CN108428807A - Thin-film packing structure and display screen - Google Patents
Thin-film packing structure and display screen Download PDFInfo
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- CN108428807A CN108428807A CN201810456067.4A CN201810456067A CN108428807A CN 108428807 A CN108428807 A CN 108428807A CN 201810456067 A CN201810456067 A CN 201810456067A CN 108428807 A CN108428807 A CN 108428807A
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- film layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of thin-film packing structure and display screens.Thin-film packing structure includes the multiple film layers being sealed on the outside of packed device, and multiple film layers include with non-display area, multiple film layers：At least one layer of inorganic thin film layer；With at least one layer of organic thin film layer, organic thin film layer is stacked with inorganic thin film layer.Thin-film packing structure further includes several drying particulates, several drying particulates are located in multiple film layers or the surface of multiple film layers, and several drying particulates are respectively positioned on non-display area.Using the thin-film packing structure of technical solution of the present invention, several drying particulates can absorb the moisture entered from flexible product edge, it avoids the inside that these moisture penetrationes enter packed device from causing component failure, to improve the reliability of encapsulation, is conducive to apply.
Description
Technical field
The present invention relates to display technology fields, more particularly to a kind of thin-film packing structure and display screen.
Background technology
Some special occasions that thin film encapsulation technology cannot achieve especially suitable for tradition capping encapsulation, such as have flexibility
The encapsulation of machine light emitting diode (OLED, organic light-emitting diode) and flexible organic solar batteries etc..
However, the package reliability of flexible product is relatively low at present, it is unfavorable for applying.
Invention content
Based on this, it is necessary to which the problem of for how to improve package reliability, package reliability can be improved by providing one kind
Thin-film packing structure and display screen.
A kind of thin-film packing structure, including multiple film layers on the outside of packed device are sealed in, the multiple film layer has
Non-display area, the multiple film layer include：
At least one layer of inorganic thin film layer；With
At least one layer of organic thin film layer, the organic thin film layer are stacked with the inorganic thin film layer,
The thin-film packing structure further includes several drying particulates, the drying particulate be located in the multiple film layer or
The surface of the multiple film layer of person, and the drying particulate is respectively positioned on the non-display area.
The drying particulate is molecular sieve in one of the embodiments,.
The material of the drying particulate is alumino-silicate in one of the embodiments,.
The grain size of the drying particulate is 0.3nm~1.0nm in one of the embodiments,.
The number of plies of the inorganic thin film layer is two layers in one of the embodiments, and the number of plies of the organic thin film layer is
One layer, the inorganic thin film layer is located at the both sides of the organic thin film layer, and the drying particulate is located at the inorganic thin film
In the inorganic thin film layer of the close packed device in layer.
The drying particulate is located at the close packed device of the multiple film layer in one of the embodiments,
Surface.
The number of plies of the inorganic thin film layer is at least two layers in one of the embodiments, the layer of the organic thin film layer
Number is at least two layers, the inorganic thin film layer and the alternately laminated setting of the organic thin film layer.
In addition, also providing a kind of display screen, the display screen includes：
Array substrate；
Packed device, is arranged in the array substrate；And
Any of the above-described thin-film packing structure, the thin-film packing structure is by the packed device sealing in the array base
On plate.
In one of the embodiments, the array substrate include for when forming the organic thin film layer, to flowing
The first dam unit and the second dam unit that property organic material is stopped, first dam unit and second dam unit are successively
It is arranged along the direction far from the packed device,
The drying particulate is located at side where the packed device of first dam unit, or is located at described first
Where the packed device of dam unit between side and first dam unit and second dam unit.
The packed device is flexible active matrix Organic Light Emitting Diode in one of the embodiments,.
Using the thin-film packing structure of technical solution of the present invention, several drying particulates can be absorbed from flexible product edge
The moisture of entrance avoids these moisture penetrationes from entering and is packaged the inside of device and causes component failure, to improve encapsulation can
By property, be conducive to apply.
Using the display screen of technical solution of the present invention, since several drying particulates in thin-film packing structure can absorb
The moisture entered from flexible product edge, therefore the inside that these moisture penetrationes can be avoided to enter packed device causes device to lose
Effect, to improve the reliability of encapsulation, is conducive to apply.
Description of the drawings
Fig. 1 is the thin-film packing structure of an embodiment of the present invention and the schematic diagram of display screen.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
The present invention proposes a kind of thin-film packing structure, to be packaged to packed device.Above-mentioned thin-film packing structure
Including the multiple film layers being sealed on the outside of packed device, multiple film layers have non-display area.Multiple film layers include at least one layer
Inorganic thin film layer and at least one layer of organic thin film layer, organic thin film layer are stacked with inorganic thin film layer.Wherein, organic film
Layer obstructs water oxygen with inorganic thin film layer.In addition, organic thin film layer can also play the role of planarization, to promote packed device
The levelness of part or inorganic thin film layer.
Thin-film packing structure further includes several drying particulates, several drying particulates are located in multiple film layers or multiple
The surface of film layer, and several drying particulates are respectively positioned on non-display area.Drying particulate refers to play with water imbibition
The particle of desiccation, but the water absorbing properties of drying particulate are not limited, drying particulate can be the particle of strong absorptive, can also
For the particle of weak water imbibition.
Wherein, several drying particulates, which are located in multiple film layers, refers to that multiple film layers wrap up several drying particulates
Firmly, several drying particulates can be located at the inside of inorganic thin film layer, the inside of organic thin film layer or adjacent two layers film interlayer.
Wherein, several drying particulates are located at the surfaces of multiple film layers and refer to that multiple film layers cannot completely wrap up several particles
Firmly, several drying particulates is at least partly exposed in the outside of multiple film layers.Wherein, when drying particulate is located at multiple film layers
When surface, it can also be located at the close array base of multiple film layers as surface of multiple film layers far from array substrate is located at
The surface of plate.
When moisture penetration enters in above-mentioned thin-film packing structure, these drying particulates can absorb these moisture, avoid
The inside that hydrone occurs release and penetrates into packed device causes component failure, so as to improve the reliable of encapsulation
Property, to promote the service life of device.
Fig. 1 is referred to, the thin-film packing structure 100 of an embodiment of the present invention includes being sealed in packed device (not scheme
Show) on the outside of multiple film layers 110, wherein packed device is located at the left area in Fig. 1.Wherein, multiple film layers 110 have
Non-display area 120.Multiple film layers 110 include two layers of the inorganic thin film layer 130 being stacked and one layer of organic thin film layer 140.Its
In, two layers of inorganic thin film layer 130 is located at the both sides of organic thin film layer 140 in the up-down direction.
Wherein, thin-film packing structure 100 further includes several drying particulates 150, several drying particulates 150 are located at more
In a film layer 110 or surface of multiple film layers 110, and several drying particulates 150 are respectively positioned on non-display area 120.
Wherein, non-display area 120 is the non-display area of display screen.Certainly, multiple film layers 110 also have viewing area (not
Diagram), i.e. the display area of display screen.Wherein, non-display area 120 is located at the periphery of viewing area.
When moisture penetration enters in above-mentioned thin-film packing structure 100, these drying particulates 150 can absorb these water
Point, the inside for avoiding hydrone that release occurs and penetrating into packed device causes component failure, so as to improve encapsulation
Reliability, to promote the service life of device.
On the basis of aforementioned embodiments, drying particulate 150 is molecular sieve.Molecular sieve is a kind of with cubic lattice
Alumino-silicate compound.Molecular sieve has uniform microcellular structure, its hole diameter is uniform, these holes can be than it
The small Molecular Adsorption of diameter has Preferential adsorption ability, thus energy to the inside of vestibule, and to polar molecule and unsaturated molecule
Molecules polarity degree is different, that degree of saturation is different, molecular size is different and boiling point is different separate, that is, have " screening "
The effect of molecule.Molecular sieve has very high characterization of adsorption and high speed characterization of adsorption, under the very exacting terms such as high temperature still
There is very high adsorption capacity, the inside for being conducive to avoid hydrone that release occurs and penetrate into packed device causes device to lose
Effect, so as to the reliability of encapsulation and the service life of promotion device.
On the basis of aforementioned embodiments, the material of drying particulate 150 is alumino-silicate.Its adsorption capacity is high, selects
Selecting property is strong, high temperature resistant.Meanwhile there are many duct of uniform pore diameter and the hole of marshalling, points of different pore size in structure
Son sieve different sizes and shapes molecule is separated, therefore can effectively adsorption and permeation enter the steam in multiple film layers 110.
It should be noted that the present invention thin-film packing structure in drying particulate material it is without being limited thereto, it is any can
Play the particle of desiccation.
On the basis of aforementioned embodiments, the grain size of drying particulate 150 is 0.3nm~1nm.When the grain size of drying particulate
For 0.3nm~1nm when, adsorbed water molecule can be played the role of and particle is larger and influence the flat of multiple film layers 110
Whole property and leakproofness.
Certainly, the grain size of drying particulate 150 is without being limited thereto, can also be the grain size model that other can be functioned as described above
It encloses.
On the basis of aforementioned embodiments, several drying particulates 150 are located at close packed in inorganic thin film layer
In the inorganic thin film layer of device.Several drying particulates 150 can be deposited on inorganic thin film by the method for physical deposition
In layer.After being arranged in this way, these drying particulates 150 can play barrier action, and good protection is played to packed device
Effect.
On the basis of aforementioned embodiments, several drying particulates 150 are located at the close packed device of multiple film layers 110
The surface of part.First several drying particulates 150 can be scattered in organic liquid, liquefied mixture is coated on array later
On substrate, redeposited multiple film layers 110, in obtained thin-film packing structure 100, several drying particulates 150 are located at multiple films
The surface of the close packed device of layer 110.After being arranged in this way, these drying particulates 150 can play barrier action, to quilt
Packaging plays a good protective effect.
In addition, several drying particulates can be located in organic thin film layer.Drying particulate can be scattered in prepare it is organic
In the marking ink of film layer, after printing solidification, several above-mentioned drying particulates are provided in obtained organic thin film layer.As general
Marking ink containing drying particulate is after non-display area printing solidification, and in obtained organic thin film layer, drying particulate is then located at
Above-mentioned non-display area.
It should be noted that in the thin-film packing structure of the present invention, the layer of inorganic thin film layer and organic thin film layer is not limited
Number, does not also limit the arrangement mode of inorganic thin film layer and organic thin film layer.When the number of plies of inorganic thin film layer and organic thin film layer is equal
If for dried layer when, the organic thin film layer of one layer or one layer or more the number of plies can be provided between adjacent two layers inorganic thin film layer,
Likewise, the inorganic thin film layer of one layer or one layer or more the number of plies can be provided between adjacent two layers organic thin film layer.
On the basis of aforementioned embodiments, the number of plies of inorganic thin film layer 130 is at least two layers, organic thin film layer 140
The number of plies is at least two layers, inorganic thin film layer 130 and 140 alternately laminated setting of organic thin film layer.It in this way can be to water oxygen or purple
Outside line is obstructed layer by layer, to improve the stability for being packaged device.
Using the thin-film packing structure of technical solution of the present invention, several drying particulates can be absorbed from flexible product edge
The moisture of entrance avoids these moisture penetrationes from entering and is packaged the inside of device and causes component failure, to improve encapsulation can
By property, be conducive to apply.
Fig. 1 is referred to, the display screen 200 of an embodiment of the present invention (is not schemed including array substrate 210, packed device
Show) and the above embodiment thin-film packing structure 100.
Wherein, device is packaged to be arranged in array substrate 210.Wherein, thin-film packing structure 100 is close by packed device
It is enclosed in array substrate 210.
On the basis of aforementioned embodiments, array substrate 210 includes for when forming organic thin film layer 140, convection current
The first dam unit 211 and the second dam unit 212 that dynamic property organic material is stopped, the first dam unit 211, the second dam unit
212 are arranged along the direction far from packed device successively.
Several drying particulates 150 can be located at side where the packed device of the first dam unit 211, or be located at first
Where the packed device of dam unit 211 between side and the first dam unit 211 and the second dam unit 212.The position of water oxygen invasion
The marginal position of usually substrate is set, and the thickness between the first dam unit 211 and the second dam unit 212 is smaller, belongs to encapsulation
Weakness, therefore side where several drying particulates 150 are positioned over the packed device of the first dam unit 211, or place
Where the packed device of the first dam unit 211 between side and the first dam unit 211 and the second dam unit 212, Ke Yigeng
Maximum probability absorbs moisture, and moisture is avoided to be invaded from the encapsulation weakness of device, to prevent device to be corroded, improves encapsulation effect
Fruit.
Certainly, the distribution of several drying particulates 150 is without being limited thereto.Several drying particulates 150 can also be distributed in position
In any position of multiple film layers 110 of non-display area 120.For example, several drying particulates 150 can be with integrated distribution in more
The a certain position of a film layer 110, also can be with multiple positions of the dispersed distribution in multiple film layers 110.
In addition, in the above embodiment, array substrate 210 includes two dam units, respectively the first dam unit 211 and the
Two dam units 212, for being stopped layer by layer when forming organic thin film layer 140, to mobility organic material.But dam unit
Number is without being limited thereto, in other embodiments, a dam unit can also only be arranged.At this time preferably by several drying particulates
It is set to the position adjacent with dam unit of multiple film layers.Be conducive to play absorption to the moisture invaded from dam unit periphery in this way
Effect improves packaging effect.
On the basis of aforementioned embodiments, above-mentioned packed device is flexible active matrix Organic Light Emitting Diode
(AMOLED, active-matrix organic light emitting diode).The thickness of the thin-film encapsulation layer of AMOLED
It is usually relatively thin, thus it is extremely sensitive to preparing the molecule in environment, when there are molecule, then it is easy to generate weak
Locate, remaining hydrone or the hydrone in the external world are then easy to penetrate into from above-mentioned weakness in organic thin film layer, cause device
Failure.Based on this, since the thin-film packing structure of the present invention includes drying particulate, the service life for promoting AMOLED has
Good effect.
Using the display screen of technical solution of the present invention, since several drying particulates in thin-film packing structure can absorb
The moisture entered from flexible product edge, therefore the inside that these moisture penetrationes can be avoided to enter packed device causes device to lose
Effect, to improve the reliability of encapsulation, is conducive to apply.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of thin-film packing structure, including multiple film layers on the outside of packed device are sealed in, the multiple film layer has non-
Viewing area, which is characterized in that the multiple film layer includes：
At least one layer of inorganic thin film layer；With
At least one layer of organic thin film layer, the organic thin film layer are stacked with the inorganic thin film layer,
The thin-film packing structure further includes several drying particulates, and the drying particulate is located in the multiple film layer or institute
The surface of multiple film layers is stated, and the drying particulate is respectively positioned on the non-display area.
2. thin-film packing structure according to claim 1, which is characterized in that the drying particulate is molecular sieve.
3. thin-film packing structure according to claim 1, which is characterized in that the material of the drying particulate is aluminosilicate
Salt.
4. thin-film packing structure according to claim 1, which is characterized in that the grain size of the drying particulate be 0.3nm~
1.0nm。
5. thin-film packing structure according to claim 1, which is characterized in that the number of plies of the inorganic thin film layer is two layers,
The number of plies of the organic thin film layer is one layer, and the inorganic thin film layer is located at the both sides of the organic thin film layer, described dry
Dry particle is located in the inorganic thin film layer of the close packed device in the inorganic thin film layer.
6. thin-film packing structure according to claim 1, which is characterized in that the drying particulate is located at the multiple film layer
Close to the packed device surface.
7. thin-film packing structure according to claim 1, which is characterized in that the number of plies of the inorganic thin film layer is at least two
Layer, the number of plies of the organic thin film layer is at least two layers, the inorganic thin film layer and the alternately laminated setting of the organic thin film layer.
8. a kind of display screen, which is characterized in that the display screen includes：
Array substrate；
Packed device, is arranged in the array substrate；And
Such as thin-film packing structure according to any one of claims 1 to 7, the thin-film packing structure is by the packed device
It is sealed in the array substrate.
9. display screen according to claim 8, which is characterized in that the array substrate includes for described organic in formation
The first dam unit and the second dam unit stopped when film layer, to mobility organic material, first dam unit and institute
The second dam unit is stated successively to be arranged along the direction far from the packed device,
The drying particulate is located at side where the packed device of first dam unit, or is located at first dykes and dams
Where the packed device in portion between side and first dam unit and second dam unit.
10. display screen according to claim 8, which is characterized in that the packed device is that flexible active matrix is organic
Light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810456067.4A CN108428807A (en) | 2018-05-14 | 2018-05-14 | Thin-film packing structure and display screen |
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| CN201810456067.4A CN108428807A (en) | 2018-05-14 | 2018-05-14 | Thin-film packing structure and display screen |
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Family
ID=63162992
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| CN109461833A (en) * | 2018-08-31 | 2019-03-12 | 云谷（固安）科技有限公司 | Display panel and its manufacturing method |
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Application publication date: 20180821 |