CN108333298A - Chip apparatus for placing and chip oriented instrument - Google Patents
Chip apparatus for placing and chip oriented instrument Download PDFInfo
- Publication number
- CN108333298A CN108333298A CN201710051656.XA CN201710051656A CN108333298A CN 108333298 A CN108333298 A CN 108333298A CN 201710051656 A CN201710051656 A CN 201710051656A CN 108333298 A CN108333298 A CN 108333298A
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- China
- Prior art keywords
- chip
- placing
- positioning
- baffle
- chip apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N2033/0095—Semiconductive materials
Abstract
The present invention provides a kind of chip apparatus for placing and chip oriented instrument, the chip apparatus for placing includes for placing the pedestal of chip, two positioning baffles, groove positioning device, front end baffle and sliding panel；The front end baffle is installed on one end of the pedestal, and the front end baffle has a gap；The sliding panel is installed on the other end of the pedestal, and can slide on the base, to change the distance between the sliding panel and the front end baffle；Two positioning baffles are symmetrically arranged on the sliding panel, have scale on two positioning baffles；The groove positioning device is installed between two positioning baffles, and point-blank with the gap of the front end baffle, the groove positioning device can be along the linear slide at the center of the groove positioning device.The chip apparatus for placing of traditional chip oriented instrument is solved when detecting different wafer sizes, need the adjustment for carrying out board component and calibration and there are problems that metallic pollution risk.
Description
Technical field
The present invention relates to semi-conductor device technology fields, and in particular to a kind of chip apparatus for placing and chip oriented instrument.
Background technology
Semiconductor integrated circuit is made in the semiconductor substrate of low index surface, currently, semi-conductor industry is most common
Chip is the chip of (111) crystal orientation and (100) crystal orientation.The difference of (111) crystal orientation or (100) crystal orientation is mainly atom
Atomic density and atomic distance difference, this characteristic in this direction will produce the areas such as surface state, mobility, impurity diffusion
Not.
In order to determine the crystal orientation of chip, current 8 inches, 12 inch wafers generally cut a V-type or U using on chip side
The mode of type groove, in this way, some subsequent semiconductor equipments can carry out chip and equipment by this V-type or U-shaped groove
Positioning.
It is cut after being formed in V-type or U-shaped groove in view of the importance of above-mentioned V-type either U-shaped groove, it will usually logical
It crosses chip oriented instrument and is further verified whether it cuts accurately.The chip apparatus for placing of traditional chip oriented instrument, such as Fig. 1
It is shown, including pedestal 101, set screw 102, set screw 103, groove positioning device 104 and front end baffle 107.The bottom
The smaller one end both sides of 101 sizes of seat are equipped with set screw 102 and set screw 103.Front end baffle 107 is mounted on the pedestal
The center of the smaller one end of 101 sizes.The front end baffle 107 includes symmetrical two parts, that is, front end baffle first part
105 and front end baffle second part 106, there are a gap, larger-size one end of the baffle 101 to be equipped between two parts
The one groove positioning device 104 that can be slided along 101 axis direction of the baffle.
Carry out it is chip oriented when, only chip 201 need to be placed on the pedestal 101, allow the chip 201 with it is described
107 3 points of set screw 102,103 and the front end baffle are tangent, then by being penetrated from the gap of the front end baffle 107
The X-ray entered carries out crystal orientation positioning, and rotation chip 201 is to adjust chip crystal orientation to prescribed direction, finally by groove positioning device
It pushes ahead, as can fitting like a glove with groove, i.e. groove cutting is correct, and crystal orientation positioning is correct, otherwise crystal orientation Wrong localization.
But apparatus above has one, that is, when carrying out different wafer sizes orientation, it is necessary to adjust set screw 102,
103 just can guarantee that different wafer sizes can be tangent.As shown in Fig. 2, for the fixed screw 102,103 of same position,
It cannot meet the tangent requirement of various sizes of chip.This problem can be more clearly from found out by Fig. 3, if wanted
3 points of tangent positioning that the set screw 102,103 and front end baffle 107 are carried out to various sizes of chip, just must be to institute
It states set screw 102,103 to carry out position adjustment and calibrate chip apparatus for placing, this also can in actual mechanical process
Human error is introduced, causes positioning inaccurate, and efficiency is very low.
In addition, it has been found that the material that the chip apparatus for placing of traditional chip oriented instrument uses easily is got rusty, with crystalline substance
Piece is in direct contact, the risk that Fe metal elements can be brought to pollute.
Invention content
The object of the present invention is to provide a kind of chip apparatus for placing, and the chip to solve traditional chip oriented instrument is put
Set the problem that device accuracy is low and efficiency is low.
Another object of the present invention is to solving the chip apparatus for placing of traditional chip oriented instrument, there are metallic pollution wind
The problem of danger.
The present invention provides a kind of chip apparatus for placing comprising：For place the pedestal of chip, two positioning baffles,
Groove positioning device, front end baffle and sliding panel；
The front end baffle is installed on one end of the pedestal, and the front end baffle has a gap；
The sliding panel is installed on the other end of the pedestal, and can slide on the base, to change the sliding
The distance between plate and the front end baffle；
Two positioning baffles are symmetrically arranged on the sliding panel, have scale on two positioning baffles；
The groove positioning device is installed between two positioning baffles, the center of the groove positioning device with it is described before
Point-blank, the groove positioning device can be along the linear slide in the gap of end-stopping plate.
Optionally, area of the area of the pedestal at least more than the chip being placed on it.
Optionally, the pedestal is axially symmetric structure.
Optionally, the front end baffle center is located on the symmetry axis of the pedestal.
Optionally, the front end baffle includes two parts.
Optionally, the width in the gap of the front end baffle is 20mm-50mm.
Optionally, the groove positioning device and contact wafers end are the protrusion coincideing with chip V-type groove.
Optionally, the groove positioning device and contact wafers end are the protrusion coincideing with the U-shaped groove of chip.
Optionally, the length of the positioning baffle is 50mm-200mm.
Optionally, the angle between two positioning baffle is 60 ° -150 °.
Optionally, the graduation position on the positioning baffle is different wafer sizes and the tangent position of the positioning baffle
It sets.
Optionally, teflon material layer is covered in the one side of the pedestal and contact wafers.
Optionally, teflon material layer is covered in the one side of the positioning baffle and contact wafers.
Optionally, it is covered with teflon material layer in the front end baffle and the one side of contact wafers
Optionally, the thickness of the teflon material layer is 2mm-5mm.
This law invention provides a kind of chip oriented instrument comprising chip apparatus for placing described in any one of the above embodiments.
In conclusion using chip apparatus for placing provided by the invention, since the positioning plate can be with various sizes of crystalline substance
Piece can be tangent, it is only necessary to correspond to different wafer sizes on positioning plate and put on scale, you can be positioned to different wafer sizes
Detection, without being adjusted and calibrating as conventional wafer apparatus for placing, to improve detection efficiency and accuracy.
In addition, since the region of wafer locating device provided by the invention and contact wafers is all covered with teflon material
Layer, to reduce the risk of metallic pollution.
Description of the drawings
Fig. 1 is the upward view of conventional wafer apparatus for placing；
Fig. 2 is the upward view that conventional wafer apparatus for placing positions different wafer sizes；
Fig. 3 is the close-up schematic view that conventional wafer apparatus for placing positions different wafer sizes；
Fig. 4 is the upward view for the chip apparatus for placing that the preferred embodiment of the present invention provides；
Fig. 5 is the schematic diagram of the front end baffle for the chip apparatus for placing that the preferred embodiment of the present invention provides；
Fig. 6 is the depression angle signal that the chip apparatus for placing that the preferred embodiment of the present invention provides positions different wafer sizes
Figure；
Fig. 7 is the schematic diagram of the side for the chip apparatus for placing that the preferred embodiment of the present invention provides；
Fig. 8 is the flow chart for the application method that the chip apparatus for placing provided is preferably implemented in the present invention；
The description of symbols of attached drawing 1- attached drawings 7 is as follows：
101,301- pedestals；102,103- set screws；104,304- grooves positioning device；105,305- front end baffles
A part；106,306- front end baffles second part；107,307- front end baffles；201,401- chips；302,303- positioning gear
Plate；308- sliding panels；309,310,311- teflon material layers；Angle between α-two positioning baffles；D1- front end baffles first
Part and front end baffle second part are away from each other the distance between one end；D2- front end baffles first part and front end baffle second
Gap width between part；The height of h- front end baffles.
Specific implementation mode
Chip apparatus for placing proposed by the present invention is described in detail below in conjunction with the drawings and specific embodiments.Under
Face illustrates and claims, advantages and features of the invention will become apparent from.It should be noted that attached drawing is all made of very simplification
Form and use non-accurate ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
It is the upward view for the chip apparatus for placing that the preferred embodiment of the present invention provides refering to Fig. 4.This implementation
The chip apparatus for placing that example provides comprising：301, two positioning baffles 302 of pedestal and 303, groove for placing chip are fixed
Position device 304, front end baffle 307 and sliding panel 308；
The front end baffle 307 is installed on one end of the pedestal 301, and the front end baffle 307 has a gap；
The sliding panel 308 is installed on the other end of the pedestal 301, and can be slided on the pedestal 301, to change
The distance between the sliding panel 308 and the front end baffle 307；
Two positioning baffles 302,303 are symmetrically arranged on the sliding panel 308, are had on two positioning baffles 302,303
There is scale；
The groove positioning device 304 is installed between two positioning baffles 302,303, the groove positioning device 304
Center and the front end baffle 307 gap point-blank, the groove positioning device 304 can be along the linear slide.
Specifically, the length of the positioning baffle 302,303 is preferably 50mm-200mm, the positioning baffle 302 and institute
It is preferably 60 ° -150 ° to state the angle α between positioning baffle 303.Certainly in practical applications, the positioning baffle 302,303
Length can be adjusted according to actual conditions, and the angle α between the positioning baffle 302 and the positioning baffle 303 can also be done
Appropriate adjustment.
Specifically, the pedestal 301 is an axially symmetric structure, the e.g. sector of unfilled corner.The area of the pedestal 301 is big
It is located on the symmetry axis of the pedestal 301 in the center of the area for the chip 401 being placed on it, the front end baffle 307.When
So in practical applications, the pedestal 301 or non-axis symmetry figure, 301 area of the pedestal are also smaller than or are equal to
The chip 401 being placed on it, it is only necessary to which the length of the pedestal 301 in the X-axis is more than the chip 401 being placed on it i.e.
Can, the position of the front end baffle 307 can be also adjusted.
Specifically, the groove positioning device 304 is the protrusion coincideing with V-type groove with 401 contact jaw of chip.Certainly exist
In illustrative application, the groove on chip 401 may be U-shaped or other shapes, correspondingly, the groove positioning device 304
Protrusion also changes therewith, and the protrusion of the groove positioning device 304 can coincide with it.
Specifically, as shown in figure 5, the front end baffle 307 includes front end baffle first part 305 and front end baffle second
It is excellent that part 306, the front end baffle first part 305 and front end baffle second part 306 are away from each other the distance between one end d1
Select ranging from 50mm-100mm, the gap width between the front end baffle first part 305 and front end baffle second part 306
D2 preferred scopes are 20mm-50mm, and the gap is located at 307 center of the front end baffle, the height h of the front end baffle 307
Preferred scope is 3-6mm.Certainly in practical applications, the size of the front end baffle can be adjusted according to actual conditions, institute
The gap width d2 stated between front end baffle first part 305 and front end baffle second part 306 also can be in front end baffle 307
Center is moved left and right, and the front end baffle 307 can not also be divided into two parts, for example, being integral structure and wherein
Between have a groove.
It is and described fixed specifically, as shown in fig. 6, when the different chip 401 of size is positioned at the chip apparatus for placing
Position baffle 302,303 has the point of contact of different location.Positioning is carried out with the various sizes of chip of standard and by tangency location mark
High scale, you can be detected for different wafer sizes during localization examination later, without carrying out board adjustment
Or calibration, it is greatly improved compared with conventional wafer apparatus for placing efficiency and accuracy.
In preferred embodiment, the bottom plate 301 of the chip apparatus for placing and 401 contact surface of chip, the front end baffle 307 with
Contact wafers face and two positioning baffles 302,303 are all covered with teflon material layer with 401 contact surface of chip.Specifically, such as
Shown in Fig. 7, bottom plate 301 and 401 contact surface of chip of the chip apparatus for placing are covered with teflon material layer 311, before described
End-stopping plate 307 is covered with teflon material layer 310, two positioning baffles 302,303 (in conjunction with shown in Fig. 4) and crystalline substance with contact wafers face
401 contact surface of piece is covered with teflon material layer 309, and the thickness of the teflon material layer 309,310,311 is preferably 2mm-
5mm.Certainly in practical applications, the bottom plate 301 also can not whole face cover the teflon material layer 309,310,311, only
Covered with 401 contact portion of the chip, the thickness of the teflon material layer 309,310,311 also can according to technique and
Actual state is adjusted.
In conjunction with shown in Fig. 4 to Fig. 8, the application method of the chip apparatus for placing is as follows：
The sliding panel 308 of S1, the sliding chip apparatus for placing make the pedestal 301 of the chip apparatus for placing expose most
Large area；
S2, chip 401 to be measured is positioned on the pedestal 301 of the chip apparatus for placing；
The sliding panel 308 of S3, the sliding chip apparatus for placing make chip 401 to be measured and the chip apparatus for placing
Two positioning plates 302,303 and front end baffle 307 be tangent, and observing the chip 401 is cut with two positioning plate 302,303
Whether corresponding graduation position is consistent for point, if unanimously, chip 401 is of the required size, into next step；If inconsistent,
Then 401 size of chip is undesirable；
S4, the rotation chip 401 to be measured, adjust its crystal orientation to prescribed direction；
The groove positioning device 304 of S5, the sliding chip apparatus for placing, keep it tight with 401 edge of chip to be measured
Patch, if the edge groove of itself and the chip 401 to be measured is just coincide, you can illustrate that crystal orientation positioning is correct.
In conclusion using chip apparatus for placing provided by the invention, due to the positioning plate and various sizes of chip
It can be tangent, it is only necessary to different wafer size table high scales are corresponded on positioning plate, you can positioning inspection is carried out to different wafer sizes
It surveys, without being adjusted and calibrating as conventional wafer apparatus for placing, to improve detection efficiency and accuracy；Due to
The region of wafer locating device and contact wafers provided by the invention is all covered with teflon material layer, thus greatly reduces gold
Belong to the risk of pollution.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (16)
1. a kind of chip apparatus for placing, which is characterized in that including：Pedestal, two positioning baffles, grooves for placing chip are fixed
Position device, front end baffle and sliding panel；
The front end baffle is installed on one end of the pedestal, and the front end baffle has a gap；
The sliding panel is installed on the other end of the pedestal, and can slide on the base, with change the sliding panel with
The distance between described front end baffle；
Two positioning baffles are symmetrically arranged on the sliding panel, have scale on two positioning baffles；
The groove positioning device is installed between two positioning baffles, the center of the groove positioning device and the preceding terminal block
Point-blank, the groove positioning device can be along the linear slide in the gap of plate.
2. chip apparatus for placing as described in claim 1, which is characterized in that the area of the pedestal is at least more than being placed on it
Chip area.
3. chip apparatus for placing as described in claim 1, which is characterized in that the pedestal is axially symmetric structure.
4. chip apparatus for placing as claimed in claim 3, which is characterized in that the center of the front end baffle is located at the pedestal
On symmetry axis.
5. chip apparatus for placing as described in claim 1, which is characterized in that the front end baffle includes two parts.
6. chip apparatus for placing as described in claim 1, which is characterized in that the width in the gap of the front end baffle is 20mm-
50mm。
7. the chip apparatus for placing as described in any one of claim 1 to 6, which is characterized in that the groove positioning device and crystalline substance
One end of piece contact is the protrusion coincideing with the V-type groove of chip.
8. the chip apparatus for placing as described in any one of claim 1 to 6, which is characterized in that the groove positioning device and crystalline substance
One end of piece contact is the protrusion coincideing with the U-shaped groove of chip.
9. the chip apparatus for placing as described in any one of claim 1 to 6, which is characterized in that the length of the positioning baffle is
50mm-200mm。
10. the chip apparatus for placing as described in any one of claim 1 to 6, which is characterized in that the folder between two positioning baffles
Angle is 60 ° -150 °.
11. chip apparatus for placing as described in claim 1, which is characterized in that the position of the scale on the positioning baffle is not
Chip with size and the tangent position of the positioning baffle.
12. chip apparatus for placing as described in claim 1, which is characterized in that covered in the one side of the pedestal and contact wafers
There is teflon material layer.
13. chip apparatus for placing as described in claim 1, which is characterized in that in the one side of the positioning baffle and contact wafers
It is covered with teflon material layer.
14. chip apparatus for placing as described in claim 1, which is characterized in that in the front end baffle and the one side of contact wafers
It is covered with teflon material layer.
15. the chip apparatus for placing as described in any one of claim 12 to 14, which is characterized in that the teflon material layer
Thickness is 2mm-5mm.
16. a kind of chip oriented instrument, which is characterized in that include the chip placement dress as described in any one of claim 1 to 15
It sets.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710051656.XA CN108333298B (en) | 2017-01-19 | 2017-01-19 | Wafer placing device and wafer orientation instrument |
| TW106123085A TWI630676B (en) | 2017-01-19 | 2017-07-10 | Chip mounting equipment and chip position finder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710051656.XA CN108333298B (en) | 2017-01-19 | 2017-01-19 | Wafer placing device and wafer orientation instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108333298A true CN108333298A (en) | 2018-07-27 |
| CN108333298B CN108333298B (en) | 2021-03-09 |
Family
ID=62922397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710051656.XA Active CN108333298B (en) | 2017-01-19 | 2017-01-19 | Wafer placing device and wafer orientation instrument |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108333298B (en) |
| TW (1) | TWI630676B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178931A (en) * | 2021-12-27 | 2022-03-15 | 江西兆驰半导体有限公司 | Chamfering positioning device and method for V-shaped NOTCH groove of sapphire wafer |
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| CN1336008A (en) * | 1998-12-02 | 2002-02-13 | 纽波特公司 | Specimen holding robotic arm end effector |
| JP3578194B2 (en) * | 1997-03-18 | 2004-10-20 | 株式会社東京精密 | Wafer positioning method and apparatus |
| CN1947223A (en) * | 2004-04-23 | 2007-04-11 | 艾克塞利斯技术公司 | Simplified wafer alignment |
| CN102189542A (en) * | 2010-03-19 | 2011-09-21 | 东京毅力科创株式会社 | Manipulator for conveying semiconductor wafers |
| CN202229978U (en) * | 2011-09-09 | 2012-05-23 | 武汉钢铁(集团)公司 | Sample centering device for tensile experiment |
| CN103811392A (en) * | 2014-03-10 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Mounting method for wafer Y-piece |
| TWI561539B (en) * | 2010-12-09 | 2016-12-11 | Kyoritsu Chemical & Co Ltd |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030064902A1 (en) * | 2001-10-03 | 2003-04-03 | Memc Electronic Materials Inc. | Apparatus and process for producing polished semiconductor wafers |
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2017
- 2017-01-19 CN CN201710051656.XA patent/CN108333298B/en active Active
- 2017-07-10 TW TW106123085A patent/TWI630676B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3578194B2 (en) * | 1997-03-18 | 2004-10-20 | 株式会社東京精密 | Wafer positioning method and apparatus |
| CN1336008A (en) * | 1998-12-02 | 2002-02-13 | 纽波特公司 | Specimen holding robotic arm end effector |
| CN1947223A (en) * | 2004-04-23 | 2007-04-11 | 艾克塞利斯技术公司 | Simplified wafer alignment |
| CN102189542A (en) * | 2010-03-19 | 2011-09-21 | 东京毅力科创株式会社 | Manipulator for conveying semiconductor wafers |
| TWI561539B (en) * | 2010-12-09 | 2016-12-11 | Kyoritsu Chemical & Co Ltd | |
| CN202229978U (en) * | 2011-09-09 | 2012-05-23 | 武汉钢铁(集团)公司 | Sample centering device for tensile experiment |
| CN103811392A (en) * | 2014-03-10 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Mounting method for wafer Y-piece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178931A (en) * | 2021-12-27 | 2022-03-15 | 江西兆驰半导体有限公司 | Chamfering positioning device and method for V-shaped NOTCH groove of sapphire wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108333298B (en) | 2021-03-09 |
| TWI630676B (en) | 2018-07-21 |
| TW201828385A (en) | 2018-08-01 |
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