CN108396345A - A kind of lead-antimony alloy electroplate liquid and electroplating technology - Google Patents
A kind of lead-antimony alloy electroplate liquid and electroplating technology Download PDFInfo
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- CN108396345A CN108396345A CN201810535574.7A CN201810535574A CN108396345A CN 108396345 A CN108396345 A CN 108396345A CN 201810535574 A CN201810535574 A CN 201810535574A CN 108396345 A CN108396345 A CN 108396345A
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- lead
- electroplate liquid
- antimony
- electroplating technology
- antimony alloy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of lead-antimony alloy electroplate liquid and electroplating technologies.The lead-antimony alloy electroplate liquid of the present invention is composed of the following components based on every liter：160 180g of fluoboric acid, 10 15g of boric acid, lead monoxide 10g 25g, potassium antimony tartrate 3g 9g, additive 2g 5g, surplus is water.It is as follows using the electroplating technology of above-mentioned lead-antimony alloy electroplate liquid：Copper sheet is successively after oil removing, pickling, polishing and activation process, and copper sheet is 30 50 DEG C, current density D in temperature as cathode using after activationKFor 0.5 3A/dm2Under conditions of plating, final plating solution copper sheet surface formed lead-antimony alloy coating.The present invention can get the coating of fine uniform, while control the content of the antimony in composite deposite.
Description
Technical field
The invention belongs to electroplating technologies, specifically, are related to a kind of lead-antimony alloy electroplate liquid and electroplating technology.
Background technology
With the rapid development of society, people propose increasingly higher demands to the performance of material surface.In the past mainly according to
Method by monometallic coating cannot meet to coat of metal performance requirement and growing needs.
Lead-antimony alloy coating is a kind of coating that corrosion resistance mechanical property is good, and lead-antimony alloy is made in lead-acid accumulator
It is widely used for grid.But currently, Pb-Sb grid mainly use fusion-cast method prepare, although this technique at
Ripe, operation is comparatively relatively simple, but the raw material that this preparation method is consumed are more, and the lead-acid accumulator matter made
Amount is big, and battery energy density is low, and it is not very convenient in certain practical applications to cause.If can be made by the method for electro-deposition
Standby lead-antimony alloy coating, can greatly increase the application range of lead-antimony alloy.For example, if alloy-layer is applied the base material in aluminium
On, it can not only reduce the weight of lead-acid battery, reduce the usage amount of lead, but also the corrosion resistance of electrode can be improved.If will
Alloy layer is used in the piece surface for needing high anticorrosive property, can reduce the usage amount of lead, delay the rate of component corrosion, right
Environmental beneficial.
Invention content
For overcome the deficiencies in the prior art, it is an object of the invention to propose a kind of lead-antimony alloy electroplate liquid and galvanizer
Skill.Electroplating technology of the present invention can power in bright Copper substrate and deposit that working current density is wider, lead antimony of good corrosion resistance
Alloy layer.The electroplate liquid composition of the present invention is simple, and plating solution facilitates preparation, and bath stability is good, is not necessarily to during plating
Stirring, operating procedure are simple.
Technical scheme of the present invention is specifically described as follows.
The present invention provides a kind of lead-antimony alloy electroplate liquid, composed of the following components based on every liter of electroplate liquid：Fluoboric acid
160-180g, boric acid 10-15g, lead monoxide 10g-25g, potassium antimony tartrate 3g-9g, animal glue 2g-5g, surplus are water.
The present invention also provides a kind of electroplating technologies for adopting above-mentioned lead-antimony alloy electroplate liquid, are as follows：
By copper sheet successively after oil removing, pickling, polishing and activation process, copper sheet is in temperature as cathode using after activation
30-50 DEG C, current density DKFor 0.5-3A/dm2Under conditions of plating, final electroplate liquid copper sheet surface formed lead-antimony alloy plating
Layer.
In the present invention, when oil removing, 15-25min is impregnated in 35-45 DEG C of degreaser, contains NaOH 18- in degreaser
22wt%, Na2CO312-16wt%.
In the present invention, when pickling, 20-40s is impregnated in 30-40 DEG C of pickle, contains 35- in every liter of pickle
The 45mL98wt% concentrated sulfuric acids, surplus are water.
In the present invention, when polishing, 40-60s is impregnated in 30-40 DEG C of polishing fluid, contains oxalic acid 35- in every liter of polishing fluid
45g, NaOH15-20g, 30wt% hydrogen peroxide 120mL, surplus are water.
In the present invention, when activation, in the H that mass percent concentration is 4-6wt%2SO445-75s is activated in aqueous solution.
Compared to the prior art, the beneficial effects of the present invention are：In the plating solution that the electroplating technology of the present invention uses, an oxygen
Change lead and potassium antimony tartrate and provide lead ion and antimony ion to plating solution, in the present invention, by changing the lead in plating solution, antimony ion
Molar concentration rate, the antimony content that may be implemented in coating change between 9-11%.Additive determines the quality of quality of coating.Energy
Cathodic polarization is improved, so that coating is refined, while the dispersibility of plating solution can be improved.Test piece test result shows to be added a certain amount of
Additive animal glue, can get fine uniform coating.
Description of the drawings
Fig. 1 is the SEM figures of lead-coat obtained by the plating solution without Sb doped in comparative example 1.
Fig. 2 is the SEM figures of plating solution gained lead-coat additive-free in comparative example 2.
Specific implementation mode
The technical solution further illustrated the present invention below by specific embodiment.
In embodiment, the preparation method of electroplate liquid is as follows：Fluoborate solution needed for being first added in certain water, then exists
Under conditions of stirring, required boric acid is added, persistently stirs to dissolve.It is to be dissolved completely after, potassium antimony tartrate side is stirred
While being slowly added into fluoborate solution to being completely dissolved；Then load weighted lead monoxide is slowly added to, is stirred to clarify,
Additive is added；Distilled water is finally added to required volume.Chemical reagent used is that analysis is pure during electroplate liquid is prepared.
In embodiment, copper sheet is specific as follows first through oil removing, pickling, polishing and activation process：
Step 1. oil removing：20min is impregnated in 40 DEG C of degreaser, composition of raw materials is following (mass fraction)：NaOH
20%, Na2CO315%.
Step 2. pickling：30s is impregnated in 35 DEG C of pickle, composition of raw materials is as follows： H2SO440mL/L, remaining is
Distilled water.
Step 3. polishes：50s is impregnated in 35 DEG C of polishing fluid, composition of raw materials is as follows：Oxalic acid 40g/L, NaOH 18g/
L, hydrogen peroxide 120mL/L, remaining is distilled water.
Step 4. activates：The H for being 5% in mass percent concentration2SO41min is activated in aqueous solution.
Comparative example 1
A kind of electroplating technology of lead, plating solution group become：
Under this condition, the pure lead obtained, Deposit appearance fine uniform (see Fig. 1) is strong with basal body binding force, not easily to fall off
With crack, illustrate that the technique can succeed lead plating.
Comparative example 2
A kind of electroplating technology of metal, plating solution group become：
Under this condition, the coating crystalline particle obtained is larger (Fig. 2), and the long dendrite in edge of model, illustrates additive
The presence of animal glue can increase cathodic polarization, play a significant role to crystal grain refinement.
Embodiment 1
A kind of electroplating technology of lead-antimony alloy, plating solution group become：
Under this condition, the coating antimony content obtained is 9% or so, Deposit appearance fine uniform, with not additive
Plating solution obtains coating (Fig. 2) and is compared with pure lead-coat (Fig. 1), and the crystal grain of lead-antimony alloy coating becomes smaller, and illustrates that the co-deposition of antimony makes
The crystal grain of coating obtains a degree of refinement.The coating and basal body binding force are strong, not easily to fall off and crack, coating tool
There is good corrosion resistance.
Embodiment 2
A kind of electroplating technology of lead-antimony alloy, plating solution group become：
Under this condition, the coating antimony content obtained is 11% or so, Deposit appearance fine uniform, with pure lead-coat (figure
1) it compares, the crystal grain of coating becomes smaller, and illustrates that the co-deposition of antimony makes the crystal grain of coating obtain a degree of refinement.The coating with
Basal body binding force is strong, not easily to fall off and crack, which has good corrosion resistance.
Embodiment 3
A kind of electroplating technology of lead-antimony alloy, plating solution group become：
Under this condition, the coating antimony content obtained is 10% or so, Deposit appearance fine uniform, with pure lead-coat (figure
1) it compares, the crystal grain of coating becomes smaller, and illustrates that the co-deposition of antimony makes the crystal grain of coating obtain a degree of refinement.The coating with
Basal body binding force is strong, not easily to fall off and crack, which has good corrosion resistance.
Claims (6)
1. a kind of lead-antimony alloy electroplate liquid, which is characterized in that composed of the following components based on every liter of electroplate liquid：Fluoboric acid
160-180g, boric acid 10-15g, lead monoxide 10g-25g, potassium antimony tartrate 3g-9g, animal glue 2g-5g, surplus are water.
2. a kind of electroplating technology using lead-antimony alloy electroplate liquid described in claim 1, which is characterized in that specific steps are such as
Under：By copper sheet successively after oil removing, pickling, polishing and activation process, copper sheet is 30-50 in temperature as cathode using after activation
DEG C, current density DKFor 0.5-3A/dm2Under conditions of plating, final electroplate liquid copper sheet surface formed lead-antimony alloy coating.
3. electroplating technology according to claim 2, which is characterized in that when oil removing, impregnated in 35-45 DEG C of degreaser
15-25min contains NaOH 18-22wt%, Na in degreaser2CO312-16wt%.
4. electroplating technology according to claim 2, which is characterized in that when pickling, impregnated in 30-40 DEG C of pickle
20-40s contains the 35-45mL98wt% concentrated sulfuric acids in every liter of pickle, and surplus is water.
5. electroplating technology according to claim 2, which is characterized in that when polishing, impregnated in 30-40 DEG C of polishing fluid
40-60s, containing oxalic acid 35-45g, NaOH 15-20g, 30wt% hydrogen peroxide 120mL in every liter of polishing fluid, surplus is water.
6. electroplating technology according to claim 2, which is characterized in that be 4-6wt% in mass percent concentration when activation
H2SO445-75s is activated in aqueous solution.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113346090A (en) * | 2021-05-27 | 2021-09-03 | 上海应用技术大学 | Lead-containing plating brass-based storage battery grid plate material and preparation method and application thereof |
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| CN101608326A (en) * | 2009-04-03 | 2009-12-23 | 昆明理工大学 | The method of aluminium and aluminum alloy surface Direct Electroplating lead |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN102424993A (en) * | 2011-12-07 | 2012-04-25 | 广东韶配动力机械有限公司 | Method for plating ternary alloy layer on aluminum-silicon alloy and product thereof |
| CN102433581A (en) * | 2011-12-05 | 2012-05-02 | 昆明理工恒达科技有限公司 | Method for preparing novel anode material for electro-deposition of nonferrous metals |
| CN102586801A (en) * | 2012-03-09 | 2012-07-18 | 山东大学 | Method for preparing novel Ti-substrate PbO2 electrode |
| CN102747408A (en) * | 2012-07-12 | 2012-10-24 | 内蒙古第一机械集团有限公司 | Lead-based multivariant alloy electroplating anode |
| CN105506368A (en) * | 2015-12-15 | 2016-04-20 | 郴州市金贵银业股份有限公司 | Lead grating plate alloy and preparing method thereof |
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2018
- 2018-05-29 CN CN201810535574.7A patent/CN108396345A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101235526A (en) * | 2007-11-01 | 2008-08-06 | 华侨大学 | Plating liquor for electroplating low-antimony-lead alloy and preparation method thereof |
| CN101608326A (en) * | 2009-04-03 | 2009-12-23 | 昆明理工大学 | The method of aluminium and aluminum alloy surface Direct Electroplating lead |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN102433581A (en) * | 2011-12-05 | 2012-05-02 | 昆明理工恒达科技有限公司 | Method for preparing novel anode material for electro-deposition of nonferrous metals |
| CN102424993A (en) * | 2011-12-07 | 2012-04-25 | 广东韶配动力机械有限公司 | Method for plating ternary alloy layer on aluminum-silicon alloy and product thereof |
| CN102586801A (en) * | 2012-03-09 | 2012-07-18 | 山东大学 | Method for preparing novel Ti-substrate PbO2 electrode |
| CN102747408A (en) * | 2012-07-12 | 2012-10-24 | 内蒙古第一机械集团有限公司 | Lead-based multivariant alloy electroplating anode |
| CN105506368A (en) * | 2015-12-15 | 2016-04-20 | 郴州市金贵银业股份有限公司 | Lead grating plate alloy and preparing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113346090A (en) * | 2021-05-27 | 2021-09-03 | 上海应用技术大学 | Lead-containing plating brass-based storage battery grid plate material and preparation method and application thereof |
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Application publication date: 20180814 |