CN108424721A - A kind of preparation method of heat radiation coating for computer - Google Patents
A kind of preparation method of heat radiation coating for computer Download PDFInfo
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- CN108424721A CN108424721A CN201810270143.2A CN201810270143A CN108424721A CN 108424721 A CN108424721 A CN 108424721A CN 201810270143 A CN201810270143 A CN 201810270143A CN 108424721 A CN108424721 A CN 108424721A
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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- C08G77/04—Polysiloxanes
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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Abstract
The present invention provides a kind of preparation method of the heat radiation coating for computer, includes the following steps:A, by aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube co-grinding, then ball milling, drying, material one is obtained;B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports in reaction kettle, heating, stirring obtain material two;C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, carries out dehydration condensation, added surfactant and silane coupling agent is uniformly mixed, obtain material three;D, material two, material three, anticorrosive packing and deionized water are mixed, is dispersed with stirring uniformly.Heat radiation coating prepared by the present invention has high thermal conductivity coefficient, good adhesive force and impact resistance.
Description
Technical field
The invention belongs to heat radiation coating technical fields, and in particular to a kind of preparation side of heat radiation coating for computer
Method.
Background technology
With the high speed development of electronic technology and the increasingly raising of people's consumption demand, electronic product just towards high power,
Highly integrated, miniaturization direction is developed, higher and higher so as to cause the operating temperature of electronic device, if heat-sinking capability is insufficient,
The operating temperature of electronic device will be caused to be substantially increased, and then directly affect the performance, stability and service life of device.
Number of patent application CN200810146607.5 discloses " a kind of heat radiation coating and preparation method thereof ", which includes
Following raw material:Silicones, solvent, anti-settling agent, zinc oxide, silicon carbide, aluminium powder, dispersant and smooth agent, preparation method include
Following steps:(a)Silicones and more than one solvents are provided, and so that it is sufficiently mixed to form the first mixed solution;(b)Add again
Add Zinc oxide powder in first mixed solution and be sufficiently mixed, forms the second mixed solution;(c)Add silicon carbide powder and
Aluminium powder is in the second mixed solution and is sufficiently mixed, and forms third mixed solution;(d)Anti-settling agent and dispersant are added in the third
Mixed solution is simultaneously sufficiently mixed to form heat radiation coating, which, which can be directly coated on radiator, can increase its heat dissipation
Area, with improving radiating effect.Although can be seen that existing heat radiation coating from above-mentioned technology achieves good achievement,
Still it is faced with some technical problems urgently to be resolved hurrily, mainly inorganic filler particle used in heat radiation coating and Matrix Match not
Good, poor so as to cause the coating adhesion of formation, mechanical performance is bad, and coating can not be used for a long time at relatively high temperatures.
In summary, it is therefore desirable to which a kind of better heat radiation coating improves the deficiencies in the prior art.
Invention content
The object of the present invention is to provide a kind of preparation method of the heat radiation coating for computer, heat dissipation prepared by the present invention
Coating simple, safety, ring with high thermal conductivity coefficient, good adhesive force and impact resistance, good heat dissipation effect, and preparation process
It protects.
The present invention provides the following technical solutions:
A kind of preparation method of heat radiation coating for computer, including following preparation process:
A, aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube are mixed, imports in pulverizer and crushes 30-
40min, then ball milling 3-4h in ball mill is imported, it is transferred in 100-120 DEG C of drying box dry 20-30min, obtains material one;
B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports anti-
It answers in kettle, under nitrogen protection, is heated to 85-90 DEG C, be stirred to react 15-25min, then be warming up to 100-110 DEG C and be stirred to react
1-2h obtains material two;
C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, under the protection of argon gas, is heated to 130-135 DEG C
Dehydration condensation 1-2h is carried out, surfactant is added and silane coupling agent is uniformly mixed, obtain material three;
D, material two, material three, anticorrosive packing and deionized water are uniformly mixed, are stirred under the rotating speed of 1200-1600r/min
Disperse 20-30min, you can obtain finished product.
Preferably, the preparation method of the aluminum nitride powder of the step a is:Carbon, calcirm-fluoride and aluminium oxide are uniformly mixed, added
Enter into tube furnace, under nitrogen atmosphere, be heated to 1700-1750 DEG C, keeps reaction 3-4h, be cooled to 700-800 DEG C, lead to
Enter air, calcines 2-3h, you can obtain aluminum nitride powder.
Preferably, the preparation method of the modified carbon fiber of the step a is:Asphalt base carbon fiber long filament is immersed in silane
In coupling agent KH560 aqueous solutions, 1-2h is reacted under 80-90 DEG C of heating water bath, and after filtering, filter residue is placed in Muffle furnace,
It is heated to 1000-1100 DEG C, 20-30min is reacted, after being cooled to room temperature, is transferred to ball milling 3-5h in ball mill, you can be modified
Carbon fiber.
Preferably, the dispersant of the step b is propylene glycol methyl ether acetate and ethylene bis stearamide in mass ratio 3:2
Mixture.
Preferably, the preparation method of the organic siliconresin of the step c is:By methyltriethoxysilane, Catalyzed by Formic Acid
Agent and deionized water mixing, polymerisation is carried out at 70-90 DEG C, is evaporated under reduced pressure after reaction, you can is obtained organic
Silicones.
Preferably, the surfactant of the step c is the mixture of lauryl amine propionate and sulfobetaines.
Preferably, the silane coupling agent of the step c is isobutyl triethoxy silane and gamma-aminopropyl-triethoxy silicon
The mixture of alkane.
Preferably, the anticorrosive packing of the step d is the mixture of trbasic zinc phosphate, modified zinc phosphate and zinc molybdate.
The beneficial effects of the invention are as follows:
Heat radiation coating prepared by the present invention has excellent heat dissipation performance, is coated in substrate surface, and it is higher scattered can to form hardness
Hot coating, while coating adhesion is higher, mechanical performance is excellent, and high temperature resistance is good, and the heat dissipation of playing of energy long-term temperature is made
With effectively extending the service life of basis material, and there is high thermal conductivity coefficient and impact resistance, preparation process is simple, peace
Entirely, environmentally friendly, it is suitble to large-scale promotion production.
Methyl phenyl vinyl polysiloxane in the present invention has high thermal conductivity, and using it as matrix, composite modified carbon
The materials such as fiber, aluminium nitride utilize modified carbon fiber, effective overlap joint of aluminium nitride so that whole mixt can be formed well
Heat conduction network, to improve the thermal conductivity of coating entirety.
Specific implementation mode
Embodiment 1
A kind of preparation method of heat radiation coating for computer, including following preparation process:
A, aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube are mixed, imports in pulverizer and crushes 40min, then
Ball milling 4h in ball mill is imported, dry 30min is transferred in 100 DEG C of drying box, obtains material one;
B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports anti-
It answers in kettle, under nitrogen protection, is heated to 90 DEG C, is stirred to react 15min, then be warming up to 110 DEG C and be stirred to react 1h, obtain material
Two;
C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, under the protection of argon gas, is heated to 130 DEG C of progress
Dehydration condensation 2h, adds surfactant and silane coupling agent is uniformly mixed, and obtains material three;
D, material two, material three, anticorrosive packing and deionized water are uniformly mixed, are dispersed with stirring under the rotating speed of 1200r/min
30min, you can obtain finished product.
The preparation method of the aluminum nitride powder of step a is:Carbon, calcirm-fluoride and aluminium oxide are uniformly mixed, tube furnace is added to
In, under nitrogen atmosphere, 1700 DEG C are heated to, keep reaction 4h, be cooled to 800 DEG C, be passed through air, calcine 3h, you can
To aluminum nitride powder.
The preparation method of the modified carbon fiber of step a is:Asphalt base carbon fiber long filament is immersed in silane coupling agent KH560
In aqueous solution, 1h is reacted under 80 DEG C of heating water bath, after filtering, filter residue is placed in Muffle furnace, is heated to 1000 DEG C, reaction
30min after being cooled to room temperature, is transferred to ball milling 3h in ball mill, you can obtain modified carbon fiber.
The dispersant of step b is propylene glycol methyl ether acetate and ethylene bis stearamide in mass ratio 3:2 mixture.
The preparation method of the organic siliconresin of step c is:By methyltriethoxysilane, Catalyzed by Formic Acid agent and deionized water
Mixing, polymerisation is carried out at 90 DEG C, is evaporated under reduced pressure after reaction, you can obtains organic siliconresin.
The surfactant of step c is the mixture of lauryl amine propionate and sulfobetaines.
The silane coupling agent of step c is the mixture of isobutyl triethoxy silane and gamma-aminopropyl-triethoxy-silane.
The anticorrosive packing of step d is the mixture of trbasic zinc phosphate, modified zinc phosphate and zinc molybdate.
Embodiment 2
A kind of preparation method of heat radiation coating for computer, including following preparation process:
A, aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube are mixed, imports in pulverizer and crushes 30min, then
Ball milling 3h in ball mill is imported, dry 20min is transferred in 100 DEG C of drying box, obtains material one;
B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports anti-
It answers in kettle, under nitrogen protection, is heated to 85 DEG C, is stirred to react 15min, then be warming up to 100 DEG C and be stirred to react 1h, obtain material
Two;
C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, under the protection of argon gas, is heated to 130 DEG C of progress
Dehydration condensation 2h, adds surfactant and silane coupling agent is uniformly mixed, and obtains material three;
D, material two, material three, anticorrosive packing and deionized water are uniformly mixed, are dispersed with stirring under the rotating speed of 1200r/min
20min, you can obtain finished product.
The preparation method of the aluminum nitride powder of step a is:Carbon, calcirm-fluoride and aluminium oxide are uniformly mixed, tube furnace is added to
In, under nitrogen atmosphere, 1700 DEG C are heated to, keep reaction 3h, be cooled to 700 DEG C, be passed through air, calcine 2h, you can
To aluminum nitride powder.
The preparation method of the modified carbon fiber of step a is:Asphalt base carbon fiber long filament is immersed in silane coupling agent KH560
In aqueous solution, 1h is reacted under 80 DEG C of heating water bath, after filtering, filter residue is placed in Muffle furnace, is heated to 1000 DEG C, reaction
20min after being cooled to room temperature, is transferred to ball milling 3h in ball mill, you can obtain modified carbon fiber.
The dispersant of step b is propylene glycol methyl ether acetate and ethylene bis stearamide in mass ratio 3:2 mixture.
The preparation method of the organic siliconresin of step c is:By methyltriethoxysilane, Catalyzed by Formic Acid agent and deionized water
Mixing, polymerisation is carried out at 70 DEG C, is evaporated under reduced pressure after reaction, you can obtains organic siliconresin.
The surfactant of step c is the mixture of lauryl amine propionate and sulfobetaines.
The silane coupling agent of step c is the mixture of isobutyl triethoxy silane and gamma-aminopropyl-triethoxy-silane.
The anticorrosive packing of step d is the mixture of trbasic zinc phosphate, modified zinc phosphate and zinc molybdate.
Embodiment 3
A kind of preparation method of heat radiation coating for computer, including following preparation process:
A, aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube are mixed, imports in pulverizer and crushes 40min, then
Ball milling 4h in ball mill is imported, dry 30min is transferred in 120 DEG C of drying box, obtains material one;
B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports anti-
It answers in kettle, under nitrogen protection, is heated to 90 DEG C, is stirred to react 25min, then be warming up to 110 DEG C and be stirred to react 2h, obtain material
Two;
C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, under the protection of argon gas, is heated to 135 DEG C of progress
Dehydration condensation 2h, adds surfactant and silane coupling agent is uniformly mixed, and obtains material three;
D, material two, material three, anticorrosive packing and deionized water are uniformly mixed, are dispersed with stirring under the rotating speed of 1600r/min
30min, you can obtain finished product.
The preparation method of the aluminum nitride powder of step a is:Carbon, calcirm-fluoride and aluminium oxide are uniformly mixed, tube furnace is added to
In, under nitrogen atmosphere, 1750 DEG C are heated to, keep reaction 4h, be cooled to 800 DEG C, be passed through air, calcine 3h, you can
To aluminum nitride powder.
The preparation method of the modified carbon fiber of step a is:Asphalt base carbon fiber long filament is immersed in silane coupling agent KH560
In aqueous solution, 2h is reacted under 90 DEG C of heating water bath, after filtering, filter residue is placed in Muffle furnace, is heated to 1100 DEG C, reaction
30min after being cooled to room temperature, is transferred to ball milling 5h in ball mill, you can obtain modified carbon fiber.
The dispersant of step b is propylene glycol methyl ether acetate and ethylene bis stearamide in mass ratio 3:2 mixture.
The preparation method of the organic siliconresin of step c is:By methyltriethoxysilane, Catalyzed by Formic Acid agent and deionized water
Mixing, polymerisation is carried out at 90 DEG C, is evaporated under reduced pressure after reaction, you can obtains organic siliconresin.
The surfactant of step c is the mixture of lauryl amine propionate and sulfobetaines.
The silane coupling agent of step c is the mixture of isobutyl triethoxy silane and gamma-aminopropyl-triethoxy-silane.
The anticorrosive packing of step d is the mixture of trbasic zinc phosphate, modified zinc phosphate and zinc molybdate.
Heat radiation coating prepared by above example is detected, following experimental data is obtained:
Table one:
Project | Embodiment 1 | Embodiment 2 | Embodiment 3 |
Temperature tolerance(℃) | 715 | 680 | 690 |
Adhesive force(Grade) | 1 | 1 | 1 |
Impact resistance(cm·kg) | 64 | 68 | 69 |
Thermal coefficient(W/m·k) | 13 | 14 | 12 |
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to the foregoing embodiments
Invention is explained in detail, for those skilled in the art, still can be to foregoing embodiments institute
The technical solution of record is modified or equivalent replacement of some of the technical features.It is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of preparation method of heat radiation coating for computer, which is characterized in that including following preparation process:
A, aluminum nitride powder, modified carbon fiber, Nickel Aluminium Alloy Powder and carbon nanotube are mixed, imports in pulverizer and crushes 30-
40min, then ball milling 3-4h in ball mill is imported, it is transferred in 100-120 DEG C of drying box dry 20-30min, obtains material one;
B, methyl phenyl vinyl polysiloxane, polycarbonate waterborne polyurethane and dispersant are added into material one, imports anti-
It answers in kettle, under nitrogen protection, is heated to 85-90 DEG C, be stirred to react 15-25min, then be warming up to 100-110 DEG C and be stirred to react
1-2h obtains material two;
C, organic siliconresin, ethyl acetate and titanate catalyst are mixed, under the protection of argon gas, is heated to 130-135 DEG C
Dehydration condensation 1-2h is carried out, surfactant is added and silane coupling agent is uniformly mixed, obtain material three;
D, material two, material three, anticorrosive packing and deionized water are uniformly mixed, are stirred under the rotating speed of 1200-1600r/min
Disperse 20-30min, you can obtain finished product.
2. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
Suddenly the preparation method of the aluminum nitride powder of a is:Carbon, calcirm-fluoride and aluminium oxide are uniformly mixed, are added in tube furnace, in nitrogen atmosphere
Under enclosing, it is heated to 1700-1750 DEG C, reaction 3-4h is kept, is cooled to 700-800 DEG C, be passed through air, calcine 2-3h, you can
Obtain aluminum nitride powder.
3. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
Suddenly the preparation method of the modified carbon fiber of a is:Asphalt base carbon fiber long filament is immersed in silane coupling agent KH560 aqueous solutions,
1-2h is reacted under 80-90 DEG C of heating water bath, after filtering, filter residue is placed in Muffle furnace, is heated to 1000-1100 DEG C, instead
20-30min is answered, after being cooled to room temperature, is transferred to ball milling 3-5h in ball mill, you can obtain modified carbon fiber.
4. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
The dispersant of rapid b is propylene glycol methyl ether acetate and ethylene bis stearamide in mass ratio 3:2 mixture.
5. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
Suddenly the preparation method of the organic siliconresin of c is:Methyltriethoxysilane, Catalyzed by Formic Acid agent and deionized water are mixed, in 70-
Polymerisation is carried out at 90 DEG C, is evaporated under reduced pressure after reaction, you can obtains organic siliconresin.
6. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
The surfactant of rapid c is the mixture of lauryl amine propionate and sulfobetaines.
7. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
The silane coupling agent of rapid c is the mixture of isobutyl triethoxy silane and gamma-aminopropyl-triethoxy-silane.
8. a kind of preparation method of heat radiation coating for computer according to claim 1, which is characterized in that the step
The anticorrosive packing of rapid d is the mixture of trbasic zinc phosphate, modified zinc phosphate and zinc molybdate.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111118380A (en) * | 2020-02-20 | 2020-05-08 | 黄河水利职业技术学院 | Carbon nano tube and phosphate synergistic enhanced nickel-aluminum-based composite material and preparation method thereof |
CN111545424A (en) * | 2020-04-28 | 2020-08-18 | 李志杰 | Computer CPU heat conduction silicone grease obliterator |
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2018
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111118380A (en) * | 2020-02-20 | 2020-05-08 | 黄河水利职业技术学院 | Carbon nano tube and phosphate synergistic enhanced nickel-aluminum-based composite material and preparation method thereof |
CN111118380B (en) * | 2020-02-20 | 2021-02-05 | 黄河水利职业技术学院 | Carbon nano tube and phosphate synergistic enhanced nickel-aluminum-based composite material and preparation method thereof |
CN111545424A (en) * | 2020-04-28 | 2020-08-18 | 李志杰 | Computer CPU heat conduction silicone grease obliterator |
CN111545424B (en) * | 2020-04-28 | 2022-01-18 | 中科视拓(南京)科技有限公司 | Computer CPU heat conduction silicone grease obliterator |
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