CN108356607B - Device and method for monitoring the condition of a tool in cutting machining and chip forming - Google Patents
Device and method for monitoring the condition of a tool in cutting machining and chip forming Download PDFInfo
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- CN108356607B CN108356607B CN201810387335.1A CN201810387335A CN108356607B CN 108356607 B CN108356607 B CN 108356607B CN 201810387335 A CN201810387335 A CN 201810387335A CN 108356607 B CN108356607 B CN 108356607B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Optics & Photonics (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
The invention discloses a device and a method for monitoring the state of a cutter in cutting machining and chip forming, the device comprises a cutter, an AE signal collector, a workpiece, a test platform and a data acquisition system, wherein the cutter and the AE signal collector are arranged on a cutter holder, the cutter holder comprises a main holder, an auxiliary holder and a heat insulation vibration damping pad, the cutter and the heat insulation vibration damping pad are arranged between the main holder and the auxiliary holder side by side, the auxiliary holder passes through the heat insulation vibration damping pad through a connecting bolt to be positively locked on the main holder, the auxiliary holder is reversely propped against the main holder through an adjusting bolt, the AE signal collector is arranged on the auxiliary holder, a piezoelectric force sensor I is arranged on the rear cutter surface of the cutter, a piezoelectric force sensor II is arranged on the front cutter surface of the cutter, a surface strain gauge is arranged on the main holder, and a high-speed CCD camera is arranged above the cutter. The AE signals of the invention have high acquisition precision, good independence and strong relevance.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a device and a method for monitoring the state of a tool in cutting machining and chip forming.
Background
The high-speed cutting processing is an advanced manufacturing process which is much higher than the conventional cutting speed, can greatly improve the processing efficiency of parts, reduce the processing cost, can enable the surface processing quality and the processing precision of the parts to reach higher level, and has been widely applied in the fields of aviation, aerospace, automobiles, ultra-precise micro-processing and the like.
In the high-speed cutting process, a series of conditions such as cutter abrasion, tipping, breakage, failure, chip formation, fracture, cutting interruption and the like often occur. These conditions have a specific impact on the machining process and tool conditions. During machining, these unexpected occurrences can affect the cutting state and the machining stability of the tool. In conventional machining, chip forming is the primary method of machining a workpiece into a desired shape. While the effect of the chip on the tool condition is mainly dependent on the chip forming mechanism and its geometry. The shape of the chip, the rate of separation and formation of the chip, the temperature and energy density of the chip, and the frictional squeezing movement of the chip and the cutting face of the tool all play a decisive role in the wear of the tool.
The chip forming process causes not only tool wear, but also breakage of the cutting edge, which increases power loss, and the cutting edge chipping interrupts normal processing and affects the quality of the workpiece. Therefore, in machining processes, monitoring of tool conditions is critical in order to avoid uncertain associativity of high speed cutting machining with chip formation related problems.
The existing tool state monitoring system mainly comprises a direct monitoring system and an indirect monitoring system, wherein the direct monitoring system, such as a laser sensor, an optical sensor and an ultrasonic sensor, is relatively expensive and is difficult to be practically used in machining; the indirect monitoring system is mainly realized by monitoring cutting force, vibration, current, temperature and the like through recalculation analysis, and the applied components mainly comprise an acceleration sensor, a force sensor, an AE sensor and a current sensor, so that the cost is relatively low, but the following problems generally exist:
1. because the vibration frequency of the cutter and the processed workpiece is higher in the chip forming process and basically exceeds 10KHZ, an AE sensor is needed, and the AE sensor of the existing monitoring system is directly arranged on the processed workpiece or the cutter.
2. The signals acquired by the AE sensors cannot be correlated with the chip morphology, the states of the cutter and the workpiece, whether the chips and the front cutter face of the cutter are in contact friction or not, and the cutter abrasion state is effectively monitored and analyzed, so that the application range is narrow.
Disclosure of Invention
The invention aims to provide a device and a method for monitoring cutter states in cutting machining and chip forming, wherein AE signals can be accurately and effectively distinguished from AE signals in different cutter states.
The device for monitoring the state of the cutter in the cutting machining and chip forming comprises a cutter and AE signal collector arranged on a cutter holder, a workpiece arranged on a clamp, a test platform for arranging the cutter holder and the clamp, and a data acquisition system for signal acquisition and storage, wherein the cutter holder comprises a main clamp holder, an auxiliary clamp holder and a heat insulation vibration reduction pad, the cutter and the heat insulation vibration reduction pad are arranged between the main clamp holder and the auxiliary clamp holder side by side, the auxiliary clamp holder is positively locked on the main clamp holder through a plurality of connecting bolts passing through the heat insulation vibration reduction pad, and the auxiliary clamp holder is reversely propped against the main clamp holder through a plurality of adjusting bolts;
the AE signal collector is arranged on the auxiliary clamp holder and is used for collecting sound signals of chip fracture, contact friction between chips and a front cutter surface of the cutter and shearing deformation or extrusion friction deformation of a workpiece in the cutting process;
a piezoelectric force sensor I for detecting whether cutting processing occurs or not is arranged on the rear cutter surface of the cutter;
a piezoelectric force sensor II for detecting whether the formed chips are contacted with the front tool surface of the cutter or not is arranged on the front tool surface of the cutter;
a surface strain gauge for measuring the frequency of cutting impact and cutting force in the high-speed cutting process is arranged on the main clamp holder;
a high-speed CCD camera for shooting a thermal imaging instrument for collecting the chip forming process, the chip forming form, the surface state and the temperature of the cutter in the high-speed cutting process is arranged on a test platform above the cutter;
the AE signal collector, the piezoelectric force sensor I, the piezoelectric force sensor II, the surface strain gauge and the output end of the high-speed CCD camera are all connected with the data acquisition system.
In order to be able to accurately and effectively acquire signals, the AE signal acquisition device is mounted on the auxiliary holder above the main cutting edge of the tool.
In order to accurately and effectively collect signals, the piezoelectric force sensor II is arranged on the front cutter surface of the cutter and is 10-40um away from the auxiliary cutting edge of the cutter.
For accurate and effective acquisition signals, the data acquisition system comprises a coupler, a low-pass filter, a charge amplifier, a signal acquisition module and a signal processing module which are electrically connected in sequence, wherein an AE signal acquisition device, a piezoelectric force sensor I, a piezoelectric force sensor II, a surface strain gauge and the output end of a high-speed CCD camera are connected with each serial port of a buffer amplifier.
The coupler is formed by sequentially and electrically combining a buffer amplifier, a power amplifier and a high-pass filter.
The fixture is arranged on a high-speed electric push rod on the test platform, and the high-speed electric push rod moves linearly to push a workpiece on the fixture and the cutter to form relative linear cutting movement.
The main clamp is arranged on a workpiece receiving pipe on the test platform, the cross section of the main clamp is annular, and the main clamp, the workpiece receiving pipe and the high-speed electric push rod are coaxially arranged.
A method for any one of the above devices for monitoring the condition of a tool in cutting machining and chip forming, comprising the steps of: in the high-speed cutting process, the surface strain gauge sends the measured stress value to a data acquisition system, and the data acquisition system calculates and obtains the frequency and the cutting force of cutting impact according to the stress value, the elastic modulus of the strain gauge material and the cross-sectional area of the main clamp holder:
ε=σ/E，F=σ·A
wherein epsilon is the frequency of cutting impact, sigma is the stress measured by the surface strain gauge, E is the elastic modulus of the strain gauge material, F is the cutting force, and A is the cross-sectional area of the main clamp.
Compared with the prior art, the invention has the following advantages:
1. the clamp is divided into two layers of a main clamp and an auxiliary clamp, the cutter and the heat-insulating vibration-damping pad are clamped between the main clamp and the auxiliary clamp side by side, the AE signal collector is arranged on the auxiliary clamp and is not directly connected with the main clamp, the buffer function of the heat-insulating vibration-damping pad is utilized to inhibit low-frequency vibration caused by elastic deformation and abrasion of the cutter in the high-speed cutting process, the possibility that noise signals caused by vibration of the cutter or a workpiece are mixed with signals required to be collected by the AE signal collector is reduced, and therefore the collection precision of the AE signal collector is ensured, and the monitoring function of a monitoring system is more effective.
2. By arranging the piezoelectric force sensor I, the piezoelectric force sensor II, the surface strain gauge and the high-speed CCD camera, the real-time synchronous monitoring of cutting force, chip morphology, states of a cutter and a workpiece (shearing cutting, friction collision and non-cutting), whether the chip contacts with a front cutter surface of the cutter or not and states of abrasion of the cutter and AE signals is realized, so that AE signals of the cutter and the chip in different states are effectively distinguished, and a basis is provided for accurately establishing the relevance and detecting the cutting state.
The AE signal acquisition precision is high, the independence is good, the relevance is strong, the AE signal acquisition precision can be widely applied to various cutting processing technologies, and the AE signal acquisition precision can be applied to different processing speeds, and particularly can be applied to an ultra-high speed (5 m/s-75 m/s) processing monitoring system.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of a partial enlarged structure at A-A in fig. 1.
Fig. 3 is an enlarged schematic view of the structure at I in fig. 1.
Fig. 4 is a schematic circuit diagram of the present invention.
The labels shown in the figures and the corresponding component names are:
1. a tool holder; 2. a cutter; 3. an AE signal collector; 4. a clamp; 5. a workpiece; 6. a test platform; 7. a piezoelectric force sensor I; 8. a piezoelectric force sensor II; 9. a surface strain gauge; 10. a high-speed CCD camera; 11. a main gripper; 12. an auxiliary clamp holder; 13. a thermal insulation vibration damping pad; 14. a connecting bolt; 15. an adjusting bolt; 16; a high-speed electric push rod; 17. the workpiece receives the tube.
Detailed Description
As can be seen from fig. 1 to 3, the device for monitoring the state of a tool in cutting machining and chip forming according to the present invention comprises a tool holder 1, a tool 2, an AE signal acquisition unit 3, a clamp 4, a workpiece 5, a test platform 6, a piezoelectric force sensor 7, a piezoelectric force sensor 8, a surface strain gauge 9, a high-speed CCD camera 10, and a data acquisition system for signal acquisition and storage, wherein
The tool rest 1 comprises a main clamp 11, an auxiliary clamp 12, a heat-insulating vibration-damping pad 13, a plurality of connecting bolts 14 and a plurality of adjusting bolts 15, wherein the tool 2 and the heat-insulating vibration-damping pad 13 are arranged between the main clamp 11 and the auxiliary clamp 12 side by side, threads on the connecting bolts 14 rotate in the forward direction, threads on the adjusting bolts 15 rotate in the reverse direction, the connecting bolts 14 are sequentially connected with the auxiliary clamp 12, the heat-insulating vibration-damping pad 13 and the main clamp 11 in a threaded manner, the adjusting bolts 15 are sequentially connected with the auxiliary clamp 12 and the heat-insulating vibration-damping pad 13 in a threaded manner, and the main clamp 11 is fixedly arranged on the test platform 6;
the cutter 2 is fixedly clamped between the main clamp 11 and the auxiliary clamp 12 through the forward rotating clamp of the connecting bolt 14, the reverse rotation of the adjusting bolt 15 is used for controlling the clamping force at different connecting positions between the main clamp 11 and the auxiliary clamp 12 in a micro-distance manner, and the clamping force at different positions has obvious influence on the dynamic characteristics of the cutter holder 1 consisting of the main clamp 11, the auxiliary clamp 12 and the heat insulation vibration reduction pad 13;
the AE signal collector 3 is arranged on the auxiliary holder 12 and is used for collecting sound signals of chip fracture, contact friction between chips and the front cutter surface of the cutter and shearing deformation or extrusion friction deformation of a workpiece in the cutting process;
the clamp 4 is arranged on the test platform 6, and the workpiece 5 is clamped on the clamp 4;
the piezoelectric force sensor I7 is arranged on the rear cutter surface of the cutter 2 and is used for detecting whether cutting processing occurs or not;
the piezoelectric force sensor II 8 is arranged on the front cutter surface of the cutter 2 and is used for detecting whether the formed chips are contacted with the front cutter surface of the cutter or not;
the surface strain gauge is arranged on the main clamp 11 and is used for measuring the frequency and the cutting force of cutting impact on the main clamp 11 in the high-speed cutting process;
the high-speed CCD camera 10 is arranged on the test platform 6 above the cutter 2, and a thermal imaging system is assembled on the high-speed CCD camera 10 and is used for shooting the chip forming process and form, the cutter surface state and the temperature in the high-speed cutting process;
the output ends of the AE signal collector 3, the piezoelectric force sensor I7, the piezoelectric force sensor II 8, the surface strain gauge 9 and the high-speed CCD camera 10 are all connected with a data acquisition system.
As can be seen from fig. 2, the AE signal acquisition unit 3 of the present invention is mounted on the sub-holder 12 above the main cutting edge of the tool 2.
In the present invention, the second piezoelectric force sensor 8 is mounted on the rake face of the tool 2 at a distance of 10-40um from the minor cutting edge of the tool 2.
As can be seen from fig. 4, the data acquisition system of the present invention includes a coupler, a low-pass filter, a charge amplifier, a signal acquisition module and a signal processing module, which are electrically connected in sequence, wherein the coupler is formed by sequentially electrically connecting a buffer amplifier, a power amplifier and a high-pass filter, and the output ends of the AE signal acquisition device, the piezoelectric force sensor one, the piezoelectric force sensor two, the surface strain gauge and the high-speed CCD camera are all connected with each serial port of the buffer amplifier, and the high-pass filter is electrically connected with the low-pass filter.
In the invention, the AE signal collector 3 and the data collection system can allow the collection and storage of signals above 50 KHZ.
As can also be seen from fig. 1 to 3, the clamp 4 is mounted on a high-speed electric push rod 16 of the test platform 6, the workpiece 5 is clamped on the clamp 4, and the high-speed electric push rod 16 is arranged coaxially with the main clamp 11; the cross section of the main clamp 11 is circular, the main clamp 11 is arranged on a workpiece receiving pipe 17 on the test platform 6, and the main clamp 11 and the workpiece receiving pipe 17 are coaxially arranged with the high-speed electric push rod 16; the cutter 2 is provided with two symmetrical ends which are arranged at one end of the main holder 11 close to the high-speed electric push rod 16, the high-speed electric push rod 16 moves linearly along the axis to push the workpiece 5 on the clamp 4 to move towards the main holder 11, the workpiece 5 is connected with the main cutting edge of the cutter 2 in a cutting way to form relative linear cutting movement, and the cutter can be directly used for monitoring the states of the cutter in the processes of pulling, planing and chip forming; and the correlation among chips, cutting force, cutting parameters, AE signals and cutter abrasion can be analyzed through the cutting movement generated by the cutter, so that a foundation is laid for a self-adaptive system for turning and milling.
The method for monitoring the state of a tool in cutting machining and chip forming according to the invention comprises the following steps: in the high-speed cutting process, the surface strain gauge 9 sends the measured stress value to a coupler of a data acquisition system, the stress value is stored in a signal processing module through a low-pass filter, a charge amplifier and a signal acquisition module, and the signal processing module calculates and obtains the frequency and the cutting force of cutting impact according to the measured stress value, the elastic modulus of a strain gauge material which is input manually and the cross section area of a main clamp holder:
ε=σ/E，F=σ·A
wherein epsilon is the frequency of cutting impact, sigma is the stress measured by the surface strain gauge, E is the elastic modulus of the strain gauge material, F is the cutting force, and A is the cross-sectional area of the main clamp.
Claims (6)
1. The utility model provides a device for monitoring cutter state in cutting machining and chip formation, includes cutter (2) and AE signal acquisition ware (3) of installing on knife rest (1), installs work piece (5) on anchor clamps (4), is used for installing test platform (6) of knife rest and anchor clamps, is used for signal acquisition and the data acquisition system of storage, its characterized in that: the tool rest comprises a main clamp holder (11), an auxiliary clamp holder (12) and a heat-insulating vibration-damping pad (13), wherein the tool and the heat-insulating vibration-damping pad are arranged between the main clamp holder and the auxiliary clamp holder side by side, the auxiliary clamp holder is positively locked on the main clamp holder through a plurality of connecting bolts (14) penetrating through the heat-insulating vibration-damping pad, and the auxiliary clamp holder is reversely propped against the main clamp holder through a plurality of adjusting bolts (15);
the AE signal collector is arranged on the auxiliary clamp holder above the main cutting edge of the cutter and is used for collecting sound signals of cutting fracture, contact friction between cutting chips and the front cutter surface of the cutter in the cutting process, and shearing deformation or extrusion friction deformation of a workpiece in the cutting process;
a piezoelectric force sensor I (7) for detecting whether cutting machining occurs or not is arranged on the rear cutter surface of the cutter;
a second piezoelectric force sensor (8) for detecting whether the formed chips are in contact with the front cutter surface of the cutter or not is arranged on the front cutter surface of the cutter, and the second piezoelectric force sensor is arranged on the front cutter surface of the cutter and is 10-40um away from the auxiliary cutting edge of the cutter;
a surface strain gauge (9) for measuring the frequency of cutting impact and cutting force in the high-speed cutting process is arranged on the main clamp holder;
a high-speed CCD camera (10) for shooting a thermal imaging collector for capturing the chip forming process and form, the surface state and the temperature of the cutter in the high-speed cutting process is arranged on a test platform above the cutter;
the AE signal collector, the piezoelectric force sensor I, the piezoelectric force sensor II, the surface strain gauge and the output end of the high-speed CCD camera are all connected with the data acquisition system.
2. The apparatus for monitoring tool conditions in cutting machining and chip forming according to claim 1, wherein: the data acquisition system comprises a coupler, a low-pass filter, a charge amplifier, a signal acquisition module and a signal processing module which are electrically connected in sequence, wherein the output ends of the AE signal acquisition device, the piezoelectric force sensor I, the piezoelectric force sensor II, the surface strain gauge and the high-speed CCD camera are connected with all serial ports of the buffer amplifier.
3. The apparatus for monitoring tool conditions in cutting machining and chip forming according to claim 2, wherein: the coupler is formed by sequentially and electrically combining a buffer amplifier, a power amplifier and a high-pass filter.
4. The apparatus for monitoring tool conditions in cutting machining and chip forming according to claim 1, wherein: the fixture is arranged on a high-speed electric push rod (16) on the test platform, and the high-speed electric push rod moves linearly to push a workpiece on the fixture and the cutter to form relative linear cutting movement.
5. The apparatus for monitoring tool conditions in cutting machining and chip forming according to claim 4, wherein: the main clamp is arranged on a workpiece receiving pipe (17) on the test platform, the cross section of the main clamp is in a circular shape, and the main clamp, the workpiece receiving pipe and the high-speed electric push rod are coaxially arranged.
6. A method suitable for use in the apparatus of any one of claims 1 to 5, comprising the steps of: in the high-speed cutting process, the surface strain gauge sends the measured stress value to a data acquisition system, and the data acquisition system calculates and obtains the frequency and the cutting force of cutting impact according to the stress value, the elastic modulus of the strain gauge material and the cross-sectional area of the main clamp holder:
ε=σ/E，F=σ·A
wherein epsilon is the frequency of cutting impact, sigma is the stress measured by the surface strain gauge, E is the elastic modulus of the strain gauge material, F is the cutting force, and A is the cross-sectional area of the main clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810387335.1A CN108356607B (en) | 2018-04-26 | 2018-04-26 | Device and method for monitoring the condition of a tool in cutting machining and chip forming |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810387335.1A CN108356607B (en) | 2018-04-26 | 2018-04-26 | Device and method for monitoring the condition of a tool in cutting machining and chip forming |
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| CN108356607A CN108356607A (en) | 2018-08-03 |
| CN108356607B true CN108356607B (en) | 2023-08-08 |
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| CN201810387335.1A Active CN108356607B (en) | 2018-04-26 | 2018-04-26 | Device and method for monitoring the condition of a tool in cutting machining and chip forming |
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