measured.Pass through SEM-BSE images (BSE：Back scattered electron) gray scale different shades Threshold value analyzed.Here, setting SEM-BSC images brightness and contrast make hole and particle it is readily discernible and It is distinguished from each other in image.The sliding block for being used as shades of gray function by distinguishing hole and particle controls to select suitable gray scale cloudy Shadow value is as threshold value.In order to determine average cell size, in the corresponding region for the relevant layers being pre-selected in polishing part The pore size of all particles measures, and subsequently forms average value.For each particle to be measured in each situation, particle Geometric profile be determinant rather than the granule boundary for the multiple particles for forming particle may be engaged, and each particle tool There is different crystal orientation.The hole or particle being only located in selected region include in assessment.By determining that it is selected that hole is located at Relative to the gross area in selected region, (including hole is only partially located within the part in selected region to the area of part in region Area) come polishing part (SEM-BSC images) in determine layer porosity.In this case, using with analysis module " Partikel analyses " program avatar image access (program Imagic ImageAccess) (version：11 distribution 12.1)。
In one embodiment, the first middle layer has the average cell size less than support substrate.According to one embodiment, The average cell size that first middle layer has is in 0.20-2.00 μ ms, especially in 0.31-1.20 μ ms, or even preferably In 0.31-0.80 μ ms.Particularly, the pore size distribution of the first middle layer is in 0.01-25.0 μ ms.In one embodiment In, the authority particle size that the first middle layer has is in 0.70-3.50 μ ms, especially in 0.76-2.50 μ ms, even It is preferred that in 0.80-1.80 μ ms.Particularly, the particle size distribution of the first middle layer is in 0.01-100.00 μ ms.First The porosity of middle layer is preferably at least 20%, but due to the general angular shape of small layer thickness and each ceramic particle, determines Porosity to be subjected to relatively large measurement error.Since features described above obtains in feature itself or its each situation combined Obtain average cell size gradually reducing from support substrate to film.
In one embodiment, ceramic, fluid penetrable (especially gas-permeable), among porous second Layer extends between the first middle layer and film, and second middle layer has the average cell size smaller than the first middle layer.Especially It is in the case of gas separation membrane is arranged, the second middle layer of setting is advantageous, however in the case of fluid detaches, second Middle layer can ignore that in most cases.In one embodiment, the average cell size that the second middle layer has exists 0.03-0.50 μ ms, especially in 0.03-0.30 μ ms, it is even furthermore preferable that 0.03-0.25 μ ms.At one In embodiment, the average particle size that the second middle layer has is in 0.01-1.00 μ ms, especially in 0.01-0.75 μm of model It encloses, it is even furthermore preferable that in 0.03-0.50 μ ms.For particle size distribution and pore size distribution, for recognizing engagement The range of layer is preferred.According to one embodiment, the layer thickness of the second middle layer is in 5-75 μ ms, especially 5-50 μm of model It encloses, more preferably in 10-25 μ ms.It is arranged the of the particle size reduced with the pore size reduced and preferably Two middle layers provide fully smooth surface to the application of film, and similar provide diffusion impervious layer.Preferably with connect It closes the identical starting material of layer and identical sintering step is used for the second middle layer so that composition and micro-structure and bonding layer phase Together.In one embodiment, the second middle layer extends in interconnecting piece direction in the first middle layer.Particularly, the second middle layer Terminate in bonding layer or alternatively on interconnecting piece, the second middle layer is since good bonding is extremely as bonding layer for similarity Articulamentum.With this, setting for film application abundant smooth surface directly by interconnecting piece.In one embodiment, film Extend on bonding layer and at least one middle layer in interconnecting piece direction and is more than bonding layer and at least one middle layer, Yi Jizhi It is connected on interconnecting piece and terminates.With this, obtains in transitional region and at least the other fluid in fluid mixture (is especially Other gas in admixture of gas) be Fluid Sealing arrangement.In general, the second middle layer being capable of direct junction film.However, Alternatively, one or more other ceramics, fluid penetrable (being especially gas-permeable), porous middle layer It can be arranged between the second middle layer and film, the wherein average cell size of these other middle layers is then preferably from second Interbed to film further decreases.
In one embodiment, bonding layer and the material of at least one middle layer are selected from the group that following material forms：
A. yttrium oxide (Y is used2O3) stablize zirconium oxide (ZrO2),
B. zirconium oxide (the ZrO for using calcium oxide (CaO) to stablize2),
C. zirconium oxide (the ZrO for using magnesia (MgO) to stablize2),
D. aluminium oxide (Al2O3)。
The zirconium oxide (for being briefly YSZ) for preferably using stabilized with yttrium oxide, especially uses the yttrium oxide of 8mol% (Y2O3) complete stability zirconium oxide (for briefly be 8YSZ).In one embodiment, bonding layer and at least one middle layer by One is made with identical material (or composition).With this, obtains similar coefficient of thermal expansion and so that cheap production becomes It may.YSZ, especially 8YSZ are preferred.However, each layer, especially one side bonding layer and the second middle layer and another On the one hand the first middle layer can be different in terms of its micro-structure, such as are average cell size, average particle size and hole Gap rate is different.Partially stabilized zirconium oxide can be used (such as when using Y2O3Usually increase 3mol% when as stabilizer Yttrium oxide) rather than the yttrium oxide of complete stability (such as when using Y2O3Usually increase the oxidation of 8mol% when as stabilizer Yttrium).Other possible stabilizer for yttrium oxide is cerium oxide (CeO2), scandium oxide (ScO3) or ytterbium oxide (YbO3)。
In one embodiment, each of support substrate and interconnecting piece are tubular or tubulose.Section in an axial direction is preferred It is the circle with constant diameter.However, alternatively, additionally it is possible to provide different closed sections, such as oval cross section or edge The section axially to broaden.It can be by the overall structure of interconnecting piece and support substrate via soldered joint and welding in adhesive portion principle It closes and is formed.In one embodiment, extend preferably about this circumference of respective tubular peripheral part in the basic configuration of tubulose In the case of, adhesive portion is preferably formed by welding to close.Welding is closed and can cheaply and reliably be produced.Due to the hole of support substrate Gap rate, recess are generally formed in the region that welding is closed.
In the case of hydrogen is isolated, there is certain permeability for hydrogen but blocking is formed for other atom/molecules Simple metal principle on the entirely appropriate material for film.Selectable infiltrative oxide layer will be damaged from avoiding the formation of It sees, it is preferable to use noble metal, especially palladium, include the alloy (especially more than the palladium of 50% weight) of palladium, such as palladium-vanadium closes Gold, palladium-billon, Pd-Ag alloy, palladium-copper alloy, palladium-ruthenium alloy or other for hydrogen (H to be isolated2) the group for including palladium Compound film, such as with palladium, vanadium, the sequence of layer of palladium.In one embodiment, therefore, film is by palladium or based on the metal material of palladium (such as alloy, composition etc.) is made.The Pd contents of this film, in particular, pressing at least 50% weight, preferably at least 80% weight It calculates.It is also preferred that bonding layer and/or at least one middle layer are by with yttrium oxide (Y2O3) stablize zirconium oxide (ZrO2) system At especially 8YSZ.It is also preferred that each of support substrate and interconnecting piece are made of the material based on iron.In multiple components Each of these features be advantageous, and it combines and shows particularly advantageous effect.
A kind of method the present invention further provides production for the film arrangement of permeability and separation fluid from fluid mixture, The permeability and separation gas especially from admixture of gas, especially from including H2Admixture of gas in detach H2, the film arrangement Including porous, fluid penetrable (being especially gas-permeable), metal support substrate and interconnecting piece, the integrated substrate It is at least formed on the metal material of Fluid Sealing (especially airtight) with interconnecting piece, wherein support substrate is viscous along its peripheral part It is connected to interconnecting piece.Method includes the following steps：
A. at least one ceramic bonding layer is applied directly to adhesive portion, and at least along total bonding length of adhesive portion Subsegment is applied directly to the bonding part of interconnecting piece；
B. at least one ceramics, fluid penetrable (being especially gas-permeable), porous middle layer is gradual It is applied to support substrate (and overlapping region of bonding layer), wherein being applied directly to the middle layer of support substrate on bonding layer Terminate or terminate at bonding layer, and middle layer has the average cell size than bonding layer bigger, and
The film that fluid to be separated (especially gas) may be selected infiltration is gradually applied at least one middle layer.
Substantially, method through the invention can obtain above-mentioned identical in the case of film according to the present invention is arranged The advantages of.Therefore, above-described embodiment and variation example can also be realized and obtain corresponding advantage according to the method for the present invention.It is connecing In the case of closing layer and at least one middle layer, the application includes particularly applying to include organic bond by wet chemical technology With the layer of ceramic particle, and it is then sintered the layer, and only then applies next layer (optional with corresponding manner).
The further advantage of the present invention and effective aspect can be by obtaining the following description referring to attached drawing .
Attached drawing is shown：
Attached drawing 1：The sectional view of the film arrangement of first embodiment according to the present invention in the axial direction；
Attached drawing 2：The sectional view of film arrangement in the axial direction according to the second embodiment of the present invention；
Attached drawing 3：According to the third embodiment of the invention the sectional view of film arrangement in the axial direction；
Attached drawing 4：The pore size distribution of bonding layer according to an embodiment of the invention；
Attached drawing 5：The particle size distribution of bonding layer according to an embodiment of the invention；
Attached drawing 6：The pore size distribution of first middle layer according to an embodiment of the invention；
Attached drawing 7：The particle size distribution of first middle layer according to an embodiment of the invention.
Attached drawing 1-3 shows multiple embodiments, multiple embodiments in configuration aspects, for from admixture of gas (such as Including CH4, H2O, CO2, H2Equal steam reformations natural gas) in permeability and separation gas to be separated (such as H2) film arrangement in terms of on It is different from each other, and the transitional region from support substrate to interconnecting piece is only described in each case.In fig. 1, tubulose , porous, gas-permeable, metal support substrate 2 (such as ITM constitute) along its (circle) peripheral part 3 via bonding Portion 4 is bonded to tubular junction 6, and adhesive portion is formed by welding to close in this case, and the solid-state material of interconnecting piece 6 is by metal (such as steel) is constituted.The soldered of adhesive portion 4 forms circumferential recess, and the recess extends in axial direction on length d.It may be selected The film 8 (such as Pd is constituted) for permeating gas to be separated extends on the region of support substrate (except in the distal end of support substrate 2 Except the optionally recessed peripheral region of (not shown)).First ceramics, gas-permeable, porous middle layer 10 (such as burns The 8YSZ of knot is constituted) and the second ceramics, gas-permeable, porous middle layer 12 (such as the 8YSZ of sintering is constituted) is in support lining Extend between bottom 2 and film 8.In the region away from 4 certain distance of adhesive portion, the first middle layer 10 directly engage support substrate 2 and With the average cell size smaller than support substrate 2.In the region, the second middle layer 12 directly engages the first middle layer 10 and The direct junction film in the other sides of two middle layers 8.Second middle layer 12 has the average cell size smaller than the first middle layer 10.Viscous In the region of socket part 4, ceramic bonding layer 14 (such as the 8YSZ of sintering is constituted) is on interconnecting piece 6 and adhesive portion 4, ceramics Bonding layer at least extends on the bonding part of adhesive portion 4 and interconnecting piece 6, and the first middle layer 10 terminates on bonding layer 14. In first embodiment, bonding layer 14 extends from adhesive portion 4 (due to the deviation of diagram, engagement on the bound fraction of support substrate 2 Layer has penetrated into the region mesoporous of support substrate 2).Bonding layer 14 in this case is porous and gas is permeable, and And extend on entire (circle) bonding length of adhesive portion 4 (and engaging zones of support substrate 2 and interconnecting piece 6).Second Middle layer 12 extends in the direction of interconnecting piece 6 and more than the first middle layer 10 so that fully smooth substrate is provided to film 8.The Two middle layers 12 are similar to be terminated on bonding layer 14, due to the average cell size reduced compared with the first middle layer 10, second Middle layer and bonding layer 14 also provide the abundant smooth surface for film 8.Film 8 is in the direction of interconnecting piece 6 in bonding layer 14 Extend in (and two middle layers 10 and 12) and be more than, and terminate on interconnecting piece 6, film 8 is formed with interconnecting piece 6 to be separated Gas (such as H2) airtight engagement.
In second and third embodiments shown in attached drawing 2 and 3 described below, identical reference numeral is used for identical portions Part.Difference with first embodiment is only discussed.In second embodiment (attached drawing 2), bonding layer 14 is ' only in adhesive portion 4 and connection Extend (on the entire bonding length of adhesive portion 4) on the bonding part in portion 6.To the beginning of more to adhesive portion 4, the first middle layer Therefore 10 directly extend in support substrate 2, until its relatively good bonding.In 3rd embodiment (attached drawing 3), interconnecting piece 6 " it is made of porous, gas-permeable basis material, material (such as ITM) especially identical with support substrate 2, and Interconnecting piece 6 only has gas impermeable surfaces region 16 on its outer surface.For example, having been able to through application coating or sealing compositions Or by interconnecting piece 6 " porous matrix material the close surface region of melt surface next life aerogenesis 16.In addition, 3rd embodiment with The difference of first embodiment is that the second middle layer 12 " extends on bonding layer 14 and is more than, and " above terminate in interconnecting piece 6.
The example of the production of film arrangement according to the present invention explained below.The form of antipriming pipe made of ITM, and have There is an outer diameter of 6mm, the length of 200mm, the support substrate of about 40% porosity and the average cell size less than 50 μm is at it Axial end Korea Spro's medium tubular junction, the solid-state material of tubular junction are made of steel, and have phase by laser welding Same outer diameter.In order to ensure that the homogenizing of welding transition, the component of acquisition are subjected to 1200 DEG C of heat treatment in hydrogen atmosphere.It is then right Surface in weldering engaging zones carries out sandblasting to obtain surface evenly.Then, bonding layer is applied in weldering engaging zones. For this purpose, production is suitable for wet-chemical coating processes and derived from the suspension of two 8YSZ powder with different particle sizes, it is special It is not a kind of powder (and about 1 μm d50) with about 2 μm of d80 and a kind of particle with about 25nm (nanometer) The very delicate powder of size (crystallite dimension), such as dispersant is added, solvent (such as from Merck KGaA Darmstadt Obtainable BCA [2- (2- Butoxyethoxies) acetic acid] ethyl ester) and adhesive produce.In bonding layer wire drawing to weldering joint portion And in wire drawing to the engaging zones of support substrate and around interconnecting piece wire drawing.Soldered is located around connecing for whole circumference extension The centre of layer is closed, and in each case, layer extends in interconnecting piece direction and support substrate direction from the respective end of soldered The width of 1cm.The component of acquisition is then subjected to 1200 DEG C of sintering in hydrogen atmosphere, therefore burns out organic principle, frees pottery The sintering of enamel coating simultaneously obtains porous, sintering, ceramic bonding layer.Attached Figure 4 and 5 show the bonding layer produced in this approach Typical pore size distribution and particle size distribution.Particularly, from attached drawing 4 (wherein no longer several holes of the display with larger diameter) As can be seen that pore size distribution is in 0.03 to 5.72 μ m (with 0.13 μm of average cell size)；And from 5 (its of attached drawing In no longer display with larger diameter several particles) as can be seen that particle size distribution 0.03 to 18.87 μ m (tool There is 0.24 μm of average particle size).In the next step, by using the above-mentioned data for indicating bonding layer similar application (in addition to whole coarse 8YSZ powder), production again is used for the 8YSZ powder suspensions of the first middle layer, and setting ratio is connecing Close suspension more viscous in layer situation.Particularly, the 8YSZ powder with about 2 μm of d80 (and about 1 μm d50) is only made It is used for ceramic powders.It is applied by oozing, i.e., by the way that tubular part is penetrated into suspension, using the first middle layer, and among first Layer terminates on bonding layer.The component of acquisition is then subjected to 1300 DEG C of sintering in hydrogen atmosphere, therefore burns out organic principle, It frees the sintering of ceramic layer and obtains porous, sintering, ceramic first middle layer.Attached drawing 6 and 7 shows and produces in this approach First among typical pore size distribution and particle size distribution layer by layer.Particularly, from attached drawing 6, (wherein no longer display has Several holes of larger diameter) as can be seen that pore size distribution (has 0.55 μm of average hole ruler in 0.08 to 12.87 μ m It is very little)；And from attached drawing 7 (wherein no longer several particles of the display with larger diameter) as can be seen that particle size distribution exists 0.08 to 61.37 μ m (with 1.27 μm of average particle size).For the second middle layer then applied, using with Application is applied in the identical suspension of bonding layer and by oozing.The component of acquisition is then subjected to 1200 DEG C of sintering in hydrogen atmosphere, Therefore organic principle is burnt out, the sintering of ceramic layer occurs and obtains porous, sintering, ceramic second middle layer.Then pass through Sputtering technology application Pd films.The second middle layer is completely covered in film and bonding layer and the first middle layer also are located at below.Finally, Other Pd layers can be applied on the Pd layers of sputtering by electrochemical process, need gas to seal the Pd layers of sputtering and to obtain Close property.
The present invention be not restricted to it is attached in the embodiment shown in the figure.Particularly, adhesive portion must not necessarily be used as welding to close It realizes in portion.For example, adhesive portion can also be brazed joints or the joint portion form using adhesive production.In addition, interconnecting piece Can also have one or overall structure, adhesive portion to be formed between gas-permeable support substrate and interconnecting piece with support substrate Transition, interconnecting piece are at least airtight on the surface thereof.For example, the integral structure of support substrate and interconnecting piece is in 3rd embodiment To be possible in (attached drawing 3).In addition, the structure is not only adapted to detach H2It is further adapted for detaching other gases (such as CO2, O2, Deng).It is also possible to use interchangeable film, such as micropore, ceramic membrane (Al2O3, ZrO2, SiO2, TiO2, zeolite etc.) or it is fine and close , proton conductive ceramic (SrCeO3-δ, BaCeO3-δDeng).More particularly to use the nano-porous films of the compositions such as carbon, zeolite, as Film carries out the separation (such as alcohols being detached from the liquid mixture comprising water, wastewater treatment etc.) of liquid.

Claims (19)

1. a kind of film arrangement for the permeability and separation fluid from fluid mixture, the film arrangement include
Porous, fluid penetrable, metal support substrate (2)；
Film (8), the film are located in support substrate (2) and selectable make fluid permeability to be separated；
Interconnecting piece (6；6 "), the interconnecting piece is at least formed on the surface of Fluid Sealing；
Metal material, wherein support substrate (2) are bonded to interconnecting piece (6 along the peripheral part (3) of metal material；6“)；
Ceramics, fluid penetrable, porous first middle layer (10), first middle layer be located at support substrate (2) and Between film (8)；
It is characterized in that
At least one ceramics bonding layer (14；14 '), at least one ceramic bonding layer is at least along total engagement of adhesive portion (4) The subsegment of length is located immediately at interconnecting piece (6；6 ") and adhesive portion (4) on, and at least in adhesive portion (4) and interconnecting piece (6；6“) Bonding part on extend, and be the first middle layer (10) in bonding layer (14；14 ') on or terminate in bonding layer, and And first middle layer average cell size be more than bonding layer (14；14‘).
2. film arrangement according to claim 1, it is characterised in that bonding layer (14；14 ') average cell size deviate first At least 0.10 μm of the average cell size of middle layer (10).
3. film arrangement according to claim 1 or 2, it is characterised in that bonding layer (14；14 ') and/or the first middle layer (10) it is the ceramic layer being sintered.
4. film arrangement according to any one of the preceding claims, it is characterised in that bonding layer (14) is straight from adhesive portion (4) It is connected on the part for extending to support substrate (2) engagement adhesive portion (4) in support substrate (2).
5. film arrangement according to any one of the preceding claims, it is characterised in that in each case, bonding layer (14； 14 ") in interconnecting piece (6；6 ") on the direction and/or direction of support substrate (2) from adhesive portion (4) extension include 0.2 to including The length range of 3.0cm.
6. film arrangement according to any one of the preceding claims, it is characterised in that the thickness (14 of bonding layer；14 ") wrapping 1 is included to the range for including 50 μm.
7. film arrangement according to any one of the preceding claims, it is characterised in that bonding layer (14；14 ") be it is porous and Fluid penetrable.
8. film arrangement according to any one of the preceding claims, it is characterised in that bonding layer (14；14 ") average hole ruler It is very little including 0 to the range for including 0.50 μm.
9. film arrangement according to any one of the preceding claims, it is characterised in that the first middle layer (10), which has, is less than branch Support the average cell size of substrate (2).
10. film arrangement according to any one of the preceding claims, it is characterised in that the first middle layer (10) has flat Equal pore size is including 0.20 to the range for including 2.00 μm.
11. film arrangement according to any one of the preceding claims, it is characterised in that ceramic, fluid penetrable, more Second middle layer (12 in hole；12 ") extend between the first middle layer (10) and film (8), second middle layer (12；12“) With the average cell size smaller than the first middle layer (10).
12. film arrangement according to claim 11, it is characterised in that the second middle layer (12；12 ") in interconnecting piece (6；6“) Direction extends in the first middle layer (10).
13. film arrangement according to any one of the preceding claims, it is characterised in that film (8) is in interconnecting piece (6；6 ") direction In bonding layer (14；14 ') and at least one middle layer (10,12；12 ") on extend, and directly in interconnecting piece (6；6 ") on tie Beam.
14. film arrangement according to any one of the preceding claims, it is characterised in that bonding layer (14；14 ') and at least one A middle layer (10,12；12 ") material selected from the group that following material forms：
A. yttrium oxide (Y is used2O3) stablize zirconium oxide (ZrO2),
B. zirconium oxide (the ZrO for using calcium oxide (CaO) to stablize2),
C. zirconium oxide (the ZrO for using magnesia (MgO) to stablize2), and
D. aluminium oxide (Al2O3)。
15. film arrangement according to any one of the preceding claims, it is characterised in that bonding layer (14；14 ') and at least one A middle layer (10,12；12 ") be made of the same material.
16. film arrangement according to any one of the preceding claims, it is characterised in that support substrate (2) and interconnecting piece (6；6 ") each of be tubulose.
17. film arrangement according to any one of the preceding claims, it is characterised in that adhesive portion (4) closes shape by welding At.
18. film arrangement according to any one of the preceding claims, it is characterised in that film (8) is by palladium or based on the metal of palladium Material is made,
It is bonding layer (14；14 ') and/or at least one middle layer (10,12；12 ") by with yttrium oxide (Y2O3) stablize oxidation Zirconium (ZrO2) be made,
It is support substrate (2) and interconnecting piece (6 in each case；6 ") be made of the material based on iron.
19. a kind of method of production for the film arrangement of permeability and separation fluid from fluid mixture, the film arrangement include
Porous, fluid penetrable, metal support substrate (2) and
Interconnecting piece (6；6 "), the interconnecting piece at least forms on the metal material of Fluid Sealing, and wherein support substrate (2) is along it Peripheral part (3) is bonded to interconnecting piece (6；6 "),
It is characterized in that including the following steps：
A. by least one ceramic bonding layer (14；14 ') it is applied directly to adhesive portion (4), and at least along the total of adhesive portion (4) The subsegment of bonding length is applied directly to interconnecting piece (6；6 ") bonding part；
B. by least one ceramic, fluid penetrable, porous middle layer (10,12；12 ") gradually it is applied to support substrate (2), wherein being applied directly to the middle layer (10) of support substrate (2) in bonding layer (14；14 ') on terminate or in bonding layer (14；14 ') at terminate, and middle layer have than bonding layer (14；14 ') average cell size of bigger, and
The film (8) that fluid to be separated may be selected infiltration is gradually applied at least one middle layer 10,12；12“).
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