CN108300978B - Device and method for detecting cleaning end time point of vapor deposition machine - Google Patents
Device and method for detecting cleaning end time point of vapor deposition machine Download PDFInfo
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- CN108300978B CN108300978B CN201710020644.0A CN201710020644A CN108300978B CN 108300978 B CN108300978 B CN 108300978B CN 201710020644 A CN201710020644 A CN 201710020644A CN 108300978 B CN108300978 B CN 108300978B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
According to the device for detecting the cleaning end time point of the vapor deposition machine, the vapor deposition machine comprises a machine main body and a control system which are in communication connection. The device for detecting the cleaning end time point of the vapor deposition machine comprises a voltage acquisition device, wherein the voltage acquisition device is respectively in communication connection with the machine main body and the control system, and the voltage acquisition device acquires a voltage signal of the machine main body at regular time and transmits the voltage signal to the control system; the control system processes the voltage signal and displays the variation trend of the voltage. The invention can more accurately detect the actual cleaning finishing time point of the vapor deposition machine, and is convenient for reasonably controlling the optimal cleaning time of the vapor deposition machine. The invention also discloses a method for detecting the cleaning ending time point of the vapor deposition machine.
Description
Technical Field
The invention relates to the field of detection, in particular to a device and a method for detecting the cleaning ending time point of a vapor deposition machine.
Background
After the conventional vapor deposition machine performs the external vapor deposition operation, a large amount of granular or film-like residues usually remain on the deposition chamber and the internal devices of the deposition chamber, and in order to not affect the working efficiency of the next vapor deposition, the residues need to be cleaned. Conventionally, cleaning by purging with high-pressure N2 or cleaning with a substance capable of reacting with the residue, such as fluorine ions, has been generally performed. However, too short a cleaning time may result in the deposition chamber not being cleaned; and if the cleaning time is too long, other devices in the deposition cavity are easily damaged, so that the service life of the devices is influenced or the vapor deposition effect of the machine is directly influenced.
The cleaning end time point (clean end point) is a time at which the machine itself determines that cleaning is finished, and the cleaning end time point changes according to different actual cleaning conditions such as a cleaning method and a cleaning medium. The operator usually extends the cleaning time properly based on the cleaning end time point according to the actual situation to achieve the best actual cleaning effect. However, the conventional vapor deposition machine cannot directly and accurately determine the actual cleaning end time point of the machine, and each time the cleaning condition of the machine changes, the cleaning effect of different time periods can only be summarized to estimate the cleaning end time point, so that the finally obtained cleaning time depends too much on the experience of an operator and is not accurate enough.
Therefore, improvement on the existing equipment is urgently needed to determine the cleaning ending time point of the vapor deposition machine more intuitively and accurately.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a device for detecting the cleaning ending time point of a vapor deposition machine based on the voltage change rule in the cleaning process of the vapor deposition machine, and the device can be used for conveniently and accurately detecting the cleaning ending time point of the vapor deposition machine. The invention further provides a method for detecting the cleaning end time point of the vapor deposition machine.
According to the device for detecting the cleaning ending time point of the vapor deposition machine, the vapor deposition machine comprises a machine main body and a control system which are in communication connection, and the device for detecting the cleaning ending time point of the vapor deposition machine comprises a voltage acquisition device, wherein the voltage acquisition device is in communication connection with the machine main body and the control system respectively, acquires a voltage signal of the machine main body at regular time and transmits the voltage signal to the control system; the control system processes the voltage signal and displays the variation trend of the voltage.
Further, the voltage signal is collected every 2s by the voltage collecting device.
According to the invention, a method for detecting the cleaning end time point of a vapor deposition machine comprises a machine main body and a control system, and the method comprises the following steps:
step 1: a voltage acquisition device is used for periodically acquiring a voltage signal of a machine main body in the cleaning process of the vapor deposition machine;
step 2: the voltage acquisition device transmits the acquired voltage signal to the control system;
and step 3: and the control system processes the voltage signal, and determines and displays a cleaning ending time point.
Further, step 1 comprises the voltage acquisition device acquiring the voltage signal every 2 s.
Further, step 3 comprises:
step 3 a: the control system converts the voltage signal into a digital signal;
and step 3 b: the control system draws and displays a voltage change curve according to the digital signal;
and step 3 c: the operator determines the voltage jump point according to the voltage change curve and determines the voltage jump point as the cleaning end time point.
Compared with the prior art, the invention (1) only needs to add a voltage acquisition device on the traditional machine table without large-scale transformation, and has simple operation and low cost; (2) the voltage signal of the machine table in the cleaning process is directly acquired through the voltage acquisition device, and the actual cleaning ending time point is determined through the voltage shock point, so that more reasonable cleaning time can be set according to the cleaning ending time point.
Drawings
FIG. 1 is a schematic diagram of an apparatus for detecting a cleaning end time of a vapor deposition tool according to the present invention;
FIG. 2 is a graph illustrating the trend of the main body voltage of the apparatus with the cleaning time according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a method for detecting a cleaning end time of a vapor deposition tool according to the present invention.
Description of reference numerals:
100 machine main body, 200 control system, 300 voltage acquisition device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
FIG. 1 is a schematic diagram of an apparatus for detecting a cleaning end time of a vapor deposition tool according to the present invention. The device for detecting the cleaning end time point of the vapor deposition machine is applied to the vapor deposition machine comprising a machine main body 100 and a control system 200, wherein the machine main body 100 and the control system 200 are in communication connection with each other, so that the control system 200 can conveniently send command information to the machine main body 100 and receive and display working condition information fed back by the machine main body 100. As shown in fig. 1, the apparatus for detecting a cleaning end time point of a vapor deposition tool includes a voltage acquisition device 300 communicatively connected to the tool body 100 and the control system 200, respectively. The voltage collecting device 300 collects the voltage signal of the machine main body 100 at regular time and transmits the voltage signal to the control system 200. The control system 200 processes the received voltage signal and displays a voltage variation trend of the machine host 100. Since the voltage of the machine main body 100 suddenly changes at the cleaning end time point, i.e., the time when the machine itself determines that the cleaning is ended, the operator can observe the time when the voltage suddenly changes through the voltage change trend displayed by the control system 200, and the time is the cleaning end time point. The operator can properly prolong the cleaning time on the basis according to the actual condition so as to realize the optimal actual cleaning effect.
In the embodiment shown in fig. 2, the voltage acquisition device 300 acquires the voltage signal every 2 s. The voltage of the machine main body 100 suddenly changes when the cleaning process proceeds to 105s, that is, the cleaning end time point is reached. The operator ended the cleaning when the cleaning process proceeded to 135s, that is, 30s after the cleaning end time point was reached.
As shown in fig. 3, the method for detecting the cleaning end time point of the vapor deposition machine by using the above apparatus includes the following steps:
step 1: the voltage signal of the tool main body 100 is periodically collected by using the voltage collecting device 300 in the cleaning process of the vapor deposition tool, for example, the voltage signal is collected every 2 s;
step 2: the voltage acquisition device 300 transmits the acquired voltage signal to the control system 200;
and step 3: the control system 200 processes the voltage signal, and determines and displays a cleaning end time point.
In an embodiment of the present invention, the processing of the voltage signal by the control system 200 may specifically include: step 3 a: the control system converts the voltage signal into a digital signal; and step 3 b: the control system draws and displays a voltage change curve according to the digital signal; and step 3 c: the operator determines the voltage jump point according to the voltage change curve and determines the voltage jump point as the cleaning end time point.
The device and the method can more accurately detect the actual cleaning finishing time point of the vapor deposition machine, and are convenient for reasonably controlling the optimal cleaning time of the vapor deposition machine so as to realize the technical effects of ensuring good vapor deposition effect and prolonging the service life of the machine.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A method for detecting a cleaning end time point of a vapor deposition machine, the vapor deposition machine comprising a machine main body and a control system, wherein a voltage signal of the machine main body suddenly changes at the cleaning end time point, the method comprising the steps of:
step 1: a voltage acquisition device is used for periodically acquiring a voltage signal of the machine main body in the cleaning process of the vapor deposition machine;
step 2: the voltage acquisition device transmits the acquired voltage signal to the control system;
and step 3: the control system processes the voltage signal, determines the time point of the sudden change of the voltage signal according to the change trend of the voltage to determine and display the cleaning ending time point,
and prolonging certain cleaning time on the basis of the cleaning ending time point, and then ending the cleaning.
2. The method as claimed in claim 1, wherein the voltage signal is collected by the voltage collecting device every 2s in step 1.
3. The method according to claim 1, wherein the step 3 comprises:
step 3 a: the control system converts the voltage signal into a digital signal;
and step 3 b: the control system draws and displays a change curve of the voltage according to the digital signal;
and step 3 c: and determining a voltage sudden change point by an operator according to the voltage change curve, and determining the voltage sudden change point as the cleaning ending time point.
4. An apparatus for detecting a cleaning end time point of a vapor deposition tool using the method of any one of claims 1 to 3, the vapor deposition tool comprising a tool body and a control system, the tool body being communicatively connected, the voltage signal of the tool body abruptly changes at the cleaning end time point, wherein the apparatus for detecting the cleaning end time point of the vapor deposition tool comprises a voltage acquisition device, wherein,
the voltage acquisition device is in communication connection with the machine main body and the control system respectively, acquires voltage signals of the machine main body at regular time and transmits the voltage signals to the control system;
and the control system processes the voltage signal, displays the variation trend of the voltage, and determines the time point of the sudden change of the voltage signal according to the variation trend of the voltage so as to determine and display the cleaning ending time point.
5. The apparatus of claim 4, wherein the voltage acquisition device acquires the voltage signal every 2 seconds.
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| CN201710020644.0A CN108300978B (en) | 2017-01-12 | 2017-01-12 | Device and method for detecting cleaning end time point of vapor deposition machine |
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| CN201710020644.0A CN108300978B (en) | 2017-01-12 | 2017-01-12 | Device and method for detecting cleaning end time point of vapor deposition machine |
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| CN108300978B true CN108300978B (en) | 2020-10-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104213089A (en) * | 2014-08-22 | 2014-12-17 | 京东方科技集团股份有限公司 | Magnetron sputtering equipment and magnetron sputtering method |
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| JP2005033173A (en) * | 2003-06-16 | 2005-02-03 | Renesas Technology Corp | Method for manufacturing semiconductor integrated circuit device |
| GB201609119D0 (en) * | 2016-05-24 | 2016-07-06 | Spts Technologies Ltd | A method of cleaning a plasma processing module |
| CN107119265B (en) * | 2017-04-27 | 2019-05-21 | 武汉华星光电技术有限公司 | Chemical vapor deposition process chamber room and its clean endpoint monitoring method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104213089A (en) * | 2014-08-22 | 2014-12-17 | 京东方科技集团股份有限公司 | Magnetron sputtering equipment and magnetron sputtering method |
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Address after: No. 333, Xinghua Street, Suzhou Industrial Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone, Suzhou, Jiangsu 215123 Patentee after: Warship chip manufacturing (Suzhou) Limited by Share Ltd. Address before: 215123 No. 333 Xinghua street, Suzhou Industrial Park, Jiangsu, Suzhou, Jiangsu Patentee before: HE JIAN TECHNOLOGY (SUZHOU) Co.,Ltd. |