CN108395561A - Packaging protection film and preparation method thereof - Google Patents
Packaging protection film and preparation method thereof Download PDFInfo
- Publication number
- CN108395561A CN108395561A CN201810264953.7A CN201810264953A CN108395561A CN 108395561 A CN108395561 A CN 108395561A CN 201810264953 A CN201810264953 A CN 201810264953A CN 108395561 A CN108395561 A CN 108395561A
- Authority
- CN
- China
- Prior art keywords
- organic layer
- coating fluid
- protection film
- packaging protection
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000012044 organic layer Substances 0.000 claims abstract description 138
- 239000010410 layer Substances 0.000 claims abstract description 77
- 239000011248 coating agent Substances 0.000 claims abstract description 70
- 238000000576 coating method Methods 0.000 claims abstract description 70
- 239000012530 fluid Substances 0.000 claims abstract description 54
- 238000001723 curing Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229920001225 polyester resin Polymers 0.000 claims description 9
- 239000004645 polyester resin Substances 0.000 claims description 9
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229910020776 SixNy Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 9
- 230000001681 protective effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 53
- -1 polyethylene terephthalate Polymers 0.000 description 20
- 229920001296 polysiloxane Polymers 0.000 description 17
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 239000002270 dispersing agent Substances 0.000 description 10
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical group [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000005543 nano-size silicon particle Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- UNIYDALVXFPINL-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propylsilicon Chemical compound CC(=C)C(=O)OCCC[Si] UNIYDALVXFPINL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- MCEBKLYUUDGVMD-UHFFFAOYSA-N [SiH3]S(=O)=O Chemical compound [SiH3]S(=O)=O MCEBKLYUUDGVMD-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000008431 aliphatic amides Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 125000000118 dimethyl group Polymers [H]C([H])([H])* 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DNXHEGUUPJUMQT-CBZIJGRNSA-N Estrone Chemical compound OC1=CC=C2[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CCC2=C1 DNXHEGUUPJUMQT-CBZIJGRNSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229920013822 aminosilicone Polymers 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000005313 fatty acid group Chemical group 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920005569 poly(vinylidene fluoride-co-hexafluoropropylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- BAZVSMNPJJMILC-UHFFFAOYSA-N triadimenol Chemical compound C1=NC=NN1C(C(O)C(C)(C)C)OC1=CC=C(Cl)C=C1 BAZVSMNPJJMILC-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/125—Deposition of organic active material using liquid deposition, e.g. spin coating using electrolytic deposition e.g. in-situ electropolymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The present invention relates to a kind of packaging protection film and preparation method thereof, which includes the first organic layer being arranged from inside to outside, flexible substrate layer, inorganic layer, the second organic layer and third organic layer.A kind of preparation method of packaging protection film includes the following steps：First organic layer coating fluid is uniformly coated on flexible parent metal, curing reaction is carried out, is put into vacuum coating equipment, vacuumizes, the second organic layer coating fluid is uniformly coated on inorganic layer surface, is put into baking in baking oven；Third organic layer coating fluid is uniformly coated on the second organic surface, carries out UV curing reactions, forms packaging protection film.Above-mentioned packaging protection film on flexible parent metal by being equipped with four tunics such as the first organic layer, inorganic layer, the second organic layer and third organic layer so that the barrier property of the protective film is preferable, can improve electronic component barrier moisture capacity, improve product quality.
Description
Technical field
The present invention relates to a kind of thin film encapsulation technology fields, more particularly to a kind of packaging protection film and preparation method thereof.
Background technology
In display field, as (abbreviation of Quantum Dot Light Emitting Diodes, is to be not required to QLED
Want the self-luminous technology of additional light source) introducing of display technology and OLED display technologies so that show that the colour gamut of equipment can reach
It is even higher to 100% full gamut, there is better color representation power.OLED and quantum dot in environment steam and oxygen it is non-
Often sensitive, the use of packaging protection film is particularly important.In general, including to the method that electronic component is sealed：In electronics member
Packaging protection film is formed on part, and packaging protection film and electronic component are bonded using epoxy resin, so that electronic component
Each functional layer and steam, oxygen in air etc. at separating.Enter however, the steam in air can penetrate packaging protection film
Electronic component or steam can influence the adhesive property of epoxy resin so that gap is generated between Obstruct membrane and epoxy resin, into
And steam is made to be in direct contact electronic component, to influence the service life of electronic component.
Invention content
Based on this, it is necessary to for current traditional technology there are the problem of, a kind of packaging protection film, barrier property are provided
Preferably, electronic component barrier moisture capacity can be improved, product quality is improved.
The present invention also provides the preparation methods of above-mentioned packaging protection film.
In order to achieve the object of the present invention, the present invention uses following technical scheme：
A kind of packaging protection film, including be arranged from inside to outside the first organic layer, flexible substrate layer, inorganic layer, second have
Machine layer and third organic layer.
Above-mentioned packaging protection film on flexible parent metal by being equipped with the first organic layer, inorganic layer, the second organic layer and the
Four tunic such as three organic layers so that the barrier property of the protective film is preferable, can improve electronic component barrier moisture capacity, improve
Product quality.
First organic layer is vinylidene fluoride-hexafluoropropylene copolymer layer in one of the embodiments,；The flexibility
The material of substrate layer is one kind in PET, PI, PP, PC, PE, PVC, TAC, TPU, PEN；The material of the inorganic layer is nitridation
One or several kinds of combinations in object or oxide；Second organic layer is modified organopolysiloxane resin layer；It is described
Third organic layer is fluorocarbon modified resin layer.
The nitride is SixNy or AlN in one of the embodiments,；The oxide is SiOx or Al2O3。
The thickness of first organic layer is 2 μm~8 μm in one of the embodiments,；The thickness of the flexible substrate layer
Degree is 10 μm~150 μm；The thickness of the inorganic layer is 10nm~300nm；The thickness of second organic layer is 3 μm~20 μ
m；The thickness of the third organic layer is 4 μm~20 μm.
A kind of preparation method of packaging protection film, includes the following steps：
Flexible parent metal and the first organic layer coating fluid are provided, the first organic layer coating fluid is uniformly coated on described soft
Property base material one side, the flexible parent metal with the first organic layer coating fluid is put into baking oven, carry out curing reaction, formed tool
There is the film one of the first organic layer；
Vacuum coating equipment and inorganic layer Coating Materials are provided, the film one is put into the vacuum coating equipment, is taken out
The inorganic layer Coating Materials is plated in side of the film one backwards to first organic layer by vacuum using Vacuum Coating method
Face forms the film two with inorganic layer；
Second organic layer coating fluid is provided, the second organic layer coating fluid is uniformly coated on to the inorganic layer of the film two
Film two with the second organic layer coating fluid is put into baking oven and toasts by surface, forms the film three with the second organic layer；
Third organic layer coating fluid is provided, second that the third organic layer coating fluid is uniformly coated on the film three has
Machine layer surface will carry out UV curing reactions with the film three of third organic layer coating fluid, form packaging protection film.
The solidification temperature of the curing reaction is 120 DEG C in one of the embodiments, hardening time 2min；It is described
The baking temperature of baking is 100 DEG C, baking time 2min.
The Vacuum Coating method is the gas phase of magnetron sputtering method, plasma enhanced chemical in one of the embodiments,
One kind in sedimentation, atom deposition method.
The first organic layer coating fluid includes the component of following parts by weight in one of the embodiments,：
5~25 parts of vinylidene fluoride-hexafluoropropylene copolymer；
10~30 parts of polyester resin；
First 50~70 parts of organic layer solvent.
The second organic layer coating fluid includes the component of following parts by weight in one of the embodiments,：
The third organic layer coating fluid includes the component of following parts by weight in one of the embodiments,：
Description of the drawings
Fig. 1 is a preferred embodiment of the present invention the structural schematic diagram of packaging protection film.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.Keep the understanding to the disclosure more thorough on the contrary, purpose of providing these embodiments is
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Referring to Fig. 1, the packaging protection film 100 of the preferred embodiment for the present invention, including be arranged from inside to outside the
One organic layer 10, flexible substrate layer 20, inorganic layer 30, the second organic layer 40 and third organic layer 50.
The first organic layer 10 is vinylidene fluoride-hexafluoropropylene copolymer layer (PVDF-HFP) in one of the embodiments,；
The material of flexible substrate layer 20 is PET (polyethylene terephthalate), PI (polyimides), PP (polypropylene), PC (poly- carbon
Acid esters), PE (polyethylene), PVC (polyvinyl chloride), TAC (Triafol T), TPU (thermoplastic polyurethane elastomer rubber),
One kind in PEN (polyethylene naphthalate)；The material of inorganic layer 30 be one kind either in oxide of nitride or
Several combinations；Second organic layer 40 is modified organopolysiloxane resin layer；Third organic layer 50 is fluorocarbon modified resin layer.Nothing
Machine layer 30 is prepared by Vacuum Coating methods such as magnetron sputtering, PECVD, atomic depositions.
Wherein, nitride is SixNy (silicon nitride) or AlN；Oxide be SiOx (nano silicon-based oxide) or
Al2O3.The range of x/y is 0.75~1.5 in silicon nitride (SixNy)；Nano silicon-based oxide (SiOx) is unformed white powder
(referring to its aggregate) is a kind of nontoxic, tasteless, free of contamination inorganic non-metallic material, has many unusual or unusual physics
Chemical characteristic, there are the hydroxyls of undersaturated residual bond and different bond styles on surface, and stable state is deviated from because its surface is oxygen debt
Silica structure, therefore molecular formula be SiOx, wherein X is between 0.4~0.8.
In another embodiment, the thickness of the first organic layer 10 is 2 μm~8 μm；The thickness of flexible substrate layer 20 is 10 μm
~150 μm；The thickness of inorganic layer 30 is 10nm~300nm；The thickness of second organic layer 40 is 3 μm~20 μm；Third organic layer
50 thickness is 4 μm~20 μm.
Further, the thickness of flexible substrate layer 20 is 50 μm~100 μm.The thickness of inorganic layer is 20nm~100nm.
Above-mentioned packaging protection film 100 is organic by being equipped with the first organic layer 10, inorganic layer 30, second on flexible parent metal
Four tunic of layer 40 and third organic layer 50 etc. so that the barrier property of the protective film is preferable, can improve electronic component barrier water
Vapour ability improves product quality.
The present invention also provides a kind of preparation methods of packaging protection film 100, include the following steps：
Flexible parent metal and the first organic layer coating fluid are provided, the first organic layer coating fluid is uniformly coated on flexible parent metal
Flexible parent metal with the first organic layer coating fluid is put into baking oven by one side, carries out curing reaction, and being formed has first to have
The film one of machine layer 10；
Vacuum coating equipment and 30 Coating Materials of inorganic layer are provided, film one is put into very by cleaning, preheating vacuum coating equipment
It in empty filming equipment, vacuumizes, 30 Coating Materials of inorganic layer is plated in backwards to the first organic layer 10 by film one using Vacuum Coating method
One side, set filming parameter, plated film goes out sample, forms the film two with inorganic layer 30；
Second organic layer coating fluid is provided, the second organic layer coating fluid is uniformly coated on to 30 surface of inorganic layer of film two,
Film two with the second organic layer coating fluid is put into baking oven and is toasted, the film three with the second organic layer 40 is formed；
Third organic layer coating fluid is provided, third organic layer coating fluid is uniformly coated on to 40 table of the second organic layer of film three
Face will carry out UV curing reactions with the film three of third organic layer coating fluid, form packaging protection film 100.
In a wherein embodiment, the solidification temperature of curing reaction is 120 DEG C, hardening time 2min；The baking of baking
Temperature is 100 DEG C, baking time 2min.Vacuum Coating method is the vapor deposition of magnetron sputtering method, plasma enhanced chemical
One kind in method, atom deposition method.
Optionally, the first organic layer coating fluid includes the component of following parts by weight：
5~25 parts of vinylidene fluoride-hexafluoropropylene copolymer；
10~30 parts of polyester resin；
First 50~70 parts of organic layer solvent.
Wherein, the first organic layer solvent is methanol, ethyl alcohol, isopropanol, glycerine, toluene, one kind in ethyl acetate or several
Kind combination.
Optionally, the second organic layer coating fluid includes the component of following parts by weight：
Further, the second organic layer auxiliary agent includes the component of following parts by weight：
Second 0.05~2 part of organic layer dispersant；
Second 0.005~1 part of organic layer levelling agent；
Second 0.002~0.8 part of organic layer coupling agent.
Wherein, modified organopolysiloxane resin layer contains abundant silicone hydroxyl group, adds coupling agent to improve second
The cementability of organic layer 40 and inorganic layer 30, silicone condensation of the silicone hydroxyl group easily with 30 surface of inorganic layer is at firm
Si-O-Si structures make coating be improved the adhesive force of inorganic layer 30, and the netted knot of high crosslink density is formed after resin solidification
The nano-sized filler of structure, addition effectively enhances coating compactness, while enhancing coating high-low temperature resistant, barrier property, resistance to ultraviolet
Line, flexibility.
In wherein some embodiments, the second organic layer levelling agent is polyether-modified dimethyl polysiloxane copolymer, third
Olefin(e) acid polyester-modified polysiloxanes, polyether-modified hydroxyl polysiloxane copolymer, nonionic polysiloxane copolymer, propylene
Esterification polysiloxanes, response type organosiloxane, modified polyorganosiloxane, polyacrylate, Siloxane-Oxyalkylene Copolymers, poly- silicon
One kind in oxygen alkane-copolyether；Second organic layer filler is nano aluminium oxide, nano silicon dioxide, zinc oxide, zinc barium
In vain, one or several kinds of combinations in calcium carbonate, nano-titanium dioxide；Second organic layer coupling agent is vinyl silanes, amino silicone
One or more combination in alkane, epoxy radicals silicone hydride, hydrosulphonyl silane, methacryloxypropyl silane；Second organic layer dispersant is
One kind in fatty acid, aliphatic amide type, esters.Second organic layer solvent is methanol, ethyl alcohol, isopropanol, glycerine, first
One or more of benzene, ethyl acetate combine.The type of curing agent is more, such as p-hydroxybenzenyl sulfonate.
Optionally, third organic layer coating fluid includes the component of following parts by weight：
Further, third organic layer auxiliary agent includes the component of following parts by weight：
0.05~2 part of third organic layer dispersant；
0.005~1 part of third organic layer levelling agent；
0.002~0.8 part of third organic layer coupling agent.
Wherein, third organic layer 50 is fluorocarbon modified resin layer, and film forming is preferable after coating, is in colorless and transparent, fluorine chain
The surfaces Duan Qi dense distribution, the polarizability of C-F keys is very low, and the intermolecular force between fluorocarbon resin film and Air Interface is very
It is small, cause the surface free energy of fluorocarbon resin film very low, therefore, have hydrophobicity, excellent weatherability, high crosslink density,
Excellent flexibility.
In wherein some embodiments, fluorocarbon resin include polytetrafluoroethylene (PTFE) (PTFE), polytrifluorochloroethylene (PCTFE),
Polyvinyl fluoride (PVF), Kynoar (PVDF), perfluoroethylene-propylene (FEP), ethylene-tetrafluoroethylene copolymer (ETFE), four
One kind or several in vinyl fluoride-perfluoroalkyl vinyl ether copolymer (PFA), ethylene-chlorotrifluoro-ethylene copolymer (ECTFE) etc.
Kind combination.Third organic layer levelling agent be polyether-modified dimethyl polysiloxane copolymer, acrylic polyester modified polyorganosiloxane,
Polyether-modified hydroxyl polysiloxane copolymer, nonionic polysiloxane copolymer, acroleic acid esterification polysiloxanes, response type
One in organosiloxane, modified polyorganosiloxane, polyacrylate, Siloxane-Oxyalkylene Copolymers, polysiloxane-polyether copolymer
Kind；Third organic layer filler is nano aluminium oxide, nano silicon dioxide, zinc oxide, lithopone, calcium carbonate, nano-titanium dioxide
Middle one or several kinds of combinations；Third organic layer coupling agent be vinyl silanes, amino silane, epoxy radicals silicone hydride, hydrosulphonyl silane,
One or more combination in methacryloxypropyl silane；Third organic layer dispersant is fatty acid, aliphatic amide type, ester
One kind in class.The type of light curing agent is more, such as light curing agent 184.
The technical solution that will be further illustrated the present invention below by several embodiments.
Embodiment 1：
The preparation method of the packaging protection film 100 of the present invention, includes the following steps：
Flexible parent metal and the first organic layer coating fluid are provided, the first organic layer coating fluid is uniformly coated on flexible parent metal
Flexible parent metal with the first organic layer coating fluid is put into baking oven by one side, carries out curing reaction, solidification temperature 120
DEG C, hardening time 2min forms the film one with the first organic layer 10；
Vacuum coating equipment and 30 Coating Materials of inorganic layer are provided, film one is put into very by cleaning, preheating vacuum coating equipment
It in empty filming equipment, vacuumizes, 30 Coating Materials of inorganic layer is plated in backwards to the first organic layer 10 by film one using Vacuum Coating method
One side, set filming parameter, plated film goes out sample, forms the film two with inorganic layer 30；
Second organic layer coating fluid is provided, the second organic layer coating fluid is uniformly coated on to 30 surface of inorganic layer of film two,
Film two with the second organic layer coating fluid is put into baking oven and is toasted, baking temperature is 100 DEG C, baking time 2min, shape
At the film three with the second organic layer 40；
Third organic layer coating fluid is provided, third organic layer coating fluid is uniformly coated on to 40 table of the second organic layer of film three
Face will carry out UV curing reactions with the film three of third organic layer coating fluid, form packaging protection film 100.
Wherein, flexible substrate layer 20 is polyethylene terephthalate layer, and the thickness of flexible substrate layer 20 is 10 μm, the
One organic layer coating fluid includes the component of following parts by weight：5 parts of vinylidene fluoride-hexafluoropropylene copolymer, 10 parts of polyester resin are different
50 parts of propyl alcohol；The thickness of first organic layer 10 is 2 μm；30 Coating Materials of inorganic layer is AlN, and the thickness of inorganic layer 30 is 10nm；
Second organic layer coating fluid includes the component of following parts by weight：5 parts of modified organopolysiloxane resin, 20 parts of polyurethane resin,
0.5 part of nano aluminium oxide, 1 part of curing agent, 40 parts of isopropanol, 0.05 part of dispersant, acrylic polyester modified polyorganosiloxane 0.005
Part, 0.002 part of vinyl silanes；The thickness of second organic layer 40 is 3 μm；Third organic layer coating fluid includes following parts by weight
Component：Ultraviolet light cures fluorine-carbon modified 20 parts of polyester resin, 10 parts of acrylic monomers, 2 parts of light curing agent, nano aluminium oxide 0.5
Part, 0.05 part of dispersant, 0.005 part of acrylic polyester modified polyorganosiloxane, 0.002 part of vinyl silanes；Third organic layer 50
Thickness be 4 μm.
Embodiment 2：
As different from Example 1, the flexible substrate layer 20 of the present embodiment is polyethylene terephthalate layer, flexible
The thickness of substrate layer 20 is 80 μm, and the first organic layer coating fluid includes the component of following parts by weight：Biasfluoroethylene-hexafluoropropylene is total
15 parts of polymers, 20 parts of polyester resin, 60 parts of isopropanol；The thickness of first organic layer 10 is 5 μm；30 Coating Materials of inorganic layer is
The thickness of AlN, inorganic layer 30 are 150nm；Second organic layer coating fluid includes the component of following parts by weight：Modified organic poly- silica
17 parts of alkane resin, 25 parts of polyurethane resin, 5 parts of nano aluminium oxide, 5 parts of curing agent, 55 parts of isopropanol, 1 part of dispersant, acrylic acid
0.5 part of polyester-modified polysiloxanes, 0.4 part of vinyl silanes；The thickness of second organic layer 40 is 12 μm；Third organic layer is coated with
Liquid includes the component of following parts by weight：Ultraviolet light cures fluorine-carbon modified 30 parts of polyester resin, 20 parts of acrylic monomers, light curing agent
6 parts, 4 parts of nano aluminium oxide, 1 part of dispersant, 0.5 part of acrylic polyester modified polyorganosiloxane, 0.4 part of vinyl silanes；Third
The thickness of organic layer 50 is 13 μm.
Embodiment 3：
As different from Example 1, the flexible substrate layer 20 of the present embodiment is polyethylene terephthalate layer, flexible
The thickness of substrate layer 20 is 150 μm, and the first organic layer coating fluid includes the component of following parts by weight：Biasfluoroethylene-hexafluoropropylene
25 parts of copolymer, 30 parts of polyester resin, 70 parts of isopropanol；The thickness of first organic layer 10 is 8 μm；30 Coating Materials of inorganic layer is
The thickness of AlN, inorganic layer 30 are 300nm；Second organic layer coating fluid includes the component of following parts by weight：Modified organic poly- silica
30 parts of alkane resin, 30 parts of polyurethane resin, 10 parts of nano aluminium oxide, 10 parts of curing agent, 70 parts of isopropanol, 2 parts of dispersant, propylene
1 part of acid polyester modified polyorganosiloxane, 0.8 part of vinyl silanes；The thickness of second organic layer 40 is 20 μm；Third organic layer is coated with
Liquid includes the component of following parts by weight：Ultraviolet light cures fluorine-carbon modified 40 parts of polyester resin, 30 parts of acrylic monomers, light curing agent
10 parts, 8 parts of nano aluminium oxide, 2 parts of dispersant, 1 part of acrylic polyester modified polyorganosiloxane, 0.8 part of vinyl silanes；Third has
The thickness of machine layer 50 is 20 μm.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of packaging protection film, which is characterized in that including the first organic layer, flexible substrate layer, inorganic being arranged from inside to outside
Layer, the second organic layer and third organic layer.
2. packaging protection film according to claim 1, which is characterized in that first organic layer is vinylidene-hexafluoro
Propylene copolymer；The material of the flexible substrate layer is one kind in PET, PI, PP, PC, PE, PVC, TAC, TPU, PEN；Institute
The material for stating inorganic layer is one or several kinds of combinations in nitride or oxide；Second organic layer is that modification is organic
Polyorganosiloxane resin layer；The third organic layer is fluorocarbon modified resin layer.
3. packaging protection film according to claim 2, which is characterized in that the nitride is SixNy or AlN；It is described
Oxide is SiOx or Al2O3。
4. packaging protection film according to claim 1, which is characterized in that the thickness of first organic layer is 2 μm~8 μ
m；The thickness of the flexible substrate layer is 10 μm~150 μm；The thickness of the inorganic layer is 10nm~300nm；Described second has
The thickness of machine layer is 3 μm~20 μm；The thickness of the third organic layer is 4 μm~20 μm.
5. a kind of preparation method of packaging protection film, which is characterized in that include the following steps：
Flexible parent metal and the first organic layer coating fluid are provided, the first organic layer coating fluid is uniformly coated on the flexible base
Flexible parent metal with the first organic layer coating fluid is put into baking oven by the one side of material, carries out curing reaction, and being formed has the
The film one of one organic layer；
Vacuum coating equipment and inorganic layer Coating Materials are provided, the film one is put into the vacuum coating equipment, is vacuumized,
The inorganic layer Coating Materials is plated in by one side of the film one backwards to first organic layer using Vacuum Coating method, is formed
Film two with inorganic layer；
Second organic layer coating fluid is provided, the second organic layer coating fluid is uniformly coated on to the inorganic layer table of the film two
Film two with the second organic layer coating fluid is put into baking oven and toasts by face, forms the film three with the second organic layer；
Third organic layer coating fluid is provided, the third organic layer coating fluid is uniformly coated on to the second organic layer of the film three
Surface will carry out UV curing reactions with the film three of third organic layer coating fluid, form packaging protection film.
6. the preparation method of packaging protection film according to claim 5, which is characterized in that the solidification temperature of the curing reaction
Degree is 120 DEG C, hardening time 2min；The baking temperature of the baking is 100 DEG C, baking time 2min.
7. the preparation method of packaging protection film according to claim 5, which is characterized in that the Vacuum Coating method is magnetic control
One kind in sputtering method, the vapour deposition process of plasma enhanced chemical, atom deposition method.
8. the preparation method of packaging protection film according to claim 5, which is characterized in that the first organic layer coating fluid
Include the component of following parts by weight：
5~25 parts of vinylidene fluoride-hexafluoropropylene copolymer；
10~30 parts of polyester resin；
First 50~70 parts of organic layer solvent.
9. the preparation method of packaging protection film according to claim 5, which is characterized in that the second organic layer coating fluid
Include the component of following parts by weight：
10. the preparation method of packaging protection film according to claim 5, which is characterized in that the third organic layer coating
Liquid includes the component of following parts by weight：
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114479623A (en) * | 2022-01-26 | 2022-05-13 | 苏州鼎奕通材料科技有限公司 | Coating material capable of resisting escherichia coli and staphylococcus aureus and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104385731A (en) * | 2014-10-21 | 2015-03-04 | 佛山佛塑科技集团股份有限公司 | Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film |
| CN104409549A (en) * | 2014-11-18 | 2015-03-11 | 苏州福斯特新材料有限公司 | High-efficiency black solar cell backplane and preparation method thereof |
| CN105175768A (en) * | 2015-10-30 | 2015-12-23 | 中物院成都科学技术发展中心 | Polymer film modified by fluororesin and preparation method thereof |
| CN106711345A (en) * | 2015-11-12 | 2017-05-24 | 宁波长阳科技股份有限公司 | Flexible transparent barrier film and preparation method thereof |
| CN107393987A (en) * | 2016-05-11 | 2017-11-24 | 张家港康得新光电材料有限公司 | Encapsulating material and photoelectric device |
-
2018
- 2018-03-28 CN CN201810264953.7A patent/CN108395561A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104385731A (en) * | 2014-10-21 | 2015-03-04 | 佛山佛塑科技集团股份有限公司 | Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film |
| CN104409549A (en) * | 2014-11-18 | 2015-03-11 | 苏州福斯特新材料有限公司 | High-efficiency black solar cell backplane and preparation method thereof |
| CN105175768A (en) * | 2015-10-30 | 2015-12-23 | 中物院成都科学技术发展中心 | Polymer film modified by fluororesin and preparation method thereof |
| CN106711345A (en) * | 2015-11-12 | 2017-05-24 | 宁波长阳科技股份有限公司 | Flexible transparent barrier film and preparation method thereof |
| CN107393987A (en) * | 2016-05-11 | 2017-11-24 | 张家港康得新光电材料有限公司 | Encapsulating material and photoelectric device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114479623A (en) * | 2022-01-26 | 2022-05-13 | 苏州鼎奕通材料科技有限公司 | Coating material capable of resisting escherichia coli and staphylococcus aureus and preparation method thereof |
| CN114479623B (en) * | 2022-01-26 | 2022-09-27 | 苏州鼎奕通材料科技有限公司 | Coating material capable of resisting escherichia coli and staphylococcus aureus and preparation method thereof |
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Application publication date: 20180814 |