CN108315727A - The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits - Google Patents
The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits Download PDFInfo
- Publication number
- CN108315727A CN108315727A CN201810310643.4A CN201810310643A CN108315727A CN 108315727 A CN108315727 A CN 108315727A CN 201810310643 A CN201810310643 A CN 201810310643A CN 108315727 A CN108315727 A CN 108315727A
- Authority
- CN
- China
- Prior art keywords
- plating
- nano
- chemical
- solutions
- deposits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 92
- 239000000126 substance Substances 0.000 title claims abstract description 24
- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- 230000036571 hydration Effects 0.000 claims abstract description 18
- 238000006703 hydration reaction Methods 0.000 claims abstract description 18
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 7
- YASYEJJMZJALEJ-UHFFFAOYSA-N Citric acid monohydrate Chemical compound O.OC(=O)CC(O)(C(O)=O)CC(O)=O YASYEJJMZJALEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229960002303 citric acid monohydrate Drugs 0.000 claims abstract description 6
- 239000008139 complexing agent Substances 0.000 claims abstract description 5
- 239000006174 pH buffer Substances 0.000 claims abstract description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 14
- 229910021529 ammonia Inorganic materials 0.000 claims description 7
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical group N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 7
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 7
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000005554 pickling Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000002203 pretreatment Methods 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005238 degreasing Methods 0.000 abstract description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002105 nanoparticle Substances 0.000 abstract description 3
- 230000000844 anti-bacterial effect Effects 0.000 abstract description 2
- 230000000845 anti-microbial effect Effects 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 abstract 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 abstract 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 41
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 229910000806 Latten Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 239000012669 liquid formulation Substances 0.000 description 4
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 238000007605 air drying Methods 0.000 description 2
- 230000003115 biocidal effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 244000144992 flock Species 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000928 Yellow copper Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Abstract
The invention discloses a kind of the chemical plating bath formula and its plating technology of Ni P Ag nano-deposits, which includes two kinds of plating solutions of A and B, is used after mixing, A plating solutions each component and its content are as follows:20 ~ 25g/L of nickel sulfate hexahydrate, a 25 ~ 30g/L of hydration sodium phosphite, 50 ~ 100g/L of two citric acid monohydrate trisodiums, pH buffer 30 ~ 50g/L, B plating solution each component and its content are as follows：1 ~ 2g/L of silver nitrate, 50 ~ 80mL/L of complexing agent.Plating technology includes:Alkaline degreasing, acid pickling and rust removing, surface active pre-treatment；A plating solutions and B plating solutions are respectively configured, mix；Mix the processes such as the plating of plating solution.The Ni P Ag nano-deposits prepared using inventive formulation and technique, any surface finish, smooth, secured, nano-particle diameter are within the scope of 200 300nm, with preferable corrosion resistance and antimicrobial properties, need to be with a wide range of applications in antibacterial, the energy of antibiont dirt coating, chemical industry, power equipment and device various.
Description
Technical field
The present invention relates to the electroless plating technology fields of nanometer silver alloy layers, are plated more particularly to a kind of Ni-P-Ag nanometers
The chemical plating bath formula and its plating technology of layer.
Background technology
The method of chemical plating is constantly developed in decades after eighties of last century inferior lobe is suggested, wherein Ni-P platings
Layer is due to higher wearability and corrosion resistance, being widely used in chemical industry, vehicle and textile industry.But
Be Ni-P performance characteristics it is more single, cannot meet the needs of some special occasions.The purpose of the present invention is obtain to have to resist
Bacterium and antibiont dirt coating, application field are the energy, chemical industry, the fluid machinery of power industry, heat transmission equipment and device.The present invention
It is antibiont dirt ingredient to have selected the Ag with spectrum antibacterial effect, but Ag+Solubility it is very poor, it is difficult to deposit in the plating solution
Ag is replaced using silver ammino ion in, the present invention+, on the basis of Ni-P chemical platings, use new electroplate liquid formulation and improvement
Plating technology, obtains Ni-P-Ag nano-deposits.
Invention content
The present invention solves the technical problem of the electroplate liquid formulation of Ni-P-Ag nano-deposits and plating technologies, especially
The addition of Ag elements in the plating solution.The plating solution of the present invention includes A plating solutions and B plating solutions, and component and its content difference are as follows:
A plating solutions：
20 ~ 25 g/L of six hydration nickel sulfate,
One hydration ortho phosphorous acid receives 25 ~ 30 g/L,
50 ~ 100 g/L of two citric acid monohydrate trisodiums,
30 ~ 50 g/L of ammonium sulfate,
PH values 9 ~ 11,
B plating solutions：
1 ~ 2 g/L of silver nitrate,
One hydration 50 ~ 80 mL/L of ammonia,
PH values 9 ~ 11.
Using latten(-tin) as basis material, the formula and its component content of specific plating solution are as follows:
A plating solutions：
23 g/L of six hydration nickel sulfate,
One hydration ortho phosphorous acid receives 28 g/L,
100 g/L of two citric acid monohydrate trisodiums,
Appropriate ammonium sulfate,
PH values 10,
B plating solutions：
1 g/L of silver nitrate,
Appropriate complexing agent,
PH values 10.
In one embodiment, the A plating solutions and B plating solutions of the Ni-P-Ag nano-deposit chemical platings are respectively configured,
Mixing plating solution is being formed after evenly mixing, and mixing plating solution, which is placed in 85-90 DEG C of water-bath, to be heated 1-2 hours, and surface to be plated is completed
Chemical plating.
In one embodiment, the A plating solutions of the Ni-P-Ag nano-deposit chemical platings, it is characterized in that the pH
Buffer is ammonium sulfate.
In one embodiment, the B plating solutions of the Ni-P-Ag nano-deposit chemical platings, it is characterized in that the network
Mixture is a hydration ammonia.
The plating technology of the present invention is as follows：
(1) it polishes, polishes substrate material surface, to obtain the higher substrate material surface of finish；
(2) alkaline degreasing, acid pickling and rust removing pre-treatment；
(3) surface active, the H that matrix is 20% in volume fraction2SO4It is impregnated 20 seconds in solution, to remove the oxidation of matrix surface
Film, passivating film etc.；
(4) A plating solutions are stirred evenly according to recipe configuration, the pH value of A plating solutions is adjusted to 9-11 with ammonium sulfate；
(5) 1 ~ 2 g/L of silver nitrate is first added when B plating solutions configure in deionized water, gradually instills a hydration ammonia, B plating solutions later
There is white flock precipitate, continues to instill a hydration ammonia, precipitation disappears, by sodium hydrate regulator solution pH value to 9-11, i.e.,
B plating solutions are made；
(6) A plating solutions and B plating solutions are uniformly mixed, dilute；
It (7) will be by polishing, oil removing, pickling and the plating piece for activating pre-treatment（Basis material）It is put into plating solution, by plating piece and plating
Liquid is placed in 85-90 DEG C of water bath with thermostatic control, plating 1-2 hours, takes out natural air drying after plating piece washing.
The Ni-P-Ag chemical deposits prepared using electroplate liquid formulation of the present invention and plating technology, can obtain particle diameter and exist
The nano particle of 200-300nm, coating is secured, and surface is smooth, smooth, and Ag mass fractions are about 3%-5%, can play sterilization,
The effect of antibiosis fouling.
Specific implementation mode
Embodiments of the present invention are illustrated with reference to embodiment.
Embodiment 1
Using latten(-tin) as basis material, the formula and its component content of specific plating solution are as follows:
A plating solutions：
23 g/L of six hydration nickel sulfate,
One hydration ortho phosphorous acid receives 28 g/L,
100 g/L of two citric acid monohydrate trisodiums,
Appropriate ammonium sulfate,
PH values 10,
B plating solutions：
1 g/L of silver nitrate,
Appropriate complexing agent,
PH values 10.
Below by taking example 1 as an example, the specific implementation method of the present invention is illustrated：
(1) it is polished successively latten(-tin) surface using 400#, 800#, 1600# abrasive paper for metallograph, to ensure the light of brass surfaces
Cleanliness.
(2) alkaline degreasing is using the grease of the saponification removal matrix surface of aqueous slkali, and aqueous slkali is by 20g/L
NaOH、20g/L Na2CO3、35g/L Na3PO4It is formulated with the OP-10 of 4g/L.Aqueous slkali is heated to 85 DEG C, then will be yellow
Copper sheet immerses 15 minutes, is rinsed well later with deionized water.The purpose of acid pickling and rust removing is to remove the corrosion of brass surfaces, with
The bond strength of brass and chemical deposit is improved, method is that brass is immersed the H that volume fraction is 10%2SO410 seconds in solution.
(3) surface active, the H that matrix is 20% in volume fraction2SO4It is impregnated 20 seconds in solution, to remove matrix surface
Oxidation film, passivating film etc..
(4) by 3 g six hydration nickel sulfates, 28 g mono- hydration ortho phosphorous acid receive, 100 g two citric acid monohydrate trisodiums and go from
Sub- water is configured to A plating solutions, stirs evenly, and ammonium sulfate is used in combination to adjust pH value of solution to 10.
(5) first 1 g of silver nitrate is dissolved in deionized water when configuring B plating solutions, gradually instills a hydration ammonia, B later
There is white flock precipitate in plating solution, continues to instill a hydration ammonia, and precipitation disappears, by sodium hydrate regulator solution pH value to 10,
Dilution is configured to B plating solutions.
(6) A plating solutions and B plating solutions are uniformly mixed, and are diluted to the mixing plating solution of 1L.
(7) it will vertically hang in mixing plating solution, will plate by the latten(-tin) of polishing, oil removing, pickling and activation pre-treatment
Liquid is placed in 85 DEG C of water bath with thermostatic control, plating 2 hours, takes out natural air drying after plating piece washing.
The Ni-P-Ag chemical deposits prepared using electroplate liquid formulation of the present invention and plating technology, can obtain particle diameter and exist
The nano particle of 200-300nm, coating is secured, and surface is smooth, smooth, and Ag mass fractions are about 3%-5%, can play sterilization,
The effect of antibiosis fouling.
Claims (4)
1. the chemical plating bath formula and its plating technology of a kind of Ni-P-Ag nano-deposits, which is characterized in that formula is plated comprising A
Liquid and B plating solutions, plating solution each component and its content difference are as follows:
A plating solutions：
20 ~ 25 g/L of six hydration nickel sulfate,
One hydration ortho phosphorous acid receives 25 ~ 30 g/L,
50 ~ 100 g/L of two citric acid monohydrate trisodiums,
30 ~ 50 g/L of pH buffers,
PH values 9 ~ 11；
B plating solutions：
1 ~ 2 g/L of silver nitrate,
50 ~ 80 mL/L of complexing agent,
PH values 9 ~ 11.
2. according to the chemical plating bath formula and its plating technology of the Ni-P-Ag nano-deposits described in claim 1, feature
It is：The A plating solutions and B plating solutions of Ni-P-Ag nano-deposit chemical platings are respectively configured, and are forming mixing plating solution after evenly mixing, are mixing
Conjunction plating solution, which is placed in 85-90 DEG C of water-bath, to be heated 1-2 hours, and the chemical plating on surface to be plated is completed.
3. special according to the chemical plating bath formula and its plating technology of the Ni-P-Ag nano-deposits described in claim 1
Sign is：The A plating solutions of Ni-P-Ag nano-deposit chemical platings, it is characterized in that the pH buffer is ammonium sulfate.
4. the chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits according to claim 1, feature
It is：The B plating solutions of Ni-P-Ag nano-deposit chemical platings, it is characterized in that the complexing agent is a hydration ammonia.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810310643.4A CN108315727A (en) | 2018-04-09 | 2018-04-09 | The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810310643.4A CN108315727A (en) | 2018-04-09 | 2018-04-09 | The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108315727A true CN108315727A (en) | 2018-07-24 |
Family
ID=62896318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810310643.4A Pending CN108315727A (en) | 2018-04-09 | 2018-04-09 | The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108315727A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114163233A (en) * | 2021-12-30 | 2022-03-11 | 湖南省美程陶瓷科技有限公司 | High-dielectric low-loss piezoelectric ceramic relay material and preparation method thereof |
| CN115369389A (en) * | 2022-08-01 | 2022-11-22 | 青岛绿波源新材料科技有限公司 | Metal surface anticorrosion antibacterial nano composite coating in marine environment and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009059917A2 (en) * | 2007-11-07 | 2009-05-14 | Nanogate Ag | Silver-containing nickel layer |
| CN103103510A (en) * | 2013-02-25 | 2013-05-15 | 中国科学院深圳先进技术研究院 | Silver-plated copper nanowire and preparation method thereof |
| CN107326349A (en) * | 2017-07-07 | 2017-11-07 | 荆门市拓达科技有限公司 | High-performance multi-component alloy catalytic liquid and preparation method thereof |
-
2018
- 2018-04-09 CN CN201810310643.4A patent/CN108315727A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009059917A2 (en) * | 2007-11-07 | 2009-05-14 | Nanogate Ag | Silver-containing nickel layer |
| CN103103510A (en) * | 2013-02-25 | 2013-05-15 | 中国科学院深圳先进技术研究院 | Silver-plated copper nanowire and preparation method thereof |
| CN107326349A (en) * | 2017-07-07 | 2017-11-07 | 荆门市拓达科技有限公司 | High-performance multi-component alloy catalytic liquid and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 屈战民: "石墨粉末化学镀镍及化学镀银工艺", vol. 29, no. 29, pages 24 - 27 * |
| 徐景雨等: "镀银铜粉的制备及其导电性研究", 科学技术与工程, vol. 12, no. 4, pages 922 - 925 * |
| 朱洪法主编: "无机化工产品手册", 金盾出版社, pages: 487 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114163233A (en) * | 2021-12-30 | 2022-03-11 | 湖南省美程陶瓷科技有限公司 | High-dielectric low-loss piezoelectric ceramic relay material and preparation method thereof |
| CN115369389A (en) * | 2022-08-01 | 2022-11-22 | 青岛绿波源新材料科技有限公司 | Metal surface anticorrosion antibacterial nano composite coating in marine environment and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101321894B (en) | Wet on wet method and chrome-free acidic solution for the corrosion control treatment of steel surfaces | |
| CN100430520C (en) | Process for copper coating on surface of magnesium and magnesium alloy | |
| CN100500937C (en) | Chemical plating liquid of high-phosphor chemical plating Ni-P alloy for use on 304 stainless steel surface | |
| CN1924091B (en) | Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface | |
| WO2000040773A2 (en) | Heat exchanger with a reduced tendency to produce deposits and method for producing same | |
| CN103726036B (en) | Environment-friendly high-brightness medium-phosphorus chemical nickel-plating additive | |
| CN108315727A (en) | The chemical plating bath formula and its plating technology of Ni-P-Ag nano-deposits | |
| CN103687979A (en) | Aqueous acidic composition for forming chromium-containing conversion coating on ferrous member, and ferrous member having conversion coating formed using said composition | |
| CN104947094B (en) | A kind of chemical nickel-plating liquid and its application in chemical nickel plating and a kind of wiring board | |
| CN101275222B (en) | Nickel-phosphorus-polytetrafluorethylene composite plating solution | |
| CN109355645A (en) | A kind of method of weakly acidic pH chemical plating high W content Ni-W-P alloy layer | |
| CN103966581B (en) | Surface has iron copper product of densification, evenly discrete distribution layers of copper and preparation method thereof | |
| CN100476028C (en) | Low temperature chemcial plating nickel solution | |
| CN101376970B (en) | Surface conditioning solution used before manganese series phosphating, preparation and use | |
| CN103966590A (en) | Monosilane composited chromate-free passivation liquid and method for passivating galvanized steel wire surface coating | |
| CN101537490B (en) | Method for preparing nickel phosphorus alloy coating iron powder | |
| CN100420772C (en) | Chemical plating solution for preparing long-lasting self-lubricating composite coating and chemical plating method thereof | |
| CN100362129C (en) | Technique for compositely coating Ni-B-nanometer TiO2 chemically | |
| CN104962887B (en) | The Preparation equipment and technique of nano chemical composite plating layer of the surface with microcellular structure | |
| CN114592223A (en) | Neodymium iron boron magnet galvanizing and surface lubricating process | |
| CN102560451A (en) | Chemical nano-silver plating solution and preparation method thereof, and silver plating method for copper part | |
| KR101332301B1 (en) | Plating method using the ni-free three element alloys plating and tri-valent chromium plating | |
| CN102392236B (en) | Chemical copper plating solution of surface of zinc alloy and copper plating process of surface of zinc alloy | |
| CN109136894B (en) | Environment-friendly multi-element alloy autocatalytic plating process | |
| CN110201864B (en) | Copper-containing antibacterial self-cleaning coating, preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |