CN108299645B - Preparation and use of directly thermally curable organosiloxanes - Google Patents

Preparation and use of directly thermally curable organosiloxanes Download PDF

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CN108299645B
CN108299645B CN201810114109.6A CN201810114109A CN108299645B CN 108299645 B CN108299645 B CN 108299645B CN 201810114109 A CN201810114109 A CN 201810114109A CN 108299645 B CN108299645 B CN 108299645B
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organosiloxane
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CN108299645A (en
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房强
王佳佳
金凯凯
孙晶
周俊峰
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Shanghai Institute of Organic Chemistry of CAS
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
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    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C07F7/0825—Preparations of compounds not comprising Si-Si or Si-cyano linkages
    • C07F7/083—Syntheses without formation of a Si-C bond
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    • C07—ORGANIC CHEMISTRY
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    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
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Abstract

The invention provides preparation and application of a type of organic siloxane capable of being directly thermally cured, in particular to organic siloxane containing a thermal curing group, wherein the organic siloxane connects an aryl substituent containing a thermosetting group with siloxane monomers or polysiloxane through a-Si-O-Si-bond to obtain a series of novel functionalized siloxane or polysiloxane matrix resins. The organic siloxane can be crosslinked and polymerized by heating, has simple and efficient preparation method, is suitable for serving as an insulating coating layer and a packaging material of electronic components in the electronic and electrical industry, and can also serve as a crosslinking agent of silicon rubber or silicon resin.

Description

Preparation and use of directly thermally curable organosiloxanes
Technical Field
The invention belongs to the field of manufacturing of high-performance polymer monomers, and particularly relates to novel organic siloxane containing thermosetting groups and a preparation method thereof.
Background
Organosiloxane polymers are widely used in the fields of electronics, electrical and electronic packaging, etc. due to their high and low temperature resistance, easy processability, insulating properties, optical properties, etc. In general, organosiloxane polymers are prepared as follows: firstly, organic siloxane monomers are hydrolyzed and condensed under acidic or alkaline conditions; secondly, carrying out a Pt-catalyzed hydrosilylation reaction; and thirdly, the initiator is obtained by chain reaction initiated by other initiators. Such as: sylgard 184 by dow corning is a silicone rubber obtained by a hydrosilylation reaction; also, typical polydimethyl linear siloxanes are obtained by hydrolytic condensation. These preparation methods require the addition of an initiator or a catalyst, and the catalyst remains to some extent to adversely affect the properties of the finally obtained polymer material.
In recent years, in order to avoid this drawback, researchers have developed some organosiloxanes that can be cured directly thermally, by introducing thermosetting groups into the organosiloxanes, to obtain a series of organosiloxane monomers or polymers containing thermosetting groups. Subsequently, polymerization is initiated under heating conditions to give an organosiloxane polymeric material. Typical thermosetting groups are: benzocyclobutene, trifluorovinyl aryl ether, alkynyl, alkenyl, maleimide, and the like. For example: benzocyclobutene functionalized siloxane monomers (glass fiber reinforced plastics/composites, 2005, 4 th, 16-19.) developed by the dow company are shown below:
Figure BDA0001570158080000011
however, the monomer is obtained through a Heck reaction between halogenated benzocyclobutene and a vinyl double-end socket catalyzed by palladium, on one hand, the palladium catalyst is expensive, a metal ligand, alkali and the like are required to be used in the reaction process, and the requirement on a reaction system is high; on the other hand, the yield of the reaction is not high generally, and the separation and purification of the product are difficult. Thus, the cost of the final silicone resin is increased, and the application thereof is greatly limited.
Yankeen et al reported monomers of the formula (J.Polym.Sci.Polym.Chem.2009,47, 6246-6258):
Figure BDA0001570158080000021
these monomers are actually improvements over the dow monomers by incorporating phenylsilanes to increase the heat resistance of the polymer. However, the preparation of the above monomers is likewise less easy than purification.
The polymer (Chinese patent application No. 201110367893.X) with siloxane as the main chain and thermosetting benzocyclobutene as the side chain is obtained by hydrosilylation in the Yang university and the like, and compared with the preparation of the two siloxane monomers, the preparation method is simpler, and the structure is shown as follows:
Figure BDA0001570158080000022
strength, etc. several of the siloxane monomers or polymers described above were improved to obtain an organosiloxane polymer having a thermosetting benzocyclobutene group in the side chain as shown below (poly. chem.2015,6, 5984):
Figure BDA0001570158080000023
by linking the benzocyclobutene groups directly to the silicon atoms of the organosiloxane backbone, the thermal stability of the polymer can be greatly improved.
In addition to benzocyclobutene groups, trifluorovinyl aryl ethers are another class of thermosetting groups that are more widely used. Building strength et al attached trifluorovinyl aryl ethers to the side chains of organosiloxanes to give fluoro-organic linear and cyclic siloxanes (Macromolecules,2014,47,6311. Polym. chem.2016,7,3378.) as shown below:
Figure BDA0001570158080000031
the introduction of fluorine atoms can improve the hydrophobicity and the insulating property of the material to a certain extent, and provides help for the application of organic siloxane polymer materials in the microelectronic industry.
However, the preparation of these siloxane monomers or polymers described above is still insufficient: the reaction process is not efficient enough and the methylene groups generated by hydrosilylation can be detrimental to the improvement of thermal properties.
In view of the above, there is an urgent need in the art to develop a direct thermal curable organosiloxane and corresponding silicone resin or silicone rubber, etc., which have efficient and simple preparation process and mild reaction conditions.
Disclosure of Invention
The invention aims to provide a class of directly thermocurable organic siloxane and corresponding silicon resin or silicon rubber and the like, which have high efficiency and simple preparation process and mild synthesis conditions.
In a first aspect of the present invention, there is provided a class of directly thermally curable organosiloxanes, which link an organosilicon backbone to an aryl substituent containing a thermosetting group via a-Si-O-Si-bond, the siloxanes having the structure of formula I;
Figure BDA0001570158080000032
wherein n is an integer of 1 to 1000 (preferably an integer of 1 to 20, more preferably an integer of 1 to 10);
wherein each R isaEach independently selected from the following substituents: substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkoxy, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl, substituted or unsubstituted phenyl, or
Figure BDA0001570158080000033
Each R isbEach independently selected from the following substituents: none, substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkoxy, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl, substituted or unsubstituted phenyl, substituted or unsubstituted C1-C6 silyl, substituted or unsubstituted C1-C6 siloxy, alkoxy, substituted or unsubstituted C1-C6 alkoxy, substituted or unsubstituted C1-C6 silyl,
Figure BDA0001570158080000041
The substitution means that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, alkyl of C1-C6, alkenyl of C2-C6, alkynyl of C2-C6 and unsubstituted phenyl;
said RbWhen the organic siloxane is absent, the organic siloxane is a cyclic structure;
each R is independently selected from the group consisting of:
(1)H；
(2) substituted or unsubstituted C1-C12 alkyl, substituted or unsubstituted C2-C12 alkenyl, wherein said substitution means that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, C1-C12 alkyl, C2-C12 alkenyl, C2-C12 alkynyl, unsubstituted benzene ring or phenyl with 1-3 hydrogen atoms on the benzene ring substituted by substituents selected from the group consisting of: C1-C12 alkyl, C2-C12 alkenyl and C2-C12 alkynyl;
(3) substituted or unsubstituted phenyl, said substitution meaning that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, alkyl of C1-C12, alkenyl of C2-C12, alkynyl of C2-C12 and unsubstituted phenyl;
(4) a thermosetting aryl group;
the thermosetting aryl group includes: benzocyclobutene radical
Figure BDA0001570158080000042
Trifluorovinyl ether substituted aryl groups
Figure BDA0001570158080000043
Vinyl-substituted phenyl
Figure BDA0001570158080000044
Ethynyl substituted phenyl
Figure BDA0001570158080000045
And at least one R is a thermosetting aryl group.
In another preferred embodiment, the polysiloxane is a cyclic siloxane or a linear polysiloxane.
In another preferred embodiment, the polysiloxane is selected from the following group (b1) or (b 2):
(b1)
Figure BDA0001570158080000046
wherein n is 3-8; r3A substituent selected from: substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl, substituted or unsubstituted CUnsubstituted phenyl, said substitution meaning that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, alkyl of C1-C6, alkenyl of C2-C6, alkynyl of C2-C6 and unsubstituted phenyl; or
(b2)
Figure BDA0001570158080000051
Wherein n is 2-1000; each R4Independently selected from: h, SiMe3(ii) a Each R5Independently selected from the following substituents: h, substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl, and substituted or unsubstituted phenyl, wherein the substituted means that one or more hydrogen atoms on the group are substituted by a substituent selected from the group consisting of: halogen, alkyl of C1-C6, alkenyl of C2-C6, alkynyl of C2-C6 and unsubstituted phenyl;
in another preferred embodiment, the organosiloxane comprises organosiloxane monomers and/or organosiloxane polymers.
In another preferred embodiment, the siloxane polymer backbone comprises a linear backbone and/or a branched backbone, preferably a linear backbone.
In another preferred embodiment, the refractive index of the organic siloxane is 1.5-1.6.
In another preferred embodiment, the organosiloxane has the following structure of formula II:
Figure BDA0001570158080000052
wherein
Figure BDA0001570158080000053
In another preferred embodiment, each R is independently a group selected from the group consisting of: C1-C4 alkyl, C2-C4 alkenyl, or substituted or unsubstituted phenyl.
In another preferred embodiment, each of said R is independently a group selected from the group consisting of: methyl, vinyl, phenyl, or a thermosetting group.
In another preferred embodiment, each group is a specific group described in each compound of examples.
In another preferred embodiment, each R is independently selected from the group consisting of:
(1)H；
(2) substituted or unsubstituted C1-C4 alkyl, substituted or unsubstituted C2-C4 alkenyl, wherein said substitution means that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, C1-C4 alkyl, C2-C6 alkenyl, C2-C6 alkynyl, unsubstituted benzene ring or phenyl with 1-3 hydrogen atoms on the benzene ring substituted by substituents selected from the group consisting of: C1-C6 alkyl, C2-C6 alkenyl and C2-C6 alkynyl;
(3) a thermosetting aryl group, said thermosetting aryl group being a group selected from the group consisting of:
Figure BDA0001570158080000061
and at least one R is a thermosetting aryl group.
In another preferred embodiment, the organosiloxane has a structure selected from the group consisting of:
Figure BDA0001570158080000062
Figure BDA0001570158080000071
in a second aspect of the present invention, there is provided a process for preparing an organosiloxane according to the first aspect of the present invention by a condensation reaction as follows:
Figure BDA0001570158080000072
wherein X and Y are selected from the following (1) or (2):
(1)X＝H，Y＝OH，OMe，OEt；
(2)X＝OH，OMe，OEt，Y＝H。
in another preferred example, X ═ H and Y ═ OEt.
In another preferred example, X ═ OEt and Y ═ H.
In another preferred embodiment, X ═ OH and Y ═ H.
In another preferred embodiment, the silane I-a is selected from the group consisting of:
(1) alkoxy silane
Figure BDA0001570158080000073
Wherein R is2Is H, Me, or Et; each R1Independently selected from the following substituents: substituted or unsubstituted C1-C12 alkyl, substituted or unsubstituted C2-C12 alkenyl, substituted or unsubstituted C2-C12 alkynyl, and substituted or unsubstituted phenyl, wherein the substituted means that one or more hydrogen atoms on the group are substituted by a substituent selected from the group consisting of: halogen, alkyl of C1-C12, alkenyl of C2-C12, alkynyl of C2-C12 and unsubstituted phenyl;
(2) cyclic siloxanes
Figure BDA0001570158080000074
Wherein n is 3-8; r3A substituent selected from: substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkoxy, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl and substituted or unsubstituted phenyl, wherein the substituted means that one or more hydrogen atoms on the group are substituted by substituent(s) selected from the group consisting of: halogen, alkyl of C1-C6, alkenyl of C2-C6, alkynyl of C2-C6 and unsubstituted phenyl;
(3) linear polysiloxanes
Figure BDA0001570158080000081
Wherein n is 2-1000; each R4Independently selected from: h, SiMe3(ii) a Each R5Independently selected from the following substituents: h, substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkylOxy, substituted or unsubstituted C2-C6 alkenyl, substituted or unsubstituted C2-C6 alkynyl, substituted or unsubstituted phenyl, said substitution indicating that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, alkyl of C1-C6, alkenyl of C2-C6, alkynyl of C2-C6 and unsubstituted phenyl.
In another preferred embodiment, the condensation reaction comprises the following steps: in the catalyst (C)6F5)3Carrying out condensation reaction on silane I-a shown in a formula I and monomer I-b in an inert solvent in the presence of the organic siloxane of the first aspect of the invention;
in another preferred embodiment, the condensation reaction is carried out in an inert solvent selected from the group consisting of: n-hexane, benzene, toluene, xylene, or combinations thereof; preferably, the condensation reaction is carried out in toluene;
in another preferred embodiment, the condensation reaction is carried out by using the catalyst B (C)6F5)3The dosage of the compound is 0.1mol percent to 1mol percent;
in another preferred embodiment, the condensation reaction has one or more conditions selected from the group consisting of:
the condensation reaction is carried out at the temperature of-20 to 80 ℃; preferably at 0-60 ℃;
the condensation reaction time is 0.5-24 h.
In another preferred embodiment, the condensation reaction further has one or more of the following characteristics:
the condensation reaction is carried out in a strong Lewis acid B (C)6F5)3Under catalysis
The condensation reaction is carried out in an inert solvent selected from the group consisting of: n-hexane, benzene, toluene, xylene, or combinations thereof;
the condensation reaction is carried out at the temperature of-20 to 80 ℃;
the condensation reaction time is 0.5-24 h.
In another preferred embodiment, the catalyst B (C) is6F5)3The dosage of the composition is 0.1 to 1 percent.
In another preferred embodiment, the condensation reaction comprises the following steps: in the catalyst (C)6F5)3In the presence of the organic siloxane, silane A and B monomers shown in the formula I are subjected to condensation reaction in an inert solvent to obtain the organic siloxane shown in the formula (I).
In a third aspect of the present invention, there is provided a crosslinked organosiloxane cured product prepared by a process comprising: the organosiloxane of the first aspect of the invention is polymerised to form a cross-linked organosiloxane.
In another preferred embodiment, the polymerization is polymerization curing by heating (i.e., heat curing).
In another preferred embodiment, the heating curing temperature is 130 to 270 ℃, preferably 150 to 260 ℃.
In another preferred embodiment, the heat curing comprises: pre-curing at 150-190 ℃, and post-curing at 230-270 ℃.
In another preferred embodiment, the heat curing comprises: pre-curing at 150-190 ℃, then heating to 230-270 ℃ at a heating rate of 15-55 ℃/h, and performing post-curing.
In another preferred example, the heat curing further comprises: prior to said pre-curing, subjecting said organosiloxane to a slow warming and/or mechanical agitation to remove gas bubbles and form a dense liquid; preferably, the temperature is raised from room temperature to 100-140 ℃.
In another preferred embodiment, the pre-curing time is 4-8 h.
In another preferred embodiment, the curing time is 4-8 h.
In a fourth aspect of the invention, there is provided an article comprising an organosiloxane of formula I as defined in the first aspect of the invention or a cured product as defined in the third aspect of the invention; or:
the article is prepared using an organosiloxane of formula I as described in the first aspect of the invention, or a cured product as described in the third aspect of the invention.
In another preferred embodiment, the article is selected from the group consisting of: cross-linking agents, cross-linked silicone rubbers, cross-linked silicone resins.
In another preferred embodiment, the product is a low dielectric constant material or a metal wire externally coated insulating material.
In another preferred embodiment, the article is a polymeric sheet or film.
In another preferred embodiment, the article comprises: a substrate, and a film coated on the substrate and containing the cured product according to the sixth aspect of the present invention.
In another preferred embodiment, the article is prepared by the following method: the product is obtained by molding the organosiloxane of formula a according to the first aspect of the invention to obtain a preform and then heating and curing the preform.
In another preferred embodiment, the molding is performed by a molding process selected from the group consisting of: heated die pressing, solution spin coating, or solution drop coating.
In another preferred embodiment, the solution spin coating or solution drop coating comprises the steps of: dissolving the organic siloxane of formula A according to the first aspect of the invention in an organic solvent to prepare a solution, and then carrying out spin coating or drop coating; preferably, the solvent is selected from the group consisting of: the organic solvent is toluene, xylene, trimethylbenzene, diphenyl ether, cyclohexanone, trichloromethane, acetone, N-dimethylformamide, N-dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone or a combination thereof.
In a seventh aspect of the present invention, there is provided a cross-linking agent comprising an organosiloxane of formula a as described in the first aspect of the invention.
In another preferred example, the cross-linking agent is a cross-linking agent of high-temperature vulcanized silicone rubber (which can be directly added into silicone resin).
In an eighth aspect of the present invention, there is provided a cross-linked silicone rubber, wherein the silicone rubber is a high temperature vulcanized silicone rubber, and the silicone rubber contains the organosiloxane of formula a according to the first aspect of the present invention.
Within the scope of the present invention, the above-mentioned technical features of the present invention and the technical features described in detail below (e.g., the embodiments) can be combined with each other to constitute a new or preferred technical solution. Not to be reiterated herein, but to the extent of space.
Detailed Description
The invention aims to provide a preparation method of a novel organic siloxane capable of being directly thermally cured. The crosslinking polymerization can be generated by heating, the crosslinked product has good insulating property, heat resistance, transparency, mechanical property and the like, and the preparation method is simple, and the crosslinking agent is suitable for serving as an insulating coating layer and a packaging material of an electronic component in the electronic and electrical industry or serving as a crosslinking agent of high-temperature vulcanized silicone rubber.
Term(s) for
As used herein, the term "siloxane" or "organosiloxane" refers to a compound containing a Si-O-Si bond structure constituent. In the present invention, one preferred organosiloxane is of the formula
Figure BDA0001570158080000101
A structure shown, wherein each R is independently an alkyl, alkenyl, or aryl group,
Figure BDA0001570158080000102
is organosilicon monomer, cyclic organic siloxane or linear polysiloxane.
The terms "organosiloxane of formula a" or "organosiloxane of the present invention" are used interchangeably and refer to the organosiloxane of formula a;
the term "silicone containing a thermosetting group" or "directly thermally curable silicone" means that the portion of each silicon atom in the silane that is originally attached to an alkyl, alkenyl, or aryl group (i.e., the portion that is originally R) is substituted with a thermosetting group;
the term "thermosetting group" in the present invention specifically refers to benzocyclobutene groups
Figure BDA0001570158080000111
Trifluorovinyl ether substituted aryl groups
Figure BDA0001570158080000112
Vinyl-substituted phenyl
Figure BDA0001570158080000113
Ethynyl substituted phenyl
Figure BDA0001570158080000114
The term "halogen" refers to fluorine, chlorine, bromine, iodine.
The term "halo" refers to the replacement of one or more hydrogen atoms on a group by a halogen.
The term "C1-C12 alkyl group" refers to a straight or branched chain alkyl group having 1 to 6 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, t-butyl, or the like.
The term "alkenyl group of C2 to C12" means a straight or branched chain alkenyl group having 2 to 12 carbon atoms, such as vinyl, propenyl, allyl, 1-butenyl, 2-butenyl, or the like.
The term "alkynyl group of C2 to C12" means a straight or branched chain alkynyl group having 2 to 12 carbon atoms, such as ethynyl, propynyl, allyl, 1-butynyl, 2-butynyl, or the like.
Organosiloxanes containing thermosetting groups
Organosiloxanes often need to be made to form a crosslinked system for better application. In recent years, in order to avoid adverse effects of a catalyst or an initiator used in a conventional crosslinking method on material properties, researchers have been constantly introducing a thermosetting group into an organosiloxane monomer or polymer to obtain a desired crosslinked silicone resin or silicone rubber or the like by a thermal polymerization reaction thereof at a certain temperature. Among the typical thermosetting groups are benzocyclobutene groups
Figure BDA0001570158080000115
Trifluorovinyl ether substituted aryl groups
Figure BDA0001570158080000116
Vinyl-substituted phenyl
Figure BDA0001570158080000117
Ethynyl substituted phenyl
Figure BDA0001570158080000118
And the like. However, in the prior art, the desired organosiloxane monomer or polymer is typically obtained by hydrolytic condensation of a siloxane containing a thermosetting group or by a hydrosilylation reaction between a silane containing a thermosetting group and an organosiloxane. These two methods still have certain drawbacks: one is that hydrolytic condensation of organosiloxanes inevitably produces a certain amount of silanol, which is difficult to control, and the presence of silicon hydroxyl groups adversely affects the properties (especially the electrical properties) of the resulting organosiloxane polymer material; secondly, the hydrosilylation reaction can form flexible-Si-CH2-CH2A bond, wherein the presence of a methylene group is detrimental to the improvement of the thermal stability of the siloxane.
The invention adopts a simple and efficient process, and adopts a silicon-hydrogen monomer containing thermosetting groups and alkoxy silane (or hydroxyl silicone oil) or siloxane (or silanol) containing thermosetting groups and a silicon-hydrogen monomer (or hydrogen-containing silicone oil) in B (C)6F5)3To obtain the novel organic siloxane monomer or polymer containing thermosetting groups connected by-Si-O-Si-bonds.
Specifically, the organosiloxane provided by the invention connects an organosilicon framework with an aryl substituent containing a thermosetting group through a-Si-O-Si-bond, and is a novel organosiloxane capable of being directly thermally cured. The siloxane has the form of
Figure BDA0001570158080000121
The structure of (1). Wherein the content of the first and second substances,
Figure BDA0001570158080000122
is an organosilicon monomer, a cyclic organosiloxane or a linear polysiloxane; each one ofR is respectively and independently substituted or unsubstituted C1-C12 alkyl, substituted or unsubstituted C2-C12 alkenyl, substituted or unsubstituted C2-C12 alkynyl and substituted or unsubstituted phenyl; the substitution means that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, C1-C12 alkyl, C2-C12 alkenyl, C2-C12 alkynyl, unsubstituted or phenyl with 1-4 hydrogen atoms on the phenyl ring substituted by substituents selected from the group consisting of: halogen, C1-C12 alkyl; and at least one R is a thermosetting aryl group (benzocyclobutene group)
Figure BDA0001570158080000123
Trifluorovinyl ether substituted aryl groups
Figure BDA0001570158080000124
Vinyl-substituted phenyl
Figure BDA0001570158080000125
Ethynyl substituted phenyl
Figure BDA0001570158080000126
)。
In another preferred embodiment, the organosiloxane comprises organosiloxane monomers and/or organosiloxane polymers.
In another preferred embodiment, the siloxane polymer backbone comprises a linear backbone and/or a branched backbone, preferably a linear backbone.
In another preferred embodiment, the refractive index of the organic siloxane is 1.5-1.6.
In another preferred embodiment, the organosiloxane has the following structure of formula II:
Figure BDA0001570158080000127
wherein
Figure BDA0001570158080000131
Each R is independently substituted or unsubstituted C1-C12 alkyl, substituted or unsubstituted C2-C12 alkenyl, substituted or unsubstituted C2-C12 alkynyl, substituted or unsubstituted phenyl; the substitution means that one or more hydrogen atoms on the group are substituted with a substituent selected from the group consisting of: halogen, C1-C12 alkyl, C2-C12 alkenyl, C2-C12 alkynyl, unsubstituted or phenyl with 1-4 hydrogen atoms on the phenyl ring substituted by substituents selected from the group consisting of: halogen, C1-C12 alkyl;
the organosiloxane is prepared by a condensation reaction between silane A and silane B as shown in the following formula I:
Figure BDA0001570158080000132
wherein X and Y are selected from the following:
x ═ H, and Y ═ OH, OMe, OEt; or X ═ OH, OMe, OEt, and Y ═ H.
In another preferred embodiment, the condensation reaction comprises the following steps: in the catalyst (C)6F5)3In the presence of the organic siloxane, silane A and B monomers shown in a formula I are subjected to condensation reaction in an inert solvent to obtain the organic siloxane;
the inert solvent for the condensation reaction is not particularly limited, and preferably, the condensation reaction is carried out in toluene;
catalyst B (C) in the condensation reaction6F5)3The dosage of the compound is 0.1mol percent to 1mol percent;
the temperature of the condensation reaction is not particularly limited, and is preferably carried out at-20 to 80 ℃; preferably at 0-60 ℃;
the condensation reaction time is not particularly limited, and is preferably 0.5 to 24 hours.
All the raw materials adopted by the invention are commercially available products.
Use of organosiloxanes
The invention also provides the application of the organic siloxane shown as the formula A, and the organic siloxane can be used in the electronic and electrical industry, as a packaging material of an insulating coating layer and an electronic component, or used for preparing a low dielectric constant material or a metal wire outer coating insulating material, or used as a cross-linking agent of high-temperature vulcanized silicone rubber.
One application of the organosiloxane of the present invention is for preparing a cured product of an organosiloxane structure, the cured product being prepared by heat curing the organosiloxane of formula a as described.
The heat curing conditions are not particularly limited, and may be adjusted in accordance with the kind of organosiloxane to be used, and the property requirements of the cured product may be adjusted in a specific manner. In a preferred embodiment of the present invention, the heating curing temperature is 230 to 270 ℃, preferably 240 to 260 ℃.
The heat curing may optionally further comprise a pre-curing step, i.e. curing for a period of time at a temperature lower than the heat curing temperature. In another preferred embodiment, the heat curing comprises: pre-curing at 150-190 ℃, and then curing at 230-270 ℃.
The heat curing can be performed under the condition of temperature programming, and in another preferred example, the heat curing comprises the following steps: pre-curing at 150-190 ℃, then heating to 230-270 ℃ at a heating rate of 15-55 ℃/h, and curing.
The pre-curing time and the curing time are not particularly limited, and in a preferred embodiment of the present invention, the pre-curing time is 4 to 8 hours, and the curing time is 4 to 8 hours.
The cured product has good thermal properties. In a preferred embodiment of the invention, the 5% thermal weight loss temperature of the cured product in nitrogen is 430-550 ℃;
in another preferred embodiment, the weight residue of the cured product at 1000 ℃ in nitrogen is more than or equal to 20 percent;
the cured product has good insulating properties. In a preferred embodiment of the present invention, the dielectric constant of the cured product is 2.4 to 2.8 (in the range of 1 to 30 MHz);
in another preferred embodiment, the dielectric constant of the cured product is preferably 2.4 to 2.6.
The organosiloxanes of the present invention may also be used to prepare an article comprising said organosiloxane of formula a, the organosilicon monomer of formula II, or said cured product; or said article is prepared using said organosiloxane of formula a, silicone monomer of formula II, or said cured product.
In another preferred embodiment, the product is a low dielectric constant material or a metal wire externally coated insulating material.
In another preferred embodiment, the article is a polymeric sheet or film.
In another preferred embodiment, the article comprises: a substrate, and a film containing the cured product coated on the substrate.
In another preferred embodiment, the article is prepared by the following method: and (2) molding the organic siloxane with the formula A to obtain a preformed body, and then heating and curing the preformed body to obtain the product.
In another preferred embodiment, the molding is performed by a molding process selected from the group consisting of: heated die pressing, solution spin coating, or solution drop coating.
In another preferred embodiment, the solution spin coating or solution drop coating comprises the steps of: in another preferred embodiment, the solution spin coating or solution drop coating comprises the steps of: dissolving the organic siloxane of formula A according to the first aspect of the invention in an organic solvent to prepare a solution, and then carrying out spin coating or drop coating; preferably, the solvent is selected from the group consisting of: the organic solvent is toluene, xylene, trimethylbenzene, diphenyl ether, cyclohexanone, trichloromethane, acetone, N-dimethylformamide, N-dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone or a combination thereof.
The organosiloxanes according to the invention can also be used as crosslinkers for the preparation of high-temperature vulcanized silicone rubbers. In use, the organosiloxanes of the invention are added directly to the silicone resin.
The invention has the main advantages that:
(1) compared with the preparation method reported in the prior art, the preparation and purification process of the organic siloxane containing thermosetting groups is simple, the by-product is discharged in a gas form, and the product system is a monomer and is beneficial to purification.
(2) The organic siloxane of the invention avoids silanol produced by the traditional hydrolysis method, and is more beneficial to improving the heat resistance and the insulating property of the finally obtained cured product.
(3) The organosiloxane disclosed by the invention generates a-Si-O-Si-structure through a condensation reaction, so that the adverse effect of a continuous methylene flexible chain formed by the traditional hydrosilylation reaction on the improvement of the thermal stability of the organosiloxane is avoided.
(4) The preparation method is simple, has low equipment requirement and is suitable for industrial production.
(5) The organic siloxane provided by the invention can be used for preparing a cured product with good electrical property, heat resistance and mechanical property, and the thermal stability of the cured product is obviously improved.
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The experimental procedures, in which specific conditions are not noted in the following examples, are generally carried out under conventional conditions or conditions recommended by the manufacturers. Unless otherwise indicated, percentages and parts are calculated in molar ratios.
EXAMPLE 1 preparation of tetraaryltrifluorovinyl ether-substituted organosiloxanes
Figure BDA0001570158080000161
Under the protection of argon, the mixture is charged with B (C)6F5)34-Trifluoroethyleneoxyphenyldimethylsilane (8.99g, 38.76mmol) was added dropwise to a 10mL toluene solution of (102mg,0.2mmol) and tetraethoxysilane (2.02g, 9.69mmol), and after stirring at room temperature for 8 hours, the reaction was stopped, and the mixture was rotary-evaporatedAfter removing the low-boiling solvent, the crude product was subjected to silica gel column chromatography to obtain 7.20g of a colorless transparent liquid in a yield of 73%.
EXAMPLE 2 preparation of triaryltrifluorovinyl ether substituted organosiloxanes
Figure BDA0001570158080000162
Under the protection of argon, the mixture is charged with B (C)6F5)34-trifluoroethyleneoxyphenyldimethylsilane (6.06g,26.1mmol) was added dropwise to a 10mL toluene solution of (67mg,0.13mmol) and perfluorooctyltriethoxysilane (5.32g,8.7mmol), and after stirring at room temperature for 8 hours, the reaction was stopped, and after removing the low boiling point solvent by rotary evaporation, the crude product was subjected to silica gel column chromatography to obtain 6.50g of a colorless transparent liquid with a yield of 61.4%.
EXAMPLE 3 preparation of a tetravinyl phenyl substituted organosiloxane
Figure BDA0001570158080000171
Under the protection of argon, the mixture is charged with B (C)6F5)34-vinylphenyldimethylsilane (3.89g,24mmol) was added dropwise to a 10mL toluene solution of (61mg,0.12mmol) and tetraethoxysilane (1.25g, 6mmol), and after stirring at room temperature for 6 hours, the reaction was stopped, and after removing the low boiling point solvent by rotary evaporation, the crude product was subjected to silica gel column chromatography to obtain 3.35g of a colorless transparent liquid, with a yield of 76%.
EXAMPLE 4 preparation of a Tetravinylphenyl-substituted OrganoCyclic siloxane
Figure BDA0001570158080000172
Under the protection of argon, the mixture is charged with B (C)6F5)3To a 12mL toluene solution of (82mg,0.16mmol) and 4-vinylphenyldimethylethoxysilane (6.6g,32mmol) was added dropwise tetramethylcyclotetrasiloxane (1.93g,8 mmol), and the mixture was stirred at room temperature after completion of dropwise additionAfter 6 hours, the reaction was stopped, and after removing the low-boiling solvent by rotary evaporation, the crude product was subjected to silica gel column chromatography to obtain 5.08g of a colorless transparent liquid with a yield of 67%.
EXAMPLE 5 preparation of Tetraaryltrifluorovinyl ether-substituted Organocyclosiloxanes
Figure BDA0001570158080000181
Under the protection of argon, the mixture is charged with B (C)6F5)3Tetramethylcyclotetrasiloxane (1.2 g,5mmol) was added dropwise to a 15mL toluene solution of (51mg,0.1mmol) and 4-trifluorovinyloxyphenyldimethylethoxysilane (5.53g,20mmol), and after stirring at room temperature for 6 hours, the reaction was stopped, and after removing the low-boiling solvent by rotary evaporation, the crude product was subjected to silica gel column chromatography to obtain 4.86g of a colorless transparent liquid with a yield of 79%.
EXAMPLE 6 preparation of a Vinylphenyl-substituted organopolysiloxane
Figure BDA0001570158080000182
Under the protection of argon, the mixture is charged with B (C)6F5)3(95mg,0.185mmol) and 4-vinylphenyldimethylethoxysilane (7.64g,37mmol) in 15mL of toluene were added dropwise to a hydrogen-containing silicone oil (2.2g), and after completion of the addition, the reaction was stirred at room temperature for 6 hours, and then the reaction mixture was stopped, and the mixture was allowed to settle in anhydrous methanol to obtain 8.34g of a colorless viscous liquid.
EXAMPLE 7 preparation of an Aryltrifluorovinyl Ether-substituted organopolysiloxane
Figure BDA0001570158080000183
Under the protection of argon, the mixture is charged with B (C)6F5)3(61mg,0.12mmol) and 4-trifluoroethyleneoxyphenyldimethylethoxysilane (6.64g,24mmol) in 10mL of toluene were added dropwise hydrogen-containing silicone oil (1.4g), and after stirring at room temperature for 6 hours, the reaction was stopped, followed by reaction with anhydrous methyl ethyl ketoneThe mixture was precipitated in an alcohol to obtain 6.94g of a colorless viscous liquid.
EXAMPLE 8 curing of tetraaryltrifluorovinyl ether-substituted organosiloxane and Heat resistance Properties of the cured product
0.8g of the polymer obtained in example 1 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 160 ℃ and held at this temperature for 2 hours, then heated to 240 ℃ and held at this temperature for 5 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature in nitrogen of 476 ℃ and a weight residue of 27% at 1000 ℃.
Example 9 dielectric Properties of Tetraaryltrifluorovinyl ether-substituted organosiloxane cured product
0.8g of the polymer obtained in example 1 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 150 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 160 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 250 ℃ at the rate of 50 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.50 and 2.58 within the frequency range of 1 MHz to 30 MHz.
EXAMPLE 10 curing of triaryltrifluorovinyl ether-substituted organosiloxane and Heat resistance Properties of the cured product
0.6g of the polymer obtained in example 2 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 160 ℃ and held at this temperature for 2 hours, then heated to 240 ℃ and held at this temperature for 5 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature in nitrogen of 440 ℃ and a weight residual of 21% at 1000 ℃.
EXAMPLE 11 dielectric Properties of triaryltrifluorovinyl ether-substituted organosiloxane cured product
0.9g of the polymer obtained in example 2 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 150 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 160 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 250 ℃ at the speed of 50 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.30 and 2.45 within the frequency range of 1 MHz to 30 MHz.
EXAMPLE 12 curing of a tetraethylenephenyl-substituted organosiloxane and Heat resistance Properties of the cured product
0.6g of the polymer obtained in example 3 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 100 ℃ and held at this temperature for 2 hours, then heated to 160 ℃ and held at this temperature for 6 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature in nitrogen of 453 ℃ and a weight residue of 34% at 1000 ℃.
Example 13 dielectric Properties of Tetravinylphenyl-substituted organosiloxane cured product
0.6g of the polymer obtained in example 3 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 60 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 100 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 160 ℃ at the rate of 30 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.62 and 2.68 within the frequency range of 1 MHz to 30 MHz.
EXAMPLE 14 curing of a Tetravinylphenyl-substituted OrganoCyclic siloxane and Heat resistance Properties of the cured product
0.6g of the polymer obtained in example 4 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 100 ℃ and held at this temperature for 2 hours, then heated to 160 ℃ and held at this temperature for 6 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature of 456 ℃ and a weight residue of 34% at 1000 ℃ in nitrogen.
EXAMPLE 15 dielectric Properties of Tetravinylphenyl-substituted OrganoCyclic siloxane cured product
0.6g of the polymer obtained in example 4 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 60 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 100 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the quartz tube furnace is moved to 160 ℃ at the rate of 30 ℃/h, and after the temperature is kept for 5 hours, the quartz tube furnace is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the result shows that the dielectric constant of the wafer is between 2.60 and 2.69 in the frequency range of 1 MHz to 30 MHz.
EXAMPLE 16 curing of Tetraaryltrifluorovinyl ether-substituted Organocyclic siloxane and Heat resistance Properties of the cured product
0.7g of the polymer obtained in example 5 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 160 ℃ and held at this temperature for 2 hours, then heated to 240 ℃ and held at this temperature for 6 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature of 469 ℃ and a weight residue of 28% at 1000 ℃ in nitrogen.
Example 17 dielectric Properties of Tetraaryltrifluorovinyl ether-substituted Organocyclosiloxane cured product
0.7g of the polymer obtained in example 5 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 150 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 160 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 250 ℃ at the rate of 50 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.50 and 2.56 in the frequency range of 1 MHz to 30 MHz.
EXAMPLE 18 curing of vinylphenyl-substituted organopolysiloxane and Heat resistance Properties of cured product
0.7g of the polymer obtained in example 6 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 100 ℃ and held at this temperature for 2 hours, then heated to 160 ℃ and held at this temperature for 6 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature of 457 ℃ in nitrogen and a weight residue of 38% at 1000 ℃.
Example 19 dielectric Properties of Vinylphenyl-substituted organopolysiloxane cured product
0.7g of the polymer obtained in example 6 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 60 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 100 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 160 ℃ at the rate of 30 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.62 and 2.69 within the frequency range of 1 MHz to 30 MHz.
EXAMPLE 20 curing of Aryltrifluorovinyl ether-substituted organopolysiloxane and Heat resistance Properties of the cured product
0.8g of the polymer obtained in example 7 was placed in a flat-bottomed glass tube having an inner diameter of 1cm, heated to 160 ℃ and held at this temperature for 2 hours, then heated to 240 ℃ and held at this temperature for 6 hours, cooled to room temperature, and the cured product was taken out, ground and subjected to TGA test. The results show that the cured product has a 5% thermogravimetric temperature of 478 ℃ and a weight residual of 31% at 1000 ℃ in nitrogen.
Example 21 dielectric Properties of Aryltrifluorovinyl Ether-substituted organopolysiloxane cured product
0.8g of the polymer from example 7 was placed in a flat-bottomed glass tube having an internal diameter of 1cm, evacuated and slowly heated to 150 ℃ under mechanical vibration to remove bubbles and form a dense liquid, heated to 160 ℃ and kept at this temperature for 5 hours to precure it. After cooling to room temperature, the sample is moved to a quartz tube furnace and heated to 240 ℃ at the rate of 50 ℃/h, and after the temperature is kept for 5 hours, the sample is taken out and polished into a wafer, and the dielectric constant of the wafer is measured, and the dielectric constant of the wafer is between 2.49 and 2.56 in the frequency range of 1 MHz to 30 MHz.
All documents referred to herein are incorporated by reference into this application as if each were individually incorporated by reference. Furthermore, it should be understood that various changes and modifications of the present invention can be made by those skilled in the art after reading the above teachings of the present invention, and these equivalents also fall within the scope of the present invention as defined by the appended claims.

Claims (8)

1. A directly thermally curable organosiloxane in which an organosilicon backbone is linked by a-Si-O-Si-bond to an aryl substituent containing a thermosetting group,
and said organosiloxane having a structure selected from the group consisting of:
Figure DEST_PATH_IMAGE001
Figure DEST_PATH_IMAGE002
、
Figure DEST_PATH_IMAGE003
；
wherein n is an integer of 1 to 1000.
2. The organosiloxane of claim 1 wherein the siloxane has the structure;
Figure 142956DEST_PATH_IMAGE003
。
3. a method of preparing the organosiloxane of claim 1 wherein the organosiloxane is prepared by a condensation reaction as follows:
Figure DEST_PATH_IMAGE004
wherein X is H, Y selected from the group consisting of: OMe, OEt.
4. The method of claim 3, wherein the silane I-a is selected from the group consisting of:
(1) cyclic siloxanes
Figure DEST_PATH_IMAGE005
Wherein n = 4; r3Is methyl;
(2) linear polysiloxanes
Figure DEST_PATH_IMAGE006
Wherein n = 2-1000; each R4Is SiMe3(ii) a A R5Is H, an R5Is methyl.
5. The method of claim 4, wherein the condensation reaction comprises the steps of: in catalyst B (C)6F5)3Condensation of silanes I-a of the formula I with monomers I-b in an inert solvent in the presence of a silane compound to give the organosiloxanes according to claim 1.
6. The method of claim 4, wherein the condensation reaction further comprises one or more of the following characteristics:
the condensation reaction is carried out in a strong Lewis acid B (C)6F5)3The reaction is carried out under catalysis;
the condensation reaction is carried out in an inert solvent selected from the group consisting of: n-hexane, benzene, toluene, xylene, or combinations thereof;
the condensation reaction is carried out at the temperature of-20 to 80 ℃;
the condensation reaction time is 0.5-24 h.
7. A crosslinked organosiloxane cured product, wherein said cured product is prepared by a process comprising: polymerizing the organosiloxane of claim 1 to form a crosslinked organosiloxane.
8. An article comprising the organosiloxane of claim 1 or the cured product of claim 7; or:
the article is produced using the organosiloxane of claim 1 or the cured product of claim 7.
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