CN108314889A - A kind of high heat conduction high temperature resistant PC composite material and preparation methods - Google Patents
A kind of high heat conduction high temperature resistant PC composite material and preparation methods Download PDFInfo
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- CN108314889A CN108314889A CN201810204550.3A CN201810204550A CN108314889A CN 108314889 A CN108314889 A CN 108314889A CN 201810204550 A CN201810204550 A CN 201810204550A CN 108314889 A CN108314889 A CN 108314889A
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- heat conduction
- high temperature
- temperature resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/24—Crystallisation aids
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses the invention discloses high heat conduction high temperature resistant PC composite material and preparation methods, the composite material is made of the raw material of following mass percentage：PC resin 35 60%, heat filling 10 30%, expanded graphite 2 5%, processing aid 1.4 5.0%, toughener 4 6%, compatilizer 0.2 0.5%, surplus is carbon fiber.Invention is inserted by PC resin in the lamella of expanded graphite, expanded graphite can be dispersed in PC resin, to improve PC resin high temperature resistance, simultaneously, graphene high heat conduction provides the heat conductivility of PC composite materials, and the heat filling grain size added is smaller, PC composite materials can be distributed in, to further increase composite material heat conductivility and high temperature resistance.
Description
Technical field
The present invention relates to high-molecular organic material technical fields, and in particular to a kind of high heat conduction high temperature resistant PC composite materials and
Preparation method.
Background technology
Makrolon (PC) is a kind of polymer containing carbonic ester in strand, it be five big general engineering plastics it
One, yield and consumption figure are only second to nylon engineering plastic, occupy second.Modified PC has the good transparency and excellent comprehensive
Performance is closed, the fields such as auto industry, electronic and electrical industry, mechanical industry are widely used in.
Extremely be widely applied although PC materials and its alloy have, with the development of economy with industrial technology into
Step, people constantly propose the application of PC materials higher and higher heatproof requirement.Such as automobile high reflection headlight outer cover, optically focused lamp housing
Body, welding hole casing, hot steam sterilize safety valve, medical high-temperature sterilization vessel etc., it is desirable that the transparent PC material dimension card softening used
Temperature is up to 180 degree, and common PC materials can only achieve 145 degree, it is difficult to reach its requirement.
Carbon fiber has many advantages, such as that high specific strength, high ratio modulus, high temperature resistant, conductive heat transfer and coefficient of thermal expansion are small.Cause
This, by that can play the role of heat conduction and heat safe simultaneously to addition carbon fiber in PC resin, the addition of carbon fiber is larger,
It can increase substantially into.
Invention content
The main purpose of the present invention is to provide a kind of high heat conduction high temperature resistant PC composite material and preparation methods, to overcome
Deficiency in the prior art.
In order to achieve the above object, the present invention is achieved through the following technical solutions：
A kind of high heat conduction high temperature resistant PC composite materials, the composite material are made of the raw material of following mass percentage：
PC resin 35-60%
Expanded graphite 2-5%
Heat filling 10-30%
Processing aid 1.5-5.0%
Compatilizer 0.2-0.5%
Toughener 4-6%
Surplus is carbon fiber.
Preferably, the coating is made of the raw material of following mass percentage：
PC resin 40-55%
Expanded graphite 2.5-4.5%
Heat filling 15-25%
Processing aid 1.6-4.8%
Compatilizer 0.3-0.4%
Toughener 4.5-5.5%
Surplus is carbon fiber.
Preferably, the relative density of the PC resin is 1.18-1.21, fusing point is 230-270 DEG C, melt index 5-
25g/min。
Preferably, the heat filling is the mixture of nano aluminum nitride, micron order silicon nitride and carbon-based material,
In, the content of nano aluminum nitride is no less than 20% in the mixture, and the weight ratio of the micron order silicon nitride and carbon-based material is not
Less than 2:1.
Preferably, the compatilizer is maleic anhydride graft copolymerization polypropylene.
Preferably, the toughener is toughener POE.
Preferably, the processing aid include lubricant, antioxidant, nucleating agent, ultra-violet absorber, age resister and
Coupling agent.
Preferably, mass content of the lubricant in the coating is 0.1-0.5%；The antioxidant is described
Mass content in coating is 0.2-0.7%；Mass content of the nucleating agent in the coating is 0.5-1.5%；It is described
Mass content of the ultra-violet absorber in the coating is 0.2-0.8%；Quality of the age resister in the coating
Content is 0.1-0.3%；Mass content of the coupling agent in the coating is 0.3-1.2%.
Preferably, the lubricant is polytetrafluoroethylene (PTFE)；The antioxidant is irgasfos 168；The nucleating agent is alkane
Yl carboxylic acid sodium；The ultra-violet absorber is chloro triazole type ultra-violet absorber；The age resister is UV327；The idol
Connection agent is KH550.
The present invention also provides the preparation methods of above-mentioned high heat conduction high temperature resistant PC composite materials, include the following steps：
（1）PC resin, expanded graphite, processing aid, compatilizer, toughener, carbon fiber are weighed by above-mentioned weight proportion；
（2）By step（1）Each raw material weighed, which is put into high-speed mixer, to be mixed, and the above component mixture is obtained；
（3）Said components mixture is continuously added to mixing extrusion in double screw extruder by hopper；
（4）By check rod, cooling, drying, pelletizing to get obtaining high heat conduction high temperature resistant PC composite materials.
Compared with prior art, the present invention having following advantageous effect：
(1) present invention is inserted by PC resin in the lamella of expanded graphite, and expanded graphite can be dispersed in PC resin, to
PC resin high temperature resistance is improved, meanwhile, graphene high heat conduction provides the heat conductivility of PC composite materials.
（2）Heat filling grain size of the present invention is smaller, can be distributed in PC composite materials, to improve composite material heat conductivility
And high temperature resistance.
（3）The preparation process of the high heat conduction high temperature resistant PC composite materials of the present invention is simple, industrialized production easy to implement.
Specific implementation mode
Form by the following examples is described in further detail the above of the present invention again, but should not be by this
The range for being interpreted as the above-mentioned theme of the present invention is only limitted to following embodiment, all based on the technology realized belonging to the above of the present invention
It all belongs to the scope of the present invention.
Embodiment 1
A kind of high heat conduction high temperature resistant PC composite materials of this implementation, including the raw material components of following mass percentage are shown in Table 1：
The raw material of the high heat conduction high temperature resistant PC composite materials of 1 embodiment 1 of table
The specific preparation process of high heat conduction high temperature resistant PC composite materials of the present embodiment is as follows：
（1）PC resin, expanded graphite, processing aid, compatilizer, toughener, carbon fiber are weighed by above-mentioned weight proportion；
（2）By step（1）Each raw material weighed, which is put into high-speed mixer, mixes 5min, obtains the above component mixture；
（3）Said components mixture is continuously added to mixing extrusion in double screw extruder by hopper；
（4）By check rod, cooling, drying, pelletizing to get obtaining high heat conduction high temperature resistant PC composite materials.
Wherein, twin-screw extruder barrel from charge door to head temperature of each section ranging from：One 280 DEG C of area's temperature, 2nd area
285 DEG C of temperature, three 290 DEG C of area's temperature, four 295 DEG C of area's temperature, five area's temperature are 300 DEG C, and six area's temperature are 305 DEG C, head temperature
Degree is 310 DEG C, screw speed 350rpm, and feeding frequency is 18Hz.
Embodiment 2
A kind of high heat conduction high temperature resistant PC composite materials of this implementation, including the raw material components of following mass percentage are shown in Table 2：
The raw material of the high heat conduction high temperature resistant PC composite materials of 2 embodiment 2 of table
The high heat conduction high temperature resistant PC composite materials of the present embodiment are specific, and the preparation method is the same as that of Example 1.
Embodiment 3
A kind of high heat conduction high temperature resistant PC composite materials of this implementation, including the raw material components of following mass percentage are shown in Table 3：
The raw material of the high heat conduction high temperature resistant PC composite materials of 3 embodiment 3 of table
The high heat conduction high temperature resistant PC composite materials of the present embodiment are specific, and the preparation method is the same as that of Example 1.
Embodiment 4
A kind of high heat conduction high temperature resistant PC composite materials of this implementation, including the raw material components of following mass percentage are shown in Table 4：
The raw material of the high heat conduction high temperature resistant PC composite materials of 4 embodiment 4 of table
The high heat conduction high temperature resistant PC composite materials of the present embodiment are specific, and the preparation method is the same as that of Example 1.
Embodiment 5
A kind of high heat conduction high temperature resistant PC composite materials of this implementation, including the raw material components of following mass percentage are shown in Table 5：
The raw material of the high heat conduction high temperature resistant PC composite materials of 5 embodiment 5 of table
The high heat conduction high temperature resistant PC composite materials of the present embodiment are specific, and the preparation method is the same as that of Example 1.
Comparative example 1
In order to be compared with the high heat conduction high temperature resistant PC composite materials of embodiment 1-5, it is provided with the comparative example 1-3. such as following table
The raw material of 3 kinds of high heat conduction high temperature resistant PC composite materials of 6 prior art of table forms.
Using the detection method of this field routine, the performance of embodiment 1-5 and comparative example 1-3 are tested, this hair
Bright thermal conductivity, high temperature resistance, mechanical performance are superior to comparative example.
It is merely a preferred embodiment of the present invention, is not intended to restrict the invention, although with reference to aforementioned implementation described in upper
Invention is explained in detail for example, for those skilled in the art, still can be to foregoing embodiments
Recorded technical solution is modified or equivalent replacement of some of the technical features.All spirit in the present invention
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of high heat conduction high temperature resistant PC composite materials, which is characterized in that the composite material is by following mass percentage
Raw material forms：
PC resin 35-60%
Expanded graphite 2-5%
Heat filling 10-30%
Processing aid 1.5-5.0%
Compatilizer 0.2-0.5%
Toughener 4-6%
Surplus is carbon fiber.
2. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the coating is by following quality
The raw material of percentage composition forms：
PC resin 40-55%
Expanded graphite 2.5-4.5%
Heat filling 15-25%
Processing aid 1.6-4.8%
Compatilizer 0.3-0.4%
Toughener 4.5-5.5%
Surplus is carbon fiber.
3. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the PC resin it is relatively close
Degree is 1.18-1.21, and fusing point is 230-270 DEG C, melt index 5-25g/min.
4. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the heat filling is nanometer
The mixture of aluminium nitride, micron order silicon nitride and carbon-based material, wherein the content of nano aluminum nitride is no less than in the mixture
20%, the weight ratio of the micron order silicon nitride and carbon-based material is not less than 2:1.
5. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the compatilizer is maleic acid
Acid anhydride graft copolymerization polypropylene.
6. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the toughener is toughener
POE。
7. high heat conduction high temperature resistant PC composite materials according to claim 1, which is characterized in that the processing aid includes profit
Lubrication prescription, antioxidant, nucleating agent, ultra-violet absorber, age resister and coupling agent.
8. high heat conduction high temperature resistant PC composite materials according to claim 7, which is characterized in that the lubricant is in the painting
Mass content in material is 0.1-0.5%；Mass content of the antioxidant in the coating is 0.2-0.7%；It is described at
Mass content of the core agent in the coating is 0.5-1.5%；Mass content of the ultra-violet absorber in the coating
For 0.2-0.8%；Mass content of the age resister in the coating is 0.1-0.3%；The coupling agent is in the painting
Mass content in material is 0.3-1.2%.
9. high heat conduction high temperature resistant PC composite materials according to claim 8, which is characterized in that the lubricant is polytetrafluoro
Ethylene；The antioxidant is irgasfos 168；The nucleating agent is sodium carboxylate；The ultra-violet absorber is chloro triazole
Class ultra-violet absorber；The age resister is UV327；The coupling agent is KH550.
10. a kind of preparation method according to claim 1-9 any one of them high heat conduction high temperature resistant PC composite materials, feature
It is, includes the following steps：
（1）PC resin, expanded graphite, processing aid, compatilizer, toughener, carbon fiber are weighed by above-mentioned weight proportion；
（2）By step（1）Each raw material weighed, which is put into high-speed mixer, to be mixed, and the above component mixture is obtained；
（3）Said components mixture is continuously added to mixing extrusion in double screw extruder by hopper；
（4）By check rod, cooling, drying, pelletizing to get high heat conduction high temperature resistant PC composite materials.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810204550.3A CN108314889A (en) | 2018-03-13 | 2018-03-13 | A kind of high heat conduction high temperature resistant PC composite material and preparation methods |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113248790A (en) * | 2021-05-12 | 2021-08-13 | 东北石油大学 | Heat-conducting composite filler, high-heat-conducting composite material and preparation method thereof |
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2018
- 2018-03-13 CN CN201810204550.3A patent/CN108314889A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113248790A (en) * | 2021-05-12 | 2021-08-13 | 东北石油大学 | Heat-conducting composite filler, high-heat-conducting composite material and preparation method thereof |
| CN113248790B (en) * | 2021-05-12 | 2022-08-09 | 东北石油大学 | Heat-conducting composite filler, high-heat-conducting composite material and preparation method thereof |
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Application publication date: 20180724 |