CN108427797A - A kind of die design method and device based on BIM - Google Patents
A kind of die design method and device based on BIM Download PDFInfo
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- CN108427797A CN108427797A CN201710688242.8A CN201710688242A CN108427797A CN 108427797 A CN108427797 A CN 108427797A CN 201710688242 A CN201710688242 A CN 201710688242A CN 108427797 A CN108427797 A CN 108427797A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
Abstract
A kind of die design method and device based on BIM provided by the present invention, this method include：Obtain the outer profile threedimensional model of PC components；Judged to whether there is corresponding die information in die parameters library according to outer profile threedimensional model；If so, according to the parameter and die information of PC components, the threedimensional model of the corresponding mold of PC components is generated；The present invention whether there is corresponding die information by judging according to outer profile threedimensional model in die parameters library, the outer profile threedimensional model of PC components can be utilized to whether there is the die information of corresponding same type in the tool parametrization library lookup of the pin-connected panel PC components pre-established, so as to determined according to the parameter of die information and PC components found the PC components mold threedimensional model, to complete the mold design of PC components, reduce the workload of staff, the efficiency for improving mold design reduces mold design delivery time and cost.
Description
Technical field
The present invention relates to building engineering field, more particularly to a kind of die design method and device based on BIM.
Background technology
With the fast development of modern social economy, urban construction achieves variation with rapid changepl. never-ending changes and improvements so that building work
Journey field has obtained extensive development and concern.In building engineering field, the mold of PC components building is a kind of combined knot
Structure mold requires, to be designed manufacture, to make position of the concrete structure according to regulation, dimensioning according to component drawing creation
Very little molding keeps building mould correct position, and bears the component lateral pressure of the dead weight and effect of building mould on it and carry
Lotus.The purpose for carrying out mold engineering is to ensure concrete engineering quality and construction safety, accelerate construction progress and reduce project at
This.
In building engineering field, project can be designed communication first after getting off, and first confirm that the period of entire project
Deng, it is a big flow from the completion for being designed into construction and installation to building, and Mold Making is one of annelet,
But be a vital link, because all prefabricated PC components are come out in mold.Therefore, generally exist
When mold actual fabrication, it can all carry out figure after staff understands paper drawing using CAD etc. graphics softwares in advance and set
Meter.Currently, PC components according to universal division, can be divided into the pin-connected panel PC components and special designing of common application
Customize PC components.
In the prior art, the design of the mold of PC components often uses CAD design, and staff is needed to be understood in advance that figure
Paper, then be designed so that the amount of reading of staff is larger, understands difficulty height, causes the design delivery time long, efficiency is low.
Therefore, how to avoid the mold engineer that plan view based on two-dimensional PC components carries out in the prior art, caused by design
Difficulty is larger, and the individually designed mold of each PC components, the higher problem of cost improve the efficiency of mold design, reduce mould
Tool design delivery time and cost is urgent problem now.
Invention content
The object of the present invention is to provide a kind of die design method and device based on BIM, to reduce the work of staff
It measures, improves the efficiency of mold design, reduce mold design delivery time and cost.
In order to solve the above technical problems, the present invention provides a kind of die design method based on BIM, including：
Obtain the outer profile threedimensional model of PC components；
Judged to whether there is corresponding die information in die parameters library according to the outer profile threedimensional model；
If so, according to the parameter of the PC components and the die information, the corresponding mold of the PC components is generated
Threedimensional model.
Optionally, described to be judged to whether there is corresponding mold in die parameters library according to the outer profile threedimensional model
Information, including：
According to the outer profile information of PC components, built-in fitting go out muscle information described in the outer profile threedimensional model and edge is opened
Information is lacked, judges to whether there is corresponding die information in the die parameters library.
Optionally, after the threedimensional model for generating the corresponding mold of the PC components, further include：
Generate graphics, construction diagrams and the plan view of the corresponding mold of the PC components.
Optionally, after the threedimensional model for generating the corresponding mold of the PC components, further include：
Generate the building block inventory and fixing piece inventory configured needed for the mold.
Optionally, described to be judged to whether there is corresponding mold in die parameters library according to the outer profile threedimensional model
After information, further include：
If corresponding die information is not present in the die parameters library, the outer profile threedimensional model is carried out several
What topological analysis generates the PC components pair according to the corresponding connection for customizing mold of the PC components and/or fixed requirement
The threedimensional model for the customization mold answered.
Optionally, after generating the corresponding threedimensional model for customizing mold of the PC components, further include：
The corresponding threedimensional model for customizing mold of the PC components of generation is stored to database.
In addition, the present invention also provides a kind of mold design device based on BIM, including：
Acquisition module, the outer profile threedimensional model for obtaining PC components；
Judgment module whether there is corresponding mould for judging according to the outer profile threedimensional model in die parameters library
Has information；
First generation module, if for there are corresponding die informations in the die parameters library, according to the PC
The parameter of component and the die information generate the threedimensional model of the corresponding mold of the PC components.
Optionally, the judgment module, including：
Judging submodule, for according to the outer profile information of PC components, built-in fitting described in the outer profile threedimensional model
Go out muscle information and edge quit a post and thus leave it vacant information, judges to whether there is corresponding die information in the die parameters library.
Optionally, which further includes：
Second generation module, if for corresponding die information to be not present in the die parameters library, to described outer
Contoured three-dimensional model carries out geometry topological analysis, is wanted according to the corresponding connection for customizing mold of the PC components and/or fixation
It asks, generates the corresponding threedimensional model for customizing mold of the PC components.
Optionally, which further includes：
Memory module, for storing the corresponding threedimensional model for customizing mold of the PC components generated to data
Library.
A kind of die design method based on BIM provided by the present invention, including：Obtain the outer profile three-dimensional mould of PC components
Type；Judged to whether there is corresponding die information in die parameters library according to the outer profile threedimensional model；If so, according to
The parameter of the PC components and the die information generate the threedimensional model of the corresponding mold of the PC components；
As it can be seen that outer profile threedimensional model of the present invention by acquisition PC components, can utilize BIM to obtain the foreign steamer of PC components
Wide threedimensional model；It, can by being judged to whether there is corresponding die information in die parameters library according to outer profile threedimensional model
It whether there is the die information of corresponding same type with the tool parametrization library lookup in the pin-connected panel PC components pre-established；Pass through
According to the parameter and die information of PC components, the threedimensional model of the corresponding mold of PC components is generated, it can be according to the mould found
Tool information and the parameter of PC components determine that the threedimensional model of the mold of the PC components subtracts to complete the mold design of PC components
The workload for having lacked staff improves the efficiency of mold design, reduces mold design delivery time and cost.In addition,
The present invention also provides a kind of mold design device based on BIM equally has above-mentioned advantageous effect.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
A kind of flow chart for die design method based on BIM that Fig. 1 is provided by the embodiment of the present invention；
The flow chart for another die design method based on BIM that Fig. 2 is provided by the embodiment of the present invention；
A kind of structure chart for mold design device based on BIM that Fig. 3 is provided by the embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Referring to FIG. 1, a kind of flow chart for die design method based on BIM that Fig. 1 is provided by the embodiment of the present invention.
This method may include：
Step 101：Obtain the outer profile threedimensional model of PC components.
Wherein, the outer profile threedimensional model in this step can be using BIM according to the outer profile information of PC components, pre-buried
Part goes out the outer profile threedimensional model of muscle information and edge quit a post and thus leave it vacant acquisition of information, that is to say, that can be wrapped in outer profile threedimensional model
Include the outer profile information of PC components, built-in fitting goes out muscle information and edge quit a post and thus leave it vacant information.For specifically being wrapped in outer profile threedimensional model
The information contained may include that the outer profile information of PC components, built-in fitting go out muscle information and edge quit a post and thus leave it vacant information these three information,
It may include one of which or two kinds of information, can also include other information, the present embodiment does not do this any restrictions.
It is understood that the specific acquisition modes of the outer profile threedimensional model for PC components, can directly receive work
Make the outer profile threedimensional model of the PC components of personnel's transmission；The three-dimensional mould for the PC components that the staff of reception can also be sent
Type is split, and the outer profile threedimensional model of PC components is obtained；First PC components can also be scanned, obtain the three of PC components
Dimension module, then obtain the outer profile threedimensional model of PC components.As long as the outer profile threedimensional model of PC components can be obtained, for PC
The specific acquisition modes of the outer profile threedimensional model of component can voluntarily be set by designer according to practical scene and user demand
It sets, the present embodiment is unrestricted to this.
Step 102：Judged to whether there is corresponding die information in die parameters library according to outer profile threedimensional model；If
It is then to enter step 103.
Wherein, die parameters library can be staff (user) or designer be pre-created according to pin-connected panel PC
After component outer profile information, built-in fitting go out muscle information and edge quit a post and thus leave it vacant information is classified, similar pin-connected panel PC components are stored
Die information, and such as length, width, the fixation card key of mold, tongue and groove depth, the spacing for going out muscle, turning connection component
Parameter information.As long as the corresponding mold letter of the outer profile threedimensional model that pin-connected panel PC components can be found according to die parameters library
Breath, and die parameters library can be utilized according to the parameter of die information and pin-connected panel PC components, generate pin-connected panel PC structures
The threedimensional model of the corresponding mold of part, for the specific set-up mode and content in die parameters library, can by designer or
User is voluntarily arranged according to practical scene and user demand, and the present embodiment does not do this any restrictions.
It is understood that this step can the outer profile threedimensional models of the components of the PC according to sentenced using die parameters library
Whether the disconnected PC components are pin-connected panel PC components；If so, the corresponding mold letter of the outer profile threedimensional model for obtaining the PC components
Breath；If it is not, then illustrating that the PC components are to customize PC components, geometry topology point can be carried out by external contoured three-dimensional model
It analyses, according to the corresponding connection for customizing mold of PC components and/or fixed requirement, generates the corresponding customization mold of PC components
Threedimensional model.The present embodiment is unrestricted to this.
Step 103：According to the parameter and die information of PC components, the threedimensional model of the corresponding mold of PC components is generated.
Wherein, the purpose of this step is according to the parameters of PC components in the die information that is preserved in die parameters library
Parameter is adjusted, and generates the threedimensional model of the corresponding mold of PC components.By taking wallboard as an example, it can be determined according to the thickness of wallboard
The depth of mold, matching tongue and groove depth goes out the corresponding design that the spacing of muscle determines mold with it, to generate the corresponding mould of wallboard
The threedimensional model of tool.
It is understood that in this step the parameter of PC components can be staff input parameter, or
According to the parameter of the obtaining three-dimensional model of PC components, the present embodiment is unrestricted to this.
Preferably, can also include graphics, construction diagrams and the plane for generating the corresponding mold of PC components after this step
The step of figure, can facilitate staff to check the mold of generation, for generation mold such as graphics, construction diagrams and plane
The type and quantity of the display diagram of figure can be voluntarily arranged by designer or user, and the present embodiment does not do this any restrictions.
Preferably, it after this step can also include the building block inventory and fixing piece inventory generated needed for configuration mold
Step, that is, further by needed for mold arrangement building block and fixing piece show, facilitate user understand Mold Making
Required cost.
In the present embodiment, the embodiment of the present invention can utilize BIM to obtain by the outer profile threedimensional model of acquisition PC components
The outer profile threedimensional model of PC components；By being judged in die parameters library with the presence or absence of corresponding according to outer profile threedimensional model
Die information can whether there is the mould of corresponding same type in the tool parametrization library lookup of the pin-connected panel PC components pre-established
Has information；By the parameter and die information according to PC components, the threedimensional model of the corresponding mold of PC components is generated, it can basis
The parameter of the die information and PC components that find determines the threedimensional model of the mold of the PC components, to complete the mould of PC components
Tool design, reduce the workload of staff, improve the efficiency of mold design, reduce the mold design delivery time and at
This.
Referring to FIG. 2, the flow for another die design method based on BIM that Fig. 2 is provided by the embodiment of the present invention
Figure.This method may include：
Step 201：Obtain the outer profile threedimensional model of PC components.
Step 202：Judged to whether there is corresponding die information in die parameters library according to outer profile threedimensional model；If
It is then to enter step 203；If it is not, then entering step 204.
Step 203：According to the parameter and die information of PC components, the threedimensional model of the corresponding mold of PC components is generated.
Wherein, step 201 is similar to step 103 to step 101 to step 203, and details are not described herein.
Step 204：External contoured three-dimensional model carries out geometry topological analysis, according to the corresponding customization mold of PC components
Connection and/or fixed requirement generate the corresponding threedimensional model for customizing mold of PC components.
Wherein, this step can be when PC components are to customize PC components by the outer profile three to customizing PC components
Dimension module carries out geometry topological analysis, according to the corresponding connection for customizing mold of PC components and/or fixed requirement, generates PC structures
The corresponding threedimensional model for customizing mold of part.
It is understood that the concrete mode of the geometry topological analysis carried out for external contoured three-dimensional model, Ke Yiyou
Designer is voluntarily arranged, as long as can be according to the corresponding connection for customizing mold of result and PC components of geometry topological analysis
And/or fixed requirement, the corresponding threedimensional model for customizing mold of PC components is generated, the present embodiment does not do this any restrictions.
It should be noted that the corresponding connection for customizing mold of PC components and/or fixed requirement can be staff
The content of input, or according to the content of the threedimensional model of PC components or outer profile obtaining three-dimensional model, the present embodiment pair
This does not do any restrictions.
Preferably, it due to same customization mold, may apply in the mold design of disparity items, after this step also
May include the step of storing the corresponding threedimensional model for customizing mold of the PC components of generation to database, that is, customizing
Change the threedimensional model of mold after first time is molded, also can record in the database alternately, it is same fixed to have again next time
It can conveniently be transferred when inhibition and generation mold.
Specifically, can also include generating the corresponding graphics for customizing mold of PC components, construction diagrams after this step
And the step of plan view, and the step of generating the building block inventory and fixing piece inventory needed for configuration and customization mold.This reality
It is unrestricted to this to apply example.
In the present embodiment, the embodiment of the present invention carries out geometry topological analysis by external contoured three-dimensional model, according to PC structures
The corresponding connection for customizing mold of part and/or fixed requirement generate the corresponding threedimensional model for customizing mold of PC components, can
To be designed to the threedimensional model for customizing the customization mold of PC components according to outer profile threedimensional model, reduce work people
The workload of member, improves the efficiency of mold design, reduces mold design delivery time and cost.
Referring to FIG. 3, a kind of structure chart for mold design device based on BIM that Fig. 3 is provided by the embodiment of the present invention.
The device may include：
Acquisition module 100, the outer profile threedimensional model for obtaining PC components；
Judgment module 200 whether there is corresponding mould for judging according to outer profile threedimensional model in die parameters library
Has information；
First generation module 300, if for there are corresponding die informations in die parameters library, according to PC components
Parameter and die information generate the threedimensional model of the corresponding mold of PC components.
Optionally, judgment module 200 may include：
Judging submodule, for going out muscle information according to the outer profile information of PC components, built-in fitting in outer profile threedimensional model
With edge quit a post and thus leave it vacant information, judge to whether there is corresponding die information in die parameters library.
Optionally, which can also include：
Second generation module, if for corresponding die information, external contoured three-dimensional to be not present in die parameters library
Model carries out geometry topological analysis, according to the corresponding connection for customizing mold of PC components and/or fixed requirement, generates PC components
The corresponding threedimensional model for customizing mold.
Optionally, which can also include：
Memory module, for storing the corresponding threedimensional model for customizing mold of the PC components of generation to database.
In the present embodiment, the embodiment of the present invention obtains the outer profile threedimensional model of PC components by acquisition module 100, can be with
The outer profile threedimensional model of PC components is obtained using BIM；Judge that mold is joined according to outer profile threedimensional model by judgment module 200
It whether there is corresponding die information in numberization library, can parameterize library lookup in the tool of the pin-connected panel PC components pre-established is
It is no that there are the die informations of corresponding same type；It is raw by the first generation module 300 according to the parameter and die information of PC components
At the threedimensional model of the corresponding mold of PC components, the PC structures can be determined according to the parameter of the die information and PC components that find
The threedimensional model of the mold of part reduces the workload of staff, improves mold to complete the mold design of PC components
The efficiency of design reduces mold design delivery time and cost.
Each embodiment is described by the way of progressive in specification, the highlights of each of the examples are with other realities
Apply the difference of example, just to refer each other for identical similar portion between each embodiment.For device disclosed in embodiment
Speech, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related place is referring to method part illustration
.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, depends on the specific application and design constraint of technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond the scope of this invention.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor
The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit
Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology
In any other form of storage medium well known in field.
The die design method provided by the present invention based on BIM and device are described in detail above.Herein
Applying specific case, principle and implementation of the present invention are described, and the explanation of above example is only intended to help
Understand the method and its core concept of the present invention.It should be pointed out that for those skilled in the art, not taking off
, can be with several improvements and modifications are made to the present invention under the premise of from the principle of the invention, these improvement and modification also fall into this
In invention scope of the claims.
Claims (10)
1. a kind of die design method based on BIM, which is characterized in that including：
Obtain the outer profile threedimensional model of PC components；
Judged to whether there is corresponding die information in die parameters library according to the outer profile threedimensional model；
If so, according to the parameter of the PC components and the die information, the three-dimensional of the corresponding mold of the PC components is generated
Model.
2. the die design method according to claim 1 based on BIM, which is characterized in that described according to the outer profile
Threedimensional model judge in die parameters library whether there is corresponding die information, including：
Go out muscle information and edge quit a post and thus leave it vacant letter according to the outer profile information of PC components, built-in fitting described in the outer profile threedimensional model
Breath judges to whether there is corresponding die information in the die parameters library.
3. the die design method according to claim 2 based on BIM, which is characterized in that described to generate the PC components
After the threedimensional model of corresponding mold, further include：
Generate graphics, construction diagrams and the plan view of the corresponding mold of the PC components.
4. the die design method according to claim 3 based on BIM, which is characterized in that described to generate the PC components
After the threedimensional model of corresponding mold, further include：
Generate the building block inventory and fixing piece inventory configured needed for the mold.
5. the die design method according to any one of claims 1 to 4 based on BIM, which is characterized in that described according to institute
It states outer profile threedimensional model to judge after whether there is corresponding die information in die parameters library, further includes：
If corresponding die information is not present in the die parameters library, geometry is carried out to the outer profile threedimensional model and is opened up
Analysis is flutterred, according to the corresponding connection for customizing mold of the PC components and/or fixed requirement, it is corresponding to generate the PC components
Customize the threedimensional model of mold.
6. the die design method according to claim 5 based on BIM, which is characterized in that generate the PC components and correspond to
Customization mold threedimensional model after, further include：
The corresponding threedimensional model for customizing mold of the PC components of generation is stored to database.
7. a kind of mold design device based on BIM, which is characterized in that including：
Acquisition module, the outer profile threedimensional model for obtaining PC components；
Judgment module, for judging to believe with the presence or absence of corresponding mold in die parameters library according to the outer profile threedimensional model
Breath；
First generation module, if for there are corresponding die informations in the die parameters library, according to the PC components
Parameter and the die information, generate the threedimensional model of the corresponding mold of the PC components.
8. the mold design device according to claim 7 based on BIM, which is characterized in that the judgment module, including：
Judging submodule, for going out muscle according to the outer profile information of PC components, built-in fitting described in the outer profile threedimensional model
Information and edge quit a post and thus leave it vacant information judge to whether there is corresponding die information in the die parameters library.
9. the mold design device according to claim 7 or 8 based on BIM, which is characterized in that further include：
Second generation module, if for corresponding die information to be not present in the die parameters library, to the outer profile
Threedimensional model carries out geometry topological analysis, raw according to the corresponding connection for customizing mold of the PC components and/or fixed requirement
At the corresponding threedimensional model for customizing mold of the PC components.
10. the mold design device according to claim 9 based on BIM, which is characterized in that further include：
Memory module, for storing the corresponding threedimensional model for customizing mold of the PC components generated to database.
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| CN109684735A (en) * | 2018-12-26 | 2019-04-26 | 中民筑友科技投资有限公司 | Rebar model generation method, system, device and storage medium in component model |
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| CN110704907A (en) * | 2019-09-18 | 2020-01-17 | 贵州匠人筑造工程咨询有限公司 | BIM-based fabricated floor design method and system |
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| CN112131643A (en) * | 2020-09-17 | 2020-12-25 | 重庆中科建设（集团）有限公司 | BIM-based PC component arrangement method and system |
| CN112131643B (en) * | 2020-09-17 | 2022-11-22 | 重庆中科建设（集团）有限公司 | BIM-based PC component arrangement method and system |
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