CN108376685B - Display panel and display device - Google Patents
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- CN108376685B CN108376685B CN201810141516.6A CN201810141516A CN108376685B CN 108376685 B CN108376685 B CN 108376685B CN 201810141516 A CN201810141516 A CN 201810141516A CN 108376685 B CN108376685 B CN 108376685B
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The invention discloses a display panel and a display device. The method comprises the following steps: the display panel comprises a display area and a step area, one end, far away from the display area, of the step area can be bent and then arranged on one side of a display surface of the display panel, a plurality of leads are arranged in the step area and comprise first leads and second leads which are arranged in an alternating mode along a first direction, the display panel is provided with a first surface, far away from the display surface of the display panel, and the distance between each first lead and the first surface is equal to the distance between each second lead and the first surface. The dielectric layer comprises a plurality of dielectric units, the extending direction of the dielectric units is the same as the extending direction of the leads, the part of the leads positioned on the first metal layer is provided with two edges opposite along the first direction, and the dielectric units at least cover one edge to enable the first leads to be electrically insulated from the adjacent second leads. The invention can increase the degree of freedom of lead design and improve the bending resistance of the lead.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
In the conventional display device technology, the display panel is mainly divided into two mainstream technologies, namely a liquid crystal display panel and an organic self-luminous display panel. The liquid crystal display panel forms an electric field capable of controlling the deflection of liquid crystal molecules by applying voltage to two ends of the liquid crystal molecules, so that the transmission of light rays is controlled to realize the display function of the display panel; the organic self-luminous display panel adopts an organic electroluminescent material, and when current passes through the organic electroluminescent material, the luminescent material can emit light, so that the display function of the display panel is realized.
In recent years, people have higher and higher requirements on the sensory experience of display devices, and the improvement of the screen ratio of the display devices becomes the key point of the competitive research of various manufacturers at present. In present display device, the lower frame of display panel leads to the width of lower frame great owing to need set up the various lead wires of connecting display area and driver chip, and in order to narrow lower frame, one scheme among the prior art is to adopt flexible substrate preparation with display panel's base plate, places display panel's back in after buckling the one end in step district, has reduced the area that the step district occupies at non-display area like this, and then realizes improving the screen and accounts for the ratio. However, in this scheme, during manufacturing, a flat step region is usually manufactured first, and then the step region is subjected to bending process, so that the lead disposed in the step region may be broken due to bending stress when the step region is bent, thereby reducing the yield of products.
Therefore, it is an urgent problem to be solved in the art to provide a display panel and a display device, which can improve the bending resistance of the lead in the step region.
Disclosure of Invention
In view of the above, the present invention provides a display panel and a display device, which solve the technical problem of improving the bending resistance of the lead in the step area.
In order to solve the above technical problem, the present invention provides a display panel, including:
a display area and a step area, wherein one end of the step area far away from the display area can be arranged at one side far away from the display surface of the display panel after being bent,
a plurality of leads are arranged in the step area, the leads are routed from the step area to the display area, the leads comprise first leads and second leads, the first leads and the second leads are alternately arranged along the first direction,
the display panel has a first surface departing from the display surface of the display panel, the distance from the first surface of the first lead wire is equal to the distance from the first surface of the second lead wire along the direction vertical to the display panel,
the display panel comprises a first metal layer and a second metal layer, at least part of the first lead is positioned in the first metal layer, at least part of the second lead is positioned in the second metal layer, an
The dielectric layer comprises a plurality of dielectric units, the extending direction of the dielectric units is the same as the extending direction of the lead, the part, located on the first metal layer, of the lead is provided with two edges opposite to each other along the first direction, and the dielectric units at least cover one edge to enable the first lead to be electrically insulated from the adjacent second lead.
Further, in order to solve the above technical problem, the present invention provides a display device including any one of the display panels.
Compared with the prior art, the display panel and the display device provided by the invention have the beneficial effects that:
according to the invention, the step areas adopt different metal layers to manufacture the leads, the adjacent leads are ensured to be mutually electrically insulated through the dielectric layers, the leads positioned on different metal layers are not limited by an etching process when being manufactured, so that the distance between the adjacent leads can be shortened, the space of the step areas is saved, the degree of freedom of design of the leads can be increased, and the bending resistance of the leads is improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic view of a step region in the related art;
FIG. 2 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating bending of a step region of a display panel according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional view taken at the location of line C-C' of FIG. 2;
FIG. 5 is a schematic top view of an alternative embodiment of a step area lead of a display panel according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view taken at the location of line D-D' of FIG. 5;
FIG. 7 is a schematic diagram illustrating a lead fabrication in a display panel according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a step area of a display panel according to the related art;
FIG. 9 is a diagram illustrating an alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 10 is a partial cross-sectional view taken at line Q1 of FIG. 9;
FIG. 11 is a diagram illustrating an alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 12 is a partial cross-sectional view taken at line Q2 of FIG. 11;
fig. 13 is a schematic diagram illustrating another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention;
FIG. 14 is a partial cross-sectional view taken at line Q3 of FIG. 13;
FIG. 15 is a schematic diagram of another alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 16 is a diagram illustrating an alternative embodiment of the step area leads of a display panel according to an embodiment of the present invention;
fig. 17 is a schematic diagram of another alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 18 is a schematic diagram of another alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 19 is a schematic partial cross-sectional view taken at line Q4 in FIG. 18;
FIG. 20 is a partial cross-sectional view taken along line Q5 of FIG. 18;
fig. 21 is a schematic diagram illustrating another alternative implementation of the step area lead in the display panel according to the embodiment of the invention;
FIG. 22 is a schematic diagram of another alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
FIG. 23 is a schematic diagram of another alternative embodiment of a step area lead in a display panel according to an embodiment of the present invention;
fig. 24 is a structural diagram of a film layer of an array substrate in a display panel according to an embodiment of the invention;
FIG. 25 is a schematic diagram of a film structure of an alternative embodiment of a display panel according to an embodiment of the invention;
fig. 26 is a schematic diagram of a film structure of another alternative embodiment of a display panel according to an embodiment of the present invention;
FIG. 27 is a schematic diagram of a power line of a display panel according to an embodiment of the present invention;
fig. 28 is a schematic diagram of an alternative implementation of the positive power line of the display panel according to the embodiment of the present invention;
fig. 29 is a schematic view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Fig. 1 is a schematic diagram of a step area in the related art, and in the related display panel technology, as shown in fig. 1, lead lines X 'of a step area T' of a display panel are usually made of the same metal layer, and due to the limitation of an etching process, in order to ensure mutual insulation between two adjacent lead lines X ', a distance D' between the adjacent lead lines X 'cannot be too small, a large number of lead lines X' need to be arranged in the step area, and at the same time, the maximum width that a single lead line X 'can be arranged is limited due to the limitation of the size of the width D' of the step area T ', and thus, the bending resistance of the lead line X' in the step area is limited. In the invention, the inventor designs the inner lead of the step area, the inner lead of the step area is made of different metal layers, and the distance between the parts of the lead positioned on the different metal layers is not limited by the etching process in the etching process, so that the distance between the adjacent leads can be reduced, the degree of freedom of the lead design can be increased, for example, the width of the lead can be properly increased or the shape of the lead can be specially designed, and the anti-stretching and anti-bending capability of the lead can be enhanced.
Fig. 2 is a schematic top view of a display panel according to an embodiment of the present invention, and fig. 3 is a schematic bending view of a step region of the display panel according to the embodiment of the present invention. Fig. 4 is a schematic cross-sectional view at the position of the tangent line C-C' in fig. 2.
As shown in fig. 2, the display panel includes a display area AA and a step area T, one end of the step area T, which is far away from the display area AA, can be bent and then placed on a side away from the display surface of the display panel, where the display surface of the display panel is a surface of the display panel displaying images. The bending schematic diagram of the step region T is shown in fig. 3. Continuing to refer to fig. 2, a plurality of lead lines X are disposed in the step area T, the lead lines X are routed from the step area T to the display area AA, the lead lines X include first lead lines 1X and second lead lines 2X, and the first lead lines 1X and the second lead lines 2X are alternately arranged along the first direction a. A driving chip can be arranged in the step area T, one end of the lead X is connected with a pin of the driving chip, and the other end of the lead X is connected to the display area to provide signals for the display area; or a binding area BD as shown in fig. 2 is arranged in the step area T, the binding area BD is used for binding the flexible circuit board, one end of the lead wire X is connected to the binding area BD, and the other end of the lead wire X is connected to the display area AA to provide signals for the display area AA.
As shown in fig. 4, the display panel has a first surface B1 facing away from the display surface of the display panel, and the distance d1 of the first lead 1X from the first surface B1 is equal to the distance d2 of the second lead 2X from the first surface B1 in the direction B perpendicular to the display panel. It should be noted that the step area of the display panel has a certain thickness, and the film layer has certain process fluctuation during the preparation process, and only the first lead 1X and the second lead 2X need to be located on the surface of the same film layer in the step area film layer structure. In the invention, when one end of the step area T is bent and then arranged on the side away from the display surface of the display panel, namely when the step area T is in a bent state, the lead wire at the bent part of the step area T can also be bent along with the step area. In the invention, when the step region T is in a bent state, the first lead 1X and the second lead 2X can be located on the same bending plane.
The display panel comprises a first metal layer and a second metal layer, wherein at least part of the first lead is positioned in the first metal layer, and at least part of the second lead is positioned in the second metal layer. The arrangement of the leads in the present invention includes various cases, for example, for the first lead, the first lead may be entirely located in the first metal layer, or the first lead includes a portion located in the first metal layer and a portion located in the second metal layer, or the first lead includes a portion located in the first metal layer and a portion located in another metal layer; for the second lead, the second lead may be entirely located in the second metal layer, or the second lead may include a portion located in the second metal layer and a portion located in the first metal layer, or the second lead may include a portion located in the second metal layer and a portion located in another metal layer. As for the specific arrangement of the first lead and the second lead, an example will be given in the following embodiments.
The display panel further comprises a dielectric layer, the dielectric layer comprises a plurality of dielectric units, the extending direction of the dielectric units is the same as the extending direction of the lead wires, the part, located on the first metal layer, of the lead wires is provided with two edges opposite to each other along the first direction, and the dielectric units cover at least one edge to enable the first lead wires to be electrically insulated from the adjacent second lead wires. The dielectric layer has the main function of ensuring the electrical insulation of the first lead and the adjacent second lead, and the arrangement conditions of the first lead and the second lead in the display panel comprise various conditions, so that the arrangement modes of the dielectric unit in the dielectric layer also comprise various modes. The portion of the lead line located at the first metal layer has two edges opposite in the first direction, and the dielectric element in the dielectric layer may cover one edge, two edges, or a portion of the entire lead line located at the first metal layer.
Fig. 5 is a schematic top view of an alternative embodiment of a step area lead of a display panel according to an embodiment of the present invention. Fig. 6 is a schematic cross-sectional view at the position of the tangent line D-D' in fig. 5. Fig. 5 only illustrates that the first lead 1X is entirely located in the first metal layer M1 and the second lead 2X is entirely located in the second metal layer M2 in the display panel, where the lead 1X has two edges B1 and B2 opposite to each other along the first direction a, and optionally, the dielectric element JD in the dielectric layer J covers the two edges in the invention, so as to realize electrical insulation between the first lead 1X and the second lead 2X. The illustration in fig. 5 is merely an exemplary illustration, and the placement of the dielectric elements in the dielectric layer will be described in detail in the following embodiments of the present application in a specific lead placement.
In the display panel provided by the invention, one end of the step area, which is far away from the display area, can be bent and then placed on one side, which is far away from the display surface of the display panel, of the step area, so that the width of the step area T in the direction e shown in figure 2 is reduced after the step area is bent, the occupied area of the step area in the non-display area is reduced, and the screen occupation ratio is favorably improved.
The lead lines disposed in the step area of the present invention include first lead lines and second lead lines, and the distance from the first surface to the first lead lines is equal to the distance from the second surface to the first surface in a direction perpendicular to the display panel. The first lead and the second lead are located on the surface of the same film layer in the step area film layer structure. According to the invention, the first lead and the second lead can be positioned on the same bending plane when the step area is bent, namely the first lead and the second lead can bear the same bending stress. In the invention, at least part of the first lead is positioned in the first metal layer, at least part of the second lead is positioned in the second metal layer, the part of the lead positioned in the first metal layer is provided with two edges opposite along a first direction, the dielectric layer comprises a plurality of dielectric units, the extending direction of the dielectric units is the same as the extending direction of the lead, and the dielectric units at least cover one edge to ensure that the first lead is electrically insulated from the adjacent second lead. When the display panel is manufactured, the part, located in the first metal layer, of the lead is manufactured firstly, then the dielectric unit in the dielectric layer is manufactured, and finally the part, located in the second metal layer, of the lead is manufactured, wherein the dielectric unit guarantees that the first lead and the second lead are mutually electrically insulated. Fig. 7 is a schematic diagram illustrating a manufacturing process of a lead in a display panel according to an embodiment of the invention. As shown in fig. 7, it is assumed that 6 leads are required in the step region in the original design S', the 6 leads are all located in the same metal layer, and it is assumed that a distance d3 between two adjacent leads is a limit distance that can be achieved by the etching process, so that the minimum occupied area of the 6 leads in the step region is ensured. In the lead arrangement of the present invention, the first leads are all located in the first metal layer, and the second leads are all located in the second metal layer, as an example, first, step S1: three first leads 1X are manufactured at corresponding positions on the substrate by adopting an etching process, and the distance between the adjacent first leads 1X is far greater than the limit distance d 3; then step S2: manufacturing a dielectric layer on the first lead 1X, and etching the shape of a dielectric unit JD, wherein only the dielectric unit JD covers the first lead 1X as an example; final step S3: and then, a second metal layer is etched to form a second lead 2X, and the dielectric unit JD ensures insulation between the first lead 1X and the second lead 2X, as shown in fig. 7, the second lead 2X can directly contact with the dielectric layer to ensure insulation with the first lead 1X, and a large space is left between the second lead 2X and the first lead 1X on the right side. Fig. 7 is a schematic diagram illustrating only one arrangement of leads according to the present invention, where leads are made of different metal layers, and adjacent leads are insulated from each other by a dielectric layer, and the leads located in different metal layers are not limited by an etching process during manufacturing, which is equivalent to shortening the distance between adjacent leads.
Fig. 8 is a cross-sectional view of a step region of a display panel according to the related art, and as shown in fig. 8, in the related art, a first lead 1X 'is first formed, an insulating layer 801' is then formed, and a second lead 2X 'is finally formed on the insulating layer 801'. In the step region T ', an insulating layer 801' is provided between the first lead 1X 'and the second lead 2X', which ensures electrical insulation between the first lead 1X 'and the second lead 2X'. In the related art, the first lead 1X 'and the second lead 2X' are formed on different film surfaces, and the first lead 1X 'and the second lead 2X' cannot have the same bending performance when the step region is bent. In the invention, the distances from the first lead and the second lead to the first surface are equal, that is, the first lead and the second lead are positioned on the same film surface, the first lead and the second lead can be positioned on the neutral plane of the bending of the step area by designing the film structure of the step area, and the first lead and the second lead can simultaneously meet the bending performance when the step area is bent, thereby ensuring that the bending stress borne by the first lead and the second lead is minimum.
It should be noted that the display panel is generally a multi-film stack structure, and the display panel includes metal layers and insulating film layers located between the metal layers. The metal layer is used for arranging various metal wires in the display panel, and the manufacturing process generally includes firstly manufacturing a whole metal layer, and then etching the metal layer to obtain the metal wires. In the present invention, the distinction between the first metal layer and the second metal layer is to indicate whether the lead is obtained by etching the first metal layer or the second metal layer, for example, at least a part of the first lead is located in the first metal layer, and at least a part of the second lead is located in the second metal layer, which indicates that at least a part of the first lead is obtained by etching the first metal layer, and at least a part of the second lead is obtained by etching the second metal layer. The lead part obtained by etching the first metal layer and the lead part obtained by etching the second metal layer can be positioned on the same plane.
Optionally, the stepped region has a neutral plane, and the first and second leads are located on the neutral plane. With continued reference to fig. 3, when the stepped region is in the bent state, the outer surface of the stepped region is subjected to tensile stress F1 due to being stretched, and the inner surface of the stepped region is subjected to compressive stress F2 due to being squeezed, wherein the tensile stress F1 and the compressive stress F2 act in opposite directions. In the stepped region, a neutral plane Z is present, which is subjected to tensile and compressive stresses that can almost cancel each other out. According to the invention, the first lead and the second lead are positioned on the neutral surface of the step area, so that the minimum bending stress borne by the first lead and the second lead bent along with the step area is ensured when the step area is in a bent state, and the risk of bending and breaking of the leads is further reduced.
Optionally, the material for manufacturing the dielectric layer in the invention includes an organic material or an inorganic material. The dielectric layer has a main function of ensuring electrical insulation between the adjacent first lead and the second lead, and is made of an insulating organic material or an inorganic material which is easy to form a film, such as an organic material of acrylic (acryl), Polyimide (PI), polyester, or the like, or an inorganic material of silicon oxide, silicon nitride, silicon oxynitride, or the like, wherein the dielectric layer may be a single layer or multiple layers.
Preferably, the manufacturing material of the dielectric layer comprises an organic material, the organic material generally has good flexibility and good bending performance, when the dielectric layer made of the organic material is bent along with the step area, cracks are not easy to generate, meanwhile, the bending stress of the lead can be released, the bending resistance of the lead in the step area is improved, and the risk of bending and breaking of the lead in the step area is reduced.
Optionally, in the present invention, the first metal layer and the second metal layer are made of at least one of aluminum and titanium. The first metal layer and the second metal layer can be made of single-layer metal or multi-layer metal, wherein the metal aluminum has small elastic modulus and good flexibility, and is not easy to break when bent. The first metal layer and the second metal layer can be of a titanium, aluminum and titanium three-layer stacked structure.
The arrangement of the step region lead in the present invention includes various cases, for example: the first leads are all positioned on the first metal layer, and the second leads are all positioned on the second metal layer; or the first lead part is positioned in the first metal layer, and the second lead part is positioned in the second metal layer. The following examples will illustrate the arrangement of the leads in the present invention.
In some alternative embodiments, the first leads are all located in the first metal layer and the second leads are all located in the second metal layer. In this embodiment, the dielectric element in the dielectric layer may cover one edge of the first lead in a direction perpendicular to the extending direction of the first lead, or both edges of the first lead, or the dielectric element may cover the first lead entirely, so as to electrically insulate the first lead from the second lead.
In one case, both the first lead and the second lead are meander traces within the step region. Fig. 9 is a schematic diagram of an alternative implementation of a step area lead in a display panel according to an embodiment of the present invention. Fig. 10 is a partial cross-sectional view taken at the location of line Q1 in fig. 9. As shown in fig. 9 and 10, the first leads 1X and the second leads 2X are alternately arranged along the first direction a in the step region, the first leads 1X and the second leads 2X are both bent wires, the first leads 1X are all located in the first metal layer M1, and the second leads 2X are all located in the second metal layer M2. The dielectric element JD in the dielectric layer J covers one edge of the first wiring 1X in the direction perpendicular to the extending direction of the first wiring 1X. In the embodiment, the first lead 1X is entirely located on the first metal layer, the second lead is entirely located on the second metal layer, when the display panel is manufactured, the shape of the first lead is etched on the first metal layer firstly, then the shape of the dielectric unit is etched by the dielectric layer, the dielectric unit covers one edge of the first lead, and finally the shape of the second lead is etched by the second metal layer.
When the step district state of buckling, first lead wire and second lead wire take place to buckle along with the step district, and first lead wire and second lead wire all can receive tensile production deformation in other words, and when the material received the exogenic action and can not produce the displacement, the shape and the size of material will change. The first lead and the second lead cannot be displaced after being manufactured, and then the first lead and the second lead can be deformed when being bent along with the step area, and the deformation is too large to cause fracture. In the embodiment of the invention, the first lead and the second lead are designed to be bent, and the bent wiring part can disperse the stress generated when the leads are bent along with the step area, so that the first lead and the second lead are prevented from being broken due to overlarge deformation.
Fig. 11 is a schematic diagram of another alternative implementation of the step region lead in the display panel according to the embodiment of the present invention, and fig. 12 is a partial cross-sectional view of the position of a cut line Q2 in fig. 11. As shown in fig. 11 and 12, in the step area, the first leads 1X and the second leads 2X are alternately arranged along the first direction a, both the first leads 1X and the second leads 2X are bent wires, the first leads 1X are all located in the first metal layer M1, and the second leads 2X are all located in the second metal layer M2, so as to cover two edges of the first leads 1X along the direction perpendicular to the extending direction of the first leads for the dielectric elements JD in the dielectric layer. The embodiment is the same as the embodiment corresponding to fig. 9 in the arrangement of the leads, and the difference is only in the arrangement of the dielectric unit in the dielectric layer. The performance reliability of the display panel is ensured. In addition, after the dielectric unit is manufactured to cover two edges of the first lead, the dielectric unit can ensure that the first lead is insulated from two adjacent second leads at left and right, the manufactured second leads can be in direct contact with the dielectric unit, the dielectric unit is completely relied on to ensure the electrical insulation between the second leads and the first lead, the distance between the second leads and the first lead is the minimum, namely the space occupied by the leads in the step area is the minimum, and the degree of freedom of lead design can be maximally increased. Fig. 13 is a schematic diagram of another alternative implementation of the step region lead in the display panel according to the embodiment of the present invention, and fig. 14 is a partial cross-sectional view of the position of a cut line Q3 in fig. 13. As shown in fig. 13 and 14, in the step area, the first leads 1X and the second leads 2X are alternately arranged along the first direction a, both the first leads 1X and the second leads 2X are bent wires, the first leads 1X are all located in the first metal layer M1, the second leads 2X are all located in the second metal layer M2, and the dielectric elements JD in the dielectric layer entirely cover the first leads 1X. The embodiment is the same as the lead wire arrangement mode in the embodiment corresponding to fig. 9, and is different in that only the dielectric unit in the dielectric layer covers the first lead wire, when the display panel is manufactured, the dielectric layer is manufactured on the first lead wire, when the pattern of the dielectric unit is formed by etching, only the dielectric unit needs to be ensured to cover the first lead wire as a whole, the shape of the mask plate for etching the dielectric unit does not need to be designed in a finer size, and the process is simple.
In another case, in the step region, the first and second leads each include a plurality of ring structures, the plurality of ring structures being electrically connected in sequence along a second direction, the second direction crossing the first direction.
Fig. 15 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 15, in the step region, the first and second leads 1X and 2X are alternately arranged along a first direction a, each of the first and second leads includes a plurality of ring structures H, the plurality of ring structures H are sequentially electrically connected along a second direction b, and the second direction b crosses the first direction a. The first wires 1X are all located at the first metal layer M1, and the second wires 2X are all located at the second metal layer M2. According to the lead manufacturing principle in fig. 7, the first lead and the second lead manufactured by different metal layers in the embodiment are not limited by the etching process during manufacturing, the distance between two adjacent leads can be smaller, the space occupied by the leads is saved, and the increase of the degree of freedom of lead design can be realized. In addition, in this embodiment, the first lead and the second lead both include a plurality of ring structures that are electrically connected to each other, and the ring structures can disperse bending stress in the lead bending and stretching process, and the deformation volume is too big when avoiding the first lead and the second lead to buckle and lead to the fracture. In addition, in the lead wire with the ring structure, as shown in fig. 15, for example, a crack is generated at a position P in the ring structure and is broken, the crack does not affect other positions of the ring structure, the lead wire can still normally transmit signals, and the performance reliability of the display panel is ensured. In addition, in the embodiment, the leads adopt the annular structures, and each annular structure is equivalent to a small parallel circuit, so that the resistance of the leads can be reduced, the power consumption of the leads is further reduced, and the reduction of the power consumption loss of the display panel is facilitated.
In addition, in this embodiment, the dielectric element in the dielectric layer may cover one edge of the first lead, or both edges of the first lead, or the first lead entirely, so as to ensure electrical insulation between the first lead and the second lead. The setting of the media units can refer to the corresponding cases in fig. 9, 11 and 13, and will not be described again here.
In other alternative embodiments, the first lead includes a first subsection at the first metal layer and a second subsection at the second metal layer, and the second lead includes a third subsection at the first metal layer and a fourth subsection at the second metal layer. In an alternative embodiment, the dielectric element may cover one edge of the first subsection in a direction perpendicular to the extension direction of the leads; in alternative embodiments, the dielectric element may cover both edges of the first section in a direction perpendicular to the extension of the leads, or other embodiments to electrically isolate the first leads from the second leads, and the particular arrangement of the dielectric element in the dielectric layer will be described in the particular examples.
In one case, the first, second, third and fourth subsections are all ring-shaped structures. The lead adopts the design of annular structure, all is equivalent to forming a little parallel circuit in every annular structure, can reduce the resistance of lead, and then has reduced the consumption of lead, is favorable to reducing display panel's power loss.
Fig. 16 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 16, in the step area, the first lead 1X and the second lead 2X are alternately arranged in the first direction a in the step area, the first lead 1X includes a first subsection 1X1 located at a first metal layer M1 and a second subsection 1X2 located at a second metal layer M2, the first subsection 1X1 and the second subsection 1X2 are alternately arranged in a second direction b in the first lead 1X, the second direction b intersects with the first direction a, a length of the first subsection 1X1 is greater than a length of the second subsection 1X2 in a direction extending perpendicular to the first lead 1X, the dielectric element JD covers one edge of the first subsection 1X1, or the dielectric element JD covers both edges of the first subsection 1X1 as shown in fig. 16; the second lead 2X includes a third subsection 2X1 located at the first metal layer M1 and a fourth subsection 2X2 located at the second metal layer M2. In the second lead 2X, the third and fourth divisions 2X1 and 2X2 are alternately arranged in the second direction b, and the length of the fourth division 2X2 is greater than the length of the third division 2X1 in the direction extending perpendicularly to the second lead 2X.
When the display panel is manufactured, first, the portions of the lead wires located in the first metal layer, that is, the first subsection 1X1 of the first lead wire 1X and the third subsection 2X1 of the second lead wire 2X are manufactured, then, a pattern of the dielectric layer etching dielectric unit JD is manufactured, it is ensured that the dielectric unit JD covers one edge or two edges of the first subsection 1X1, and finally, the portions of the lead wires located in the second metal layer, that is, the second subsection 1X2 of the first lead wire 1X and the fourth subsection 2X2 of the second lead wire 2X are manufactured. The length of the first subsection 1X1 is greater than the length of the second subsection 1X2 along the direction perpendicular to the extension direction of the leads, and the dielectric element JD covers the edge of the first subsection 1X1 during manufacture, so that the electrical insulation between the first lead 1X and the second lead 2X can be ensured. According to the lead manufacturing principle in fig. 7, in this embodiment, the distance between the first sub-portion 1X1 of the first lead 1X and the fourth sub-portion 2X2 of the second lead 2X, which are manufactured by using different metal layers, may not be limited by the etching process, and further the distance between two adjacent leads may be smaller, so that the space occupied by the leads is saved, and the degree of freedom in designing the leads can be increased. When the first lead and the second lead are arranged on the neutral plane and the bending stress of the first lead and the second lead is reduced, in the embodiment, the first subsection, the second subsection, the third subsection and the fourth subsection are all in annular structures, namely the first lead is formed by electrically connecting the annular structures, the second lead is formed by electrically connecting the annular structures, the annular structures can disperse the bending stress in the bending and stretching process of the leads, and the situation that the first lead and the second lead are broken due to overlarge deformation when being bent is avoided. The performance reliability of the display panel is ensured.
Fig. 17 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 17, in the step area, the first lead 1X and the second lead 2X are alternately arranged in the first direction a in the step area, the first lead 1X includes a first section 1X1 located in the first metal layer M1 and a second section 1X2 located in the second metal layer M2, in the first lead 1X, the plurality of first sections 1X1 are sequentially arranged and electrically connected in the second direction b, the plurality of second sections 1X2 are sequentially arranged and electrically connected in the second direction b, and one first section 1X1 is electrically connected to one second section 1X2 correspondingly, the second direction b crosses the first direction a, in the step area, the second lead 2X includes a third section 2X1 located in the first metal layer M1 and a fourth section 2X2 located in the second metal layer M2, in the second lead 2X, the plurality of third sections 2X1 are sequentially arranged and electrically connected in the second direction b, and the plurality of fourth sections 2X 56 are sequentially arranged and electrically connected in the second direction b2, and a third section 2X1 is electrically connected to a fourth section 2X2, the media units include a first media unit JD1 and a second media unit JD2, the first media unit JD1 covers the edge of the first section 1X1 on the side away from the second section 1X 2; the second media unit JD covers the edge of the third section 2X1 on the side away from the fourth section 2X 2.
This embodiment is also fabricated according to the lead fabrication principle in fig. 7, saving space occupied by the leads and enabling increased freedom in designing the leads. When the display panel is manufactured, firstly, parts of the lead wires, which are positioned on the first metal layer, namely a first subsection 1X1 of a first lead wire 1X and a third subsection 2X1 of a second lead wire 2X are manufactured, then, a pattern of a dielectric layer etching dielectric unit JD is manufactured, and the first dielectric unit JD1 is ensured to cover the edge of one side, far away from the second subsection 1X2, of the first subsection 1X 1; the second dielectric element JD covers the edge of the third section 2X1 on the side away from the fourth section 2X2, and finally makes the portion of the lead located in the second metal layer, i.e. the second section 1X2 of the first lead 1X and the fourth section 2X2 of the second lead 2X. In this embodiment, the first subsection, the second subsection, the third subsection and the fourth subsection are all ring-shaped structures, and the ring-shaped structures can disperse bending stress in the bending and stretching process of the lead, so that the phenomenon that the first lead and the second lead are broken due to overlarge deformation amount during bending is avoided. Meanwhile, in this embodiment, the first section and the second section are electrically connected in the first lead, and the third section and the fourth section are electrically connected in the second lead. When a certain part of the honeycomb is broken due to bending, the other parts of the lead are still electrically connected with each other, and the lead can still normally provide signals, so that the bending resistance of the lead is further improved.
In another case, fig. 18 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 18, in the step area, the first leads 1X and the second leads 2X are alternately arranged in the first direction a in the step area, the first leads 1X include a first section 1X1 located in the first metal layer M1 and a second section 1X2 located in the second metal layer M2, the second section 1X2 has a first short-connection W1 in the first lead 1X, and the first short-connection W1 is electrically connected to the first section 1X1 through a via hole K1; the second lead 2X includes a third branch 2X1 located in the first metal layer M1 and a fourth branch 2X2 located in the second metal layer M2, and in the second lead 2X, the fourth branch 2X2 has a second short-connection W2, and the second short-connection W2 is electrically connected to the third branch 2X1 through a via K2. The media units include a first media unit JD1 and a second media unit JD2, the first media unit JD1 covers the first subsection 1X1, the second media unit JD2 covers the third subsection 2X1, fig. 19 is a schematic partial cross-sectional view at a tangent line Q4 in fig. 18, fig. 20 is a schematic partial cross-sectional view at a tangent line Q5 in fig. 18, and fig. 19 and 20 illustrate a via connection manner of the short-circuited part in the embodiment corresponding to fig. 18.
This embodiment is also fabricated according to the lead fabrication principle in fig. 7, saving space occupied by the leads and enabling increased freedom in designing the leads. When the display panel is manufactured, first, the portions of the leads located in the first metal layer, that is, the first subsection 1X1 of the first lead 1X and the third subsection 2X1 of the second lead 2X are manufactured, then, a pattern of a dielectric layer etching dielectric unit JD is manufactured, the dielectric unit JD is etched to form a via hole K1 connecting the first short-connection portion W1 with the first subsection 1X1, and also to form a via hole K2 connecting the second short-connection portion W2 with the third subsection 2X1, and finally, the second subsection 1X2 of the first lead 1X and the fourth subsection 2X2 of the second lead 2X are manufactured. In this embodiment, the first part and the second part are electrically connected through the first short-circuit portion in the first lead, the first part and the second part are not in direct contact, if the first part cracks due to bending, the cracks cannot extend to the second part, so that the second part also cracks, namely, the cracks on the first part and the second part cannot influence each other, and the cracks on the third part and the fourth part in the second lead cannot influence each other in the same way, so that the bending resistance of the first lead and the second lead is improved.
In another case, fig. 21 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 21, in the step area, the first leads 1X and the second leads 2X are alternately arranged in the first direction a in the step area, the first leads 1X include a first section 1X1 located in the first metal layer M1 and a second section 1X2 located in the second metal layer M2, the second section 1X2 has a first short-connection W1 in the first lead 1X, and the first short-connection W1 is electrically connected in direct contact with the first section 1X 1; the second lead 2X includes a third branch 2X1 located in the first metal layer M1 and a fourth branch 2X2 located in the second metal layer M2, and in the second lead 2X, the fourth branch 2X2 has a second short-connection portion W2, and the second short-connection portion W2 is electrically connected to the third branch 2X1 in direct contact. The media units include a first media unit JD1 and a second media unit JD2, the first media unit JD1 covering the edge of the side of the first section 1X1 remote from the second section 1X 2; the second media unit JD2 covers the edge of the third section 2X1 on the side away from the fourth section 2X 2.
This embodiment is also fabricated according to the lead fabrication principle in fig. 7, saving space occupied by the leads and enabling increased freedom in designing the leads. When the display panel is manufactured, firstly, the parts of the leads positioned in the first metal layer, namely the first subsection 1X1 of the first lead 1X and the third subsection 2X1 of the second lead 2X are manufactured, then, the pattern of the dielectric layer etching dielectric unit is manufactured, and finally, the second subsection 1X2 of the first lead 1X and the fourth subsection 2X2 of the second lead 2X are manufactured. In this embodiment, the first part and the second part are electrically connected through the first short-circuit portion in the first lead, the first part and the second part are not in direct contact, if the first part cracks due to bending, the cracks cannot extend to the second part, so that the second part also cracks, namely, the cracks on the first part and the second part cannot influence each other, and the cracks on the third part and the fourth part in the second lead cannot influence each other in the same way, so that the bending resistance of the first lead and the second lead is improved. In addition, in the embodiment, the first dielectric unit is arranged to cover the edge of the first subsection, which is far away from the second subsection, the second dielectric unit is arranged to cover the edge of the third subsection, which is far away from the fourth subsection, no via hole is needed when the second subsection is electrically connected with the first subsection in the first lead, and no via hole is needed when the fourth subsection is electrically connected with the third subsection in the second lead, which is equivalent to saving of a via hole etching process of the dielectric unit and simplification of a process.
Optionally, the first and second short portions W1 and W2 in fig. 18 or fig. 21 are staggered in the step region, so that the stress generated when the first and second leads 1X and 2X bend along with the step region can be uniformly dispersed, and the bending resistance of the lead in the step region can be enhanced.
In another case, fig. 22 is a schematic diagram of another alternative implementation of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 22, in the step area, the first lead 1X and the second lead 2X are alternately arranged in the first direction a in the step area, the first lead 1X includes a first subsection 1X1 located in the first metal layer M1 and a second subsection 1X2 located in the second metal layer M2, the first subsection 1X1 and the second subsection 1X2 extend in the same direction in the first lead 1X, and the first subsection 1X1 and the second subsection 1X2 are electrically connected in direct contact; the second lead 2X includes a third subsection 2X1 located in the first metal layer M1 and a fourth subsection 2X2 located in the second metal layer M2, the third subsection 2X1 and the fourth subsection 2X2 extend in the same direction within the second lead 2X, and the third subsection 2X1 and the fourth subsection 2X2 are electrically connected in direct contact; the media units include a first media unit JD1 and a second media unit JD2, the first media unit JD1 covering the edge of the side of the first section 1X1 remote from the second section 1X 2; the second media unit JD2 covers the edge of the third section 2X1 on the side away from the fourth section 2X 2. The dielectric element ensures electrical insulation between the first lead and the second lead.
The display panel is manufactured according to the lead manufacturing principle in fig. 7. The first lead comprises the first subsection and the second subsection, the second lead comprises the third subsection and the fourth subsection, and the embodiment is equivalent to increasing the width of the first lead and the second lead, so that the bending resistance of the first lead and the second lead is increased.
It should be noted that, in the embodiments corresponding to fig. 15, 16, and 17, the embodiment relating to the ring-shaped structure in the lead is only exemplified by the shape of the ring-shaped structure being a diamond ring, and is not a limitation to the present invention. Taking the embodiment corresponding to fig. 15 as an example, fig. 23 is a schematic diagram of another alternative implementation manner of the step area lead in the display panel according to the embodiment of the present invention. As shown in fig. 23, in the step area, the first and second leads 1X and 2X are alternately arranged in the first direction a in the step area, each of the first and second leads 1X and 2X includes a plurality of ring structures H, the plurality of ring structures H are sequentially electrically connected in the second direction b, and the second direction b crosses the first direction a. The first leads 1X are all located on the first metal layer M1, and the second leads 2X are all located on the second metal layer M2, wherein the ring structure H is in the shape of a circular ring.
The display panel provided by the invention can be a liquid crystal display panel or an organic light emitting display panel. When the display panel is a liquid crystal display panel, the display panel comprises an array substrate and a color film substrate which are oppositely arranged, and a liquid crystal layer is also arranged between the array substrate and the color film substrate. The array substrate extends out of the color film substrate to form a step area. When the substrate material of the array substrate is a flexible material (such as a polyimide material), the step area of the array substrate has bending flexibility, so that one end of the step area, which is far away from the display area, can be bent and then placed on one side, which is far away from the display surface of the display panel; when the display panel is an organic light-emitting display panel, the display panel comprises an array substrate and a light-emitting device layer on the array substrate, and a packaging structure can be further arranged above the light-emitting device layer. The step area is positioned on the array substrate. When the substrate material of the array substrate is a flexible material (such as a polyimide material), the step area of the array substrate has bending flexibility, and one end, far away from the display area, of the step area can be bent and then placed on one side, far away from the display surface of the display panel.
Further, in some optional embodiments, the display panel is a multi-film stack structure, the display panel includes an array substrate, and fig. 24 is a film structure diagram of the array substrate in the display panel according to the embodiment of the present invention. As shown in fig. 24, the array substrate includes a semiconductor active layer 1011, a gate metal layer 1012, and a source/drain metal layer 1013, and an insulating film (not shown) is further disposed between the metal layers. The array substrate comprises a plurality of Thin Film Transistors (TFTs) which comprise an active layer 11, a gate electrode 12, a source electrode 13 and a drain electrode 14, wherein the active layer 11 is positioned on a semiconductor active layer 1011, the gate electrode 12 is positioned on a gate metal layer 1012, and the source electrode 13 and the drain electrode 14 are positioned on a source drain metal layer 1013. Fig. 24 schematically shows only a thin film transistor having a top gate structure, and the thin film transistor in the array substrate of the present invention may have a bottom gate structure.
Optionally, when the display panel is a touch display panel, the display panel further includes a touch layer, and the touch electrode of the display panel is located on the touch layer. The original metal film layer in the display panel is reused during the manufacturing of the step area lead, and no new process is added. Fig. 25 is a schematic diagram of a film structure of an alternative embodiment of a display panel according to an embodiment of the present invention. As shown in fig. 25, taking the display panel as an organic light emitting display panel as an example, the display panel includes an array substrate 101, a display device layer 102 located on the array substrate 101, an encapsulation layer 103 located on the display device layer 102, and a touch layer 104 located on the encapsulation layer 103, where the touch layer 104 may also be located between the display device layer 102 and the encapsulation layer 103.
Optionally, the display panel further includes a lead metal layer. Fig. 26 is a schematic diagram of a film structure of another alternative embodiment of a display panel according to an embodiment of the present invention. As shown in fig. 26, the display panel includes an array substrate including a semiconductor active layer 1011, a gate metal layer 1012, and a source/drain metal layer 1013, and a lead metal layer 1014, and an insulating film (not shown) is disposed between the metal layers. The positional relationship of the film layers in fig. 26 is only a schematic representation and is not intended to limit the present invention. In the present invention, the first metal layer and the source/drain metal layer 1013 are prepared as the same film layer, and the second metal layer and the lead metal layer 1014 are prepared as the same film layer. The display panel provided by the invention is an organic light-emitting display panel, the display panel comprises a plurality of organic light-emitting devices, the display panel comprises a power line, the power line provides light-emitting signals for the organic light-emitting devices, the power line comprises a first power line and a second power line, and the first power line and the second power line are electrically connected; the first power line and the source drain metal layer are prepared in the same film layer, and the second power line and the lead metal layer are prepared in the same film layer. The first power line and the second power line are defined in this embodiment only to distinguish the power lines located in different metal layers. The first power line and the second power line are electrically connected to indicate that the first power line and the second power line transmit the same signal. In the conventional design, the power line is only prepared by one metal film layer, while the power line is prepared by two metal layers, and the first power line and the second power line which are respectively positioned on the two metal layers are electrically connected, so that the resistance of the power line is reduced, and further, the power consumption of the display panel can be reduced. According to the embodiment, the insulating film layer can be manufactured on the source and drain electrode metal layer, then the lead metal layer is continuously manufactured, the step area lead is manufactured by adopting different metal layers through the lead metal layer, meanwhile, the lead metal layer can be used for manufacturing the power line in the display panel, the resistance of the power line is reduced, and then the reduction of the power consumption of the display panel can be realized.
The organic light emitting display panel needs to be set as a power line for providing a light emitting signal for a light emitting device, the power line comprises an anode power line and a cathode power line, and the power line and a source-drain metal layer are prepared in the same film layer under normal conditions. For the invention, the anode power line can be prepared by two metal layers to reduce the resistance on the anode power line, the cathode power line can be prepared by two metal layers to reduce the resistance on the cathode power line, or both the anode power line and the cathode power line are prepared by two metal layers.
Fig. 27 is a schematic diagram of a power line of a display panel according to an embodiment of the present invention, where as shown in fig. 27, the display panel includes a display area AA and a non-display area BA, the organic light emitting display panel needs to be configured as a power line for providing light emitting signals to light emitting devices, and the power line includes a positive power line 271 and a negative power line 272. Only by taking the case that the positive power line in the display panel is prepared by two metal layers as an example, fig. 28 is a schematic diagram of an alternative implementation manner of the positive power line of the display panel provided in the embodiment of the present invention, and as shown in fig. 28, the positive power line includes a first positive power line 2711 prepared in the same film layer as the source/drain metal layer 1013 and a second positive power line 2712 prepared in the same film layer as the lead metal layer 1014. The first positive power line 2711 and the second positive power line 2712 are electrically connected through a via K. The position of the first positive power line 2711 and the second positive power line 2712 connected by a via is not limited in the present invention, and the first positive power line 2711 and the second positive power line 2712 may be connected by a via at a plurality of positions. The connection mode of the negative power line when two layers of metal are adopted is the same as that of the positive power line, and the description is omitted here.
Fig. 29 is a schematic view of a display device according to an embodiment of the present invention. The display device provided by the invention comprises the display panel provided by any embodiment of the invention. According to the invention, the step areas adopt different metal layers to manufacture the leads, the adjacent leads are ensured to be mutually electrically insulated through the dielectric layers, the leads positioned on different metal layers are not limited by an etching process when being manufactured, so that the distance between the adjacent leads can be shortened, the space of the step areas is saved, the degree of freedom of design of the leads can be increased, and the bending resistance of the leads is improved. Thereby ensuring the performance reliability of the display device.
According to the embodiment, the display panel and the display device of the invention have the following beneficial effects:
according to the invention, the step areas adopt different metal layers to manufacture the leads, the adjacent leads are ensured to be mutually electrically insulated through the dielectric layers, the leads positioned on different metal layers are not limited by an etching process when being manufactured, so that the distance between the adjacent leads can be shortened, the space of the step areas is saved, the degree of freedom of design of the leads can be increased, and the bending resistance of the leads is improved.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (15)
1. A display panel, comprising:
a display area and a step area, wherein one end of the step area far away from the display area can be arranged at one side far away from the display surface of the display panel after being bent,
a plurality of lead wires are arranged in the step area, the lead wires are routed from the step area to the display area, the lead wires comprise first lead wires and second lead wires, the first lead wires and the second lead wires are alternately arranged along a first direction,
the display panel includes a first metal layer and a second metal layer, the first lead includes a first section located at the first metal layer and a second section located at the second metal layer, the second lead includes a third section located at the first metal layer and a fourth section located at the second metal layer, and
the dielectric layer comprises a plurality of dielectric units, the extending direction of the dielectric units is the same as the extending direction of the lead, the part of the lead positioned on the first metal layer is provided with two edges opposite to each other along the first direction, and the dielectric units at least cover one edge to enable the first lead to be electrically insulated from the adjacent second lead.
2. The display panel according to claim 1,
the step region has a neutral plane, and the first and second leads are located on the neutral plane.
3. The display panel according to claim 1,
the manufacturing material of the dielectric layer comprises an organic material or an inorganic material.
4. The display panel according to claim 3,
the manufacturing material of the dielectric layer comprises an organic material.
5. The display panel according to claim 1,
the first metal layer and the second metal layer are made of at least one of aluminum and titanium.
6. The display panel according to claim 1,
the first, second, third and fourth sections are all ring-shaped structures.
7. The display panel according to claim 6,
in the first lead, the first and second sections are alternately arranged in a second direction intersecting the first direction, a length of the first section is longer than a length of the second section in a direction perpendicular to an extending direction of the first lead, the dielectric element covers one of the edges of the first section, or the dielectric element covers both of the edges of the first section;
in the second lead, the third and fourth portions are alternately arranged in the second direction, and a length of the fourth portion is longer than a length of the third portion in a direction perpendicular to an extending direction of the second lead.
8. The display panel according to claim 6,
in the first lead, a plurality of the first subsections are sequentially and electrically connected along a second direction, a plurality of the second subsections are sequentially and electrically connected along the second direction, one first subsection is correspondingly and electrically connected with one second subsection, and the second direction is crossed with the first direction;
in the second lead, a plurality of the third sections are sequentially and electrically connected in the second direction, a plurality of the fourth sections are sequentially and electrically connected in the second direction, and one third section is correspondingly and electrically connected with one fourth section;
the media units comprise a first media unit and a second media unit, and the first media unit covers the edge of one side of the first subsection far away from the second subsection; the second media unit covers an edge of a side of the third section remote from the fourth section.
9. The display panel according to claim 1,
within the first lead, the second section has a first short that electrically connects the first section through a via;
within the second lead, the fourth section has a second short, which is electrically connected to the third section by a via;
the media units include a first media unit overlaying the first subsection and a second media unit overlaying the third subsection.
10. The display panel according to claim 1,
within the first lead, the second sub-portion has a first shorting section in direct contact electrical connection with the first sub-portion;
within the second lead, the fourth segment has a second shorting section in direct contact electrical connection with the third segment;
the media units comprise a first media unit and a second media unit, the first media unit covers the edge of one side, far away from the second subsection, of the first subsection, and the second media unit covers the edge of one side, far away from the fourth subsection, of the third subsection.
11. The display panel according to claim 9 or 10,
the first short-circuit portions and the second short-circuit portions are distributed in the step area in a staggered mode.
12. The display panel according to claim 6,
the annular structure is in the shape of a circular ring, a diamond ring or an oval ring.
13. The display panel according to claim 1,
the display panel comprises a source drain metal layer and a touch layer;
the display panel comprises a plurality of thin film transistors, source electrodes and drain electrodes of the thin film transistors are positioned on the source drain electrode metal layers, and the display panel further comprises touch electrodes positioned on the touch layers;
the first metal layer and the source drain metal layer are prepared on the same film layer, and the second metal layer and the touch layer are prepared on the same film layer.
14. The display panel according to claim 1,
the display panel comprises a source drain electrode metal layer and a lead metal layer; the first metal layer and the source and drain metal layer are prepared on the same film layer, and the second metal layer and the lead metal layer are prepared on the same film layer;
the display panel is an organic light emitting display panel and comprises a plurality of organic light emitting devices, the display panel comprises a power line, the power line provides light emitting signals for the organic light emitting devices, the power line comprises a first power line and a second power line, and the first power line and the second power line are electrically connected; the first power line and the source drain metal layer are prepared on the same film layer, and the second power line and the lead metal layer are prepared on the same film layer.
15. A display device characterized by comprising the display panel according to any one of claims 1 to 14.
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| CN201810141516.6A CN108376685B (en) | 2018-02-11 | 2018-02-11 | Display panel and display device |
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| CN201810141516.6A CN108376685B (en) | 2018-02-11 | 2018-02-11 | Display panel and display device |
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| CN109103345B (en) * | 2018-08-17 | 2021-03-05 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109545801B (en) * | 2018-12-12 | 2021-02-09 | 昆山国显光电有限公司 | Display panel and display device |
| KR20200130550A (en) * | 2019-05-08 | 2020-11-19 | 삼성디스플레이 주식회사 | Display device and method of manufacturing for the display device |
| CN112286395A (en) * | 2020-10-30 | 2021-01-29 | 维沃移动通信有限公司 | Touch screen and electronic equipment |
| US11803269B2 (en) | 2020-12-04 | 2023-10-31 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Touch control structure and display apparatus |
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| TWI516851B (en) * | 2011-05-05 | 2016-01-11 | 友達光電股份有限公司 | Lead line structure of liquid crystal display panel and liquid crystal display panel having the same |
| KR102085961B1 (en) * | 2013-12-24 | 2020-03-06 | 엘지디스플레이 주식회사 | Flexible organic light emitting display and method of manufacturing the same |
| US9349758B2 (en) * | 2014-09-30 | 2016-05-24 | Lg Display Co., Ltd. | Flexible display device with divided power lines and manufacturing method for the same |
| TWI550850B (en) * | 2014-11-19 | 2016-09-21 | 財團法人工業技術研究院 | Flexible electronic device |
| KR102643637B1 (en) * | 2016-03-02 | 2024-03-06 | 삼성디스플레이 주식회사 | Display apparatus |
| CN206758434U (en) * | 2016-09-29 | 2017-12-15 | 昆山工研院新型平板显示技术中心有限公司 | A kind of flexible display circuit structure |
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