CN108336241A - OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device - Google Patents

OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device Download PDF

Info

Publication number
CN108336241A
CN108336241A CN201810053117.4A CN201810053117A CN108336241A CN 108336241 A CN108336241 A CN 108336241A CN 201810053117 A CN201810053117 A CN 201810053117A CN 108336241 A CN108336241 A CN 108336241A
Authority
CN
China
Prior art keywords
layer
oled
light
film layer
encapsulates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810053117.4A
Other languages
Chinese (zh)
Inventor
李梦真
罗志忠
刘玉成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yungu Guan Technology Co Ltd
Original Assignee
Yungu Guan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yungu Guan Technology Co Ltd filed Critical Yungu Guan Technology Co Ltd
Priority to CN201810053117.4A priority Critical patent/CN108336241A/en
Publication of CN108336241A publication Critical patent/CN108336241A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices

Abstract

The present invention relates to a kind of OLED to encapsulate film layer comprising the first inorganic layer, light removing layer and the protective layer being covered in OLED device;Light removing layer has photon crystal structure;Light removing layer is between the first inorganic layer and protective layer.Above-mentioned OLED encapsulates film layer, since light removing layer can improve the light extraction efficiency of OLED, to make OLED encapsulation film layer itself also have the function of light taking-up;So taking out piece without being bonded light outside OLED screen;Influence of the piece to OLED screen flexibility speciality is taken out so as to avoid fitting light;It is particularly suitable for flexible folding structure, does not easily cause OLED illumination agings or damage.The present invention also provides preparation method, OLED screen and lighting devices that a kind of OLED encapsulates film layer.

Description

OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device
Technical field
The present invention relates to display technology fields, and film layer and preparation method thereof, OLED screen are encapsulated more particularly to a kind of OLED And lighting device.
Background technology
OLED becomes the focus of research and development with its flexible characteristic, and OLED illuminations are the important development directions of OLED.
Currently, OLED lighting devices are bonded light usually in OLED screen takes out piece, to improve entire OLED lighting devices Luminous efficiency.
But the radius of curvature that light takes out piece is big, is not well suited for the flexible speciality of OLED.Especially shone in OLED Bright screen easily causes the aging of OLED lighting screens or damage when folding.
Invention content
Based on this, a kind of new OLED encapsulation film layers are provided.
A kind of OLED encapsulation film layer, including:
First inorganic layer, is covered in OLED device;
Protective layer is located at side of the OLED encapsulation film layers far from first inorganic layer;
And light removing layer, between first inorganic layer and the protective layer;The smooth removing layer has photon Crystal structure.
Above-mentioned OLED encapsulates film layer, since light removing layer can improve the light extraction efficiency of OLED, to make OLED encapsulating films Layer itself also has the function of light taking-up;So taking out piece without being bonded light outside OLED screen;So as to avoid fitting light Take out influence of the piece to OLED screen flexibility speciality;Be particularly suitable for flexible folding structure, do not easily cause OLED illumination aging or Damage.
The OLED encapsulation film layer further includes the first organic layer in one of the embodiments,;First organic layer covers It is placed on first inorganic layer;The smooth removing layer is formed on first organic layer;The protective layer is formed in described On light removing layer.
The photon crystal structure is periodical cylindrical structure in one of the embodiments,;Wherein, cylinder is a diameter of The height of 20nm~500nm, cylinder are 100nm~5000nm.
The smooth removing layer is titanium dioxide microballoon sphere film in one of the embodiments,;The titanium dioxide microballoon sphere Grain size is 10nm~500nm.
The thickness of the smooth removing layer is 0.1 μm~10 μm in one of the embodiments,.
The photon crystal structure is opal structural or counter opal structure in one of the embodiments,.
The material of the smooth removing layer is polymethyl methacrylate in one of the embodiments,.
The present invention also provides the preparation methods that the OLED of present invention a kind of encapsulates film layer.
A kind of preparation method of OLED encapsulation film layer, includes the following steps:
The first inorganic layer is covered in OLED device;
Light removing layer is formed on first inorganic layer;
The protective layer is covered on the smooth removing layer.
The preparation method of above-mentioned OLED encapsulation film layer, makes OLED encapsulation film layer itself also have the function of light taking-up;So Piece is taken out without being bonded light outside OLED screen;So as to avoid the shadow that fitting light takes out piece to OLED screen flexibility speciality It rings;It is particularly suitable for flexible folding structure, does not easily cause OLED illumination agings or damage.
The smooth removing layer is formed by way of nano impression or transfer in one of the embodiments,.
The present invention also provides a kind of OLED screens.
A kind of OLED screen, the OLED screen include OLED encapsulation film layer provided by the present invention.
Above-mentioned OLED screen, due to encapsulating film layer using OLED provided by the present invention, to make OLED screen itself that there is light Function is taken out, piece is taken out without being bonded light outside OLED screen;Piece is taken out to OLED screen flexibility so as to avoid fitting light The influence of speciality is conducive to OLED screen performance flexible;It is particularly suitable for flexible folding structure, does not easily cause OLED screen aging Or damage.
The present invention also provides a kind of lighting devices.
A kind of lighting device, including OLED screen provided by the present invention.
Above-mentioned lighting device takes out due to using OLED screen provided by the present invention without being bonded light outside OLED screen Piece;Influence of the piece to OLED screen flexibility speciality is taken out so as to avoid fitting light;It is particularly suitable for flexible folding structure, Lighting device aging or damage are not easily caused.
Description of the drawings
Fig. 1 is that the OLED of an embodiment of the present invention encapsulates the cross-sectional view of film layer.
Fig. 2 is that the OLED of another embodiment of the present invention encapsulates the cross-sectional view of film layer.
Fig. 3 is the cross-sectional view of the OLED screen of an embodiment of the present invention.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, right below in conjunction with specific implementation mode The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are only used to explain the present invention, It is not intended to limit the present invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant Listed Items.
Referring to Fig. 1-2, the OLED of an embodiment of the present invention encapsulates film layer 100, including the first inorganic layer 110, first has Machine layer 120, light removing layer 130 and protective layer 140.
Wherein, the first inorganic layer 110 is covered on OLED device (not shown).First inorganic layer 110 primarily serves resistance The effect of water proof oxygen.
First inorganic layer 110 is preferably the silicon nitride layer of densification.Water oxygen obstructing capacity can be further increased in this way.
Preferably, the thickness of the first inorganic layer 110 is 100nm~2000nm.The first inorganic layer 110 can be both ensured in this way Water oxygen obstructing capacity;The flexibility for being conducive to improve the first inorganic layer 110 simultaneously, avoids the first inorganic layer 110 from being broken.
Wherein, the first organic layer 120 is covered on the first inorganic layer 110.First organic layer 120 primarily serves planarization Effect;It can also play the role of discharging stress in bending simultaneously.
The material of first organic layer 120 is preferably PMMA polymethyl methacrylates;It is more advantageous to planarization in this way, simultaneously Also further increase bend resistance ability.Certainly, the material of the first organic layer 120 can also be other Polyacrylate materials, Or other non-polypropylene esters of gallic acid materials.
Preferably, the thickness of the first organic layer 120 is 1 μm~20 μm.
Wherein, light removing layer 130 is formed on the first organic layer 120.Light removing layer 130 has photon crystal structure.Light Sub- crystal structure refers to the periodic dielectric knot with photon band gap (PhotonicBand-Gap, referred to as PBG) characteristic Structure.
In a specific embodiment, photon crystal structure is periodical cylindrical structure (referring specifically to Fig. 1);Wherein, circle The height of a diameter of 20nm~300nm of column, cylinder are 100nm~5000nm.Taking for visible light can be further increased in this way Go out.
It is highly preferred that periodical cylindrical structure is located at the surface far from 120 side of the first organic layer of light removing layer 130.
Gap between cylinder, when forming protective layer 140, the material of protective layer 140 can be filled in the gap.
In this embodiment, the material of light removing layer 130 is silicon nitride or aluminium oxide.It can further carry in this way The water oxygen obstructing capacity of high OLED encapsulation film layer 100.
Preferably, the thickness of entire light removing layer 130 is 100nm-10 μm;Ensure light extraction efficiency in this way.
In another specific implementation mode, light removing layer 130 is titanium dioxide microballoon sphere film (referring specifically to Fig. 2).Wherein, The grain size of titanium dioxide microballoon sphere is 10nm~500nm.
Titanium dioxide microballoon sphere can enhanced light scattering, to reach light take out effect.The same time delay of titanium dioxide microballoon sphere film The path for having grown water oxygen intrusion, to improve water oxygen obstructing capacity.
Gap between titanium dioxide microballoon sphere, when forming protective layer 140, the material of protective layer 140 can be filled in the sky In gap.Therefore the light removing layer of this structure, is conducive to stress absorption, can also improve the bend resistance of OLED encapsulation film layers 100 Ability.
In this embodiment, the thickness of titanium dioxide microballoon sphere film is 0.1 μm~10 μm.It in this way can be more into one Step improves light extraction efficiency.
In another specific implementation mode, light removing layer has opal structural (referring specifically to Fig. 2).That is, photon Crystal structure is specially opal structural.
The lattice constant of opal structural is preferably 30nm-100nm, and the light that can further improve visible light in this way takes Go out efficiency.
In the present embodiment, the overall thickness 300nm-600nm of light removing layer;Be conducive to take into account light extraction efficiency and system in this way Standby difficulty.
In this embodiment, the material of light removing layer 130 is polymethyl methacrylate.It in this way can be more into one Step improves the flexibility of entire OLED encapsulation film layer.
Preferably, the thickness of entire light removing layer 130 is 100nm-10 μm.It can ensure light extraction efficiency in this way.
Opal structural photon band gap in the horizontal direction is located in visible-range, therefore can prevent the lateral wave of light It leads, and then improves the coupling of vertical direction, to make the vertical direction of light transmit enhancing, have the function that light takes out.
In still another embodiment, light removing layer 130 has counter opal structure (referring specifically to Fig. 2).Namely It says, photon crystal structure is specially counter opal structure.The photon band gap of counter opal structure is wider, and it is more preferable that light takes out effect.
Preferably, the lattice constant of counter opal structure is 30nm-100nm, can further improve visible light in this way Light extraction efficiency.
In this embodiment, overall thickness 300nm-600nm;Be conducive to take into account light extraction efficiency in this way and prepare hardly possible Degree.
In this embodiment, the material of light removing layer 130 is polymethyl methacrylate.It in this way can be more into one Step improves the flexibility of entire OLED encapsulation film layer.
Counter opal structure photon band gap in the horizontal direction is located in visible-range, therefore can prevent the transverse direction of light Waveguide, and then the coupling of vertical direction is improved, to make the vertical direction of light transmit enhancing, have the function that light takes out.
Wherein, protective layer 140 is covered on light removing layer 130.The main function of protective layer is, for protecting light removing layer 130, while being also used as stress release layer.
The material of protective layer 140 is preferably organosilicon.It is more advantageous to stress release in this way.It is, of course, understood that protecting The material of sheath 140 simultaneously not as good as this is confined to, can also be inorganic material, such as ultra-thin glass, can also be inorganic organic mixed Condensation material.
Preferably, the thickness of protective layer 140 is 100 microns.It is more advantageous to stress release in this way.
It is, of course, understood that the OLED encapsulation film layer of the present invention is not limited to above structure, ability can also be Field technique personnel think suitable other structures, if light removing layer between the first inorganic layer and protective layer, such as It includes the first inorganic layer, light removing layer, the first organic layer, the second inorganic layer and protective layer that OLED, which encapsulates film layer successively,;Or It includes the first inorganic layer, light removing layer and protective layer that OLED, which encapsulates film layer successively,.
Above-mentioned OLED encapsulates film layer, since light removing layer can improve the light extraction efficiency of OLED, to make OLED encapsulating films Layer itself also has the function of light taking-up;So taking out piece without being bonded light outside OLED screen;So as to avoid fitting Light takes out influence of the piece to OLED screen flexibility speciality;It is particularly suitable for flexible folding structure, does not easily cause OLED illumination agings Or damage.
The present invention also provides the preparation methods that a kind of OLED encapsulates film layer.
A kind of preparation method of OLED encapsulation film layer, includes the following steps:
S1, the first inorganic layer is covered in OLED device;
S2, the first organic layer is covered on first inorganic layer;
S3, light removing layer is formed on first organic layer;
S4, the protective layer is covered on the smooth removing layer.
Wherein, in step sl, the formation of the first inorganic layer may be used those skilled in the art and think suitably respectively Kind forming method;In step s 2, the formation of the first organic layer may be used those skilled in the art and think suitable various Forming method;Details are not described herein.
Wherein, in step s3, the formation of light removing layer is as follows:
When the photon crystal structure of light removing layer is periodical cylindrical structure, it is preferred to use prepared by following steps:
One layer of inorganic layer is prepared in the first organic layer, is then formed in the upper surface of the inorganic layer by nanometer embossing Periodical cylindrical structure forms light removing layer.
When light removing layer is titanium dioxide microballoon sphere film, it is preferred to use prepared by following steps:
Spin coating or spraying titanium dioxide microballoon sphere solution, form titanium dioxide microballoon sphere film, pass through the side of transfer in template Titanium dioxide microballoon sphere film is transferred on the first organic layer by formula, that is, forms light removing layer.
When the photon crystal structure of light removing layer is opal structural, it is preferred to use prepared by following steps:
Opal structural layer is formed in template;Then opal structural layer is detached from template;Pass through transfer again Opal structural layer is transferred on the first organic layer by mode, that is, forms light removing layer.
Similarly, when the photon crystal structure of light removing layer is counter opal structure, it is preferred to use prepared by following steps:
Counter opal structure layer is formed in template;Then counter opal structure layer is detached from template;Again by turning Counter opal structure layer is transferred on the first organic layer by the mode of print, that is, forms light removing layer.
The mode of transfer using dry film, rather than directly forms liquid film on the first organic layer, in this way can be to avoid The influence that liquid film encapsulates OLED reduces influence of the water oxygen to OLED device in light removing layer preparation process.
Wherein, in step s 4, the method for forming protective layer may be used those skilled in the art and think suitable each Kind forming method;Details are not described herein.
It is understood that the preparation method of the OLED encapsulation film layers of the present invention is not limited to the above method, it can be with It is that those skilled in the art think suitable other methods, as long as light removing layer is between the first inorganic layer and protective layer It can.
The preparation method of above-mentioned OLED encapsulation film layer, makes OLED encapsulation film layer itself also have the function of light taking-up;So Piece is taken out without being bonded light outside OLED screen;So as to avoid the shadow that fitting light takes out piece to OLED screen flexibility speciality It rings;It is particularly suitable for flexible folding structure, does not easily cause OLED illumination agings or damage.
The present invention also provides a kind of OLED screens.
A kind of OLED screen, including OLED provided by the present invention encapsulate film layer.
Referring to Fig. 3, specifically, OLED screen 1000 includes flexible substrate 200, the OLED devices being formed in flexible substrate 200 Part 400 and the OLED encapsulation film layers 100 being formed in OLED device 400.
Preferably, water oxygen barrier layer 300 is additionally provided between flexible substrate 200 and OLED device 400.It can obstruct in this way Water oxygen is invaded from flexible liner bottom side in OLED device, further increases water oxygen obstructing capacity.
Wherein, people in the art may be used in flexible substrate 200, OLED device 400 and water oxygen barrier layer 300 Member thinks suitable specific material and structure, and details are not described herein.
Above-mentioned OLED screen, due to encapsulating film layer using OLED provided by the present invention, to make OLED screen itself that there is light Function is taken out, piece is taken out without being bonded light outside OLED screen;Piece is taken out to OLED screen flexibility so as to avoid fitting light The influence of speciality is conducive to OLED screen performance flexible;It is particularly suitable for flexible folding structure, does not easily cause OLED screen aging Or damage.
The present invention also provides a kind of lighting devices.
A kind of lighting device, including OLED screen provided by the present invention.
It is, of course, understood that the present invention lighting device in addition to OLED screen can with other components, other components Concrete structure and connection relation may be used those skilled in the art and think suitable concrete structure and connection relation, Details are not described herein.
Above-mentioned lighting device takes out due to using OLED screen provided by the present invention without being bonded light outside OLED screen Piece;Influence of the piece to OLED screen flexibility speciality is taken out so as to avoid fitting light;It is particularly suitable for flexible folding structure, Lighting device aging or damage are not easily caused.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (11)

1. a kind of OLED encapsulates film layer, which is characterized in that including:
First inorganic layer, is covered in OLED device;
Protective layer is located at side of the OLED encapsulation film layers far from first inorganic layer;
Light removing layer, between first inorganic layer and the protective layer;The smooth removing layer has photon crystal structure.
2. OLED according to claim 1 encapsulates film layer, which is characterized in that the OLED encapsulation film layer further includes first having Machine layer;First organic layer is covered on first inorganic layer;The smooth removing layer is formed on first organic layer; The protective layer is formed on the smooth removing layer.
3. OLED according to claim 1 encapsulates film layer, which is characterized in that the photon crystal structure is periodical cylinder Structure;Wherein, the height of a diameter of 20nm~500nm of cylinder, cylinder are 100nm~5000nm.
4. OLED according to claim 1 encapsulates film layer, which is characterized in that the smooth removing layer is that titanium dioxide microballoon sphere is thin Film;The grain size of the titanium dioxide microballoon sphere is 10nm~500nm.
5. OLED according to claim 3 encapsulates film layer, which is characterized in that the thickness of the smooth removing layer is 0.1 μm~ 10μm。
6. OLED according to claim 1 encapsulates film layer, which is characterized in that the photon crystal structure is opal structural Or counter opal structure.
7. OLED according to claim 6 encapsulates film layer, which is characterized in that the material of the smooth removing layer is poly- methyl-prop E pioic acid methyl ester.
8. a kind of preparation method of OLED encapsulation film layer, which is characterized in that include the following steps:
The first inorganic layer is covered in OLED device;
Light removing layer is formed on first inorganic layer;
The protective layer is covered on the smooth removing layer.
9. the preparation method of encapsulation film layer according to claim 8, which is characterized in that the smooth removing layer is pressed by nanometer Print or the mode of transfer are formed.
10. a kind of OLED screen, which is characterized in that the OLED screen includes claim 1-7 any one of them OLED encapsulating films Layer.
11. a kind of lighting device, which is characterized in that including OLED screen according to any one of claims 10.
CN201810053117.4A 2018-01-19 2018-01-19 OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device Pending CN108336241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810053117.4A CN108336241A (en) 2018-01-19 2018-01-19 OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810053117.4A CN108336241A (en) 2018-01-19 2018-01-19 OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device

Publications (1)

Publication Number Publication Date
CN108336241A true CN108336241A (en) 2018-07-27

Family

ID=62926213

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810053117.4A Pending CN108336241A (en) 2018-01-19 2018-01-19 OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device

Country Status (1)

Country Link
CN (1) CN108336241A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817819A (en) * 2019-01-31 2019-05-28 深圳市华星光电半导体显示技术有限公司 Enhance the white OLED device that light takes out
WO2020042543A1 (en) * 2018-08-31 2020-03-05 昆山国显光电有限公司 Display panel and display apparatus
CN113178528A (en) * 2021-04-07 2021-07-27 武汉华星光电半导体显示技术有限公司 Display panel and display device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2439231A (en) * 2005-03-10 2007-12-19 Konica Minolta Holdings Inc Resin film substrate for organic electroluminescence and organic electroluminescent device
CN102246064A (en) * 2008-10-31 2011-11-16 3M创新有限公司 Light extraction film with high index backfill layer and passivation layer
CN102272973A (en) * 2008-12-17 2011-12-07 3M创新有限公司 Light extraction film with nanoparticle coatings
CN105098097A (en) * 2015-09-11 2015-11-25 四川虹视显示技术有限公司 Package structure and packaging method of flexible OLED (Organic Light Emitting Diode) device
CN105350077A (en) * 2015-10-20 2016-02-24 同济大学 Preparation method of photonic crystal scintillator by using polymer template
CN106848100A (en) * 2017-03-01 2017-06-13 武汉华星光电技术有限公司 The encapsulating structure and method for packing of flexible OLED display part

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2439231A (en) * 2005-03-10 2007-12-19 Konica Minolta Holdings Inc Resin film substrate for organic electroluminescence and organic electroluminescent device
CN102246064A (en) * 2008-10-31 2011-11-16 3M创新有限公司 Light extraction film with high index backfill layer and passivation layer
CN102272973A (en) * 2008-12-17 2011-12-07 3M创新有限公司 Light extraction film with nanoparticle coatings
CN105098097A (en) * 2015-09-11 2015-11-25 四川虹视显示技术有限公司 Package structure and packaging method of flexible OLED (Organic Light Emitting Diode) device
CN105350077A (en) * 2015-10-20 2016-02-24 同济大学 Preparation method of photonic crystal scintillator by using polymer template
CN106848100A (en) * 2017-03-01 2017-06-13 武汉华星光电技术有限公司 The encapsulating structure and method for packing of flexible OLED display part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020042543A1 (en) * 2018-08-31 2020-03-05 昆山国显光电有限公司 Display panel and display apparatus
US11283051B2 (en) 2018-08-31 2022-03-22 Kunshan Go-Visionox Opto-Electronics Co., Ltd Thin film packaging layer coated display panel and display device
CN109817819A (en) * 2019-01-31 2019-05-28 深圳市华星光电半导体显示技术有限公司 Enhance the white OLED device that light takes out
CN113178528A (en) * 2021-04-07 2021-07-27 武汉华星光电半导体显示技术有限公司 Display panel and display device

Similar Documents

Publication Publication Date Title
CN108336241A (en) OLED encapsulates film layer and preparation method thereof, OLED screen and lighting device
WO2019205234A1 (en) Display panel and fabrication method therefor
CN106865493B (en) Nano-structured product
US10192939B2 (en) Display device and fabrication method thereof
CN109037289A (en) Display base plate and preparation method thereof, display panel
CN105510999B (en) Anti-reflection structure and its manufacturing method, display and its manufacturing method
WO2015085711A1 (en) Organic light-emitting display and display apparatus
US20080138538A1 (en) Barrier layer, composite article comprising the same, electroactive device, and method
CN103443952A (en) OLED light extraction films having nanoparticles and periodic structures
CN1832222B (en) Organic electroluminescent device and manufacturing method for the same
CN107254206A (en) Molding nano-particle phosphor for luminous application
TWI609504B (en) Quantum dots encapsulation structure and method for making the same
CN104505468B (en) Luminescent device and its method for packing
US20150221891A1 (en) High efficacy seal for organic light emitting diode displays
TWI449006B (en) Hybrid display device
CN102201549B (en) Substrate for flexible light emitting device and fabrication method thereof
CN105518895A (en) Substrate for organic electronic devices and production method therefor
US20200028115A1 (en) Method of encapsulating a flexible oled panel and encapsulation structure
CN104576697A (en) Double-sided OLED (organic light emitting diode) display device and manufacture method thereof
CN106229420A (en) Thin-film packing structure and preparation method thereof and display device
Li et al. Facile fabrication of crack-free large-area 2D WO 3 inverse opal films by a ‘dynamic hard-template’strategy on ITO substrates
WO2019127702A1 (en) Oled panel and manufacturing method therefor
CN106373990A (en) OLED (optical light emitting diode) display panel and manufacturing method thereof
CN106374057A (en) Packaging method of OLED device
CN109950416A (en) Production method, display panel and the electronic equipment of display panel

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20180727

RJ01 Rejection of invention patent application after publication