CN108370005B - Battery pack - Google Patents
Battery pack Download PDFInfo
- Publication number
- CN108370005B CN108370005B CN201680071258.8A CN201680071258A CN108370005B CN 108370005 B CN108370005 B CN 108370005B CN 201680071258 A CN201680071258 A CN 201680071258A CN 108370005 B CN108370005 B CN 108370005B
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- China
- Prior art keywords
- secondary battery
- circuit board
- resin
- battery cell
- region
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/271—Lids or covers for the racks or secondary casings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/218—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material
- H01M50/22—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material of the casings or racks
- H01M50/227—Organic material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The secondary battery unit and the circuit board are integrated, and the mechanical strength is improved. The design is changed into various shapes and sizes, and the product is produced in low cost. The battery pack includes: a thin secondary battery cell (1) having a terminal surface (1X); a circuit board (5) on which a protection circuit is mounted; a holding case (2) that houses the secondary battery cell (1) and the circuit board (5); and a resin mold part (4) formed by insert molding the circuit board (5). The holding case (2) has a battery arrangement region (21) in which the secondary battery cells (1) are arranged and a substrate arrangement region (22) in which the circuit substrate (5) is arranged on the same plane. The circuit board (5) is disposed in a board disposition region (21) in proximity to a terminal surface (1X) of a secondary battery cell (1) disposed in a battery disposition region (21). The battery pack is formed by embedding a part or the whole of a terminal surface (1X) of a secondary battery cell (1) arranged in a battery arrangement region (21) and a circuit board (5) arranged in a board arrangement region (22) in an insulating molding resin, thereby forming a resin mold section (4).
Description
Technical Field
The present invention relates to a battery pack in which a thin secondary battery cell and a circuit board are arranged on the same plane and integrally connected.
Background
With the spread of thin portable devices such as notebook personal computers and single-board PCs (so-called tablet PCs), a battery pack including a rechargeable and dischargeable thin secondary battery cell is required as a power source. A battery pack having a built-in secondary battery cell is provided with a protection circuit, and the battery is charged and discharged while being protected by the protection circuit, whereby the safety can be improved, and the deterioration can be prevented to prolong the life. A battery pack that achieves this includes a circuit board on which a protection circuit is mounted. The battery pack can be made compact as a whole by arranging the thin secondary battery cell and the circuit board on the same plane and forming an integral structure.
As such a battery pack, the applicant of the present application has previously developed a battery pack having a shape in which a plurality of battery cells are connected to each other by a low-temperature molding resin (see patent document 1). In this battery pack, a circuit board on which a battery protection circuit is mounted is disposed between the opposed secondary battery cells, and the circuit board is embedded in a low-temperature molding resin, whereby the plurality of secondary battery cells and the circuit board can be integrally connected, and the circuit board and the mounting member can be insulated and protected.
However, since portable devices housing a battery pack have various shapes and sizes, the battery pack may be required to have various design changes in its outer shape and size so as to be mounted in the portable devices. For example, a battery pack to be mounted on a large-sized portable device may need to have a structure in which the overall external shape is enlarged as if the battery pack were to follow the external shape of the portable device. In such a case, the entire size is adjusted by adjusting not the secondary battery cell having a specific outer shape but a portion connecting the secondary battery cells, that is, a region where a circuit board or the like is disposed. However, in a structure in which a plurality of secondary battery cells are directly connected to each other by a low-temperature molding resin, if the resin molded portion becomes large, the mechanical strength of the connection portion may become insufficient. Further, a large amount of low-temperature molding resin is required, which also causes a problem of high cost.
Documents of the prior art
Patent document
Patent document 1: JP application 2014-201583
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made in view of such background. An object of the present invention is to provide a battery pack having an integrated secondary battery cell and circuit board and improved mechanical strength.
Still another object of the present invention is to provide a battery pack which can be easily designed and changed into various shapes and sizes and can be mass-produced at low cost without using a large amount of low-temperature molding resin.
Means for solving the problems
In order to achieve the above object, a battery pack according to the present invention includes: a thin secondary battery cell 1 having a rectangular shape with a thickness smaller than a width and having a terminal surface 1X; a circuit board 5 electrically connected to the secondary battery cell 1 and having a protection circuit mounted thereon; a holding case 2 that houses the secondary battery cell 1 and the circuit board 5; and a resin mold part 4 formed by insert molding the circuit board 5 accommodated in the holding case 2. Holding case 2 has, on the same plane, battery placement region 21 where secondary battery cells 1 are placed and substrate placement region 22 where circuit substrate 5 is placed. The circuit board 5 is disposed in the board disposition region 22 in proximity to the terminal surface 1X of the secondary battery cell 1 disposed in the battery disposition region 21. In the battery pack, a part or the whole of the terminal surface 1X of the secondary battery cell 1 disposed in the battery disposition region 21 and the circuit board 5 disposed in the board disposition region 22 are embedded in an insulating molding resin, thereby forming the resin mold 4.
With the above configuration, by housing and fixing the secondary battery cell and the circuit board at a predetermined position of the holding case, the secondary battery cell and the circuit board can be arranged on the same plane, and the mechanical strength can be improved by providing an integrated structure. In particular, by protecting the entire outer periphery of the battery pack with the holding case, high external strength is achieved, and strength against dropping and bending can be improved. Further, when the housing is designed, the outer shape of the housing can be variously changed by adjusting the arrangement of the battery arrangement region and the substrate arrangement region and the size of the substrate arrangement region, and the housing can be easily adapted to an electronic device in which the battery pack is mounted.
Further, in the battery pack, the circuit board is sealed with the insulating molding resin, and thus the electronic component mounted on the circuit board can be resin-molded, thereby reliably insulating the electronic component. Further, by resin-molding the connecting portion between the secondary battery cell and the circuit board, the connection strength between the secondary battery cell and the circuit board can be improved, and disconnection or the like due to an impact such as dropping can be effectively prevented. Further, in the manufacturing process of the battery pack, since all the components can be arranged and fixed at predetermined positions by housing the circuit board on which the electronic components are mounted and the secondary battery cell in the holding case, the assembling work can be simplified and the manufacturing cost can be reduced. As described above, the battery pack according to the present invention can realize an ideal battery pack in which the characteristics based on the specification of the holding case and the specification of the insulating molding resin are effectively utilized by combining the holding case and the resin mold portion.
The battery pack of the present invention may be: the battery unit includes a plurality of secondary battery cells 1, battery disposition regions 21 are disposed at both ends of a holding case 2, and a substrate disposition region 22 is disposed between the opposing battery disposition regions 21. With the above configuration, a plurality of secondary battery cells and a circuit board can be arranged on the same plane and can be firmly connected to each other.
The battery pack of the present invention may be: the substrate placement region 22 is provided with the circuit substrate 5, a resin molding region 23 in which the resin mold 4 is formed, and a hollow region 24 in which the resin mold 4 is not formed, and the resin molding region 23 and the hollow region 24 are partitioned by a partition wall 33. With the above configuration, the substrate arrangement region is partitioned by the partition wall, and the resin molding region for forming the resin mold portion is provided, whereby the amount of insulating molding resin used can be reduced and the manufacturing cost can be reduced. Further, the region where the resin mold portion is not formed is hollow, so that the entire structure can be light in weight.
The battery pack of the present invention may be: the battery placement region 21 includes a frame portion 27 that houses the secondary battery cell 1 along the outer periphery of the secondary battery cell 1, and the frame portion 27 and the secondary battery cell 1 are covered with the exterior sheet 8. With the above configuration, the exposed portion of the secondary battery cell can be covered and protected by the exterior sheet, and the frame portion and the exterior sheet for the secondary battery cell can be firmly coupled to each other.
The battery pack of the present invention may be: a resin injection guide passage 29 for injecting an insulating molding resin is formed in the substrate arrangement region 22. With the above configuration, by adjusting the position where the resin injection guide passage is provided, the molten resin can be injected while determining the flow direction of the molten resin when the resin mold section is resin-molded.
The battery pack of the present invention may be: the resin mold 4 has a plurality of rows of grooves 41 formed in its surface. With the above configuration, the amount of insulating molding resin used is reduced, and the manufacturing cost can be reduced. Further, since the surface area can be increased by the plurality of rows of grooves provided on the surface of the resin mold portion, heat generated by the electronic component embedded in the resin mold portion can be efficiently dissipated. In this structure, in the conventional battery cell in which the secondary battery cells are connected only by the resin mold portion, the strength is reduced, and the structure is difficult to realize, but in the present invention, the strength of the battery pack can be secured by holding the case, and therefore, even if the groove portion is provided in the resin mold portion, there is no fear of reduction in strength, and both improvement in heat dissipation characteristics of the resin mold portion and cost reduction can be realized.
The battery pack of the present invention may be: the grooves 41 are formed in parallel with each other along the longitudinal direction of the circuit board 5 fitted in the resin mold 4. With the above configuration, since the plurality of rows of grooves are formed in parallel on the surface of the resin mold portion when the insulating molding resin is injected, the insulating molding resin in a molten state can be smoothly flowed along the ridges provided in the molding die. Therefore, the injected molten insulating molding resin can be quickly and reliably injected into the deep part of the molding chamber along the circuit board extending in the longitudinal direction.
The battery pack of the present invention may be: the holding case 2 is molded with a resin having a heat-resistant temperature of 70 ℃ or higher, and the insulating molding resin forming the resin mold 4 is a thermoplastic resin in a molten state at 70 ℃ or lower. With the above configuration, the holding case can be effectively prevented from being adversely affected by the thermoplastic resin in a molten state.
Drawings
Fig. 1 is a perspective view of a battery pack according to an embodiment of the present invention.
Fig. 2 is a perspective view of the battery pack shown in fig. 1 inverted from top to bottom.
Fig. 3 is a sectional view of the battery pack shown in fig. 2 taken along line III-III.
Fig. 4 is a sectional view of the battery pack shown in fig. 2 taken along line IV-IV.
Fig. 5 is an exploded perspective view of the battery pack shown in fig. 2.
Fig. 6 is a plan view showing a state in which the secondary battery cell, the circuit board, and the lead wires are provided in the holding case.
Fig. 7 is an enlarged perspective view showing an example of the secondary battery cell.
Fig. 8 is a sectional view taken along line VIII-VIII of the holding case shown in fig. 6.
Fig. 9 is an enlarged perspective view showing a connection portion between the circuit board of the holding case shown in fig. 6 and the secondary battery cell.
Fig. 10 is an enlarged sectional view showing a connection structure between the circuit board and the protection element.
Fig. 11 is an enlarged plan view showing a connection structure of lead wires and a circuit board.
Fig. 12 is a sectional view taken along line XII-XII of the positioning mechanism shown in fig. 11.
Fig. 13 is an enlarged perspective view of the positioning mechanism.
Fig. 14 is a perspective view of a battery pack according to another embodiment of the present invention.
Fig. 15 is a perspective view of a battery pack according to another embodiment of the present invention.
Detailed Description
Fig. 1 to 6 show a battery pack according to an embodiment of the present invention. The battery pack shown in these figures is mainly mounted on a thin portable electronic device such as a notebook personal computer or a tablet computer, and is used as a power source for these devices. The battery pack of the present invention can be used as a power source by being mounted on an electronic device other than a thin portable electronic device.
The battery pack 100 shown in fig. 1 to 6 includes: a thin secondary battery cell 1; a circuit board 5 electrically connected to the secondary battery cell 1 and having a protection circuit mounted thereon; a holding case 2 that houses the secondary battery cell 1 and the circuit board 5; and a resin mold portion 4 formed by insert molding the circuit board 5 housed in the holding case 2. The battery pack 100 shown in the figure includes two secondary battery cells 1, the secondary battery cells 1 are arranged at both ends of a holding case 2 in an opposed posture, a circuit board 5 is arranged between the opposed secondary battery cells 1, and the secondary battery cells 1 and the circuit board 5 are arranged substantially on the same plane.
(Secondary Battery cell 1)
The secondary battery cell 1 has an outer shape with a thickness smaller than a width, and is a battery having a thin shape as a whole. As shown in fig. 7, the secondary battery cell 1 includes: a metal outer can 11 having a bottomed cylindrical shape with one open surface; and a sealing plate 12 for closing the opening of the outer can 11. The opening of the outer can 11 is sealed by a flat plate-shaped sealing plate 12 formed by press working a metal plate by laser welding. In the secondary battery cell 1 shown in the drawing, both sides of the outer can 11 are curved surfaces. However, not only the rectangular battery but also a laminate battery in which electrodes are disposed inside a plastic outer film can be used for the thin secondary battery cell. The thin secondary battery cell 1 is a lithium ion secondary battery having a thickness of 3mm to 10 mm. However, the secondary battery cell may be any rechargeable secondary battery other than a lithium ion secondary battery, such as a nonaqueous electrolyte secondary battery or a nickel-hydrogen battery. The battery pack 100 in which the secondary battery cell 1 is a lithium ion secondary battery can increase the overall battery capacity.
In the secondary battery cell 1, the sealing plate 12 is defined as a terminal surface 1X, and positive and negative electrodes 10 are provided on the terminal surface 1X. In the secondary battery cell 1 shown in fig. 7, a protruding electrode 13 insulated from the sealing plate 12 is provided at the center of the sealing plate 12. In this secondary battery cell 1, the protruding electrode 13 provided on the sealing plate 12 is used as the 1 st electrode 10A, and the sealing plate 12 is used as the 2 nd electrode 10B, so that the positive and negative electrodes 10 are provided on the terminal surface 1X. In the secondary battery cell 1 shown in the figure, a coating plate 14 is fixed to one end of a sealing plate 12 to form a 2 nd electrode 10B. This secondary battery cell 1 can be reliably connected to lead plate 16 via cover plate 14. In the secondary battery cell 1 shown in the figure, the protruding electrode 13 (the 1 st electrode 10A) serves as a negative electrode, and the sealing plate 12 and the covering plate 14 (the 2 nd electrode 10B) serve as a positive electrode.
In the secondary battery cell 1, a safety valve 15 is provided in the sealing plate 12. The safety valve 15 opens when the internal pressure of the battery becomes higher than a set pressure to discharge gas and the like inside, thereby preventing the internal pressure from rising. Here, the safety valve of the secondary battery cell may be provided in the outer can. In this case, the battery pack in which the sealing plate is embedded in the resin mold portion can easily discharge the gas and the like from the inside of the outer can.
Further, in secondary battery cell 1, connection lead plate 16 for conducting electricity is connected to positive and negative electrodes 10 provided on terminal surface 1X. The secondary battery cell 1 is connected to the circuit board 5 via a 1 st connecting lead plate 16A connected to the 1 st electrode 10A, i.e., the protruding portion electrode 13, and a 2 nd connecting lead plate 16B connected to the 2 nd electrode 10B, i.e., the sealing plate 12. The battery pack 100 shown in the figure connects two secondary battery cells 1 to a circuit substrate 5. Two secondary battery cells 1 are connected in series on the circuit board 5.
(Circuit Board 5)
The circuit board 5 mounts electronic components that realize a protection circuit of the secondary battery cell 1 and the like. The protection circuit detects the temperature, voltage, current, and the like of the secondary battery cell 1 to control the charging and discharging current. The protection circuit that achieves this is equipped with: a voltage detection circuit (not shown) that detects the voltage of the secondary battery cell 1; a current detection circuit (not shown) for detecting a current; a temperature sensor (not shown) that detects the temperature of the secondary battery cell 1; a semiconductor switching element (not shown) such as an FET for controlling the charge/discharge current of the secondary battery cell 1; and a protection element 7 such as a current blocking element that operates by detecting the temperature or overcurrent of the secondary battery cell 1. The mounting of the protection element 7 on the circuit board 5 and the connection thereof will be described in detail later.
The circuit board 5 may be made of epoxy resin. In the battery pack of the present invention, since the strength of the entire battery pack can be improved by holding the case 2, the circuit board 5 can be manufactured at low cost without using a resin reinforced with a reinforcing fiber such as a glass fiber. However, it can also be made of an epoxy resin reinforced with glass fibers or the like. The circuit board 5 disposed in the holding case 2 is determined in shape and size, and the posture of the circuit board disposed in the holding case, and the like, in accordance with the outer shape and size required for the battery pack. The circuit board is formed in an outer shape that can be disposed in a board housing portion formed in the holding case, and details thereof will be described later.
(holding case 2)
The holding case 2 houses the secondary battery cell 1 and the circuit board 5 and arranges them at predetermined positions. The holding case 2 is formed in a thin plate shape as a whole so that the thin secondary battery cell 1 and the circuit board 5 can be arranged on the same plane, and is formed of resin so as to have a shape having a housing opening on one side (upper surface in fig. 2 to 6) in which the secondary battery cell 1 and the circuit board 5 can be housed. The holding case 2 is made of a resin different from the resin for molding the resin mold 4, and is preferably a resin having excellent heat resistance and strength, and is molded from a resin such as polycarbonate or ABS. The holding case 2 molded from these resins can have a heat resistance temperature of 70 ℃ or higher and can improve dimensional accuracy of the outer shape.
Holding case 2 has, on the same plane, battery placement region 21 where secondary battery cells 1 are placed and substrate placement region 22 where circuit substrate 5 is placed. In the holding case 2 shown in fig. 6, battery disposition regions 21 are provided at both ends so that two secondary battery cells 1 can be housed, and a substrate disposition region 22 is provided between the opposing battery disposition regions 21. In this way, the outer shape of the holding case 2 having the battery disposition region 21 and the substrate disposition region 22 can be easily changed by adjusting the size of the substrate disposition region 22. For example, since the secondary battery cell 1 is determined in its outer shape according to its specification and capacity, it is difficult to change the design such as the size of the battery disposition region 21, but the substrate disposition region 22 can be deformed in design with a high degree of freedom. Therefore, the holding case 2 is designed to deform the substrate arrangement region 22 into an optimum size and shape in order to achieve the outer shape required for the battery pack, thereby facilitating the adaptation to the electronic device. Further, in the battery pack including the plurality of secondary battery cells, the outer shape of the holding case can be easily changed by adjusting the number of secondary battery cells to be stored, the arrangement of the battery arrangement region and the substrate arrangement region, and the battery pack can be easily adapted to an electronic device to which the battery pack is mounted.
The holding case 2 shown in fig. 6 has a rectangular shape extending in one direction as a whole. The holding case 2 has battery disposition regions 21 formed at both ends in the longitudinal direction, and has a substrate disposition region 22 formed in the middle and extending in the longitudinal direction, so that the overall length of the holding case 2 is adjusted. In the substrate arrangement region 22, the circuit board 5 extending in the longitudinal direction is arranged such that both ends of the circuit board 5 are close to the terminal surfaces 1X of the secondary battery cells 1 arranged to face each other.
Here, in the substrate arrangement region 22 having an enlarged area for adjusting the outer shape of the holding case 2, the circuit substrate 5 and the resin mold 4 to be arranged are reduced in size to reduce the cost. To achieve this, the holding case 2 shown in fig. 6 divides the substrate arrangement region 22 into a resin molding region 23 in which the circuit substrate 5 is arranged and the resin mold 4 is molded, and a hollow region 24 in which the resin mold 4 is not molded. In the holding case 2 shown in the figure, a region connecting the center portions of the terminal surfaces 1X of the opposing secondary battery cells 1, which is the center portion of the substrate arrangement region 22, is defined as a resin molding region 23, and both sides of the resin molding region 23 are defined as hollow regions 24. The resin molding region 23 and the hollow region 24 are partitioned by a partition wall 33. In the holding case 2 shown in the figure, a pair of partition walls 33 are provided along the longitudinal direction in the center of the board housing area 22, and a board housing portion 26 for housing the circuit board 5 is formed between the facing partition walls 33.
The hollow region 24 is provided with a plurality of reinforcing ribs 34 intersecting in a grid-like manner in a longitudinal and transverse direction, and the entire hollow region is divided into a plurality of hollow chambers 28 for reinforcement. In this way, the configuration in which the hollow region 24 is provided in the substrate arrangement region 22 and the plurality of hollow chambers 28 are provided can reduce the weight of the holding case 2 and the insulating molding resin used, thereby reducing the manufacturing cost. The holding case 2 of fig. 6 has hollow portions 24 on both sides of the substrate placement region 22, but the holding case can be variously modified in the placement, shape, size, and the like of the hollow portions in accordance with a desired outer shape. However, the holding case does not necessarily have to be provided with a hollow region in the substrate placement region, and the entire substrate placement region may be a substrate storage section. For example, in a configuration in which the substrate arrangement region is shortened in overall length and is extended in the width direction (the short side direction of the holding case), a substrate storage portion for storing a circuit substrate extending in the short side direction may be provided between the opposed secondary battery cells without providing a hollow region.
The holding case 2 shown in fig. 3 to 6 has a peripheral wall 30 along the outer periphery of a rectangular shape, and a battery housing 25 for housing the secondary battery cell 1 and a board housing 26 for housing the circuit board 5 are provided inside. As shown in fig. 3, the holding case 2 is formed such that the bottom plate 32, which is the bottom surface of the substrate placement region 22, is higher than the surface plate 31, which is the bottom surface of the battery placement region 21, and the substrate housing portion 26, in which the circuit board 5 is disposed, is shallower than the battery housing portion 25. This structure makes the resin mold 4 for insert molding of the circuit board 5 thin, and reduces the amount of insulating molding resin used. Further, the holding case 2 shown in the figure is provided with a plurality of projecting pieces 38 projecting outward from the peripheral wall 30 provided on the outer periphery. The protruding piece 38 is used as a coupling portion for coupling to an electronic device to which the battery pack 100 is attached.
The holding case 2 includes a frame portion 27 along the outer shape of the secondary battery cell 1 in the battery disposition region 21, and the inside of the frame portion 27 serves as a battery housing portion 25. The frame portion 27 includes a holding wall 35 along the terminal surface 1X of the secondary battery cell 1, a peripheral wall 30 along three sides other than the terminal surface 1X, and a front flat plate portion 31 along the one main surface 1A of the secondary battery cell 1. As shown in fig. 5, the holding wall 35 is formed by cutting a portion facing the substrate housing portion 26 so that the battery housing portion 25 and the substrate housing portion 26 communicate with each other. The front flat plate portion 31 has an annular shape with a central portion opened and extending along four sides of the outer peripheral edge of the main surface 1A of the secondary battery cell 1. The height of the peripheral wall 30 of the frame portion 27 is substantially equal to the thickness of the secondary battery cell 1 so that the secondary battery cell 1 can be housed in the battery housing portion 25. The inner shape of the frame portion 27 is substantially equal to the outer shape of the secondary battery cell 1, so that the secondary battery cell 1 housed therein can be arranged at a predetermined position. The secondary battery cell 1 is housed in the frame portion 27, and the terminal surface 1X on which the pair of electrodes 10 are provided is in a posture facing the substrate arrangement portion 22.
As shown in fig. 8, the substrate storage section 26 is formed in a space surrounded by a pair of partition walls 33 and a bottom flat plate 32 that face each other. The substrate housing portion 26 is provided with the circuit board 5, and the resin mold portion 4 is molded by filling the molten insulating molding resin therein. The board housing portion 26 in fig. 8 fixes the circuit board 5 at a predetermined position via the connection mechanism 19. The coupling mechanism 19 shown in the figure is constituted by a locking rib 36 and a locking hook 37 provided on the holding case 2 to lock both side edges of the circuit board 5, and a locking portion 56 provided on the circuit board 5. The holding case 2 is provided with a vertical rib 36a and a horizontal rib 36b as locking ribs 36 protruding to the inside of the substrate accommodating portion 26 on one partition wall 33 (right side in fig. 8), and a locking hook 37 protruding from the bottom surface flat plate 32 on the side facing the partition wall 33. The horizontal rib 36b is disposed in the horizontal direction so as to be capable of inserting the side edge portion of the circuit board 5 with the bottom surface plate 32. As shown in fig. 5, the circuit board 5 is provided with a slit recess 56a as an engaging portion 56 at a position facing the vertical rib 36a, and a locking recess 56b at a position facing the locking hook 37. The coupling mechanism 19 guides the vertical rib 36a to the slit recess 56a to determine the position of the circuit board 5 in the left-right direction. Further, the coupling mechanism 19 inserts one side edge portion of the circuit board 5 between the horizontal rib 36b and the bottom surface flat plate 32, and engages the hook portion of the engagement hook 37 with the engagement recess 56b provided in the side edge portion on the opposite side of the circuit board 5, thereby fixing the circuit board 5 at a predetermined position without falling down.
Further, in the holding case 2 shown in fig. 5 and 6, in order to insert-mold the circuit board 5 disposed in the board housing portion 26 into the resin mold portion 4, a resin injection guide passage 29 for injecting a molten insulating molding resin is provided in the board disposition region 22. The holding case 2 in fig. 5 is provided with a passage as a resin injection guide passage 29 that communicates one end (left side in the drawing) of the substrate housing portion 26 with the outside. The resin injection guide passage 29 shown in fig. 5 is partitioned from the hollow chamber 28 by opposing passage walls 39. In the holding case 2 having this configuration, the opening side of the substrate placement region 22 is closed by a molding die (not shown) at the time of molding the resin mold portion 4, and a molding chamber is formed inside the substrate storage portion 26. The resin injection guide passage 29 has an injection hole 29a opened in the peripheral wall 30, and the injection hole 29a is exposed to the outside in a state where the opening of the substrate arrangement region 22 is closed by a mold at the time of resin injection.
Further, the holding case 2 may be provided with a 2 nd resin injection guide passage for communicating an end portion on the opposite side of the board housing portion 26 with the outside, in addition to the resin injection guide passage 29 provided on the one end portion side of the board housing portion 26. With this configuration, since the insulating molding resin can be injected from two places in the molding step of the resin mold portion, there is an advantage that the injection time of the insulating molding resin can be shortened and the insulating molding resin can be filled into each corner of the molding chamber.
(resin mold part 4)
The resin mold 4 embeds and fixes the circuit board 5, the electronic component mounted on the circuit board 5, and a part or the whole of the terminal surface 1X of the secondary battery cell 1 in the insulating molding resin at a predetermined position. In a state where the circuit board 5 and the secondary battery cell 1 are arranged at predetermined positions of the holding case 2, the housing opening of the holding case 2 is closed by a molding die (not shown) to form a molding chamber, and a molten insulating molding resin is injected into the molding chamber to mold the resin mold portion 4.
The thermoplastic resin is heated and injected into the molding chamber in a molten state to mold the resin mold 4. As the thermoplastic resin of the insulating molding resin, a resin which can be heated at a low temperature and can be injected into the molding chamber at a low pressure to be molded is used, and for example, a polyamide resin, a polyolefin-based thermoplastic resin, or a polyurethane-based thermoplastic resin is used. The resin injected into the molding chamber at a low temperature and a low pressure has a characteristic that adverse effects due to heat do not affect the secondary battery cell 1 or the mounting components of the circuit board 5. The temperature of the molten resin injected into the molding chamber is preferably lower than the heat-resistant temperature of the holding case 2, and is set to 70 ℃ or lower, for example. The polyolefin-based resin has higher mechanical strength than the polyamide resin, and therefore has a characteristic of more firmly connecting the circuit board 5 and the secondary battery cell 1. The polyamide resin has a characteristic that it can be firmly bonded even when the secondary battery cell 1 is at a high temperature during use, because the use temperature range is as wide as-40 to 150 ℃ as compared with the polyolefin resin. The molten insulating molding resin injected into the molding chamber embeds circuit board 5 and embeds a part or the whole of terminal surface 1X of secondary battery cell 1, and embeds and fixes them at predetermined positions.
The resin mold portion 4 of the embedded circuit board 5 also embeds a semiconductor switching element such as an FET mounted on the circuit board 5. This structure can conduct the heat generated by the semiconductor switching element to the resin mold 4 and dissipate the heat. Therefore, the resin mold portion 4 absorbs heat generated by a heat generating member such as a semiconductor switching element to reduce a temperature rise, and further dissipates the absorbed heat energy from the surface to reduce the temperature rise of the semiconductor switching element. Further, since the circuit board 5 and the terminal surface 1X of the secondary battery cell 1 are embedded in the resin mold 4, the circuit board 5 and the terminal surface 1X of the secondary battery cell 1 can be provided with a waterproof structure.
Further, the resin mold 4 shown in fig. 2 has a plurality of rows of grooves 41 formed on the surface. The plurality of rows of grooves 41 are provided along the longitudinal direction of the circuit board 5. In this way, the structure in which the grooves 41 are provided in a plurality of rows on the surface of the resin mold 4 has a feature that the amount of insulating molding resin used can be reduced, thereby reducing the manufacturing cost. As shown in the drawing, the grooves 41 can be formed by forming a plurality of rows of ridges on the surface of a molding die, which is the inner surface of a molding chamber for molding the resin mold 4 with an insulating molding resin, for example. Here, the resin mold 4 shown in fig. 2 has a plurality of rows of grooves 41 formed along the longitudinal direction of the circuit board 5. This structure has a feature that the insulating molding resin in a molten state supplied from the resin injection guide passage 29 as shown by an arrow a in fig. 6 can smoothly flow in the longitudinal direction of the circuit board 5 as shown by an arrow B. That is, the insulating molding resin injected into the molding chamber can be filled on the opposite side of the injection side by flowing along the rows of ridges formed on the surface of the molding die. This allows the insulating molding resin in a molten state to flow to the opposite side while being injected from one side of the circuit board 5 extending in one direction, and to be filled into each corner of the molding chamber. In addition, in the structure in which the molten resin is injected from the end portion of the molding chamber, even if fine solder debris is generated and remains on the circuit board 5 when the lead wires 6 or the connecting lead plates 16 are soldered to the circuit board 5, the flowing molten resin can be flushed to the corner portion of the molding chamber, and therefore, safety can be improved. Further, the resin mold 4 having the grooves 41 in a plurality of rows on the surface can enlarge the surface area on the surface side, and therefore, the heat dissipation property from this portion can be improved and heat can be dissipated. However, the resin mold part does not necessarily have to have a groove part on the surface, and the surface may be formed in a flat shape.
(protective element 7)
The protection element 7 is an element that detects the temperature of the secondary battery cell 1 and blocks the current when the detected temperature is higher than a set temperature, or blocks the current after detecting an overcurrent flowing through a circuit, and can use a breaker 71, a fuse 72, a PTC, or the like. That is, in the present specification, the protection element 7 is used in a broad sense including a current blocking element such as a breaker 71, a fuse 72, or a PTC, which blocks a current after detecting a temperature increase of the secondary battery cell 1 or an overcurrent flowing through a circuit. The circuit board 5 shown in the figure has breakers 71 disposed at positions facing the terminal surface 1X of the secondary battery cell 1 at both ends in the longitudinal direction, and a fuse 72 disposed at one side of the central portion of the circuit board 5.
(breaker 71)
The breaker 71 as the protection element 7 is disposed for each secondary battery cell 1 built in the battery pack 100. Since the battery pack 100 shown in the figure includes two secondary battery cells 1, two breakers 71 are connected to the respective secondary battery cells 1. Each breaker 71 is attached to an end edge portion of the circuit board 5, and as shown in fig. 5, the secondary battery cell 1 is connected in series with the opposing secondary battery cell 1 via a connecting lead plate 16 connected to the circuit board 5.
As shown in fig. 9 and 10, the breaker 71 includes a main body 71X having a rectangular outer shape, and a pair of lead plates 71A and 71B protruding from both ends of the main body. The breaker 71 in the figure is disposed in a state where the entire breaker is housed in the notch 51 formed in the end edge portion of the circuit board 5. In the circuit board 5 shown in the figure, the edge portion facing the terminal surface 1X is cut in an コ shape, and a cut portion 51 is provided for housing the breaker 71 in a state where both surfaces of the circuit board 5 are exposed. In the breaker 71, the surface of the main body 71A is disposed substantially flush with the surface of the circuit board 5 in a state of being disposed in the notch 51. Further, the breaker 71 disposed in the notch 51 is electrically connected to the 1 st surface, i.e., the back surface of the circuit board 5. As shown in fig. 10, the breaker 71 is connected to the circuit board 5 on the 1 st surface of the circuit board 5 via a pair of connection flat plates 53 fixed to protrude inward from both sides of the notch 51. Specifically, one lead plate 71A of the breaker 71 is connected to the 1 st connection flat plate 53A, and the other lead plate 71B is connected to the 2 nd connection flat plate 53B, thereby being connected to the circuit substrate 5. For the connection flat plate 53, a metal plate such as a nickel plate can be used.
Further, the 1 st land 53A fixed to the back surface of the circuit board 5 is electrically connected to the 1 st land 52A formed on the 2 nd surface, i.e., the front surface of the circuit board 5, via a connection wire 54 which is a metal pattern wired inside the circuit board 5. In the circuit board 5 shown in fig. 9, a pair of lands 52 is formed at the end of the 2 nd surface in order to connect the pair of connection lead plates 16 drawn out from the secondary battery cell 1. The 1 st connecting lead plate 16A is connected to the 1 st land 52A and the 2 nd connecting lead plate 16B is connected to the 2 nd land 52B, whereby the secondary battery cell 1 is electrically connected to the 2 nd surface of the circuit substrate 5. The secondary battery cell 1 is energized in the order of the planar electrode 14 → the 2 nd connecting lead plate 16B → the 2 nd land 52B on the 2 nd electrode 10B side, and is output to a positive side output line (not shown) of the circuit substrate 5. In the secondary battery cell 1, the electric power supplied from the negative side output line (not shown) of the circuit board 5 is supplied to the 1 st electrode 10A side of the secondary battery cell 1 in the order of the 2 nd connecting flat plate 53B → the lead plate 71B → the body portion 71X of the circuit breaker 71 → the lead plate 71A → the 1 st connecting flat plate 53A → the connecting wire 54 → the 1 st land 52A → the 1 st connecting lead plate 16A → the protruding portion electrode 13, and is input to the secondary battery cell 1. In this way, in the configuration in which the breaker 71 is connected to the 1 st electrode 10A, which is the negative electrode side of the secondary battery cell 1, the protective element 7 is connected to the ground side, so that safety can be ensured. However, the breaker can also be connected to the 2 nd electrode, which is the positive electrode side of the secondary battery cell.
In the above configuration, the lead plates 71A and 71B of the breaker 71 are connected to the circuit board 5 on the 1 st surface, i.e., the back surface of the circuit board 5, and the connection lead plate 16 drawn out from the secondary battery cell 1 is connected to the circuit board 5 on the 2 nd surface, i.e., the front surface of the circuit board 5, and therefore, the following advantages are obtained: even in a state where the breaker 71 and the connection lead plate 16 are brought close to each other to perform wiring, the connection lead plate 16 and the lead plates 71A and 71B are reliably prevented from contacting each other and from short-circuiting. However, the circuit breaker is not necessarily disposed in the cutout provided in the circuit board, and may be mounted on the surface of the circuit board. The breaker thus configured can be easily mounted on a circuit board by, for example, reflow soldering or the like.
In addition, in order to reliably detect heat generation of the secondary battery cell 1 at the breaker 71 serving as the protective element 7, the battery pack 100 is configured such that the lead plate 16 is laminated and connected to the surface of the main body portion 71X of the breaker 71 in a thermally bonded state. In the configuration shown in fig. 9 and 10, the 1 st connecting lead plate 16A connected to the 1 st electrode 10A, i.e., the convex portion electrode 13, is disposed in a state of being laminated on the surface of the main body portion 71X of the breaker 71, and the main body portion 71X of the breaker 71 and the 1 st connecting lead plate 16A are thermally bonded. This allows heat generated in the secondary battery cell 1 to be efficiently thermally conducted to the breaker 71, and when the temperature of the secondary battery cell 1 rises to the set temperature, the breaker 71 can reliably detect the heat generation, thereby interrupting the current.
The 1 st connecting lead plate 16A shown in the figure is disposed in a posture intersecting the body portion 71X of the breaker 71, and the intermediate portion of the 1 st connecting lead plate 16A is reliably brought into contact with the surface of the body portion 71X in a state where the tip portion of the 1 st connecting lead plate 16A is connected to the 1 st land 52A. In particular, the breaker 71 shown in the figure is disposed in the notch 51 provided in the circuit board 5, so that the surface of the main body 71X is substantially flush with the front surface of the circuit board 5. Therefore, in a state where the connection lead plate 16 drawn out from the electrode 10 of the secondary battery cell 1 is connected to the land 52 provided on the front surface of the circuit board 5, the connection lead plate 16 can be preferably laminated on the surface of the main body portion 71X of the breaker 71 and brought into contact therewith.
In the battery pack 100 described above, the connection lead plate 16 connected to the protruding electrode 13 of the secondary battery cell 1 is stacked on the breaker 71. As described above, the structure in which the connecting lead plate 16 connected to the convex electrode 13 of the secondary battery cell 1 is thermally bonded to the breaker 71 enables heat generated inside the secondary battery cell to be efficiently thermally conducted from the convex electrode 13 to the breaker 71, and the breaker 71 can be reliably operated. In the battery pack, although not shown, a connection lead plate connected to a sealing plate of the secondary battery cell may be stacked on a breaker to detect heat generation of the secondary battery cell.
(fuse 72)
The fuse 72 serving as the protection element 7 is connected between the secondary battery cells 1 connected in series, and is blown out to interrupt the current when an overcurrent flows. The fuse 72 shown in fig. 6 is disposed in a region on one side of the central portion of the circuit board 5, which is apart from the resin injection guide passage 29 into which the molten insulating molding resin is injected. This configuration can effectively prevent the fuse 72 from being erroneously blown out by the heat of the molten resin because the flow distance of the molten resin supplied from the resin injection guide channel 29 can be extended as shown by arrows a and B in fig. 6.
Further, the resin mold 4 shown in fig. 2 and 3 is provided with a shielding groove 42 for preventing the molten resin injected from the resin injection guide passage 29 from directly contacting the fuse 72. The shielding groove 42 is formed by a shielding rib 99 (shown by a dotted line in fig. 6) provided to protrude toward the inner surface of the molding die in a state where the molten resin is injected into the molding chamber. The shielding rib 99 shown in fig. 6 is formed in an コ shape in a plan view, and is provided in a posture of closing the inflow side of the molten insulating molding resin and disposing the opening portion on the opposite side. The insulating molding resin supplied to the molding chamber is filled around the fuse 72 in a state of bypassing the shielding rib 99, without directly abutting the fuse 72, by the shielding rib 99. Therefore, the high-temperature insulating molding resin in a molten state does not directly contact the fuse 72, but contacts the fuse 72 in a state in which the temperature is reduced to some extent, whereby the malfunction of the fuse can be prevented. However, when the distance between the resin injection guide channel 29 and the fuse 72 can be increased to extend the distance of the flow of the molten resin, it is not always necessary to provide a shielding groove in the resin mold.
(lead-out wire 6)
Further, in the battery pack 100 shown in fig. 1 to 6, a plurality of lead wires 6 are connected to the circuit board 5 and led out from the resin mold 4 to the outside. The lead wires 6 are constituted by positive and negative power lines and signal lines, and are directly connected to a connector of a device in which the battery pack 100 is installed. The lead wires 6 are connected at one end to the circuit board 5 and connected at the other end to the connector 69. The lead wire 6 is embedded and fixed in the insulating molding resin in a state where one end thereof is connected to the circuit board 5, and is led out to the outside from the resin mold portion 4 in which the circuit board 5 is insert molded. As shown in fig. 11, the plurality of lead wires 6 are arranged at predetermined positions with their ends connected to the circuit board 5 interposed therebetween by a positioning mechanism 60.
The positioning mechanism 60 shown in fig. 11 to 13 is integrally formed with the holding case 2. In the holding case 2 shown in the figure, a positioning mechanism 60 is provided on a part of the partition wall 33 on the outer peripheral surface of the board housing portion 26 so that the plurality of lead wires 6 are arranged at predetermined positions of the circuit board 5 arranged in the board housing portion 26. The positioning mechanism 60 shown in fig. 11 to 13 includes comb-shaped ribs 61 formed in a parallel posture so that a plurality of lead wires 6 can be arranged in a parallel posture at predetermined intervals, and a plurality of guide grooves 62 formed in a predetermined position so that the lead wires 6 are inserted into the guide grooves are provided between the adjacent comb-shaped ribs 61. The guide grooves 62 are capable of inserting the lead wires 6 individually and moving the inserted lead wires 6 along the comb-shaped ribs 61.
In the positioning mechanism 60 shown in fig. 13, a plurality of rows of comb-shaped ribs 61 are arranged in parallel at equal intervals, and a plurality of rows of guide grooves 62 are arranged at equal intervals. The positioning mechanism 60 inserts the lead wires 6 into the respective guide grooves 62, and arranges the lead wires 6 at regular intervals. The interval of the guide grooves 62 can be substantially equal to the interval of the lead wires 6 connected to the connector 69 at the front end. The positioning mechanism 60 can quickly guide each lead wire 6 connected to the connector 69 to the guide groove 62 in the vicinity of the connector 69. This is because the plurality of lead wires 6 can be arranged at intervals of the guide groove 62 via the connector 69, and therefore the plurality of lead wires 6 can be pushed into the guide groove 62, and all the lead wires 6 can be easily inserted into the guide groove 62.
The guide groove 62 has a depth and a width enabling insertion of the lead wires 6, and the upper end opening 63 is made slightly narrower than the thickness of the lead wires 6, thereby preventing the lead wires 6 inserted therein from falling out. The guide groove 62 shown in fig. 12 and 13 is formed in a shape that protrudes the upper end portion of the comb rib 61 inward, narrowing the upper end opening 63. The guide groove 62 has an opening width of the upper end opening 63 smaller than the outer shape of the lead wire 6 and larger than the thickness of the core wire 6a of the lead wire 6. The lead wire 6 can be easily inserted into the guide groove 62 by pushing the lead wire 6 from the upper end opening 63, and the lead wire 6 can be slid along the guide groove 62 in a state of being inserted into the guide groove 62.
Further, in the positioning mechanism 60 shown in fig. 12 and 13, a circular groove 64 along the outer peripheral surface of the lead wire 6 is provided in the partition wall 33 on the circuit board 5 side of the guide groove 62 as a boundary with the board housing portion 26. As described above, since the circular groove 64 formed in the end face on the circuit board side can narrow the gap with the lead wire 6 inserted therethrough, the molten resin filled in the board housing portion 26 serving as the molding chamber during molding of the resin mold portion 4 can be effectively prevented from leaking to the outside from the guide groove 62. Further, in the holding case 2 shown in the figure, a lead-out recess 66 through which the lead wire 6 passes is provided between the peripheral wall 30 on the side from which the lead wire 6 is led out and the positioning mechanism 60.
The positioning mechanism 60 described above can slide the lead wires 6 in the axial direction while inserting the lead wires 6 into the respective guide grooves 62 from the upper end openings 63. The positioning mechanism 60 inserts the lead wires 6 into the guide grooves 62 in the vicinity of the connector 69, and then moves the connector 69 in a direction away from the guide grooves 62 to adjust the length of the lead wires 6 led out from the holding case 2 to a predetermined length. The lead wires 6 are connected to the circuit board 5 by soldering at their distal ends in a state of being drawn out from the holding case 2 by a predetermined length. Further, the positioning mechanism 60 arranges the plurality of lead wires 6 at a constant interval in a state where the tip portions of the lead wires 6 soldered to the circuit substrate 5 are moved to the connection portion connected to the circuit substrate 5. As shown in fig. 11, the circuit board 5 is provided with a plurality of connection portions 55 at positions where the tip portions of the lead wires 6 held at a constant interval by the positioning mechanism 60 can be soldered. Since the interval between the plurality of connection portions 55 is equal to the interval between the lead wires 6 arranged in the positioning mechanism 60, the tip of each lead wire 6 can be arranged in the connection portion 55 to be soldered, and the lead wires 6 can be soldered efficiently. The plurality of lead wires 6 connected to predetermined positions of the circuit board 5 via the positioning mechanism 60 are fixed in a state where the circuit board 5 is embedded in the insulating molding resin, and are drawn out to the outside from the resin mold portion 4.
The positioning mechanism 60 described above is provided integrally with the holding case 2. However, the positioning mechanism 60 may be fixed as a positioning holder as a separate member from the holding case 2 by being coupled to the holding case. The positioning holder can have the same shape as the positioning mechanism described above, and a coupling portion for arranging the positioning holder at a predetermined position can be provided in the holding case. The positioning holder can connect the lead wires in a state of being fixed to a predetermined position of the circuit board, for example, and then dispose the circuit board in the board housing portion of the holding case to dispose the lead wires at the predetermined position of the holding case.
(exterior sheet 8)
Further, the battery pack 100 covers the periphery of the secondary battery cell 1 with the exterior sheet 8. The battery pack 100 of fig. 1 covers and fixes the secondary battery cell 1 and the frame portion 27 housed in the frame portion 27 of the holding case 2 with the exterior sheet 8. The exterior sheet 8 firmly connects the frame portion 27 and the secondary battery cell 1 while insulating the outer periphery of the secondary battery cell 1 with an insulating sheet.
The battery pack 100 described above is manufactured as follows.
(1) The circuit board 5 is connected to a breaker 71 as a protection element 7. As shown in fig. 5, the circuit board 5 has breakers 71 fixed to portions of both ends in the longitudinal direction, which portions face the terminal surfaces 1X of the secondary battery cells 1. As shown in fig. 9 and 10, the breaker 71 is disposed in the notch 51 provided at the end of the circuit board 5, and the lead plates 71A and 71B protruding from both ends of the main body 71X are connected to the connection flat plate 53 provided on the circuit board 5.
(2) The circuit board 5 is disposed in the holding case 2. The circuit board 5 is guided to the board housing portion 26 of the holding case 2, and is set at a predetermined position by the locking structure via the coupling mechanism 19 as shown in fig. 8.
(3) The lead wires 6 are connected to the circuit board 5 provided in the holding case 2. The lead wire 6 shown in fig. 4 and 6 includes a connector 69 at the other end, and the length of the lead wire 6 is adjusted by inserting the connector-side intermediate portion into the guide groove 62 of the positioning mechanism 60 and then moving the connector 69 in a direction away from the guide groove 62. In this state, the leading ends of the lead wires 6 are soldered to the circuit board 5.
(4) The secondary battery unit 1 is disposed in the battery housing portion 25 of the holding case 2. The holding case 2 shown in fig. 5 includes frame portions 27 at both ends, and the secondary battery cells 1 are disposed at predetermined positions inside the frame portions 27. The two secondary battery cells 1 are arranged in a posture in which the terminal surfaces 1X face each other.
(5) A pair of connecting lead plates 16 connected to the terminal surface 1X of the secondary battery cell 1 are connected to the circuit board 5. As shown in fig. 9, in the secondary battery cell 1, the 1 st connecting lead plate 16A connected to the 1 st electrode 10A is disposed in a state of being stacked on the surface of the breaker 71 and connected to the 1 st land 52B of the circuit board 5, and the 2 nd connecting lead plate 16B connected to the 2 nd electrode 10B is connected to the 2 nd land 52B of the circuit board 5.
(6) The opening portion side of the substrate placement region 22 of the holding case 2 is closed by a molding die (not shown) to form a molding chamber inside the substrate storage portion 26. In this state, the molten insulating molding resin is injected from an injection hole 29a of the resin injection guide passage 29 to mold the resin mold 4.
(7) After the insulating molding resin is cured and the molding die is released, the frame portion 27 of the holding case 2 and the secondary battery cell 1 are covered with the exterior sheet 8.
In the above assembled battery 100, the opposed secondary battery cells 1 are arranged at both ends, and the circuit board 5 is arranged between them, but the assembled battery may be configured such that a plurality of secondary battery cells are arranged in parallel in the lateral direction so that the terminal surfaces are positioned on the same plane, and the circuit board is arranged at a position opposed to the plurality of terminal surfaces.
Further, in the battery pack 100 of the above embodiment, two secondary battery cells 1 are disposed at both ends of the holding case 2, and the circuit board 5 is disposed between the facing secondary battery cells 1, but the battery pack of the present invention may include one secondary battery cell, and may include three or more secondary battery cells. As an assembled battery according to another embodiment of the present invention, fig. 14 shows an example of an assembled battery 200 including one secondary battery cell 1, and fig. 15 shows an example of an assembled battery 300 including four secondary battery cells 1. Here, the assembled batteries 200 and 300 shown in fig. 14 and 15 show a state in which the resin mold portion and the exterior sheet are removed. In the embodiments shown in these drawings, the same components as those in the above-described embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
In the battery pack 200 shown in fig. 14, the holding case 2B includes a battery disposition region 21B formed of a frame portion 27B in which one secondary battery cell 1 is disposed, and a substrate disposition region 22B in which the circuit substrate 5B is disposed along the terminal surface 1X of the secondary battery cell 1. The substrate placement region 22B shown in the figure is provided with only the resin molding region 23B without a hollow portion, and the circuit substrate 5B is placed with the resin molding region 23B as the substrate housing portion 26B. However, the holding case may be provided with a hollow portion when the area is expanded by a design change of the substrate accommodating portion or the like as shown by a broken line in the figure. The circuit board 5B in the figure is formed to extend in the short side direction of the holding case 2B, and a breaker 71 as the protection element 7 is attached to a side edge portion facing the terminal surface 1X of the secondary battery cell 1. The battery pack 200 has the following structure: the plurality of lead wires 6 are connected to predetermined positions of the circuit substrate 5B via a positioning mechanism 60B provided on the peripheral wall 30B of the holding case 2B, and the lead wires 6 of the connection connector 69 are led out to the outside.
In the battery pack 300 shown in fig. 15, the holding case 2C has battery disposition regions 21C formed by frame portions 27C in which two secondary battery cells 1 are disposed at both end portions, respectively, and the circuit board 5 is disposed by providing a board disposition region 22C between the battery disposition regions 21C. In order to accommodate two secondary battery cells 1, the battery arrangement region 21C includes a peripheral wall 30C surrounding three sides and an intermediate wall 40 arranged between adjacent secondary battery cells 1 to form two battery accommodation portions 25. Further, the substrate arrangement region 22C is formed with a resin molding region 23C in which a resin mold portion is formed and a hollow region 24C. In the battery pack 300 shown in fig. 15, the circuit board 5 is disposed by providing the board housing portion 26 between the two secondary battery cells 1 disposed at the front in the drawing, and the circuit board is not disposed between the two secondary battery cells 1 disposed at the rear in the drawing, and almost the entire part is the hollow region 24C.
In the battery pack 300 shown in fig. 15, the following configuration is adopted: the circuit board 5 is disposed at a position facing the terminal surfaces 1X of the two secondary battery cells 1 disposed at the front, and the two secondary battery cells 1 disposed at the rear are connected to the circuit board 5 via the extended lead plate 17. In this assembled battery 300, the region where the extended lead plate 17 is disposed is made into the resin molding region 23C, and the insulating molding resin is filled, whereby the terminal surface 1X of the secondary battery cell 1 and the extended lead plate 17 disposed at the rear can be fitted into the resin mold portion and fixed.
The embodiments and examples of the present invention have been described above based on the drawings. However, the above-described embodiments and examples are intended to exemplify the technical idea of the present invention, and the present invention is not limited to the above-described contents. In addition, the present specification by no means defines the components shown in the claims as the components of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements of the constituent members described in the embodiments, and the like are merely illustrative examples, and the scope of the present invention is not intended to be limited to these unless specifically stated. In addition, the size, positional relationship, and the like of the members shown in the drawings may be exaggerated for clarity of the description. In the above description, the same names and reference numerals denote the same or similar members, and detailed description thereof is omitted as appropriate. Further, each element constituting the present invention may be realized by constituting a plurality of elements by the same member so that one member doubles as a plurality of elements, or conversely, by sharing the function of one member by a plurality of members.
Industrial applicability
The battery pack according to the present invention can firmly connect a thin secondary battery cell and a circuit board arranged on the same plane, and therefore, is suitable for use in portable electronic devices such as notebook personal computers and tablet personal computers, which are thin battery packs requiring high voltage and high battery capacity.
Description of reference numerals
100. 200, 300 battery pack
1 Secondary Battery cell
1A major face
1X terminal surface
2. 2B, 2C holding case
4 resin mold part
5. 5B circuit board
6 leading-out wire
6a core wire
7 protective element
8 outer sheet
10 electrode
10B No. 2 electrode
11 outer can
12 sealing plate
13 convex electrode
14 cladding plate
15 safety valve
16 connecting lead plate
17 extension lead plate
19 connecting mechanism
21. 21B, 21C battery arrangement region
22. 22B, 22C substrate arrangement region
23. 23B, 23C resin molding region
24. Hollow region of 24C
25 Battery receiving part
26. 26B substrate accommodating part
27. 27B, 27C frame
28 hollow chamber
29 resin injection guide passage
29a injection hole
30. 30B, 30C peripheral wall
31 surface plate
32 bottom surface flat plate
33 dividing wall
34 reinforcing ribs
35 holding wall
36 stop rib
36a vertical rib
36b horizontal Ribs
37 stop hook
38 protruding piece
39 passageway wall
40 intermediate wall
41 groove part
42 shield groove
51 notch part
52 connecting disc
53 connect the plateform
53A No. 1 connection plate
53B No. 2 connection plate
54 connecting wire
55 connecting part
56 locking part
56a slit recess
56b latching recess
60. 60B positioning mechanism
61 comb rib
62 guide groove
63 upper end opening
64 circular groove
66 lead-out recess
69 connector
71 circuit breaker
71A lead plate
71B lead plate
71X Main body part
72 fuse
99 shielding rib
Claims (7)
1. A battery pack is provided with:
a thin secondary battery cell having a square shape with a thickness smaller than a width and having a terminal surface;
a circuit board electrically connected to the secondary battery cell and having a protection circuit mounted thereon;
a holding case that houses the secondary battery cell and the circuit board; and
a resin mold part formed by insert molding the circuit board accommodated in the holding case,
the holding case has a battery disposition region in which the secondary battery cells are disposed and a substrate disposition region in which the circuit substrate is disposed on the same plane,
the circuit board is disposed in the board disposition region in proximity to the terminal surface of the secondary battery cell disposed in the battery disposition region,
and a part or the whole of the terminal surface of the secondary battery cell arranged in the battery arrangement region and the circuit board arranged in the board arrangement region are embedded in an insulating molding resin to form the resin mold portion,
the substrate arrangement region is configured to arrange the circuit substrate, and includes a resin molding region in which the resin mold portion is formed, and a hollow region in which the resin mold portion is not formed, the hollow region being divided into a plurality of hollow chambers by providing a plurality of reinforcing ribs in a lattice shape.
2. The battery pack according to claim 1,
the battery pack is provided with a plurality of the secondary battery cells,
the battery disposition regions are disposed at both end portions of the holding case, and the substrate disposition region is disposed between the opposing battery disposition regions.
3. The battery pack according to claim 1 or 2,
the battery arrangement region includes a frame portion that houses the secondary battery cell along an outer periphery of the secondary battery cell,
the frame portion and the secondary battery cell are covered and fixed by an exterior sheet.
4. The battery pack according to claim 1 or 2,
a resin injection guide passage for injecting an insulating molding resin is formed in the substrate arrangement region.
5. The battery pack according to claim 1 or 2,
a plurality of rows of grooves are formed on the surface of the resin mold.
6. The battery pack according to claim 5,
the plurality of rows of grooves are formed parallel to each other along a longitudinal direction of the circuit board fitted in the resin mold.
7. The battery pack according to any one of claims 1, 2, and 6,
the holding case is molded with a resin having a heat-resistant temperature of 70 ℃ or higher,
the insulating molding resin forming the resin mold part is a thermoplastic resin in a molten state at 70 ℃ or lower.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-246416 | 2015-12-17 | ||
| JP2015246416 | 2015-12-17 | ||
| PCT/JP2016/004927 WO2017104108A1 (en) | 2015-12-17 | 2016-11-21 | Battery pack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108370005A CN108370005A (en) | 2018-08-03 |
| CN108370005B true CN108370005B (en) | 2021-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680071258.8A Active CN108370005B (en) | 2015-12-17 | 2016-11-21 | Battery pack |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6900319B2 (en) |
| CN (1) | CN108370005B (en) |
| WO (1) | WO2017104108A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11862817B2 (en) | 2018-02-14 | 2024-01-02 | Gs Yuasa International Ltd. | Energy storage apparatus |
| KR20210091556A (en) * | 2020-01-14 | 2021-07-22 | 주식회사 엘지화학 | Battery packs with Battery Management Unit component damage prevention structure |
| CN114747070B (en) * | 2020-06-30 | 2024-03-19 | 东莞新能德科技有限公司 | Battery, battery assembly, battery pack and electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001266820A (en) * | 2000-03-24 | 2001-09-28 | Sanyo Electric Co Ltd | Battery pack |
| JP3474175B2 (en) * | 2001-02-27 | 2003-12-08 | 京セラ株式会社 | Battery, method of manufacturing the same, and mobile terminal |
| JP5183074B2 (en) * | 2007-02-05 | 2013-04-17 | 三洋電機株式会社 | Pack battery |
| JP5405196B2 (en) * | 2009-05-26 | 2014-02-05 | 三洋電機株式会社 | Pack battery and pack battery intermediate |
| KR101270593B1 (en) * | 2010-07-16 | 2013-06-03 | 주식회사 엘지화학 | Pack Case of Novel Structure |
| US9065085B2 (en) * | 2011-04-19 | 2015-06-23 | Samsung Sdi Co., Ltd. | Battery pack |
-
2016
- 2016-11-21 WO PCT/JP2016/004927 patent/WO2017104108A1/en active Application Filing
- 2016-11-21 JP JP2017556320A patent/JP6900319B2/en active Active
- 2016-11-21 CN CN201680071258.8A patent/CN108370005B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017104108A1 (en) | 2018-10-04 |
| WO2017104108A1 (en) | 2017-06-22 |
| CN108370005A (en) | 2018-08-03 |
| JP6900319B2 (en) | 2021-07-07 |
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Effective date of registration: 20230907 Address after: Osaka, Japan Patentee after: Panasonic New Energy Co.,Ltd. Address before: Japan Osaka Patentee before: Sanyo Electric Co.,Ltd. |