CN108372092A - Dispensing method, front shell assemblies and electronic device - Google Patents
Dispensing method, front shell assemblies and electronic device Download PDFInfo
- Publication number
- CN108372092A CN108372092A CN201810355435.6A CN201810355435A CN108372092A CN 108372092 A CN108372092 A CN 108372092A CN 201810355435 A CN201810355435 A CN 201810355435A CN 108372092 A CN108372092 A CN 108372092A
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- Prior art keywords
- side wall
- glue
- panel assembly
- edge
- overflow
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000000712 assembly Effects 0.000 title claims abstract description 35
- 238000000429 assembly Methods 0.000 title claims abstract description 35
- 239000003292 glue Substances 0.000 claims abstract description 149
- 239000002390 adhesive tape Substances 0.000 claims description 17
- 238000007711 solidification Methods 0.000 claims description 13
- 230000008023 solidification Effects 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 238000005034 decoration Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 11
- 239000013464 silicone adhesive Substances 0.000 description 6
- 239000004568 cement Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
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- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A kind of dispensing method disclosed by the invention includes：Shell and panel assembly are provided, panel assembly includes display screen and cover board, and display screen includes viewing area and non-display area, and cover board covers viewing area and the edge relative to display screen is at least partly retracted；Anti-overflow glue is arranged in circumferential direction along side wall on the inside of side wall；Cure anti-overflow glue to form at least one anti-overflow item；By gap of the panel assembly setting between groove, the edge of anti-overflow item sealing side wall knead dough board group part；Joint filling glue is arranged in gap between the top of side wall and the edge of panel assembly；Cure joint filling glue to be fixedly connected with shell and panel assembly.The dispensing method of embodiment of the present invention is by being pre-formed anti-overflow item, and when can prevent subsequent point from setting joint filling glue, joint filling glue penetrates into groove pollution shell and/or panel assembly.Cover board is at least partly retracted the screen accounting that can improve electronic device in this way relative to the edge of display screen.The present invention also provides a kind of front shell assemblies and electronic devices.
Description
Technical field
The present invention relates to a kind of electronic device more particularly to dispensing method, front shell assemblies and electronic devices.
Background technology
In the related art, the electronic devices such as mobile phone include shell and panel assembly, and shell forms fluted, panel assembly
It is arranged in groove, shell and the side of panel assembly generally being fixedly connected by mode for dispensing glue.However, since glue has
Mobility, glue are easy to flow to the bottom pollution panel assembly of panel assembly.
Invention content
A kind of dispensing method of present invention offer, front shell assemblies and electronic device.
The dispensing method of embodiment of the present invention includes step：
There is provided shell and panel assembly, the shell includes bottom wall and the side wall that the side from the bottom wall extends, described
Bottom wall surrounds fluted with the side wall, and the panel assembly includes display screen and cover board, the display screen include viewing area and
Non-display area around the viewing area, the cover board cover the viewing area and the edge at least portion relative to the display screen
Divide retraction；
Anti-overflow glue is arranged in circumferential direction along the side wall on the inside of the side wall；
Cure the anti-overflow glue to form at least one anti-overflow item；
The panel assembly is arranged in the groove, the anti-overflow item seals the side of the side wall and the panel assembly
Gap between edge；
Joint filling glue is arranged in the gap between the top of the side wall and the edge of the panel assembly；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
The front shell assemblies of embodiment of the present invention include shell, panel assembly, at least one anti-overflow item and joint filling adhesive tape.Institute
It includes bottom wall and the side wall that the side from the bottom wall extends to state shell, and the bottom wall surrounds fluted with the side wall.It is described
Anti-overflow item is by being arranged anti-overflow glue on the inside of the side wall along the circumferential direction of the side wall and being formed by curing.The panel group
Part is arranged in the groove.The panel assembly includes display screen and cover board, and the display screen includes viewing area and surrounds described
The non-display area of viewing area, the cover board cover the viewing area and the edge relative to the display screen and are at least partly retracted.
The anti-overflow item seals the gap between the side wall and the edge of the panel assembly.Joint filling adhesive tape passes through in the side wall
The gap between top and the edge of the panel assembly is arranged joint filling glue and is formed by curing.The joint filling adhesive tape is fixed
Connect the shell and the panel assembly.
The electronic device of embodiment of the present invention includes the front shell assemblies of ontology and any of the above embodiment.The front housing
Component is arranged on the body.
Dispensing method, front shell assemblies and the electronic device of embodiment of the present invention are described anti-overflow by pre-setting and curing
At least one anti-overflow item of the glue to be formed so that the anti-overflow item seals the edge of the side wall and the panel assembly
Between gap, it is described when can prevent that the joint filling glue for curing the shell and the panel assembly is subsequently arranged again
Joint filling glue penetrates into the groove and pollutes the shell and/or the panel assembly.In addition, edge of the cover board relative to display screen
The area ratio of viewing area and cover board can be improved in this way by being at least partly retracted, and improve the screen accounting of electronic device.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the floor map of the electronic device of embodiment of the present invention.
Fig. 2 is the perspective exploded view of the front shell assemblies of embodiment of the present invention；
Fig. 3 is the floor map of the front shell assemblies of embodiment of the present invention；
Fig. 4 is diagrammatic cross-section of the front shell assemblies along the directions III-III of Fig. 3；
Fig. 5 is the enlarged diagram of the parts front shell assemblies IV of Fig. 4；
Fig. 6 is diagrammatic cross-section of the front shell assemblies along the directions V-V of Fig. 3；
Fig. 7 is the enlarged diagram of the parts front shell assemblies VI of Fig. 6；
Fig. 8 is the flow diagram of the dispensing method of embodiment of the present invention；
Fig. 9 is the process schematic of the dispensing method of embodiment of the present invention；
Figure 10 is the step S18 process schematics of the dispensing method of embodiment of the present invention；
Figure 11 is the part-structure enlarged diagram of the front shell assemblies of embodiment of the present invention.
Main element symbol description：
Electronic device 100, ontology 20, front shell assemblies 10, gap 11, shell 12, groove 122, medial surface 1222, long side surface
1223, long side wall 1224, short sides 1225, short side wall 1226, bottom surface 1228, bottom wall 124, side wall 126, top 1262, step
128, step surface 1282,1286, outside 121 above 1284, rank below rank, panel assembly 14, edge 142, cascaded surface 1422, aobvious
Display screen 144, display platen edge 1442, cover board 146, side edge thereof 1462, surface 148, anti-overflow item 16, joint filling adhesive tape 18, opening
112, it is bonded adhesive tape 19.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the front shell assemblies 10 of embodiment of the present invention can be applied to electronic device 100.Electronic device 100
Including ontology 20, front shell assemblies 10 are arranged on ontology 20.Electronic device 100 includes but not limited to mobile phone, tablet computer or can
Wearable device.
Specifically, electronic device 100 further includes battery cover (not shown), and battery cover is located at shell 12 and panel assembly
On 14 opposite sides.
Fig. 2 to Fig. 5 is please referred to, the front shell assemblies 10 of embodiment of the present invention include shell 12, panel assembly 14, at least one
A anti-overflow item 16 and joint filling adhesive tape 18.
Shell 12 includes bottom wall 124 and the side wall 126 that the side from bottom wall 124 extends, and bottom wall 124 is surrounded with side wall 126
Fluted 122.Panel assembly 14 includes display screen 144 and cover board 146.Display screen 144 includes viewing area 1443 and surrounds described
The non-display area 1444 of viewing area 1443, cover board 146 cover viewing area 1443 and edge relative to display screen 144 at least partly
Retraction.In other words, the size of cover board 146 is less than the size of display screen 144.
Anti-overflow item 16 is by being arranged anti-overflow glue on the inside of side wall 126 along the circumferential direction of side wall 126 and being formed by curing.Face
Board group part 14 is arranged in groove 122.Anti-overflow item 16 seals the gap 11 between side wall 126 and the edge 142 of panel assembly 14.It fills out
It stitches adhesive tape 18 and joint filling glue is arranged by the gap 11 between the top of side wall 126 1262 and the edge of panel assembly 14 142
And it is formed by curing.Joint filling adhesive tape 18 is fixedly connected with shell 12 and panel assembly 14.
In the front shell assemblies 10 of embodiment of the present invention, front shell assemblies 10 are by pre-setting and curing anti-overflow glue with shape
At at least one anti-overflow item 16 so that anti-overflow item 16 seal side wall 126 top 1262 and edge 142 between gap 11,
When can prevent that the joint filling glue for curing shell 12 and panel assembly 14 is subsequently arranged again, joint filling glue penetrates into groove 122 and pollutes
Shell 12 and/or panel assembly 14.It can be carried in this way in addition, cover board 146 is at least partly retracted relative to the edge of display screen 144
The area ratio of high viewing area 1443 and cover board 146 improves the screen accounting of electronic device 100.
Shell 12 is substantially in cuboid, and shell 12 is the load-bearing part of electronic device 100, for carrying electronic device 100
Most of part.Shell 12 may be used plastics and be made, and can also be made of metal material, or use plastics and metal
Integral structure is formed by the technique of in-mould injection.In one example, the material of bottom wall 124 is metal, the material of side wall 126
For plastics, first bottom wall 124 can be put into mold, then by injecting the plastic cement of melting into mold, after plastic cement solidification
Side wall 126 is formed, to obtain shell 12.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222
Bottom surface 1228, medial surface 1222 are the plane perpendicular to bottom surface 1228.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222
Bottom surface 1228, medial surface 1222 are the side outwardly extending inclined-plane upwards of bottom surface 1228.
Medial surface 1222 can be vertical with bottom surface 1228, can also upwards extend outwardly from the edge of bottom surface 1228, front housing
Component 10 can select specific structure as needed.
In some embodiments, the edge 142 of panel assembly 14 includes side edge thereof 1462 and display platen edge 1442.
Anti-overflow item 16 seals side wall 126 and shows that the gap 11 between platen edge 1442, joint filling adhesive tape 18 are fixedly connected with side edge thereof
1462 and side wall 126 top 1262.
In this way, the top 1262 of side edge thereof 1462 and side wall 126 is able to connect by joint filling adhesive tape 18, so that face
Board group part 14 is fixedly connected with shell 12.
Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146
Due to the input part as electronic device 100, cover board 146 is often subject to the contacts such as collide or scratch.For example, user is by electronics
When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146
The larger material of hardness, such as above sapphire material may be used.Or hardened layer is formed to carry on the surface of cover board 146
The anti-scratch ability of high cover board 146.
Specifically, display screen 144 is, for example, liquid crystal display die set (LCD Module, LCM), and certainly, display module also may be used
Think display module flexible.Touch control layer on display screen 144 is used to receive the touch-control input of user, aobvious for controlling to generate
Show the signal of the content of module displays.
Display screen 144 is for example bonded by optical cement (Optically Clear Adhesive, OCA) solid with cover board 146
It is scheduled on together, optical cement is not only adhesively fixed display screen 144 and cover board 146, can also penetrate the light that display screen 144 is sent out.
In one example, panel assembly 14 can be formed by following steps：Display screen 144 and cover board 146 are first provided,
Cover board 146, is finally fitted on optical cement by the then coated optical glue on display screen 144, so that cover board 146 and display
Screen 144 is fixed together.
In some embodiments, medial surface 1222 includes long side wall 1224 and connects the short side wall of long side wall 1224
1226, anti-overflow item 16 is arranged along the length direction of long side wall 1224 in long side wall 1224.In this way, the size of long side wall 1224 compared with
Greatly, anti-overflow item 16 is arranged in long side wall 1224 along the length direction of long side wall 1224 and is conducive to seal medial surface 1222 and edge
Gap 11 between 1226.
Referring to Fig. 5, in some embodiments, it is convex that the oriented cover board 146 is formed on the top 1262 of the side wall 126
Go out the convex block 1263 of extension, the joint filling adhesive tape 18 is fixedly connected with the convex block 1263 and the panel assembly 14.
In this way, convex block 1263 can reduce the gap size between cover board 146 and side wall 126 so that electronic device 100 is more
Add beauty, in addition, convex block 1263 can increase the thickness at the top of side wall 126, to improve the anti-seismic performance of side wall 126,
Reduce the impact that cover board 146 receives.
In some embodiments, the width and display screen 144 in the gap between the edge of cover board 146 and convex block 1263 with
The width in the gap between side wall 126 is equal.In this way, being conducive to improve the consistency of electronic device 100 in this way so that electricity
Sub-device 100 is relatively reliable.Certainly, in other embodiments, the width in the gap between the edge of cover board 146 and convex block 1263
Degree can be less than or greater than the width in the gap between display screen 144 and side wall 126.
In some embodiments, the edge of the cover board 146 is located at 1444 top of the non-display area.In other words, it covers
The edge of plate 146 is located between the edge and the outer edge of non-display area 1444 of viewing area 1443.In this way so that improving electronics
The beam projecting that can allow cover board 146 that viewing area 1443 is generated while the screen accounting of device 100.
It please join Figure 11, in some embodiments, medial surface 1222 is formed with multiple raised 1229, multiple raised 1229 can
To increase the connection area of anti-overflow item 16 and medial surface 1222 so that anti-overflow item 16 and the connection of medial surface 1222 are more secured,
Prevent anti-overflow item 16 from being split away off from medial surface 1222.
Also referring to Fig. 6 and Fig. 7, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes inside
Face 1222, medial surface 1222 include long side surface 1223 and connect the short sides 1225 of long side surface 1223, and short sides 1225 are formed with
The transverse ends of step 128, cover board 146 are retracted relative to the edge of display screen 144, and longitudinal both sides of cover board 146 are relative to aobvious
It protrudes at the edge of display screen 144.Cover board 146 is supported on step 128 and is adhesively fixed with step 128.
In this way, step 128 to panel assembly 14 play the role of one support, be conducive to panel assembly 14 steadily with shell
Body 12 connects.Specifically, in present embodiment, display screen 144 is located at the side of step 128.
In other embodiment, short sides 1225 can save step 128 and have with long side surface 1223 same
Structure, and be equally coated with anti-overflow glue and form anti-overflow item 16.It longitudinal both ends of cover board 146 can also be relative to display screen 144
Retraction.
The present invention also provides a kind of dispensing method, the dispensing method of embodiment of the present invention, which can be used for manufacturing, forms this
The front shell assemblies 10 of invention embodiment.Specifically, the dispensing method of embodiment of the present invention will be described in detail below.
Fig. 8 and Fig. 9 are please referred to, the dispensing method of embodiment of the present invention includes the following steps：
S12：Shell 12 and panel assembly 14 are provided, shell 12 includes bottom wall 124 and the side that the side from bottom wall 124 extends
Wall 126, bottom wall 124 surround fluted 122 with side wall 126.Panel assembly 14 includes display screen 144 and cover board 146.Display screen
144 include viewing area 1443 and the non-display area 1444 around the viewing area 1443, and cover board 146 covers viewing area 1443 and phase
The edge of display screen 144 is at least partly retracted.
S14：Anti-overflow glue is arranged in circumferential direction along side wall 126 on the inside of side wall 126；
S16：Cure anti-overflow glue to form at least one anti-overflow item 16；
S18：By the setting of panel assembly 14 in groove 122, anti-overflow item 16 seals the edge of side wall 126 and panel assembly 14
Gap 11 between 142；
S20：Joint filling glue is arranged in gap 11 between the top of side wall 126 1262 and the edge of panel assembly 14 142；
S22：Cure joint filling glue to be fixedly connected with shell 12 and panel assembly 14.
The dispensing method of embodiment of the present invention is formed at least one anti-by pre-setting and curing anti-overflow glue
Overflow item 16 so that anti-overflow item 16 seals the gap 11 between side wall 126 and edge 142, can prevent that solidifying shell is subsequently arranged again
When the joint filling glue of body 12 and panel assembly 14, joint filling glue penetrates into groove 122 and pollutes shell 12 and/or panel assembly 14.Separately
Outside, cover board 146 is at least partly retracted relative to the edge of display screen 144 can improve viewing area 1443 and cover board 146 in this way
Area ratio improves the screen accounting of electronic device 100.
Wherein, in step S14, anti-overflow glue can be located at by dispenser point on the inside of side wall 126.In step
In S16, anti-overflow glue can also can by other means be cured with spontaneous curing.For example, when anti-overflow glue is UV glue,
Anti-overflow glue can be irradiated by ultraviolet light so that anti-overflow glue curing.
In step S18, panel assembly 14 can be drawn by sucker, be then charged into groove 122, and make anti-overflow item 16
It is contacted with edge 142, so as to seal the gap 11 between side wall 126 and edge 142.It is pointed out that anti-overflow item 16
Seal the gap 11 of side wall 126 and 142 lower part of edge.
In step S20, joint filling glue can be located at by dispenser point in the top in gap 11.
In step S22, the curing mode of joint filling glue can be identical with the mode of anti-overflow glue.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes long side wall 1224 and connection long side wall
1224 short side wall 1226.Step S14 includes the following steps：
Anti-overflow glue is arranged in length direction along long side wall 1224 on the inside of long side wall 1224.
In this way, may be implemented anti-overflow glue being arranged on the inside of the long side wall 1224 of side wall 126.
In some embodiments, adhesive-spill-preventing is set on the inside of long side wall 1224 along the length direction of long side wall 1224
The step of water, includes the following steps：
Length direction along long side wall 1224 is continuously provided anti-overflow glue on the inside of long side wall 1224.
In this way, the size of long side wall 1224 is larger, anti-overflow item 16 is arranged along the length direction of long side wall 1224 in long side wall
Be conducive to seal the gap 11 between side wall 126 and edge 1226 on 1224.In addition, anti-overflow glue is continuous in long side wall 1224
Distribution so that the anti-overflow item 16 after anti-overflow glue curing is continuous in long side wall 1224, is prevented due to anti-overflow item 16 not
Continuous spot coating and cause anti-overflow item 16 that cannot form continuous sealing ring and to seal the gap between side wall 126 and edge 142
11 effect is poor.
In some embodiments, anti-overflow glue includes silicone adhesive.
The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue
Leakproofness and the moisture resistance for changing the anti-overflow item 16 formed are more preferable.In addition, silicone adhesive also adapts to larger temperature change, to make
Sealing effect will not be reduced because of temperature change by obtaining anti-overflow item 16.Certainly, joint filling glue may be silicone adhesive.Anti-overflow glue and
Joint filling glue may be the preferable glue of other mobility such as UV glue.
In some embodiments, step S16 includes the following steps：
It is more than five minutes to cure anti-overflow glue in 20-25 DEG C of environment.
In one example, cure anti-overflow glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure anti-overflow glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure anti-overflow glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, 20-25 DEG C is normal temperature environment, cure the condition of cure that anti-overflow glue makes anti-overflow glue in normal temperature environment
Simply, easy to implement, to reduce the manufacturing cost of front shell assemblies 10.
In some embodiments, the time is fully cured less than anti-overflow glue in the hardening time of anti-overflow glue.At one
In example, the time that is fully cured of anti-overflow glue is more than 25min, and in the present invention, the hardening time of anti-overflow glue is 10min.
In this way, anti-overflow glue curing for a period of time after, by panel assembly 14 be arranged in groove 122, can make
Panel assembly 14 is arranged in groove when anti-overflow glue is also uncured for tight ness rating ratio between panel assembly 14 and groove 122
Tight ness rating in the case of in 122 is small, facilitates the dismounting during subsequent maintenance.In addition, before anti-overflow glue is fully cured,
Panel assembly 14 is arranged in groove 122, it can be to avoid since anti-overflow glue is fully cured and reduces close caused by mobility
It is poor to seal effect.
It is appreciated that after anti-overflow glue is fully cured, anti-overflow glue loses mobility, at this time sets panel assembly 14
It sets in groove 122, anti-overflow glue can not be deformed upon according to the extruding of panel assembly 14 and groove 122 and be obtained preferably close
Seal effect.In addition, the anti-overflow item 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, can cause
When panel assembly 14 is placed into groove 122, obstruction is generated.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes medial surface 1222, and medial surface 1222 wraps
It includes long side surface 1224 and connects the short sides 1226 of long side surface 1224.Short sides 1226 are formed with step 128, and step 128 includes
Step surface 1282, connection step surface 1282 and long side surface 1224 rank below 1284 and connect step surface 1282 rank above
1286.Step S14 includes the following steps：
It is continuously provided anti-overflow glue below rank 1284 length direction is 1284 below the rank.
In this way, continuously distributed on can making adhesive-spill-preventing water 1284 below the rank so that anti-overflow after anti-overflow glue curing
Item 16 1284 below the rank on be continuous, prevent from causing anti-overflow item 16 that cannot be formed due to the discontinuous spot printing of anti-overflow item 16
Continuous sealing ring makes the effect for sealing the gap 11 between side wall 126 and edge 142 poor.
It is appreciated that the anti-overflow glue being coated in long side wall 1224 and short side wall 1226 is continuous, in this way, along inside
The anti-overflow item 16 formed after the anti-overflow glue curing being circumferentially coated in face 1222 can form the sealing ring of a closure.
Referring to Fig. 10, in some embodiments, the transverse ends of cover board 146 contract relative to the edge of display screen 144
Into longitudinal both sides of cover board 146 are protruded relative to the edge of display screen 144.Step S18 includes the following steps：
The setting bonding glue on step surface 1282；
Cover board 146 is supported on step surface 1282；With
Solidification bonding glue is to be bonded step surface 1282 and cover board 146.
In this way, panel assembly 14 is able to bear against and is fixed on step surface by being bonded the bonding adhesive tape 19 that glue curing is formed
On 1282.Step 128 plays the role of a support to cover board 146, is conducive to panel assembly 14 and is steadily connect with shell 12.
Specifically, bonding glue can be identical with the ingredient of joint filling glue, such as is above-mentioned silicone adhesive.In addition, aobvious
It 1284 can be by 16 gluing of anti-overflow item that anti-overflow glue curing is formed below display screen 144 and rank.
In some embodiments, the edge 142 of panel assembly 14 includes side edge thereof 1462 and display platen edge 1442.
Step S20 includes：
Joint filling glue is arranged in gap 11 between the top of side wall 126 1262 and side edge thereof 1462；
The solidification joint filling glue includes：
Cure joint filling glue to be fixedly connected with shell 12 and side edge thereof 1462.
In this way, shell 12 and side edge thereof 1462 are connected and are consolidated by the joint filling adhesive tape 18 formed by joint filling glue curing
It is fixed, to make panel assembly 14 be fixed in groove 122.
In some embodiments, gap 11 is formed with towards upper opening 112, and step S20 includes the following steps：
It is placed in gap 11 from opening 112 by joint filling glue.
Joint filling glue can be placed in gap 11 by Glue dripping head generally in needle-shaped by opening 112.In one example, may be used
First fixture to be used to fix front shell assemblies 10, then Glue dripping head was moved along one week of gap 11, by opening 112 by gap-filling glue
Water is placed in gap 11.In this way, realizing the filling of joint filling glue.
In some embodiments, the solidification joint filling glue includes：
It is more than five minutes to cure joint filling glue in 20-25 DEG C of environment.
In one example, cure joint filling glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure joint filling glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure joint filling glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, realizing the solidification of joint filling glue.It is appreciated that after joint filling glue is fully cured, joint filling glue loses
Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that follow-up removal positioned at the surface 148 of panel assembly 14 and
The joint filling glue in the outside of shell 12 121 is inconvenient, it could even be possible to damaged in removal process panel assembly 14 surface 148 and
The outside 121 of shell 12.The shape that joint filling glue of the solidification more than five minutes is also not up to fully cured in 20-25 DEG C of environment
State is conducive to subsequently remove the joint filling glue positioned at the surface 148 of panel assembly 14 and the outside 121 of shell 12.In addition, 20-
25 DEG C are normal temperature environment, cure joint filling glue in normal temperature environment and make the condition of cure of joint filling glue simple, easy to implement, from
And reduce the manufacturing cost of front shell assemblies 10.
In some embodiments, dispensing method is further comprising the steps of after curing joint filling glue：
Remove the residual glue (not shown) positioned at the surface 148 of panel assembly 14 and the outside 121 of shell 12.
During by joint filling glue from 112 points of opening into gap 11, since gap 11 is very narrow, when from Glue dripping head
When the dispensing amount of outflow is excessive, gap-filling glue water is easy to spill into the formation of surface 148 of the outside 121 of shell 12 and panel assembly 14
Remain glue.Therefore, after curing joint filling glue, glue will be remained by, which also needing, wipes so that the outside 121 of shell 12 and panel
There is no residual glue on the surface 148 of component 14.
In some embodiments, the removing residual glue positioned at the surface 148 of panel assembly 14 and the outside 121 of shell 12 is removed
The step of water, includes the following steps：
The residual glue positioned at the surface 148 of panel assembly 14 and the outside 121 of shell 12 is wiped using non-dust cloth.
Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface
While the surface 148 of board group part 14 and outside 121 of shell 12, higher cleaning efficiency can be obtained.In one example,
First fixture can be used to fix front shell assemblies 10, then by manipulator clamping non-dust cloth, last control machinery hand movement is to wipe
Except the joint filling glue positioned at the surface of panel assembly 14 148 and the outside of shell 12 121.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (20)
1. a kind of dispensing method, which is characterized in that include the following steps：
Shell and panel assembly are provided, the shell includes bottom wall and the side wall that the side from the bottom wall extends, the bottom wall
Surrounded with the side wall fluted, the panel assembly includes display screen and cover board, and the display screen includes viewing area and surrounds
The non-display area of the viewing area, the cover board cover the viewing area and the edge relative to the display screen and at least partly contract
Into；
Anti-overflow glue is arranged in circumferential direction along the side wall on the inside of the side wall；
Cure the anti-overflow glue to form at least one anti-overflow item；
The panel assembly is arranged in the groove, the anti-overflow item seal the side wall and the panel assembly edge it
Between gap；
Joint filling glue is arranged in the gap between the top of the side wall and the edge of the panel assembly；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
2. dispensing method as described in claim 1, which is characterized in that the groove is generally rectangular shaped, and the side wall includes length
Side wall and the short side wall for connecting the long side wall, it is described that adhesive-spill-preventing is set on the inside of the side wall along the circumferential of the side wall
The step of water, includes the following steps：
The anti-overflow glue is arranged in length direction along the long side wall on the inside of the long side wall.
3. dispensing method as claimed in claim 2, which is characterized in that the length direction along the long side wall is in the length
The step of anti-overflow glue is arranged on side wall includes the following steps：
Length direction along the long side wall is continuously provided the anti-overflow glue on the inside of the long side wall.
4. dispensing method as described in claim 1, which is characterized in that the solidification anti-overflow glue is at least one to be formed
Anti-overflow the step of, includes the following steps：
It is more than five minutes to cure the anti-overflow glue in 20-25 DEG C of environment.
5. dispensing method as described in claim 1, which is characterized in that the hardening time of the anti-overflow glue is less than described anti-overflow
The time is fully cured in glue.
6. dispensing method as described in claim 1, which is characterized in that the groove is generally rectangular shaped, and the side wall includes interior
Side, the medial surface include long side surface and connect the short sides of the long side surface, and the short sides are formed with step, described
Rank includes step surface, connects below the rank of the step surface and the long side surface and above the rank of the connection step surface, described
Circumferential along the side wall includes the following steps the step of anti-overflow glue is arranged on the inside of the side wall：
Length direction below the rank is continuously provided the anti-overflow glue.
7. dispensing method as claimed in claim 6, which is characterized in that the transverse ends of the cover board are relative to the display screen
Edge retraction, longitudinal both sides of the cover board are protruded relative to the edge of the display screen, described to set the panel assembly
It sets and includes the following steps in the step of groove：
The setting bonding glue on the step surface；
By the cover plate support on the step surface；With
Cure the bonding glue to be bonded the step surface and the cover board.
8. dispensing method as described in claim 1, which is characterized in that the edge of the panel assembly includes side edge thereof and shows
Display screen edge, the gap setting joint filling glue between the top of the side wall and the edge of the panel assembly
Step includes the following steps：
The joint filling glue is arranged in gap between the top of the side wall and the side edge thereof；
The solidification joint filling glue includes：
Cure the joint filling glue to be fixedly connected with the shell and the side edge thereof.
9. dispensing method as described in claim 1, which is characterized in that the gap is formed with towards upper opening, it is described
The step of joint filling glue is arranged in the gap between the top of the side wall and the edge of the panel assembly includes following step
Suddenly：
The joint filling glue is placed in the gap from the opening.
10. dispensing method as described in claim 1, which is characterized in that the step of solidification joint filling glue include with
Lower step：It is more than five minutes to cure the joint filling glue in 20-25 DEG C of environment；And/or
The step of solidification decoration glue, includes the following steps：
It is more than five minutes to cure the decoration glue in 20-25 DEG C of environment.
11. dispensing method as described in claim 1, which is characterized in that the dispensing method is in the solidification gap-filling glue
It is further comprising the steps of after the step of water：
Remove the residual glue positioned at the surface of the panel assembly and the outside of the shell.
12. dispensing method as claimed in claim 11, which is characterized in that the removal is located at panel assembly surface and the shell
The step of residual glue of external side, includes the following steps：
The residual glue positioned at the surface of the panel assembly and the outside of the shell is wiped using non-dust cloth.
13. a kind of front shell assemblies, which is characterized in that including：
Shell, the shell include bottom wall and the side wall that the side from the bottom wall extends, and the bottom wall is surrounded with the side wall
It is fluted；
Panel assembly in the groove is set, and the panel assembly includes display screen and cover board, and the display screen includes display
Area and non-display area around the viewing area, the cover board cover the viewing area and edge relative to the display screen extremely
Small part is retracted；
At least one anti-overflow item that anti-overflow glue is set on the inside of the side wall and is formed by curing along the circumferential direction of the side wall,
The anti-overflow item seals the gap between the side wall and the edge of the panel assembly；
The gap between the top of the side wall and the edge of the panel assembly is arranged joint filling glue and is formed by curing
The joint filling adhesive tape for being fixedly connected with the shell and the panel assembly.
14. front shell assemblies as claimed in claim 13, which is characterized in that it is convex that the oriented cover board is formed on the top of the side wall
Go out the convex block of extension, the joint filling adhesive tape is fixedly connected with the convex block and the panel assembly.
15. front shell assemblies as claimed in claim 14, which is characterized in that the seam between the edge of the cover board and the convex block
The width in the gap between the width of gap and the display screen and the side wall is equal.
16. front shell assemblies as claimed in claim 13, which is characterized in that the side wall includes medial surface, the medial surface shape
At there is multiple protrusions.
17. front shell assemblies as claimed in claim 13, which is characterized in that the edge of the cover board is located on the non-display area
Side.
18. front shell assemblies as claimed in claim 13, which is characterized in that the edge of the panel assembly include side edge thereof and
Show that platen edge, the anti-overflow item seal the gap between the side wall and the display platen edge, the joint filling adhesive tape is fixed
Connect the top of the side edge thereof and the side wall.
19. front shell assemblies as claimed in claim 13, which is characterized in that the groove is generally rectangular shaped, and the side wall includes
Medial surface, the medial surface include long side surface and connect the short sides of the long side surface, and the short sides are formed with step, described
The transverse ends of cover board are retracted relative to the edge of the display screen, and longitudinal both sides of the cover board are relative to the display screen
Edge protrudes, and the cover plate support is adhesively fixed on the step and with the step.
20. a kind of electronic device, which is characterized in that including：
Ontology；
Front shell assemblies described in claim 13-19 any one, the front shell assemblies setting is on the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810355435.6A CN108372092B (en) | 2018-04-19 | 2018-04-19 | Dispensing method, front shell assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810355435.6A CN108372092B (en) | 2018-04-19 | 2018-04-19 | Dispensing method, front shell assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
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| CN108372092A true CN108372092A (en) | 2018-08-07 |
| CN108372092B CN108372092B (en) | 2021-09-10 |
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ID=63032386
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810355435.6A Expired - Fee Related CN108372092B (en) | 2018-04-19 | 2018-04-19 | Dispensing method, front shell assembly and electronic device |
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| CN (1) | CN108372092B (en) |
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| CN108600452A (en) * | 2018-04-25 | 2018-09-28 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN109782470A (en) * | 2019-03-25 | 2019-05-21 | 中航华东光电有限公司 | Whole plane ruggedized monitor |
| CN110225163A (en) * | 2019-06-26 | 2019-09-10 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN112600959A (en) * | 2020-12-18 | 2021-04-02 | Oppo（重庆）智能科技有限公司 | Cover plate for electronic equipment and electronic equipment with same |
| CN113411438A (en) * | 2021-06-09 | 2021-09-17 | 维沃移动通信有限公司 | Electronic device |
| CN115183163A (en) * | 2022-07-14 | 2022-10-14 | 厦门普为光电科技有限公司 | Lamp tube structure for preventing glue from overflowing |
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| CN103057244A (en) * | 2011-10-24 | 2013-04-24 | 比亚迪股份有限公司 | Dispensing method for touch panel and touch panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108600452A (en) * | 2018-04-25 | 2018-09-28 | Oppo广东移动通信有限公司 | Electronic equipment |
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| CN112600959A (en) * | 2020-12-18 | 2021-04-02 | Oppo（重庆）智能科技有限公司 | Cover plate for electronic equipment and electronic equipment with same |
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|---|---|
| CN108372092B (en) | 2021-09-10 |
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Granted publication date: 20210910 |