CN108385849A - Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure - Google Patents

Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure Download PDF

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Publication number
CN108385849A
CN108385849A CN201711119895.0A CN201711119895A CN108385849A CN 108385849 A CN108385849 A CN 108385849A CN 201711119895 A CN201711119895 A CN 201711119895A CN 108385849 A CN108385849 A CN 108385849A
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CN
China
Prior art keywords
unit
micropunch
panel
midfeather
period
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201711119895.0A
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Chinese (zh)
Inventor
俞悟周
余江凌
张恒
吴睿
姜在秀
毛东兴
王旭
朱兴
朱兴一
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SHANGHAI SHENHUA ACOUSTICS EQUIPMENT CO Ltd
Tongji University
Original Assignee
SHANGHAI SHENHUA ACOUSTICS EQUIPMENT CO Ltd
Tongji University
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Application filed by SHANGHAI SHENHUA ACOUSTICS EQUIPMENT CO Ltd, Tongji University filed Critical SHANGHAI SHENHUA ACOUSTICS EQUIPMENT CO Ltd
Priority to CN201711119895.0A priority Critical patent/CN108385849A/en
Publication of CN108385849A publication Critical patent/CN108385849A/en
Pending legal-status Critical Current

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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/82Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to sound only
    • E04B1/84Sound-absorbing elements
    • E04B1/8404Sound-absorbing elements block-shaped
    • EFIXED CONSTRUCTIONS
    • E01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01FADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F8/00Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic
    • EFIXED CONSTRUCTIONS
    • E01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01FADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F8/00Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic
    • E01F8/0005Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic used in a wall type arrangement
    • E01F8/0023Details, e.g. foundations
    • EFIXED CONSTRUCTIONS
    • E01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01FADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F8/00Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic
    • E01F8/0005Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic used in a wall type arrangement
    • E01F8/0047Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic used in a wall type arrangement with open cavities, e.g. for covering sunken roads
    • E01F8/0064Perforated plate or mesh, e.g. as wall facing
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04BGENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/62Insulation or other protection; Elements or use of specified material therefor
    • E04B1/74Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
    • E04B1/82Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to sound only
    • E04B1/84Sound-absorbing elements
    • E04B2001/8457Solid slabs or blocks
    • E04B2001/8476Solid slabs or blocks with acoustical cavities, with or without acoustical filling

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Physics & Mathematics (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Building Environments (AREA)

Abstract

The present invention relates to a kind of three-dimensional double impedance micropunch period ultrabroad band sound absorption structures.The closed cavity of periodic arrangement in 2 orthogonal directions is connected to form by micropunch panel, unit midfeather, unit diaphragm plate, unit baseboard, left side, right side, front end face, rear end face, by two kinds of depth cavity mechanical periodicities, larger depth is 1.5 ~ 4.5 times of smaller depth.0.3%~4% micropore that occupied area is panel area is distributed on micropunch panel, micropore size is 0.3~1.2mm, and cell width and length are no more than 0.15m.As long as the present invention to be installed to the place for the processing that needs to absorb sound when use, it is fixed on wall surface.Apparatus of the present invention are simple, simple processing, thin type is light, and sound absorbing performance is excellent, sound sucting band width of the acoustic absorptivity in 2.5KHz more than 0.8 is up to 2 ~ 3 octaves, sound sucting band of the acoustic absorptivity not less than 0.6 is close to 3 octaves, and for peak value close to 1.0, sound absorbing performance is flat, it is widely applicable, easy cleaning, high temperature resistant, and there is superior weatherability, it can recycle completely.

Description

Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure
Technical field
The invention belongs to technical field of acoustics, specially a kind of three-dimensional alliteration impedance micropunch period reduced for noise is super Broadband flush sound absorption structure.
Background technology
Problem of noise pollution is with the development of urban economy and the growth getting worse of population, shadow of the noise pollution to people It rings caused complaint and accounts for 50% or more that all kinds of environment are complained in economically developed city.With the propulsion of Process of Urbanization Construction, no Breaking increased social activities and uses equipment to make the living environment low frequency characteristic of people apparent, this just often results in ambient noise Sound pressure level when being also not up to standard limited value, subjective sensation is worried by people.Low-frequency noise can generate the thinking ability of people It interferes significantly with, influences the auditory system, nervous system and cardiovascular system of people.Therefore low-frequency noise is ground in recent ten years Study carefully and earn widespread respect, the research of low-frequency sound-absorbing structure is one of hot spot therein.
Sound absorption structure is one of the important measures in noise control technique.Traditional sound absorption structure be mostly hole fibrous material such as Mineral wool, rock wool etc., additional perforated face plate.Porous fibrous material has the advantages that sound absorbing performance is good, but that there are weatherabilities is poor, Sound absorbing performance fails and is used for a long time fiber generation the problem of flying upward, causing secondary pollution after being moistened, is produced to health Raw harm.Usual porous fibrous material needs to be replaced after a period of use, and can also be endangered in production, process fiber Human body.Due to resonance sound-absorbing structure moisture resistant, hygiene, environmental-friendly etc. than conventional porous fibrous material have it is excellent More property, has been more and more widely used, and has the trend of substitution traditional fibre material.The mechanism of novel resonance sound-absorbing structure, Computation model and development and application also always constantly develop it is perfect.
With the enhancing and improvement of living standard of people's environmental consciousness, no fiber absorbing material is more and more weighed Depending on the trend for gradually replacing traditional porous fibrous material is presented.What is developed at present mainly has micro- wear without fiber absorbing material Hole sound absorber, aluminum fabric acoustic absorption material, foaming aluminum sound-absorbing material, foam glass, polyurethane sound absorption foam etc..Foam glass is deposited In frangible disadvantage, for acoustic absorptivity 0.4~0.6, sound sucting band is relatively narrow.Polyurethane sound absorption foam, which exists, is unable to high temperature resistant, resistance to The shortcomings of time property is poor.The processing of microperforated panel structure is simple, is not necessarily to interior filling chock material, enough acoustic resistances is generated by micropore, with cavity shape At resonance sound-absorbing structure.But it is limited by processing technology, the aperture of metal microperforated panel is usually in 0.5mm ~ 1mm, single layer micropunch The sound sucting band of harden structure is very narrow, is usually no more than 1 octave.The sound sucting band of multilayer microperfrated structure is expanded, but Typically not greater than 2 octaves.
But for the normal resonant sound absorption structure of single cavity, there is good sound absorbing performance in low frequency, it is necessary to substantially Degree increases cavity depth, and the scale of construction is often very big.In addition, the sound sucting band of the normal resonant sound absorption structure of single cavity is relatively narrow, it is right The microperforated panel for being 1mm in aperture, half wide band sound absorption (acoustic absorptivity >=0.5) are typically less than 2 octaves.Absorb sound frequency requirement It is lower, the thickness of sound absorption structure often require that it is bigger, under the occasion that space is generally restricted, normal resonant sound absorption structure without Method meets the actual needs of noise abatement well.
For this purpose, the research and design of the good small size novel low-frequency resonance sound-absorbing structure of sound absorbing performance are always acoustics neck The hot and difficult issue in domain.By the single layer perforated microstructure of two kinds of acoustic impedances, the period is arranged side by side in one direction, and acoustic impedance variation causes Scattering significantly affect the sound absorption characteristics of structure.Integrally-built sound sucting band can be made notable in the case of impedance matching It widens, effective sound sucting band of 0.8 or more acoustic absorptivity is up to 3 octaves, and peak value is close to 1.0, and low frequency absorption performance is aobvious It writes and improves.
Structure processing is simple, and simple installation is not necessarily to any porous fibre sound-absorbing material, and sound absorbing performance is superior.
Invention content
It is an object of the invention to propose a kind of ultrabroad band, high acoustic absorption coefficient, device are simple, easy to clean alliteration resistance Anti- mechanical periodicity micropunch wideband flush sound absorption structure, suitable for each occasion for needing noise reduction, especially 2.5KHz is below Noise.
Three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure proposed by the present invention, includes the list of rectangular parallelepiped structure First A closed cavities 11 and unit B closed cavity 12, in the unit A closed cavities 11 adjacent with unit B closed cavity 12 two Replace periodic arrangement on a direction to obtain;
Unit A closed cavities 11 are by unit A micropunch panel 1, rear end face 4, left side 5, unit midfeather 7, unit midfeather 8 Be connected to form with unit A bottom plates 9, unit A micropunch panel 1 and unit A bottom plates 9 be separately connected 4 side of rear end face, left side 5, 7 side of unit midfeather, 8 side of unit diaphragm plate;After staggeredly, before unit A micropunch panel 1 and unit A bottom plates 9 are separately connected 3 side of end face, right side 6,7 side of unit midfeather, 8 side of unit diaphragm plate;
Unit B closed cavity 12 is by unit B micropunch panel 2, rear end face 4, right side 6, unit midfeather 7, unit midfeather 8 It is connected to form with unit B bottom plate 10;Unit B micropunch panel 2 and unit B bottom plate 10 are separately connected 4 side of rear end face, right side 6,7 side of unit midfeather, 8 side of unit diaphragm plate;After staggeredly, unit B micropunch panel 2 and unit B bottom plate 10 connect respectively Connect 3 side of front end face, left side 5,7 side of unit midfeather, 8 side of unit diaphragm plate;
2 flush with outer surface of unit A micropunch panel 1 and unit B micropunch panel;
Unit A micropores 13 are distributed on unit A micropunch panel 1, the area shared by unit A micropores 13 is the micropunch faces unit A Unit B micropore 14, the face shared by unit B micropore 14 is distributed on unit B micropunch panel 2 in the 0.3%~4% of 1 gross area of plate Product is the 0.3%~4% of 2 gross area of unit B micropunch panel;Micropore 13 is different with the perforation field accounting of micropore 14.Unit A The cavity depth of closed cavity 11 and unit B closed cavity 12 changes in binary cycle.
In the present invention, the aperture of unit A micropores 13 and unit B micropore 14 is 0.2 ~ 1.2mm.
In the present invention, the distance of unit A micropunch panel 1 to unit A bottom plates 9 is unit B micropunch panel 2 and unit B 1.5-4.5 times of the distance of bottom plate 10.
In the present invention, unit A micropunch panel 1 arrives the distance of unit A bottom plates 9, is no more than 350mm.
In the present invention, the width and length of unit A closed cavities 11 and unit B closed cavity 12 are no more than 15cm.
The present invention has the advantages that acoustic absorptivity height, acoustic frequency bandwidth.In the frequency range within 150Hz~2.5KHz Preferable sound absorbing performance is all had, most of noise sources, the especially stronger noise source of middle low-frequency component, noise drop can be suitable for Low significant effect.
Since the sound absorber of the present invention is formed using metal material or nonmetallic materials thin plate punching processing, have Easy processing, easy cleaning, high temperature resistant, and there is superior weatherability, it can recycle completely, it is entirely avoided traditional fibre material The problem of existing weatherability and secondary pollution, has superior environment-friendly function.
Using simple installation of the present invention, as long as attaching it to the place for the processing that needs to absorb sound.
The beneficial effects of the present invention are:Middle low frequency absorption frequency band is significantly widened, low frequency absorption coefficient in raising.
Device is simple, and thin type is light, and sound absorbing performance is good, and simple processing is of low cost, and acoustic absorptivity is more than 0.8 suction Sonic-frequency band width has superior weatherability up to 3 octaves, widely applicable, easy cleaning, high temperature resistant, can recycle profit completely The problem of with, it is entirely avoided secondary pollution, has superior environment-friendly function.
Description of the drawings
Fig. 1 is front view of the present invention.
Fig. 2 is A-A sectional views of the present invention.
Fig. 3 is B-B sectional views of the present invention.
Fig. 4 is the sound absorbing performance of embodiment 1.
Figure label:1 is unit A micropunch panels, and 2 be unit B micropunch panel, and 3 be front end face, and 4 be rear end face, 5 For left side, 6 be right side, and 7 be unit midfeather, and 8 be unit diaphragm plate, and 9 be unit A bottom plates, and 10 be unit B bottom plate, 11 It is unit B closed cavity for unit A closed cavities, 12,13 be unit A micropores, and 14 be unit B micropore.
Specific implementation mode
The embodiment that the invention is further illustrated by the following examples.
Embodiment 1:Following each component is connected by mode shown in Fig. 1 ~ Fig. 2, field technology personnel can smoothly implement. Unit A micropunch panel 1, unit B micropunch panel 2, front end face 3, rear end face 4, left side 5, right side 6, unit midfeather 7, unit diaphragm plate 8, bottom plate/9 unit A, unit B bottom plate 10 are connected, component units A closed cavities 11 and unit B closed cavity 12.For unit A micropunch panel 1 using the alumina plate of 0.5 ~ 0.7mm thickness, size is long 0.1m, wide 0.1m, unit A micropunch The unit A micropores 13 that 1500 ~ 3500 apertures are 0.5 ~ 0.7mm are distributed on panel 1.The use of unit B micropunch panel 2 0.6 ~ The alumina plate of 0.8mm thickness, size are long 0.1m, wide 0.1m, and unit 1500 ~ 3500 is distributed on unit B micropunch panel 2 Aperture is the unit B micropore 14 of 0.6 ~ 0.8mm.Unit A micropores panel 1 is 20 ~ 25cm, unit B at a distance from unit A bottom plates 9 Micropore panel 2 is 5 ~ 10cm at a distance from unit B bottom plate 10.
Front end face 3, rear end face 4, left side 5, right side 6, unit midfeather 7, unit diaphragm plate 8, unit A bottom plates 9, list First B bottom plates 10 use 1mm steel plates.Front end face 3 is parallel with rear end face 4, and left side 5 is parallel with right side 6, and left side 5 is with before End face 3, unit A micropunch panel 1, unit A bottom plates 9 are vertical.Right side 6 and front end face 3, unit B micropunch panel 2, unit B Bottom plate 10 is vertical.
As shown in figure 4, the sound absorbing performance of embodiment 1 is in 220Hz or more reachable 0.8,200Hz or more is up to 0.6.

Claims (6)

1. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure, it is characterised in that the unit A including rectangular parallelepiped structure Closed cavity (11) and unit B closed cavity (12), in the unit A closed cavities (11) and unit B closed cavity (12) phase Alternately periodic arrangement obtains in adjacent both direction;
Unit A closed cavities (11) by unit A micropunch panel (1), rear end face (4), left side (5), unit midfeather (7), Unit midfeather (8) and unit A bottom plates (9) are connected to form, and unit A micropunch panel (1) and unit A bottom plates (9) are separately connected Rear end face (4) side, left side (5), unit midfeather (7) side and unit diaphragm plate (8) side;After staggeredly, unit A is micro- to be worn Hole panel (1) and unit A bottom plates (9) are separately connected front end face (3) side, right side (6), unit midfeather (7) side and list First diaphragm plate (8) side;
Unit B closed cavity (12) by unit B micropunch panel (2), rear end face (4), right side (6), unit midfeather (7), Unit midfeather (8) and unit B bottom plate (10) are connected to form;Unit B micropunch panel (2) and unit B bottom plate (10) connect respectively Connect rear end face (4) side, right side (6), unit midfeather (7) side and unit diaphragm plate (8) side;After staggeredly, unit B is micro- Perforated panel (2) and unit B bottom plate (10) be separately connected front end face (3) side, left side (5), unit midfeather (7) side and Unit diaphragm plate (8) side;
Unit A micropunch panel (1) and unit B micropunch panel (2) flush with outer surface;
Unit A micropores (13) are distributed on unit A micropunch panel (1), the area shared by unit A micropores (13) is that unit A is micro- Unit B micropore (14) is distributed on unit B micropunch panel (2) in the 0.3%~4% of perforated panel (1) gross area, and unit B is micro- Area shared by hole (14) is the 0.3%~4% of unit B micropunch panel (2) gross area;Micropore (13) and micropore (14) are worn Hole area accounting is different;The cavity depth of unit A closed cavities (11) and unit B closed cavity (12) changes in binary cycle.
2. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure according to claim 1, it is characterised in that single First A closed cavities (11) and the arrangement of unit B closed cavity (12) period-interleaving, are in distributed in three dimensions structure.
3. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure according to claim 1, it is characterised in that envelope The depth ratio of closed chamber body (10) and closed cavity (11) is 1.5 ~ 4.5, i.e. unit A micropunch panel (1) arrives unit A bottom plates (9) Distance be 1.5-4.5 times of unit B micropunch panel (2) and unit B bottom plate (10) distance.
4. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure according to claim 1, it is characterised in that micro- The aperture in hole (8) is 0.2-1.2mm.
5. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure according to claim 1, it is characterised in that micro- The width and length of punch unit structure A and micropunch cellular construction B are no more than 15cm.
6. three-dimensional alliteration impedance micropunch period ultrabroad band sound absorption structure according to claim 1, it is characterised in that single First A micropunch panel (1) arrives the distance of unit A bottom plates (9), is no more than 350mm.
CN201711119895.0A 2017-11-14 2017-11-14 Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure Pending CN108385849A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220148550A1 (en) * 2019-03-04 2022-05-12 Corning Incorporated Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems

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CN103971671A (en) * 2014-04-23 2014-08-06 北京绿创声学工程股份有限公司 Composite low-frequency resonance sound absorption structure
CN203910263U (en) * 2014-05-16 2014-10-29 四川正升声学科技有限公司 A low frequency sound absorption structure
CN204898916U (en) * 2015-08-24 2015-12-23 青岛声达技术有限公司 Multilayer double entry cavity wide band sound absorption device
CN105427853A (en) * 2015-10-30 2016-03-23 东南大学 Broadband micro-perforated board sound absorber, absorber performance prediction method and absorber structure design method
CN105788587A (en) * 2014-12-24 2016-07-20 北京市劳动保护科学研究所 Porous composite sound absorption structure
CN205444527U (en) * 2015-12-31 2016-08-10 佛山市蓝博环保科技有限公司 Sound diffuser is inhaled to QRD two dimension
WO2016208580A1 (en) * 2015-06-22 2016-12-29 富士フイルム株式会社 Soundproof structure and method for producing soundproof structure
CN206034672U (en) * 2016-03-24 2017-03-22 丁海涛 Acoustics processing unit plate reaches by its wall structure who constitutes
CN106639013A (en) * 2016-11-28 2017-05-10 南京大学 Mixed soundproof wall
CN106856090A (en) * 2015-12-09 2017-06-16 北京市劳动保护科学研究所 A kind of microperforated panel combination acoustic metamaterial compound sound-absorption structural
CN107039028A (en) * 2017-06-02 2017-08-11 郭辰曦 A kind of performance test methods of wideband perforated plate
CN207512950U (en) * 2017-11-14 2018-06-19 同济大学 Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure

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Publication number Priority date Publication date Assignee Title
EP0405581A1 (en) * 1989-06-30 1991-01-02 Nitto Boseki Co., Ltd. Sound absorber
JP2010007278A (en) * 2008-06-25 2010-01-14 Kajima Corp Broad-band sound absorption structure and sound absorbing material
CN103971671A (en) * 2014-04-23 2014-08-06 北京绿创声学工程股份有限公司 Composite low-frequency resonance sound absorption structure
CN203910263U (en) * 2014-05-16 2014-10-29 四川正升声学科技有限公司 A low frequency sound absorption structure
CN105788587A (en) * 2014-12-24 2016-07-20 北京市劳动保护科学研究所 Porous composite sound absorption structure
WO2016208580A1 (en) * 2015-06-22 2016-12-29 富士フイルム株式会社 Soundproof structure and method for producing soundproof structure
CN204898916U (en) * 2015-08-24 2015-12-23 青岛声达技术有限公司 Multilayer double entry cavity wide band sound absorption device
CN105427853A (en) * 2015-10-30 2016-03-23 东南大学 Broadband micro-perforated board sound absorber, absorber performance prediction method and absorber structure design method
CN106856090A (en) * 2015-12-09 2017-06-16 北京市劳动保护科学研究所 A kind of microperforated panel combination acoustic metamaterial compound sound-absorption structural
CN205444527U (en) * 2015-12-31 2016-08-10 佛山市蓝博环保科技有限公司 Sound diffuser is inhaled to QRD two dimension
CN206034672U (en) * 2016-03-24 2017-03-22 丁海涛 Acoustics processing unit plate reaches by its wall structure who constitutes
CN106639013A (en) * 2016-11-28 2017-05-10 南京大学 Mixed soundproof wall
CN107039028A (en) * 2017-06-02 2017-08-11 郭辰曦 A kind of performance test methods of wideband perforated plate
CN207512950U (en) * 2017-11-14 2018-06-19 同济大学 Three-dimensional alliteration impedance micropunch period ultrabroad band flush sound absorption structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220148550A1 (en) * 2019-03-04 2022-05-12 Corning Incorporated Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems

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Application publication date: 20180810

WD01 Invention patent application deemed withdrawn after publication