CN108367313A - Acoustic transducer assembly with bender element and the method for manufacturing the acoustic transducer assembly with bender element - Google Patents
Acoustic transducer assembly with bender element and the method for manufacturing the acoustic transducer assembly with bender element Download PDFInfo
- Publication number
- CN108367313A CN108367313A CN201680071565.6A CN201680071565A CN108367313A CN 108367313 A CN108367313 A CN 108367313A CN 201680071565 A CN201680071565 A CN 201680071565A CN 108367313 A CN108367313 A CN 108367313A
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- China
- Prior art keywords
- vacancy portion
- bender element
- acoustic transducer
- transducer assembly
- bender
- Prior art date
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- Pending
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000013016 damping Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000007767 bonding agent Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 26
- 238000005452 bending Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001548 drop coating Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
Abstract
The present invention proposes a kind of acoustic transducer assembly (100), including：Orifice plate load-bearing part (101), the orifice plate load-bearing part includes the opposite side of the side and the second vacancy portion (103) arranged at interval at least two in the first vacancy portion (102) arranged at interval at least two, so that each first vacancy portion (102) and a second vacancy portion (103) stackedly adjacently arrange respectively, wherein, the lateral extension scale in second vacancy portion (103) is more than the lateral extension scale in first vacancy portion (102), to form bearing surface (104) in first vacancy portion (102)；At least two bender elements (111,121), wherein, the lateral extension scale of the bender element (111,121) is more than the lateral extension scale in first vacancy portion (102) and the lateral extension scale less than second vacancy portion (103), wherein, it is respectively arranged a bender element (111,121) inside each second vacancy portion (103) and the bender element is partly conductively connected with the bearing surface (104)；At least two piezoelectric elements (106,116), wherein, each piezoelectric element (106,116) is internal in first vacancy portion (102) in bender element (111,121) arranged beneath and conductively connected with the bender element (111,121) respectively；With confining bed (108), the confining bed is arranged in above the orifice plate load-bearing part (101) and the bender element (111,121) and is connect with the orifice plate load-bearing part (101) and the bender element (111,121), wherein, the confining bed (108) above the bender element (111,121) is diaphragm.
Description
Technical field
The present invention relates to a kind of acoustic transducer assemblies at least two bender elements and one kind for manufacturing sound transducing
The method of device assembly.
Background technology
39 20 872 A1 of file DE disclose a kind of method for manufacturing ultrasonic transducer, in the ultrasonic transducer
In, piezoelectric ceramics and thermoplastic material are connected with each other by heat bonding.In order to generate the necessary heat for bonding
Supply generates loss heat by applying electric signal in piezoelectric ceramics.
Show that ultrasound transducer array and one kind of a kind of focusing are corresponding in 10 2,004 047 814 A1 of document DE
Manufacturing method, the ultrasound transducer array be used as it is for focusing, can Clinical practice ultrasonic detector.Make laterally side by side
The mutual electrical connection in the transducer unit region-type of construction ground, to realize focusing that ultrasonic transduction device makes every effort to reach.
Here, disadvantageously, each ultrasonic transducer is exposed to the external action of mechanical type and electric type.
Invention content
Task of the invention lies in protect each laminar energy converter from external action.
It includes having between at least two that acoustic transducer assembly according to the present invention, which has orifice plate load-bearing part, the orifice plate load-bearing part,
The side in the first vacancy portion separatedly arranged, and the orifice plate load-bearing part includes the arranged at interval at least two
The opposite side in two vacancy portions.Each first vacancy portion and second empty portions are not arranged adjacently stackedly as a result,.The
The lateral extension scale in two vacancy portions is more than the lateral extension scale in the first vacancy portion, to form bearing in the first vacancy portion
Face.In addition, acoustic transducer assembly has at least two bender elements, wherein the lateral extension scale of bender element is more than first
The lateral extension scale in vacancy portion.The lateral extension scale of bender element is less than the lateral extension scale in the second vacancy portion.Every
A bender element is respectively disposed with inside a second vacancy portion, wherein bender element is partly conductively connected with bearing surface.
In addition, acoustic transducer assembly has at least two piezoelectric elements, wherein each piezoelectric element is respectively in bender element arranged beneath
It is inside the first vacancy portion and conductively connected with bender element.Confining bed is arranged on orifice plate load-bearing part and bender element
Side.Confining bed is connect with orifice plate load-bearing part and bender element.Confining bed above bender element is diaphragm.
Advantage is each bender element of piezoelectric element to be carried for external action protection, because of the bending herein
Element is covered in other words by single layer, i.e. confining bed covering.
In expansion scheme, the first vacancy portion and the second empty portions are not aligned.
Herein advantageously, each sonic transducer for respectively including bender element and piezoelectric element has symmetrical knot
Structure.
In another configuration, there is confining bed electric insulation layer, the electric insulation layer to be connect with bender element and orifice plate load-bearing part.
Advantage is herein, between each sonic transducer there are vibrating machine in terms of decoupling.
In expansion scheme, on confining bed or inside is disposed with metal layer, is especially continuous metal layer.
Herein advantageously, when metal layer is connected in electrical ground, sonic transducer can be realized in a simple manner
The EMV of component is shielded.
In another configuration, there are one the conductive layer of structuring, the conductive layer of the structuring has each bender element tool
First area, the first area are substantially conductively contacted in intermediate arrangement and with piezoelectric element.The conductive layer of structuring has
There is second area, which is transversely disposed on the edge of the side of each bender element and bender element and bearing surface
It is conductively connected.
Advantage is herein, the contact with piezoelectric element and the contact with bender element leading by means of structuring
Electric layer is realized.This means that, it is only necessary to a processing step.
In expansion scheme, each piezoelectric element tool there are one first electrode, the first electrode be arranged in piezoelectric element and
Between the first area of the conductive layer of the structuring.
It is contacted herein with the simple of piezoelectric element it is an advantage to be able to realize.
In another configuration, each piezoelectric element has the second electrode opposite with first electrode.In expansion scheme,
Second electrode with to be bonded wire rod conductively connected.Advantage is that second electrode can be contacted simply with ground connection herein.
In another configuration, the first vacancy portion is filled at least partly with damping material.Damping material especially has silicon tree
Fat.
Advantage is that acoustic transducer assembly is overleaf subject to mechanically stable and each acoustic transducer element solution herein
Coupling.
In expansion scheme, orifice plate load-bearing part is can be conductive.The orifice plate load-bearing part especially has metal or metallization
Ceramics.
Advantage is to provide electrical ground in a simple manner for acoustic transducer assembly herein.
Method according to the present invention for manufacturing acoustic transducer assembly includes：Make the of at least two piezoelectric elements respectively
One electrode is connected with corresponding bender element.The connection is carried out by means of the first area of the conductive layer of structuring, the structuring
Conductive layer be arranged on the side of bender element.Bender element is applied with the side opposite with the conductive layer of the structuring
Onto confining bed.Include the side in the first vacancy portion arranged at interval at least two and is spaced apart at least two
The orifice plate load-bearing part of the opposite side in the second vacancy portion of ground arrangement is applied on the region of bender element and confining bed.Orifice plate is held
Holder has the first vacancy portion and the second vacancy portion to adjoin each other, and the lateral extension scale in the second vacancy portion is more than first
Thus the lateral extension scale in vacancy portion forms bearing surface in the first vacancy portion.In other words, the structuring of bender element is led
The second area and bearing surface of electric layer connect and the transverse area between the second vacancy portion is connect with confining bed.First vacancy
Portion is filled with damping material.In expansion scheme, bender element is connect by means of the bonding agent of electrical isolation with confining bed.
In another configuration, the transverse area between the second vacancy portion is connected by means of the bonding agent of electrical isolation with confining bed
It connects.
In expansion scheme, the second area of the conductive layer of the structuring of bender element by means of can be conductive bonding agent with
Bearing surface connects.
By next obtaining other advantages to the description of embodiment or by dependent claims.
Description of the drawings
The present invention is illustrated in detail below according to preferred embodiment and attached drawing.Attached drawing is shown：
Fig. 1 has the acoustic transducer assembly of orifice plate load-bearing part, bender element, piezoelectric element and confining bed,
The method that Fig. 2 is used to manufacture acoustic transducer assembly.
Specific implementation mode
Fig. 1 shows tool, and there are three the cuing open along the directions xz of acoustic transducer assembly 100 of the acoustic transducer unit of exemplary arrangement
Diagram, the acoustic transducer unit form acoustic transducer array.Acoustic transducer unit includes piezoelectric element, which is applied
It is added on bender element.The connection of piezoelectric element and bender element passes through the first area realization of the conductive layer of structuring, the knot
The conductive layer of structure is arranged on the side of bender element.Bender element 111 is applied to confining bed 108 by means of electric insulation layer
On.Bender element 111 is especially contacted with orifice plate load-bearing part by means of the second area of conductive layer.Orifice plate load-bearing part 101 is additionally
It is connect with confining bed on transverse area between the second vacancy portion.The connection is realized by means of the bonding agent of electrical isolation.Piezoelectricity
Element 106 is by means of being bonded 113 contacting of wire rod.First vacancy portion 102 is filled with damping material.Damping material especially wraps
Include silicones.Optionally, confining bed 108 is made of multiple layers.Here, a layer in the layer for example may include metal.
Preferably, which connect with electrical ground so that realizes EMV shieldings.
In another embodiment, metal layer is arranged on confining bed 108.
Optionally, confining bed 108 includes film.The film is for example with polyamide.
Flexible transducer 111 and 121 includes bent bodies, and the bent bodies are for example with metal or metallized ceramic.Bending is changed
The thickness of energy device 111 and 121 is preferably between 100 μm and 700 μm.Piezoelectric element 106 can conductively be adhered to bender element
On 111.Piezoelectric element 106 carries the conductive metallization of energy as electrode on both sides.The thickness of piezoelectric element 106 is 150 μ
M to 700 μm, preferably 200 μm to 500 μm.Orifice plate load-bearing part 101 include conductive material, such as aluminium or metallized ceramic and
It is connect with the electrical ground of amplifier electron component.Orifice plate load-bearing part 101 is mechanical rigid, the orifice plate load-bearing part carrying bending
Element 106 and the vibration edge adjusting for showing the bender element, to form bending vibration.In addition, orifice plate load-bearing part
It is mechanically decoupled, which means that carrying out a small amount of crosstalk between acoustic transducer element between 101 responsible acoustic transducer elements.
The thickness of orifice plate load-bearing part is located at 1 between 10mm.
The signal contact of piezoelectric element 106 can be implemented by means of wire rod.Here, the wire rod be bonded or by means of
Hot compression is welded or conductive adhesive connection.
The basic configuration of piezoelectric element 106 and the basic configuration of bender element 110 and 121 may each be arbitrary.Here,
Different basic configurations may be used in piezoelectric element 106 and flexible transducer 110 and 121.Preferably regular shape, such as circle
Shape, ellipse, square, rectangle or quadrangle.Acoustic transducer array is included in 2 to 250 range, preferably 5 to 50
A certain number of acoustic transducer elements in range, and here, arbitrary geometrical basic shape may be used, preferably linear,
Rectangular or ellipse.Spacing between the acoustic transducer unit of piezoelectricity is preferably smaller than the half of wave length of sound.
Fig. 2 describes a kind of method for manufacturing acoustic transducer assembly 100.The method is started with step 200, in the step
First area by the first electrode of piezoelectric element by means of the conductive layer 110 of structuring and corresponding bender element respectively in rapid
111 and 121 connections.Here, the conductive layer of structuring is arranged on the side of bender element 111 and 121.In subsequent step
In 210, confining bed 108 is applied on the side opposite with the conductive layer of the structuring of bender element 111 and 121.
In subsequent step 220, apply orifice plate load-bearing part 101.Here, orifice plate load-bearing part 101 includes the first vacancy to adjoin each other
Portion 102 and the second vacancy portion 103, and wherein, bearing surface 104 is formed in the first vacancy portion 102.Therefore, orifice plate load-bearing part
101 make the second area of the conductive layer of the structuring of bender element and bearing surface 104 connect and make between the second vacancy portion 103
Transverse area connect with confining bed 108.In subsequent step 230, the first vacancy portion 102 is filled with damping material.
The adhesive layer of electrical isolation and adhesive layer that can be conductive can pass through drop coating or silk for all element of transducers simultaneously
Wire mark brush is realized.
The feature of each embodiment can be combined arbitrarily.
Acoustic transducer assembly can be used for example to be used to stop and shunt in the car.In addition, acoustic transducer assembly can be with
Using in the movement in the flogic system for storage or static machine.The acoustic transducer assembly can also use
In unmanned transportation system, robot, dust catcher, grass trimmer, electric wheelchair and two wheeler.
Claims (13)
1. acoustic transducer assembly (100), including
Orifice plate load-bearing part (101), the orifice plate load-bearing part include having at least two the first vacancy portions arranged at interval
(102) opposite side of side and the second vacancy portion (103) arranged at interval at least two so that each first
Vacancy portion (102) and a second vacancy portion (103) stackedly adjacently arrange respectively, wherein second vacancy portion (103)
Lateral extension scale be more than the lateral extension scale in first vacancy portion (102), in first vacancy portion (102)
Upper formation bearing surface (104),
At least two bender elements (111,121), wherein the lateral extension scale of the bender element (111,121) is more than
The lateral extension scale in first vacancy portion (102) and the lateral extension scale for being less than second vacancy portion (103),
In, it is respectively arranged a bender element (111,121) inside each second vacancy portion (103) and the bender element is partly
It is conductively connected with the bearing surface (104),
At least two piezoelectric elements (106,116), wherein each piezoelectric element (106,116) respectively bender element (111,
121) arranged beneath is internal in first vacancy portion (102) and conductively connected with the bender element (111,121), and
Confining bed (108), the confining bed are arranged on the orifice plate load-bearing part (101) and the bender element (111,121)
It connect just and with the orifice plate load-bearing part (101) and the bender element (111,121), wherein in the bender element
The confining bed (108) above (111,121) is diaphragm.
2. acoustic transducer assembly (100) according to claim 1, which is characterized in that each first vacancy portion (102) and one
A second vacancy portion (103) is aligned respectively.
3. acoustic transducer assembly (100) according to claim 1 or 2, which is characterized in that the confining bed (108) has
Electric insulation layer (109), the electric insulation layer are connect with the bender element (111,121) and the orifice plate load-bearing part (101).
4. acoustic transducer assembly (100) according to any one of the preceding claims, which is characterized in that in the confining bed
(108) on or inside is disposed with continuous metal layer (112).
5. acoustic transducer assembly (100) according to any one of the preceding claims, which is characterized in that each bender element
(111,121) there is the side of the conductive layer (110) with structuring, the conductive layer of the structuring to have first area, this
One region is arranged substantially at centre and conductively contacted with the piezoelectric element (106,116), also, the structuring is led
There is electric layer second area, the second area to be transversely disposed on the edge of the side of each bender element (111,121)
And keep the bender element (111,121) and the bearing surface (104) conductively connected.
6. acoustic transducer assembly (100) according to claim 5, which is characterized in that each piezoelectric element (106,116) tool
There are one first electrode (105), which is arranged in the conductive layer of the piezoelectric element (106,116) and the structuring
(110) between the first area.
7. acoustic transducer assembly (100) according to claim 6, which is characterized in that each piezoelectric element (106) have with
An opposite second electrode (107) of the first electrode (105).
8. acoustic transducer assembly (100) according to claim 7, which is characterized in that the second electrode (107) be bonded
Wire rod (113) is conductively connected.
9. acoustic transducer assembly (100) according to any one of the preceding claims, which is characterized in that first vacancy
Portion (102) is filled at least partly with damping material, wherein the damping material especially has silicones.
10. acoustic transducer assembly (100) according to any one of the preceding claims, which is characterized in that the orifice plate is held
Holder (101) is can be conductive, especially has metal or metallized ceramic.
11. the method for manufacturing acoustic transducer assembly (100), the method have steps of：
Made the first electrode of at least two piezoelectric elements respectively by means of the first area of the conductive layer (110) of structuring
(105) (200) are connected with corresponding bender element (111,121), the conductive layer of the structuring is arranged in the bender element
On the side of (111,121),
The side opposite with the conductive layer (110) of the structuring of the bender element (111,121) is applied into (210)
Onto confining bed (108),
Apply (220) orifice plate load-bearing part (101), which includes first arranged at interval at least two
The opposite side of the side in vacancy portion (102) and the second vacancy portion (103) arranged at interval at least two, wherein institute
It states the first vacancy portion (102) and second vacancy portion (103) adjoins each other, wherein the transverse direction in second vacancy portion (103)
Extension scale is more than the lateral extension scale in first vacancy portion (102), wherein the shape in first vacancy portion (102)
At bearing surface (104) so that the second area of the conductive layer of the structuring of the bender element (111,121) and the branch
Bearing surface (104) connects, and the transverse area between second vacancy portion (103) is connect with the confining bed (108), and
And
Make first vacancy portion (102) filling (230) with damping material.
12. according to the method for claim 11, which is characterized in that the bender element (111,121) and second sky
The transverse area lacked between portion (103) is connect by means of the bonding agent of electrical isolation with the confining bed (108).
13. method according to claim 11 or 12, which is characterized in that the knot of the bender element (111,121)
The second area of the conductive layer (110) of structure is connect by means of bonding agent that can be conductive with the bearing surface (104).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015224767.8 | 2015-12-10 | ||
| DE102015224767.8A DE102015224767A1 (en) | 2015-12-10 | 2015-12-10 | Sound transducer arrangement and method for producing a sound transducer arrangement |
| PCT/EP2016/074672 WO2017097472A1 (en) | 2015-12-10 | 2016-10-14 | Acoustic transducer arrangement having bending elements and method for producing an acoustic transducer arrangement having bending elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108367313A true CN108367313A (en) | 2018-08-03 |
Family
ID=57136886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680071565.6A Pending CN108367313A (en) | 2015-12-10 | 2016-10-14 | Acoustic transducer assembly with bender element and the method for manufacturing the acoustic transducer assembly with bender element |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3386646A1 (en) |
| CN (1) | CN108367313A (en) |
| DE (1) | DE102015224767A1 (en) |
| WO (1) | WO2017097472A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4754440A (en) * | 1985-12-27 | 1988-06-28 | Aisin Seiki Kabushikikaisha | Ultrasonic transducer |
| CN1396753A (en) * | 2001-07-11 | 2003-02-12 | 株式会社村田制作所 | Piezoelectric electroacoustic transducer and its manufacturing method |
| CN101241183A (en) * | 2007-02-05 | 2008-08-13 | 株式会社电装 | Mounting structure for sensor device |
| GB2493101A (en) * | 2011-07-22 | 2013-01-23 | Bosch Gmbh Robert | An ultrasound sensor device and an array of such devices |
| CN103720486A (en) * | 2012-10-12 | 2014-04-16 | 精工爱普生株式会社 | Ultrasonic transducer device, probe head, ultrasonic probe, and electronic machine |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129596U (en) * | 1984-07-24 | 1986-02-22 | 谷口 義晴 | Structure of ultrasonic transmitter/receiver |
| US5174926A (en) * | 1988-04-07 | 1992-12-29 | Sahagen Armen N | Compositions for piezoresistive and superconductive application |
| DE3920872A1 (en) | 1989-06-26 | 1991-01-03 | Siemens Ag | Hot bonding thermoplastic material to piezoelectric material - in transducer mfr., by surface fusing thermoplastic material |
| US6058782A (en) * | 1998-09-25 | 2000-05-09 | Kulite Semiconductor Products | Hermetically sealed ultra high temperature silicon carbide pressure transducers and method for fabricating same |
| US20050075572A1 (en) | 2003-10-01 | 2005-04-07 | Mills David M. | Focusing micromachined ultrasonic transducer arrays and related methods of manufacture |
| DE102007027936B4 (en) * | 2007-06-18 | 2009-09-10 | Giesecke & Devrient Gmbh | Portable data carrier |
| JP4944159B2 (en) * | 2009-06-02 | 2012-05-30 | Ｔｄｋ株式会社 | Piezoelectric actuator and method for manufacturing piezoelectric actuator |
| CN104022685B (en) * | 2014-05-23 | 2017-03-08 | 厦门大学 | The frequency modulation array piezoelectric cantilever prisoner applying to piezoelectric harvester can method |
-
2015
- 2015-12-10 DE DE102015224767.8A patent/DE102015224767A1/en not_active Withdrawn
-
2016
- 2016-10-14 CN CN201680071565.6A patent/CN108367313A/en active Pending
- 2016-10-14 WO PCT/EP2016/074672 patent/WO2017097472A1/en unknown
- 2016-10-14 EP EP16781787.3A patent/EP3386646A1/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4754440A (en) * | 1985-12-27 | 1988-06-28 | Aisin Seiki Kabushikikaisha | Ultrasonic transducer |
| CN1396753A (en) * | 2001-07-11 | 2003-02-12 | 株式会社村田制作所 | Piezoelectric electroacoustic transducer and its manufacturing method |
| CN101241183A (en) * | 2007-02-05 | 2008-08-13 | 株式会社电装 | Mounting structure for sensor device |
| GB2493101A (en) * | 2011-07-22 | 2013-01-23 | Bosch Gmbh Robert | An ultrasound sensor device and an array of such devices |
| CN103720486A (en) * | 2012-10-12 | 2014-04-16 | 精工爱普生株式会社 | Ultrasonic transducer device, probe head, ultrasonic probe, and electronic machine |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3386646A1 (en) | 2018-10-17 |
| DE102015224767A1 (en) | 2017-06-14 |
| WO2017097472A1 (en) | 2017-06-15 |
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Application publication date: 20180803 |