CN108293282A - composition for sealing - Google Patents
composition for sealing Download PDFInfo
- Publication number
- CN108293282A CN108293282A CN201680069787.4A CN201680069787A CN108293282A CN 108293282 A CN108293282 A CN 108293282A CN 201680069787 A CN201680069787 A CN 201680069787A CN 108293282 A CN108293282 A CN 108293282A
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- CN
- China
- Prior art keywords
- ingredient
- group
- sealing
- compound
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000203 mixture Substances 0.000 title claims abstract description 129
- 238000007789 sealing Methods 0.000 title claims abstract description 122
- 239000004615 ingredient Substances 0.000 claims abstract description 118
- 150000001875 compounds Chemical class 0.000 claims abstract description 107
- 239000000463 material Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims abstract description 36
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 22
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 20
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 19
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 10
- 125000000623 heterocyclic group Chemical group 0.000 claims description 31
- 239000004215 Carbon black (E152) Substances 0.000 claims description 29
- 229930195733 hydrocarbon Natural products 0.000 claims description 29
- 150000002430 hydrocarbons Chemical class 0.000 claims description 26
- 238000005286 illumination Methods 0.000 claims description 25
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 15
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- 238000005401 electroluminescence Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 4
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims 1
- -1 allyl compounds compound Chemical class 0.000 abstract description 95
- 238000013022 venting Methods 0.000 abstract description 9
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004593 Epoxy Substances 0.000 description 29
- 229910052757 nitrogen Inorganic materials 0.000 description 24
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 22
- 238000007711 solidification Methods 0.000 description 19
- 230000008023 solidification Effects 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 18
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- 229910052799 carbon Inorganic materials 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 150000001768 cations Chemical class 0.000 description 12
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 10
- 150000001721 carbon Chemical group 0.000 description 10
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 10
- 239000001294 propane Substances 0.000 description 9
- 125000005843 halogen group Chemical group 0.000 description 8
- 125000004430 oxygen atom Chemical group O* 0.000 description 8
- 229960000834 vinyl ether Drugs 0.000 description 8
- 125000004450 alkenylene group Chemical group 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229940052303 ethers for general anesthesia Drugs 0.000 description 7
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000001118 alkylidene group Chemical group 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 150000002148 esters Chemical group 0.000 description 6
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 6
- 239000000565 sealant Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 5
- 229940106691 bisphenol a Drugs 0.000 description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 5
- 150000002170 ethers Chemical class 0.000 description 5
- 238000004020 luminiscence type Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 5
- 150000002927 oxygen compounds Chemical class 0.000 description 5
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 125000004646 sulfenyl group Chemical group S(*)* 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 235000012222 talc Nutrition 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 3
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 150000003983 crown ethers Chemical class 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000001046 glycoluril group Chemical group [H]C12N(*)C(=O)N(*)C1([H])N(*)C(=O)N2* 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- DNVXWIINBUTFEP-UHFFFAOYSA-N 2-[(2-phenylphenoxy)methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1=CC=CC=C1 DNVXWIINBUTFEP-UHFFFAOYSA-N 0.000 description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical group C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical class [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 150000001896 cresols Chemical class 0.000 description 2
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000001041 indolyl group Chemical group 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 125000004193 piperazinyl group Chemical group 0.000 description 2
- 125000003386 piperidinyl group Chemical group 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- 125000005837 1,2-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([*:2])C1([H])[H] 0.000 description 1
- 125000005838 1,3-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:2])C([H])([H])C1([H])[*:1] 0.000 description 1
- QYCGBAJADAGLLK-UHFFFAOYSA-N 1-(cyclohepten-1-yl)cycloheptene Chemical compound C1CCCCC=C1C1=CCCCCC1 QYCGBAJADAGLLK-UHFFFAOYSA-N 0.000 description 1
- 125000006023 1-pentenyl group Chemical group 0.000 description 1
- PQNGOVMIUXSJNP-UHFFFAOYSA-N 1-phenyl-4-(4-phenylsulfanylphenyl)benzene Chemical compound C=1C=C(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 PQNGOVMIUXSJNP-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- ACKPSZGIQNQZLW-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethanol Chemical compound OCCOCCOCCOCC1CO1 ACKPSZGIQNQZLW-UHFFFAOYSA-N 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical class C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
- CEBRPXLXYCFYGU-UHFFFAOYSA-N 3-methylbut-1-enylbenzene Chemical compound CC(C)C=CC1=CC=CC=C1 CEBRPXLXYCFYGU-UHFFFAOYSA-N 0.000 description 1
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical class C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical class C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical group N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- 229910021630 Antimony pentafluoride Inorganic materials 0.000 description 1
- 229910017048 AsF6 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 description 1
- 125000005914 C6-C14 aryloxy group Chemical group 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 244000131522 Citrus pyriformis Species 0.000 description 1
- 244000205754 Colocasia esculenta Species 0.000 description 1
- 235000006481 Colocasia esculenta Nutrition 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical class NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000641 acridinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000005012 alkyl thioether group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 125000002820 allylidene group Chemical group [H]C(=[*])C([H])=C([H])[H] 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical class NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000003851 azoles Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000027455 binding Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 125000002592 cumenyl group Chemical group C1(=C(C=CC=C1)*)C(C)C 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical group C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- PWAPCRSSMCLZHG-UHFFFAOYSA-N cyclopentylidene Chemical group [C]1CCCC1 PWAPCRSSMCLZHG-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000003988 headspace gas chromatography Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000001867 hydroperoxy group Chemical group [*]OO[H] 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229960002479 isosorbide Drugs 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N n-Butanol Substances CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 150000005054 naphthyridines Chemical group 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- KHMYONNPZWOTKW-UHFFFAOYSA-N pent-1-enylbenzene Chemical compound CCCC=CC1=CC=CC=C1 KHMYONNPZWOTKW-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000001791 phenazinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3N=C12)* 0.000 description 1
- BOTNYLSAWDQNEX-UHFFFAOYSA-N phenoxymethylbenzene Chemical compound C=1C=CC=CC=1COC1=CC=CC=C1 BOTNYLSAWDQNEX-UHFFFAOYSA-N 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004742 propyloxycarbonyl group Chemical group 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 150000004040 pyrrolidinones Chemical class 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- WHLUQAYNVOGZST-UHFFFAOYSA-N tifenamil Chemical group C=1C=CC=CC=1C(C(=O)SCCN(CC)CC)C1=CC=CC=C1 WHLUQAYNVOGZST-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 150000003852 triazoles Chemical group 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- QVTVDJWJGGEOGX-UHFFFAOYSA-N urea;cyanide Chemical group N#[C-].NC(N)=O QVTVDJWJGGEOGX-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of organic EL element composition for sealing; it is when using box dam completion method sealing organic el element as the composition of box dam materials'use, and organic EL element is protected without being directly exposed to the organic EL element can be effectively formed the box dam with low venting quality and moisture resistance in UV.The organic EL element composition for sealing of the present invention is to contain following compositions (A), ingredient (B), ingredient (C), ingredient (D) as the composition of box dam materials'use when sealing organic electroluminescent device using box dam completion method.Ingredient (A)：Cation-curable compound with 2 or more the groups in alicyclic epoxy group, the group of oxygen heterocycle butane ring, epithio base and vinyl ether group in 1 molecule；Ingredient (B)：Light cationic polymerization initiator；Ingredient (C)：Selected from least one of N glycidyl compounds, N vinyl compounds and N allyl compounds compound；Ingredient (D)：Inorganic filler.
Description
Technical field
The present invention relates to can be sealed against in the case where not damaging organic EL element, to prevent caused by moisture
The composition for sealing of deterioration.The Japanese Patent Application 2015-239493 that the application is filed an application based on December 8th, 2015 in Japan
It number claims priority, and its content is incorporated herein.
Background technology
Organic electroluminescent (in the present specification, also referred to as " organic EL ") element has to be sandwiched using a pair of of opposite electrode
The structure of luminescent layer, the electrode injection electronics from side, the electrode injection hole from the other side.The injected electrons and hole
In luminescent layer in conjunction with when generate shine.The light extraction mode of organic EL element include top emission type and bottom emission type this two
Kind, the aperture opening ratio of top emission type is big, therefore light extraction efficiency is excellent, is preferred in this regard.Including organic EL element
Organic EL device it is aobvious as the tablet of full color due to the diversity of its high-impact, visibility and illuminant colour
Show device or receives expectation as the equipment for substituting LED.
However, compared with other electronic units, organic EL element is easier to be influenced by moisture, and existing can be because immersion has
Moisture in machine EL element and the problem of cause the oxidation of electrode, the denaturation of organic matter etc., the characteristics of luminescence caused to be remarkably decreased.Make
For the method for solving the problems, such as this, it is known to utilize the side on the periphery of the excellent resin seal of moisture resistance (or cladding) organic EL element
Method.
As above-mentioned encapsulating method, it is known to：Periphery to being formed in the organic EL element on substrate utilizes, and there is meeting to exist
The lower composition for sealing that cured property occurs of UV irradiations is filled, and then cures above-mentioned composition for sealing, thus
The method (1) being sealed；To composition for sealing of lid (lid) coating with above-mentioned property and after carrying out UV irradiations, by it
Fit in the substrate for being formed with organic EL element and the method (2) being sealed.
The above method (1) is due to making organic EL element be directly exposed in UV, thus presence causes the characteristics of luminescence to reduce
Problem.In addition, configuring colour filter on the top of organic EL element to form the organic EL device with high contrast
In the case of, can because colour filter there are due to shield UV, therefore existing causes what the solidification of composition for sealing became inadequate to ask
Topic.
On the other hand, in the above method (2), although can prevent due to making organic EL element be directly exposed in UV
The caused characteristics of luminescence reduces, but since the solidification of composition for sealing under uv illumination can carry out rapidly, if presence is pasted
Closing operation is slow, can cause fitting become difficult, yield rate reduce the problem of.
Following the description has been recorded in patent document 1：Containing epoxide, polymerization initiator and as cure retarder
Crown ether, polyethers composition for sealing, even if with that can carry out and complete cured if shielding UV reactions after UV irradiations
Therefore characteristic if using above-mentioned composition in the above method (2), can inhibit the organic EL element caused by UV
Deterioration while realize sealing.It can decompose in the presence of cation however, crown ether, polyethers exist and generate exhaust,
And the problem of causing organic EL element to deteriorate because of the exhaust.
Existing technical literature
Patent document
Patent document 1：No. 4384509 bulletins of Japanese Patent No.
Invention content
Problems to be solved by the invention
Therefore, the purpose of the present invention is to provide a kind of organic EL element composition for sealing, filled out using box dam
Composition when filling method sealing organic el element as box dam materials'use, it is not necessary that organic EL element to be directly exposed in UV
The box dam with low venting quality and moisture resistance can be effectively formed and protect organic EL element.
Solution to the problem
The present inventor has made intensive studies to solve the above subject, as a result, it has been found that：Relative to by light cationic polymerization
It is equivalent to for the cation that initiator generates weakly alkaline selected from N- glycidyl compounds, N- vinyl compounds and N-
At least one of allyl compound compound (hereinafter also referred to " N- glycidyl compounds etc. "), have can capture because
Carry out UV irradiations and generated by light cationic polymerization initiator cation, to inhibit the progress of cationic polymerization, and in reality
The effect for discharging cation when applying heat treatment and cationic polymerization being made to carry out；Above-mentioned N- glycidyl compounds etc. will not be at
For the producing cause of exhaust；It, can be by adjusting UV for the composition for sealing containing above-mentioned N- glycidyl compounds etc.
The opportunity of irradiation and heat treatment and freely control service life, UV and then pasted by being irradiated to the composition for sealing
Together in heat treatment is implemented after organic EL element, organic EL element can be directly exposed to not cause in UV and to be bonded
Sealing is realized in the case of becoming difficult, so as to utilize the solidfied material sealing organic el member with low venting quality and moisture resistance
Part.The present invention is completed based on these opinions.
That is, the present invention be using box dam completion method seal organic electroluminescent device when as the group of box dam materials'use
Close object, wherein the composition contains following compositions (A), ingredient (B), ingredient (C), ingredient (D).
Ingredient (A)：There are 2 or more in 1 molecule and be selected from alicyclic epoxy group, the group of oxygen heterocycle butane ring, epithio base
And the cation-curable compound of one or more of vinyl ether group group (remove by the compound for belonging to ingredient (C)
Outside)
Ingredient (B)：Light cationic polymerization initiator
Ingredient (C)：In N- glycidyl compounds, N- vinyl compounds and N- allyl compounds at least
A kind of compound (except N- glycidyl isocyanurates)
Ingredient (D)：Inorganic filler
In addition, the present invention provides above-mentioned sealing organic electroluminescent element composition, wherein ingredient (C) is following
Formula (c-1) compound represented and/or following formula (c-2) compound represented：
[chemical formula 1]
(in formula (c-1), RaIndicate from the structural formula of hydrocarbon, heterocycle structural formula or by hydrocarbon and heterocycle via singly bound and
At structural formula in removal t hydrogen atom made of group.RbIndicate hydrogen atom or selected from alkyl, heterocycle and by these bases
Group is via the group in group made of singly bound.RcIt indicates in glycidyl, vinyl and allyl at least
A kind of group.S indicates 1 or 2, and t indicates 1 or more integer.In the case that t is 2 or more, the group in 2 or more square brackets is each
From can be the same or different)；
[chemical formula 2]
(in formula (c-2), ring Z indicates the heterocycle for including nitrogen-atoms, RcIt indicates to be selected from glycidyl, vinyl and allyl
At least one of base group.U indicates 1 or more integer.In the case that u is 2 or more, 2 or more nitrogen-atoms including in ring Z
Can be with Direct Bonding, can also be via other atomistic bindings).
In addition, the present invention provides above-mentioned sealing organic electroluminescent element composition, wherein relative to ingredient (B) 1
The content of parts by weight, ingredient (C) is 0.05~3 parts by weight.
In addition, the present invention provides above-mentioned sealing organic electroluminescent element composition, further contain it is following at
Divide (E).
Ingredient (E)：The compound with 1 or more glycidyl ether (belongs to ingredient (A) and ingredient (C) in 1 molecule
Compound except)
In addition, the present invention provides above-mentioned sealing organic electroluminescent element composition, wherein ingredient (D) is average
The inorganic filler that grain size is 0.001~30 μm.
In addition, the present invention provides above-mentioned sealing organic electroluminescent element composition, wherein ingredient (D) is tablet
The inorganic filler of shape.
In addition, the present invention provides the manufacturing method of organic electroluminescence device, with the Organic Electricity for including following 1~3
Electroluminescent element sealing process.
1：Box dam is formed covering the above-mentioned sealing organic electroluminescent element composition of coating
2：Illumination is implemented to box dam
3：Fitting is provided with the substrate of organic electroluminescent device and implements to heat on the lid with the box dam after illumination
Processing
In addition, the present invention provides organic electroluminescence device, there is the periphery to surround organic electroluminescent device
Mode is configured with constituting for the box dam formed by the solidfied material of above-mentioned sealing organic electroluminescent element composition.
That is, the present invention relates to following technical proposals.
[1] sealing organic electroluminescent element composition is to seal organic electroluminescent using box dam completion method
Composition when element as box dam materials'use, wherein the composition contain following compositions (A), ingredient (B), ingredient (C),
Ingredient (D).
Ingredient (A)：There are 2 or more in 1 molecule and be selected from alicyclic epoxy group, the group of oxygen heterocycle butane ring, epithio base
And the cation-curable compound of one or more of vinyl ether group group (remove by the compound for belonging to ingredient (C)
Outside)；
Ingredient (B)：Light cationic polymerization initiator；
Ingredient (C)：In N- glycidyl compounds, N- vinyl compounds and N- allyl compounds at least
A kind of compound (except N- glycidyl isocyanurates)；
Ingredient (D)：Inorganic filler.
[2] the sealing organic electroluminescent element composition described in above-mentioned [1], wherein ingredient (A) is in being selected from the group
At least one compound：(3,4,3 ', 4 '-diepoxy) joins hexamethylene, bis- (3,4- epoxycyclohexyl-methyls) ethers, 1,2- rings
Bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases) ethane of oxygen-1,2-, bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases) propane of 2,2-, 1,2- it is bis- (3,
4- 7-oxa-bicyclo[4.1.0-1- bases) ethane and formula (1)~(10) compound represented.
[3] the sealing organic electroluminescent element composition described in above-mentioned [1], wherein ingredient (A) be (3,4,3 ',
4 '-diepoxies) join hexamethylene and/or bis- (3,4- epoxycyclohexyl-methyls) ethers.
[4] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[3], wherein ingredient
(A) content is the curability compound total amount (100 weight %) for including in sealing organic electroluminescent element composition
15~50 weight %.
[5] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[4], wherein relative to
The content of 100 parts by weight of curability compound for including in sealing organic electroluminescent element composition, ingredient (B) is 0.05
~4 parts by weight.
[6] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[5], wherein ingredient
(C) it is formula (c-1) compound represented and/or formula (c-2) compound represented.
[7] the sealing organic electroluminescent element composition described in above-mentioned [6], wherein formula (c-1) compound represented
At least one of to be selected from the group compound：4,4 '-di-2-ethylhexylphosphine oxides (N, N- diglycidylaniline), N, N, N ', N '-four
Glycidyl -1,3- benzene two (methylamine), N, N, N ', N '-four glycidyl group -1,3- hexamethylenes two (methylamine) and N, N- are bis-
Glycidyl -4- glycidyloxyanilines.
[8] the sealing organic electroluminescent element composition described in above-mentioned [6], wherein formula (c-2) compound represented
For 1,3,4,6- four glycidyl groups glycoluril and/or 1,3,4,6- tetraallyl glycolurils.
[9] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[8], wherein relative to
The content of 1 parts by weight of ingredient (B), ingredient (C) is 0.05~3 parts by weight.
[10] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[9], further contains
There are following compositions (E).
Ingredient (E)：The compound with 1 or more glycidyl ether (belongs to ingredient (A) and ingredient (C) in 1 molecule
Compound except)
[11] the sealing organic electroluminescent element composition described in above-mentioned [10], wherein ingredient (E) is to be selected from the group
At least one of compound：Aliphatic glycidyl base ether type epoxy compound, aromatic glycidyl ether type epoxy
Close object and ester ring type glycidyl ethers epoxide.
[12] the sealing organic electroluminescent element composition described in above-mentioned [10], wherein ingredient (E) is in 1 molecule
Aromatic glycidyl ether type epoxy with 1 or more glycidyl ether and without ester bond or polyether structure
Close object.
[13] the sealing organic electroluminescent element composition described in any one of above-mentioned [10]~[12], wherein at
It is the curability compound total amount (100 weight %) for including in sealing organic electroluminescent element composition to divide the content of (E)
10~90 weight %.
[14] the sealing organic electroluminescent element composition described in any one of above-mentioned [10]~[13], wherein at
Divide total content of (A) and ingredient (E) total for the curability compound for including in sealing organic electroluminescent element composition
Measure the 70 weight % or more of (100 weight %).
[15] the sealing organic electroluminescent element composition described in any one of above-mentioned [10]~[14], wherein formula
(a) total content of cycloaliphatic epoxy shown in and aromatic glycidyl ether type epoxy compound is organic electroluminescence
The 70 weight % or more for the curability compound total amount (100 weight %) for including in encapsulating luminescent element composition.
[16] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[15], wherein ingredient
(D) be average grain diameter it is 0.001~30 μm of inorganic filler.
[17] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[16], wherein ingredient
(D) it is flat inorganic filler.
[18] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[17], wherein opposite
The content of 100 parts by weight of curability compound for including in sealing organic electroluminescent element composition, ingredient (D) is 30
~70 parts by weight.
[19] the sealing organic electroluminescent element composition described in any one of above-mentioned [1]~[18], viscosity (25
DEG C, shear velocity:20 (1/s)) it is 10,000~2,000,000 mPas.
[20] manufacturing method of organic electroluminescence device, have include following 1~3 organic electroluminescent device it is close
Seal process.
1：It is formed in the sealing organic electroluminescent element composition covered described in any one of coating [1]~[19]
Box dam；
2：Illumination is implemented to box dam；
3：Fitting is provided with the substrate of organic electroluminescent device and implements to heat on the lid with the box dam after illumination
Processing.
[21] organic electroluminescence device, have in a manner of the periphery for surrounding organic electroluminescent device configured with by
[1] composition for the box dam that the solidfied material of the sealing organic electroluminescent element composition described in any one of~[19] is formed.
[22] organic electroluminescence device described in above-mentioned [21], wherein sealing organic electroluminescent element composition
Solidfied material vapor transfer rate be 150g/m2Dayatm or less.
[23] organic electroluminescence device described in above-mentioned [21] or [22], wherein sealing organic electroluminescent element is used
The capacity of the solidfied material of composition is 90ppm or less.
The effect of invention
The organic EL element composition for sealing of the present invention is due to above-mentioned composition, even if being applied to by the composition
It is distributed in the box dam irradiation UV for covering and being formed, can also inhibit cured progress until implementing the until of heating, even if with
The fitting operation having between the substrate of organic EL element is slow, and fitting will not be caused to become difficult because losing cementability.
In turn, by implementing to heat after fitting, solidification can be made to carry out, organic EL element can be directly exposed to UV
In in the case of realize sealing.In addition, can to form moisture resistance excellent, simultaneously for the organic EL element composition for sealing of the present invention
The also solidfied material with low venting quality, can prevent the deterioration of the organic EL element caused by being vented.
Therefore, organic EL element composition for sealing of the invention can be sealed with suitable for being used as using box dam completion method
Box dam materials'use when machine EL element (especially top emission type organic EL element).
In addition, the organic EL element composition for sealing of the present invention is used as the box dam when being sealed using box dam completion method
Organic EL device obtained from material is sealed has the excellent characteristics of luminescence, long lifespan and reliability height.
Description of the drawings
[Fig. 1] shows to have used the manufacturing method of the organic EL device of the organic EL element composition for sealing of the present invention
The schematic diagram of an example.
Symbol description
1 lid (lid)
2 box dams
3 distributors
4 packing materials
5 sealant layers
6 cathodes
7 luminescent layers
8 anodes
9 substrates
Specific implementation mode
[organic EL element composition for sealing]
The organic EL element composition for sealing (hereinafter also referred to " composition for sealing ") of the present invention contains following compositions
(A), ingredient (B), ingredient (C), ingredient (D).
Ingredient (A)：There are 2 or more in 1 molecule and be selected from alicyclic epoxy group, the group of oxygen heterocycle butane ring, epithio base
And the cation-curable compound of one or more of vinyl ether group group (remove by the compound for belonging to ingredient (C)
Outside)
Ingredient (B)：Light cationic polymerization initiator
Ingredient (C)：In N- glycidyl compounds, N- vinyl compounds and N- allyl compounds at least
A kind of compound (except N- glycidyl isocyanurates)
Ingredient (D)：Inorganic filler
It should be noted that in the present specification, the alicyclic epoxy group refers to, by the adjacent 2 carbon originals for constituting alicyclic ring
The sub group for being mutually bonded and being formed with 1 oxygen atom, it can be mentioned, for example epoxycyclohexyls etc..
(ingredient (A))
Ingredient (A) in the present invention is that there are 2 or more to be selected from alicyclic epoxy group, oxygen heterocycle butane ring in 1 molecule
The cation-curable compound of one or more of group, epithio base and vinyl ether group group, belongs to ingredient (C)
Compound except.
As the compound (hereinafter also referred to " alicyclic epoxy with 2 or more above-mentioned alicyclic epoxy groups in 1 molecule
Close object "), following formula (a) compound represented can be enumerated.
[chemical formula 3]
In above-mentioned formula (a), R1~R18It is identical or different, it indicates hydrogen atom, halogen atom, optionally include oxygen atom or halogen atom
Alkyl or optionally with substituent group alkoxy.
As R1~R18In halogen atom, it can be mentioned, for example：Fluorine atom, chlorine atom, bromine atom, iodine atom etc..
As R1~R18In alkyl, it can be mentioned, for example：Aliphatic alkyl, alicyclic type hydrocarbon, aromatic hydrocarbyl and by this
2 or more in groups are via group made of singly bound a bit.
As above-mentioned aliphatic alkyl, it can be mentioned, for example：It is methyl, ethyl, propyl, isopropyl, butyl, hexyl, octyl, different
The C such as octyl, decyl, dodecyl1-20Alkyl (preferably C1-10Alkyl, particularly preferably C1-4Alkyl)；Vinyl, allyl,
Methacrylic, 1- acrylic, isopropenyl, 1- cyclobutenyls, 2- cyclobutenyls, 3- cyclobutenyls, 1- pentenyls, 2- pentenyls, 3-
The C such as pentenyl, 4- pentenyls, 5- hexenyls2-20Alkenyl (preferably C2-10Alkenyl, particularly preferably C2-4Alkenyl)；Acetenyl, third
The C such as alkynyl2-20Alkynyl (preferably C2-10Alkynyl, particularly preferably C2-4Alkynyl) etc..
As above-mentioned alicyclic type hydrocarbon, it can be mentioned, for example：Cyclopropyl, cyclobutyl, cyclopenta, cyclohexyl, cyclo-dodecyl
Equal C3-12Naphthenic base；The C such as cyclohexenyl group3-12Cycloalkenyl group；The C such as bicycloheptyl, bicycloheptene base4-15Endocyclic alkyl etc..
As above-mentioned aromatic hydrocarbyl, it can be mentioned, for example：The C such as phenyl, naphthalene6-14Aryl (preferably C6-10Aryl) etc..
In addition, as by 2 or more in above-mentioned aliphatic alkyl, alicyclic type hydrocarbon and aromatic hydrocarbyl via list
Group made of key bonding, it can be mentioned, for example：The C such as cyclohexyl methyl3-12Naphthenic base replaces C1-20Alkyl；Methylcyclohexyl etc.
C1-20Alkyl replaces C3-12Naphthenic base；The C such as benzyl, phenethyl7-18Aralkyl is (in particular, C7-10Aralkyl)；The C such as cinnamyl6-14
Aryl replaces C2-20Alkenyl；The C such as tolyl1-20Alkyl replaces C6-14Aryl；The C such as styryl2-20Alkenyl replaces C6-14Aryl etc..
As R1~R18In the optionally alkyl comprising oxygen atom or halogen atom, at least one in above-mentioned alkyl can be enumerated
Hydrogen atom by with oxygen atom group or halogen atom replace made of group etc..It, can as the above-mentioned group with oxygen atom
It enumerates for example：Hydroxyl；Hydroperoxy；The C such as methoxyl group, ethyoxyl, propoxyl group, isopropoxy, butoxy, isobutoxy1-10Alkane
Oxygroup；The C such as allyloxy2-10Alkenyloxy group；Optionally have and is selected from C1-10Alkyl, C2-10Alkenyl, halogen atom and C1-10In alkoxy
The C of substituent group6-14Aryloxy group (for example, toloxyl, naphthoxy etc.)；The C such as benzyloxy, benzene ethyoxyl7-18Aralkoxy；Acetyl
The C such as oxygroup, propionyloxy, (methyl) acryloxy, benzoyloxy1-10Acyloxy；Methoxycarbonyl, ethoxy carbonyl,
The C such as propoxycarbonyl, butoxy carbonyl1-10Alkoxy carbonyl；Optionally have and is selected from C1-10Alkyl, C2-10Alkenyl, halogen atom and
C1-10The C of substituent group in alkoxy6-14Aryloxycarbonyl is (for example, phenyloxycarbonyl, toloxyl carbonyl, naphthoxycarbonyl
Deng)；The C such as benzyloxycarbonyl7-18Aromatic alkoxy carbonyl；The group containing epoxy group such as glycidyl oxygroup；Ethyl oxa- ring fourth
The group of the oxygen heterocycle butyl such as oxygroup；The C such as acetyl group, propiono, benzoyl1-10Acyl group；Isocyanate group；Sulfo group；Ammonia
Base formoxyl；Oxo base；By 2 or more in these via singly-bound or C1-10Group etc. made of the bondings such as alkylidene.
As R1~R18In alkoxy, it can be mentioned, for example：Methoxyl group, ethyoxyl, propoxyl group, isopropoxy, butoxy,
The C such as isobutoxy1-10Alkoxy.
As the substituent group that above-mentioned alkoxy optionally has, it can be mentioned, for example：Halogen atom, hydroxyl, C1-10Alkoxy,
C2-10Alkenyloxy group, C6-14Aryloxy group, C1-10Acyloxy, sulfydryl, C1-10Alkylthio group, C2-10Alkenylthio group, C6-14Arylthio, C7-18Aralkyl
Sulfenyl, carboxyl, C1-10Alkoxy carbonyl, C6-14Aryloxycarbonyl, C7-18Aromatic alkoxy carbonyl, amino, list or two C1-10Alkyl ammonia
Base, C1-10Acyl amino, the group containing epoxy group, the group of oxygen heterocycle butyl, C1-10Acyl group, oxo base and by these
2 or more via singly-bound or C1-10Group etc. made of the bondings such as alkylidene.
In above-mentioned formula (a), X indicates singly-bound or links group (bivalent group with 1 or more atom).As above-mentioned company
Group is tied, it can be mentioned, for example：Epoxidised alkenylene, carbonyl, ether has occurred in some or all of bivalent hydrocarbon radical, carbon-to-carbon double bond
Key, ester bond, carbonate group, amide groups and by multiple groups etc. to link in them.
As above-mentioned bivalent hydrocarbon radical, it can be mentioned, for example：The alkylidene of straight-chain or branched that carbon atom number is 1~18,
The alicyclic type hydrocarbon etc. of divalent.As carbon atom number be 1~18 straight-chain or branched alkylidene, it can be mentioned, for example：It is sub-
Methyl, methylmethylene, dimethylated methylene base, ethylidene, propylidene, trimethylene etc..Ester ring type hydrocarbon as above-mentioned divalent
Base, it can be mentioned, for example：1,2- cyclopentylenes, 1,3- cyclopentylenes, cyclopentylidene, 1,2- cyclohexylidenes, 1,3- cyclohexylidenes, 1,4-
Cycloalkylidenes such as cyclohexylidene, cyclohexylidene (including cycloalkanes fork) etc..
Epoxidised alkenylene (also referred to as " epoxidation Asia alkene has occurred as some or all of above-mentioned carbon-to-carbon double bond
Base ") in alkenylene, it can be mentioned, for example：Ethenylidene, allylidene, 1- butenylidenes, 2- butenylidenes, Aden's dialkylene,
The straight-chain of carbon atom numbers 2~8 or the alkenylenes etc. of branched such as inferior pentenyl, sub- hexenyl, heptene base, sub- octenyl.
In particular, as above-mentioned epoxidation alkenylene, epoxidised alkenylene has occurred in the whole of preferably carbon-to-carbon double bond, more preferably
The alkenylene of epoxidised carbon atom number 2~4 has occurred for the whole of carbon-to-carbon double bond.
It is specific enumerable as the connection group X in above-mentioned X, particularly preferably the connection group containing oxygen atom：-
CO-、-O-CO-O-、-COO-、-O-、-CONH-；By multiple groups to link in these groups；By in these groups
1 or 2 or more with above-mentioned bivalent hydrocarbon radical in 1 or 2 or more the group etc. to link.
As the typical example of cycloaliphatic epoxy shown in above-mentioned formula (a), it can be mentioned, for example：(3,4,3 ', 4 '-two
Epoxy) join hexamethylene, bis- (3,4- epoxycyclohexyl-methyls) ethers, bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases) second of 1,2- epoxies-1,2-
Bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases) propane of alkane, 2,2-, bis- (3,4- 7-oxa-bicyclo[4.1.0-1- bases) ethane of 1,2- or following formula
(1)~(10) compound represented etc..It should be noted that the L in following formula (5) is the alkylidene of carbon atom number 1~8,
In preferably carbon atom number 1~3 straight-chain or branched alkylidene.N in following formula (5), (7), (9), (10)1~n8
It is identical or different, indicate 1~30 integer.
[chemical formula 4]
[chemical formula 5]
As cycloaliphatic epoxy, wherein excellent from curability, can obtain with heat resistance (high glass transition
Temperature) and low-shrinkage or the solidfied material of low linear expansion from the perspective of, it is preferable to use (3,4,3 ', 4 '-diepoxy) join
Hexamethylene and/or bis- (3,4- epoxycyclohexyl-methyls) ethers.From the viewpoint of can be obtained the excellent solidfied material of moisture resistance, preferably
(3,4,3 ', 4 '-diepoxy) joins hexamethylene.
As in 1 molecule with 2 or more above-mentioned oxygen heterocycle butane rings group compound, it can be mentioned, for example：1,
Bis- [(3- ethyl -3- oxetanylmethoxies methoxyl group) methyl] benzene of 4-, bis- { [1- ethyls (3- oxetanylmethoxies)] methyl } ethers, 4,
4 '-bis- [(3- ethyl -3- oxetanylmethoxies) methoxies] join hexamethylene, bis- [(3- ethyl -3- oxetanylmethoxies) first of 1,4-
Oxygroup methyl] hexamethylene, 3- ethyls -3 { [(3- Ethyloxetane -3- bases) methoxyl group] methyl } oxetanes, phenol
Phenolic varnish type oxetanes etc..It can use such as trade name " ETERNACOLL OXBP " (the emerging production (strain) in space portion is made)
Commercially available product.
As in 1 molecule with 2 or more above-mentioned epithio bases compound, it can be mentioned, for example：Bis- (the β-epithio rosickyite of 1,3-
Base) hexamethylene, bis- (β-epithio propylsulfanylmethyl) hexamethylenes of 1,3-, bis- [4- (β-epithio rosickyite base) cyclohexyl] methane, 2,2-
Bis- [4- (β-epithio rosickyite base) cyclohexyl] propane, bis- [4- (β-epithio rosickyite base) cyclohexyl] thioethers, the bis- (β-epithios third of 2,5-
Sulfenyl) epithio with alicyclic ring such as -1,4- dithiane, bis- (β-epithio rosickyite base the Ethylsulfanylmethyl) -1,4- dithiane of 2,5-
Close object；Bis- (β-epithio rosickyite base) benzene of 1,3-, bis- (β-epithio propylsulfanylmethyl) benzene of 1,3-, bis- [4- (β-epithio rosickyite base) benzene
Base] methane, bis- [4- (β-epithio rosickyite base) phenyl] propane of 2,2-, bis- [4- (β-epithio rosickyite base) phenyl] thioethers, bis- [4-
(β-epithio rosickyite base) phenyl] episulfide compounds with aromatic ring such as sulfonium compound, bis- (β-epithio rosickyite base) biphenyl of 4,4-；2-
Bis- [(2- β-epithio rosickyite base ethyl) sulphur of bis- (β-epithio rosickyite base) propane of (2- β-epithio rosickyite base ethylmercapto group) -1,3-, 1,2-
Base] -3- (β-epithio rosickyite base) propane, four (β-epithio propylsulfanylmethyl) methane, 1,1,1- tri- (β-epithio propylsulfanylmethyl)
The alkyl thioethers type ring sulphur compound such as propane；Bis- { 4- [2- (the 2,3- epithios propoxyl group) ethyoxyl] phenyl } fluorenes of 9,9-, 9,9- are bis-
{ 4- [2- (2,3- epithios propoxyl group) ethyoxyl] -3- aminomethyl phenyls } fluorenes, bis- { 4- [2- (the 2,3- epithios propoxyl group) ethoxies of 9,9-
Base] -3,5- 3,5-dimethylphenyls fluorenes, bis- { 4- [2- (2,3- epithios propoxyl group) the ethyoxyl] -3- phenyls } fluorenes of 9,9-, 9,9-
Bis- { 6- [2- (2,3- epithios propoxyl group) ethyoxyl] -2- naphthalenes } fluorenes, bis- { 5- [2- (the 2,3- epithios propoxyl group) ethoxies of 9,9-
Base] -1- naphthalenes } episulfide compounds etc. with fluorene skeleton such as fluorenes.
As in 1 molecule with 2 or more above-mentioned vinyl ether groups compound, it can be mentioned, for example：Isobide diethyl
Ring-type ether type vinyl ether compound (oxirane ring, the oxetanes such as alkene ether, hydroxy norbomene divinyl ether
Ring, tetrahydrofuran ring etc. have the vinyl ether compound of cyclic ether group)；The aryl divinyl ether such as quinhydrones divinyl ether
Compound；1,4- butanediol divinyl ethers etc. have the vinyl ether compound of chain alkyl；Triethyleneglycol divinylether
Equal chains ether type vinyl ether compound；Hexamethylene divinyl ether, cyclohexanedimethanol divinyl base ether etc. have cyclic hydrocarbon
The vinyl ether compound of base.
Ingredient (A) can be used alone, or two or more is applied in combination.It is wrapped in the composition for sealing of the present invention
In the curability compound total amount (100 weight %) contained, the content (use level) of ingredient (A) is, for example, 15~50 weight % left
Right, preferably 20~40 weight %.When containing ingredient (A) with above range, it can inhibit solid during wishing solidification delay
The progress of change, and be promptly cured after implementing heat treatment, it is preferred in this regard.Ingredient (A's) contains
When amount is less than above range, exists and be difficult to obtain the tendency of sufficient curing rate implementing heat treatment.On the other hand,
When the content of ingredient (A) is more than above range, there is the tendency for being difficult to obtain sufficient solidification delay effect.
(ingredient (B))
Ingredient (B) in the present invention is to generate cation kind, by illumination to cause cation-curable compound
Curing reaction light cationic polymerization initiator.Light cationic polymerization initiator includes light absorbing cation portion and becomes sour
Occurring source anion portion.
As the light cationic polymerization initiator in the present invention, it can be mentioned, for example：DiazoniumSalt compounds, iodineSalt
Class compound, sulfonium salt compounds,Salt compounds, selenium salt compounds, oxygenSalt compounds, ammonium salt compounds,
Bromine salt compounds etc..Wherein, from can be formed from the aspect of excellent curability solidfied material, it is preferable to use sulfonium salt class chemical combination
Object.
As the cationic portion of sulfonium salt compounds, it can be mentioned, for example：Triphenylsulfonium ion, diphenyl [4- (thiophenyl)
Phenyl] the aryl sulfonium cation (in particular, triaryl matte ion) such as sulfonium cation, tri-p-tolylsulfonium ion.
As the anion portion of light cationic polymerization initiator, it can be mentioned, for example：[(Y)kB(Phf)4-k]-(in formula, Y is indicated
Phenyl or xenyl.Phf indicates at least one hydrogen atom by least one in perfluoroalkyl, perfluoro alkoxy and halogen atom
Phenyl made of kind substitution.K be 0~3 integer), BF4 -、B(C6F5)4 -、PF6 -、[(Rf)nPF6-n]-(Rf:The 80% of hydrogen atom
Alkyl, n made of being replaced by fluorine atoms above:1~5 integer), AsF6 -、SbF6 -、SbF5OH-Deng.
As the light cationic polymerization initiator in the present invention, it can be mentioned, for example：4- (4- xenyls sulfenyl) phenyl -4- connection
Phenyl sulfonium four (pentafluorophenyl group) borate, diphenyl [4- (phenylsulfartyl) phenyl] sulfonium four (pentafluorophenyl group) borate, two
Phenyl [4- (phenylsulfartyl) phenyl] sulfonium hexafluorophosphate, three (five fluorine of 4- (4- xenyls sulfenyl) phenyl -4- xenyl phenyl sulfonium
Ethyl) three fluorophosphates, three (pentafluorophenyl group) borate of 4- (phenylsulfartyl) phenyl diphenyl sulfonium phenyl, [4- (4- xenyl sulphur
Base) phenyl] three (pentafluorophenyl group) borate of -4- xenyl phenyl sulfoniums phenyl, trade name " CYRACURE UVI-6970 ",
" CYRACURE UVI-6974 ", " CYRACURE UVI-6990 ", " CYRACURE UVI-950 " (are carbonized by American Association above
Object corporation), " IRGACURE 250 ", " IRGACURE 261 ", " IRGACURE 264 " (above by BASF AG's system),
" Optomer SP-150 ", " Optomer SP-151 ", " Optomer SP-170 ", " Optomer SP-171 " (above by
(strain) ADEKA systems), " CG-24-61 " (Ciba Japan corporations), " DAICAT II " ((strain) Daicel systems),
" UVAC1590 ", " UVAC1591 " (being made above by Daicel-Cytec (strain)), " CI-2064 ", " CI-2639 ", " CI-
2624 ", " CI-2481 ", " CI-2734 ", " CI-2855 ", " CI-2823 ", " CI-2758 ", " CIT-1682 " are (above by Japan
Cao Da (strain) make), " PI-2074 " (Rhodia corporations, four (pentafluorophenylboronic acid salt) tolyl cumenyl iodineSalt),
" FFC509 " (3M corporations), " BBI-102 ", " BBI-101 ", " BBI-103 ", " MPI-103 ", " TPS-103 ", " MDS-
103 ", " DTS-103 ", " NAT-103 ", " NDS-103 " (being made above by Midori Kagaku (strain)), " CD-1010 ", " CD-
1011 ", " CD-1012 " (Sartomer America corporations), " CPI-100P ", " CPI-101A " are (above by SAN-APRO
(strain) makes) etc..These can be used alone, or two or more is applied in combination.
The cation-curable compound for including in composition for sealing relative to the present invention is (containing two or more feelings
It is its total amount under condition) 100 parts by weight, usage amount (or the use level of ingredient (B)；It is that it is total in the case of two or more
Amount) it is, for example, 0.05~4 parts by weight or so, preferably 0.2~3 parts by weight, particularly preferably 0.5~3 parts by weight.
(ingredient (C))
Containing selected from N- glycidyl compounds, N- vinyl compounds and N- alkene in the composition for sealing of the present invention
At least one of compound compound is as ingredient (C).N- glycidyl compounds etc. are relative to by light cation
The cation that polymerization initiator generates shows alkalescent, therefore has capture due to implementing illumination by light cationic polymerization initiator
The effect of the cation of generation, to play the effect for inhibiting cured progress until implementing the until of heating after illumination
Fruit or solidification delay effect.That is, in the present invention, N- glycidyl compounds etc. are cure retarder.In addition, in illumination
Implement that when heat treatment captured cation can be released afterwards, to make the solidification of composition for sealing carry out.Thereby, it is possible to
Control cured beginning period by adjusting the opportunity for implementing heat treatment, so as to prevent because fitting operation it is slow due to
The generation for the case where causing fitting to become difficult.N- glycidyl compounds etc. can be used alone, or by 2 kinds with
On be applied in combination.
N- glycidyl compounds in the present invention etc. are that have in glycidyl, vinyl and allyl
The compound of structure made of nitrogen-atoms of at least one group bonding in the compound of nitrogen atom, including such as following formula
(c-1) compound represented, following formula (c-2) compound represented.
[chemical formula 6]
In above-mentioned formula (c-1), RaIndicate the structural formula from hydrocarbon, the structural formula of heterocycle or by hydrocarbon and heterocycle via singly-bound key
Group made of t hydrogen atom is removed in structural formula made of conjunction.RbIndicate hydrogen atom or selected from alkyl, heterocycle and by this
A little groups (2 or more the groups in alkyl and heterocycle) are via the group in group made of singly bound.RcIt indicates
Selected from least one of glycidyl, vinyl and allyl group.S indicates 1 or 2, and t indicates 1 or more integer.T is 2
In the case of above, the group in 2 or more square brackets respectively can be the same or different.
In addition, in above-mentioned formula (c-2), ring Z indicates the heterocycle for including nitrogen-atoms, RcIt indicates selected from glycidyl, ethylene
At least one of base and allyl group.In the case that u indicates that 1 or more integer, u are 2 or more, include in ring Z 2 with
Upper nitrogen-atoms can also be bonded with Direct Bonding via other atoms (such as carbon atom etc.).
Above-mentioned RaIt indicates the structural formula from hydrocarbon, the structural formula of heterocycle or is tied via made of singly bound by hydrocarbon and heterocycle
Group made of t hydrogen atom is removed in structure formula.
Above-mentioned hydrocarbon includes：The chemical combination that aliphatic hydrocarbon, ester ring type hydrocarbon, aromatic hydrocarbon and these hydrocarbon are combined into via singly-bound
Object.
As above-mentioned aliphatic hydrocarbon, preferably C1-20Aliphatic hydrocarbon.
As above-mentioned ester ring type hydrocarbon, preferably C3-20Ester ring type hydrocarbon.
As above-mentioned aromatic hydrocarbon, preferably C6-14(especially C6-10) aromatic hydrocarbon.
Above-mentioned heterocycle includes aromatic series heterocycle and non-aromatic heterocycle.As such heterocycle, composition ring can be enumerated
Atom there are 3~10 membered rings of carbon atom and at least one kind of hetero atom (for example, oxygen atom, sulphur atom, nitrogen-atoms etc.) (preferably
For 4~6 membered rings) and their fused rings.It is specific enumerable：Including oxygen atom as heteroatomic heterocycle (for example, furan nucleus,
Morpholine ring etc.), comprising sulphur atom as heteroatomic heterocycle (for example, thiphene ring, thiazole ring etc.), comprising nitrogen-atoms as miscellaneous original
The heterocycle of son is (for example, pyrrole ring, pyrrolidine ring, pyrazole ring, imidazole ring, triazole ring, isocyanide urea ring, pyridine ring, pyridazine ring, phonetic
It is phenazine ring, pyridine ring, piperidine ring, piperazine ring etc., indole ring, indole ring, quinoline ring, acridine ring, naphthyridines ring, quinazoline ring, fast
Purine ring etc.) etc..
Above-mentioned hydrocarbon, heterocycle can also be bonded with various substituent groups [halogen atom, oxo base, hydroxyl, substituted oxy (for example,
C1-4Alkoxy, C6-10Aryloxy group, C7-16Aralkoxy, C1-4Acyloxy etc.), carboxyl, substituted oxy carbonyl is (for example, C1-4Alcoxyl
Base carbonyl, C6-10Aryloxycarbonyl, C7-16Aromatic alkoxy carbonyl etc.), substituted or unsubstituted carbamoyl is (for example, carbamyl
Base, C1-4Alkyl-substituted amino formoxyl, C6-10Aryl substituted-amino formoxyl), cyano, nitro, sulfo group, glycidyl ether
Base etc.].In addition, ester ring type hydrocarbon, aromatic hydrocarbon ring on can also condense the heterocycle of aromatic series or non-aromatic.
As above-mentioned Ra, wherein preferably comprising selected from least one of aliphatic hydrocarbon, aromatic hydrocarbon and heterocycle ring
The t valence groups of carbon atom number 5~20.
R in above-mentioned formulabIn alkyl include：Aliphatic alkyl, alicyclic type hydrocarbon and aromatic hydrocarbyl and by this
2 or more in groups are via group made of singly bound a bit.
As above-mentioned aliphatic alkyl, preferably C1-20(=carbon atom number 1~20) aliphatic alkyl, example can be enumerated
Such as：C1-20(preferably C1-10, particularly preferably C1-3) left and right alkyl；C2-20(preferably C2-10, particularly preferably C2-3) left and right
Alkenyl；C2-20(preferably C2-10, particularly preferably C2-3) left and right alkynyl etc..
As above-mentioned alicyclic type hydrocarbon, preferably C3-20(=3~20 yuan) alicyclic type hydrocarbon, it can be mentioned, for example：Cyclopenta,
The C such as cyclohexyl3-20(preferably C3-15, particularly preferably C5-8) left and right naphthenic base；The C such as cyclopentenyl, cyclohexenyl group3-20It is (excellent
It is selected as C3-15, particularly preferably C5-8) left and right cycloalkenyl group；Endocyclics alkyl such as norborny etc..
As above-mentioned aromatic hydrocarbyl, preferably C6-14(especially C6-10) aromatic hydrocarbyl, it can be mentioned, for example phenyl etc..
R in above-mentioned formulabIn heterocycle be from the structural formula of heterocycle remove 1 hydrogen atom made of group, as
Above-mentioned heterocycle, can enumerate and RaIn the same example of heterocycle.
It, can also be with R on above-mentioned alkyl, heterocycleaIn hydrocarbon, heterocycle be similarly bonded with various substituent groups.In addition,
Alicyclic type hydrocarbon, aromatic hydrocarbyl ring on can also condense the heterocycle of aromatic series or non-aromatic.
Above-mentioned s indicates 1 or 2, preferably 2.
The integer that above-mentioned t is 1 or more, for example, 1~4.
In addition, the product (s × t) of above-mentioned s and t is, for example, 1 or more integer, preferably 2~4.
Above-mentioned ring Z is the heterocycle for including nitrogen-atoms, it can be mentioned, for example：Pyrrolidine ring, piperidine ring, piperazine ring, morpholine ring, miaow
5~10 membered rings such as azoles ring, glycoluril ring (preferably 6~8 membered rings).
The integer that above-mentioned u is 1 or more, for example, 1~4.
N- glycidyl compounds can for example be manufactured by so that epoxychloropropane is reacted with the compound of nitrogen atom.
For example, following formula (c-1-1) compound represented can be by making epoxychloropropane and nitrogen atom shown in following formula (c-1 ')
Compound reaction and manufacture, following formula (c-2-1) compound represented can be by making epoxychloropropane and following formula (c-2 ')
Shown in nitrogen atom compound reaction and manufacture.It should be noted that in following formula (c-1 '), Ra、Rb, s, t be same as above.Separately
Outside, in following formula (c-2 '), ring Z, u are same as above.
[chemical formula 7]
As the compound of nitrogen atom shown in formula (c-1 '), it can be mentioned, for example：Diethylamine, diethylenetriamines, three
The chain fatties such as ethylene tetra, tetren race amine compounds；4,4 '-di-2-ethylhexylphosphine oxides (2- methylcyclohexyls amine),
The annular aliphatics such as alkane diamines, isophorone diamine, 4,4 '-di-2-ethylhexylphosphine oxides (cyclo-hexylamine), the bis- aminomethyl cyclohexanes of 1,3-
Amine compounds；M-xylene diamine, 2,4,6- tri- (dimethylaminomethyl) phenol, m-phenylene diamine (MPD), diaminodiphenyl-methane,
Aromatic amines compounds such as diamino diphenyl sulfone etc..
As the compound of nitrogen atom shown in above-mentioned formula (c-2 '), it can be mentioned, for example：Piperidines, pyrrolidines, morpholine, piperazine
The nitrogen-containing heterocycle compounds such as piperazine, N- aminoethylpiperazines, pyrroles, imidazoles, glycoluril.
N- vinyl compounds, N- allyl compounds can also utilize the system based on above-mentioned N- glycidyl compounds
The method of method is made to manufacture.For example, in addition to being used instead of epoxychloropropane in the case where manufacturing N- vinyl compounds
Vinyl chloride is used in the case where manufacturing N- allyl compounds instead of epoxychloropropane other than allyl chloride, may be used
Method same as the above-mentioned manufacturing method of N- glycidyl compounds.
As formula (c-1) compound represented, it can be mentioned, for example：4,4 '-di-2-ethylhexylphosphine oxides (N, N- diglycidyl benzene
Amine), N, N, N ', N '-four glycidyl group -1,3- benzene two (methylamine), N, N, N ', N '-four glycidyl group -1,3- hexamethylenes two
(methylamine), N, N- bisglycidyl base -4- glycidyloxyanilines etc..In the present invention, such as trade name can be used
Commercially available products such as " TETRAD-X " (Mitsubishi's gas chemical (strain) systems).
As formula (c-2) compound represented, it can be mentioned, for example：1,3,4,6- four glycidyl groups glycoluril, 1,3,4,6-
Tetraallyl glycoluril, 1,3- diallyl -4,6- diglycidyl glycolurils etc..In the present invention, such as commodity can be used
The commercially available products such as name " TG-G ", " TA-G ", " DAG-G " (being made above by four countries' chemical conversion industry (strain)).
The ingredient (B) for including in composition for sealing relative to the present invention (is that it is total in the case of two or more
Amount) 1 parts by weight, the usage amount (use level) of ingredient (C) is, for example, 0.05~3 parts by weight, and the upper limit is preferably 2.5 parts by weight, spy
It You Xuanwei not 2.0 parts by weight, most preferably 1.5 parts by weight.Lower limit be preferably 0.1 parts by weight, particularly preferably 0.2 parts by weight,
Most preferably 0.3 parts by weight.From sufficient solidification delay effect aspect can be obtained, preferably contained into above range
Divide (C).When the content of ingredient (C) is less than above range, there is the tendency for being difficult to obtain sufficient solidification delay effect.Another party
Face when the content of ingredient (C) is more than above range, exists and is difficult to obtain sufficient curing rate implementing heat treatment
Tendency, it some times happens that solidification is bad.
(ingredient (D))
The composition for sealing of the present invention contains inorganic filling material as ingredient (D).It can obtain having as a result, excellent anti-
Moist solidfied material.
As above-mentioned inorganic filling material, it can be mentioned, for example：The inorganic oxygen such as silica, aluminium oxide, zinc oxide, magnesia
Compound；The carbonate such as calcium carbonate, magnesium carbonate；Silicates such as calcium silicates, bead, talcum, clay, mica etc..
In the present invention, wherein coating pressure when from due to relative to distribution has linear response therefore coating
, it is preferable to use the silicates such as talcum, mica from the perspective of excellent.The average grain diameter of inorganic particles (is based on laser diffraction/scattering
Method (micro- tracing)) it is, for example, 0.001~30 μm, preferably 0.1~10 μm.
In addition, the shape of inorganic filling material is not particularly limited, it can be mentioned, for example：Spherical (just spherical, closely just spherical,
It is oval spherical etc.), polyhedral, rodlike (cylindric, prism-shaped etc.), tabular, flakey, irregular shape etc..Wherein, from
It can assign from the perspective of superior moisture resistance, it is preferable to use flat inorganic filling material.
Relative to 100 parts by weight of curability compound for including in composition for sealing, above-mentioned inorganic filling material contains
Amount for example, 30~70 parts by weight or so, preferably 40~60 parts by weight, particularly preferably 45~60 parts by weight.By with above-mentioned
Range contains inorganic filling material, can get the solidfied material with excellent moisture resistance.The content of inorganic filling material is higher than above-mentioned
When range, there is the tendency for causing viscosity to become excessively high coating reduction.On the other hand, the content of inorganic filling material is less than
When above range, sometimes results in moisture resistance and become inadequate.
(additive)
In the composition for sealing of the present invention other than mentioned component, one or two can also be contained as needed
Above other ingredients.As above-mentioned other ingredients, it can be mentioned, for example：Curability compound, conduction other than mentioned component (A)
Property material, polymerization inhibitor, silane coupling agent, antioxidant, light stabilizer, plasticizer, levelling agent, antifoaming agent, solvent, ultraviolet radiation absorption
Agent, ionic adsorption body, pigment, fluorophor, releasing agent etc..
(ingredient (E))
Can also include the mentioned component of one or more as ingredient (E) in the composition for sealing of the present invention
(A) curability compound other than (except being contained in the compound of ingredient (C) also).
As the curability compound other than mentioned component (A), it can be mentioned, for example：Compound with epoxy group has
The cation-curables compounds such as the compound of vinyl, compound with allyl.
The above-mentioned compound with epoxy group includes for example：Compound, alicyclic ring in 1 molecule with 1 alicyclic epoxy group
On directly have the compound of epoxy group, glycidyl ethers epoxide, glycidyl esters epoxy with singly bound
Compound etc..
As in 1 molecule with 1 above-mentioned alicyclic epoxy group compound, it can be mentioned, for example：1,2:8,9- diepoxy lemons
Lemon alkene, 1,2- epoxy -4- vinyl cyclohexanes etc..
As the compound for directly having epoxy group on above-mentioned alicyclic ring with singly bound, it can be mentioned, for example：Bis- (the hydroxyl first of 2,2-
Base)-n-butyl alcohol 1,2- epoxies -4- (2- epoxy ethyls) hexamethylene addition product (trade name " EHPE3150 ", (strain) Daicel
System) etc..
As above-mentioned glycidyl ethers epoxide, it can be mentioned, for example：1,6-HD-diglycidyl
Aliphatic obtained from ether, trimethylolpropane-triglycidyl group ether etc. makes epoxychloropropane be reacted with aliphatic polyol
Glycidyl ethers epoxide；Bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol E-type epoxy compound
Object, o-phenyl phenol glycidyl ether, biphenyl phenolic epoxide, phenol novolak-type epoxy compound, cresols phenol
Novolac type ring oxygen compound, the cresol novolak type epoxy compound of bisphenol-A, naphthalene type ring oxygen compound, triphenol methane type
The aromatic glycidyls ether type epoxy compound such as epoxide；Hydrogenated bisphenol A type epoxide (2,2- it is bis- [4- (2,
3- glycidoxies) cyclohexyl] propane, bis- [3,5- dimethyl -4- (2,3- glycidoxies) cyclohexyl] propane of 2,2- and it
The bisphenol A type epoxy compounds such as polymer it is hydrogenated made of compound), A Hydrogenated Bisphenol A F type rings oxygen compound (it is bis- [it is adjacent,
O- (2,3- glycidoxies) cyclohexyl] methane, bis- [adjacent, p- (2,3- glycidoxies) cyclohexyl] methane, it is bis- [it is right, it is p-
(2,3- glycidoxies) cyclohexyl] methane, bis- [3,5- dimethyl -4- (2,3- glycidoxies) cyclohexyl] methane and it
Polymer etc.), hydrogenated biphenyl phenolic epoxide, hydrogenation phenol novolak-type epoxy compound, hydrogenation cresols phenol
Novolac type ring oxygen compound, the hydrogenation cresol novolak type epoxy compound of bisphenol-A, hydrogenated naphthalene type ring oxygen compound, hydrogen
Ester ring type contracts obtained from the aromatic glycidyls ether type epoxy compounds such as change triphenol methane type epoxy compound are hydrogenated
Water glyceryl ether type epoxy compound etc..It is, for example, possible to use trade name " YL-983U " (Mitsubishi Chemical's (strain) system), " R1710 "
The commercially available products such as (Printec (strain) systems), " SY-OPG ", " PEG " (above by slope this pharmaceutical industries (strain) system).
As the above-mentioned compound with vinyl, it can be mentioned, for example：Styrene, p-methylstyrene, ethyl styrene,
The styrene compounds such as propylstyrene, isopropyl styrene, p-tert-butylstyrene；N- vinyl carbazoles, N- vinyl
Nitrogen vinyl compound such as pyrrolidones etc..
As the above-mentioned compound with allyl, it can be mentioned, for example：(methyl) allyl acrylate, Malaysia diene acid third
Ester, triallyl cyanurate, diallyl phthalate etc..
In the present invention, wherein from the viewpoint of curing rate at room temperature is slow, use the compound with epoxy group
(there is the compound of 1 or more glycidyl ether in preferably 1 molecule, be particularly preferably aromatic glycidyl ether
Class epoxide is most preferably to have 1 or more glycidyl ether in 1 molecule and without ester bond or polyether structure
Aromatic glycidyl ether type epoxy compound) when, can obtain makes solidification delay while inhibiting the generation of exhaust
Become more stable effect, therefore preferably.
That is, in the composition for sealing of the present invention, as ingredient (E), preferably comprise one or more kinds of with epoxy
Compound (compound, particularly preferably aromatic series contracting in preferably 1 molecule with 1 or more glycidyl ether of base
Water glyceryl ether type epoxy compound, be most preferably there is 1 or more glycidyl ether in 1 molecule and without ester bond and
The aromatic glycidyl ether type epoxy compound of polyether structure) (belonging to except the compound of ingredient (A) and ingredient (C)).
Ingredient (E's) contains in the curability compound total amount (100 weight %) for including in the composition for sealing of the present invention
Amount for example, 10~90 weight % or so, the upper limit are preferably 85 weight %, particularly preferably 80 weight %, are most preferably 75 weights
Measure %.Lower limit is preferably 20 weight %, particularly preferably 30 weight %, is most preferably 50 weight %, especially preferably 60 weights
Measure %.From the aspect that solidification delay can be made to become more stable, ingredient (E) is preferably contained with above range.
In addition, ingredient (A) in the curability compound total amount (100 weight %) for including in the composition for sealing of the present invention
Total content with ingredient (E) be, for example, 70 weight % or more, preferably 80 weight % or more, particularly preferably 90 weight % with
On.It should be noted that the upper limit is 100 weight %.
Further, in the curability compound total amount (100 weight %) for including in the composition for sealing of the present invention, fat
There is 1 or more glycidol in ring type epoxide (especially (3,4,3 ', 4 '-diepoxy) joins hexamethylene) and 1 molecule
Total content of the compound (especially aromatic glycidyl ether type epoxy compound) of base ether is, for example, 70 weight %
Above, it is preferably 80 weight % or more, particularly preferably 90 weight % or more.It should be noted that the upper limit is 100 weight %.
The composition for sealing of the present invention can be by by ingredient (A), ingredient (B), ingredient (C), ingredient (D) and according to need
The other ingredients (for example, ingredient (E) etc.) wanted and used are mixed using rotation-revolution formula churning deaerator, homogenizer, planet
The commonly known mixing such as machine, three-roll grinder, ball mill is mixed with equipment to be manufactured to uniform.It should be noted that respectively at
Divide to mix simultaneously, can also gradually mix.
Viscosity (25 DEG C, shear velocity before the illumination of the composition for sealing of the present invention:20 (1/s)) be, for example, 10,000~
2000000 mPas or so, preferably 20,000~1,500,000 mPas, particularly preferably 20,000~1,000,000 mPas, it is most preferably 50,000
~80 ten thousand mPas, especially preferably 100,000~200,000 mPas.
The composition for sealing of the present invention is cured by implementing heat treatment after implementing illumination.With regard to illumination
Speech, for 100 μm of thickness film the case where, irradiate 500mJ/cm preferably by mercury vapor lamp etc.2Above light.In addition, heating
Processing is preferably by baking oven etc. under such as 40~200 DEG C (be particularly preferably 60~180 DEG C, be most preferably 80~150 DEG C)
It heats 10~200 minutes (being particularly preferably 30~120 minutes).
The composition for sealing of the present invention due to containing the mentioned component (C) with cationic capture effect, even if
Implement illumination, by cationic polymerization initiators generate cation can also capture by ingredient (C), thus can after illumination up to
Inhibit the progress of cationic polymerization before implementing heat treatment.Then, by implementing to heat after illumination, by ingredient (C)
The cation captured is released, complete so as to enable the cationic polymerization of cation-curable compound to carry out
At solidification.That is, cured progress can arbitrarily be controlled by adjusting the opportunity for implementing heat treatment.
Ultraviolet light (exposure is irradiated to the composition for sealing of the present invention using the mercury vapor lamp of 200W/cm:2000mJ/
cm2) just after viscosity (25 DEG C, shear velocity:20 (1/s)) it is, for example, 10,000~5,000,000 mPas or so, preferably 50,000
~300 ten thousand mPas, particularly preferably 100,000~2,000,000 mPas.
Ultraviolet light (exposure is irradiated to the composition for sealing of the present invention using the mercury vapor lamp of 200W/cm:2000mJ/
cm2) 30 minutes viscosity (25 DEG C, shear velocities afterwards:20 (1/s)) it is, for example, 10,000~10,000,000 mPas or so, preferably 5
Ten thousand~7,000,000 mPas, particularly preferably 100,000~5,000,000 mPas.
Ultraviolet light (exposure is irradiated to the composition for sealing of the present invention using the mercury vapor lamp of 200W/cm:2000mJ/
cm2) the viscosity rising degree since just terminating until after irradiation 30 minutes be, for example, 8 times or less (such as 1~8 times), it is excellent
It is selected as 3 times or less, particularly preferably 2 times or less, is most preferably 1.5 times or less.
In addition, the water vapo(u)r transmission of solidfied material obtained from being cured as the above method is low (that is, moisture resistance is excellent), Gu
Compound (thickness:100 μm) vapor transfer rate be, for example, 150g/m2Dayatm or less, preferably 100g/m2Dayatm with
Under, particularly preferably 80g/m2Dayatm or less, it is most preferably 50g/m2Dayatm or less, particularly preferably it is less than
20g/m2·day·atm.It should be noted that above-mentioned vapor transfer rate be based on JIS L 1099 and JIS Z 0208,60 DEG C,
It measures under conditions of 90%RH and is worth obtained from the vapor transfer rate for the solidfied material that thickness is adjusted to 100 μm.
In addition, the capacity from cure retarder of solidfied material obtained from being cured as the above method (60mg) is
90ppm or less degree (preferably 70ppm or less, particularly preferably 50ppm or less), shows low venting quality.It needs to illustrate
It is that capacity can be measured by headspace GC/MS.
The composition for sealing of the present invention has solidification delay, can be arbitrarily adjusted to solidification beginning period.
It therefore, can be not by being heated after so that it is fitted in organic EL element after carrying out illumination to composition for sealing
Organic EL element is exposed in UV and is realized to organic EL members in the case of occurring the case where fitting will not be caused to become difficult
The sealing of part.In addition, the composition for sealing of the present invention can form while have low venting quality and the solidfied material of moisture resistance.Cause
This, box dam when composition for sealing of the invention can be suitable for as using box dam completion method sealing organic electroluminescent device
Materials'use.If using the composition for sealing of the present invention, organic EL element can be protected not invaded by moisture, exhaust
Evil, can prevent the deterioration of the organic EL element caused by moisture, exhaust.
[organic EL device]
The organic EL device of the present invention is the device for having organic EL element, is close using the composition for sealing of the present invention
It seals up made of stating organic EL element, has in a manner of surrounding the periphery of above-mentioned organic EL element configured with by the close of the present invention
The composition for the box dam that the solidfied material of envelope composition is formed.
If using the composition for sealing of the present invention, via including following 1~3 organic EL element sealing process,
It can be realized while preventing from deteriorating caused by illumination to organic EL element (especially top emission type organic EL element)
Sealing, so as to produce long-life and the high organic EL device of reliability.It should be noted that illumination and heat treatment
Method is such as above-mentioned record.
1：Cover coating the present invention composition for sealing and form box dam
2：Illumination is implemented to box dam
3：Fitting is provided with the substrate of organic EL element and implements to heat on the lid with the box dam after illumination
The manufacturing method of organic EL device as the present invention, wherein being preferably provided with：Work is sealed in above-mentioned organic EL element
In sequence 1 after and carry out the process that packing material is filled in 2 box dam that is formed in 1 of forward direction.In addition, as filling material
Material is, it is preferable to use include the solidification compound of ingredient (B) and ingredient (C) in the present invention, in particular, from having and of the invention
The same solidification delay effect of composition for sealing (box dam material), organic EL element can be directly exposed in UV
And from the perspective of being sealed, it is preferable to use containing the present invention in ingredient (A), ingredient (B), ingredient (C) and as needed
Ingredient (E) (preferably to contain ingredient (A), (B), (C), (E) with the identical ratio of composition for sealing of the present invention), and it is viscous
Spend (25 DEG C, shear velocity:20 (1/s)) it is such as 10~10000mPas or so, preferably 20~3000mPas, special
The composition of preferably 30~2500mPas, most preferably 30~1000mPas.
That is, the manufacturing method of the organic EL device as the present invention, preferably with the organic EL element for including following 1~4
Sealing process (referring to Fig. 1).
1：It is coated with the composition for sealing of the present invention on lid (1) and forms box dam (2)
2：Above-mentioned packing material (4) is filled into box dam (2) and forms sealant layer (5)
3：Illumination is implemented to sealant layer (5)
4：Fitting is provided with the substrate of organic EL element (6,7,8) on the lid (1) with the sealant layer (5) after illumination
(9) and implement to heat
As above-mentioned lid (lid) and substrate, it is preferable to use moisture resistance base material, it can be mentioned, for example：Soda-lime glass, alkali-free glass
Equal glass baseplates；The metal bases such as stainless steel, aluminium；Trifluoro polyethylene, polytrifluorochloroethylene (PCTFE), Kynoar
(PVDF), the poly- ethylene fluoride Type of Collective object such as the copolymer of PCTFE and PVDF, PVDF and copolymer of poly- fluorination vinyl chloride, poly-
The polyester such as the cyclenes such as acid imide, makrolon, dicyclopentadiene hydrocarbon resins, polyethylene terephthalate, gather polyethylene
Resin base materials such as styrene etc..Lid and substrate can be formed using identical base material, can also be formed using different base materials, lid
On this point surface is not provided with machine EL element, it is different with substrate.
Above-mentioned organic EL element may include the laminated body of anode/luminescent layer/cathode.SiN can also be set as desired
The passivating films such as film.
As the method for forming box dam with the composition for sealing of the linear coating present invention is being covered, do not limit especially
System, can use the progress such as distributor.
For the thickness of the height of above-mentioned box dam or sealant layer, as long as protecting the components from moisture etc. that can reach
It is then not particularly limited in the range of the purpose of infringement.
As the method for filling packing material into box dam, it is not particularly limited, the progress such as distributor can be used.
According to the above method, due to being to be provided with organic EL to the fitting after the sealant layer covered implements illumination is arranged
The substrate of element, therefore organic EL element will not be directly exposed in UV, can prevent the bad of the organic EL element caused by UV
Change.In addition, the solidfied material of the composition for sealing of the present invention has low venting quality and moisture resistance, organic EL devices of the invention simultaneously
Part has constituting for the outer rim for utilizing the box dam formed by above-mentioned solidfied material to surround organic EL element, therefore can prevent organic EL
Element because moisture, exhaust there are due to deteriorate, the excellent characteristics of luminescence can be kept for a long time.
It is not present using organic EL device obtained by the above method and is drawn due to organic EL element is exposed to when sealing in UV
The deterioration risen, there is the solidfied material of low venting quality and moisture resistance to protect simultaneously, therefore long lifespan and reliability height.
Embodiment
Hereinafter, the present invention is described in more detail in conjunction with the embodiments, but the present invention is not limited to these implementations
Example.It should be noted that viscosity is measured using rheometer (trade name " Physica MCR301 ", Anton Paar corporations)
At 25 DEG C, shear velocity be 20 (1/s) when viscosity.
Embodiment 1
According to the formula (unit described in table:Parts by weight) by each ingredient input rotation-revolution mixing machine (trade name " Awa-
Tori Rentaro (あ わ と り Practice Taros) ARE-310 ", (strain) Thinky systems) in and be stirred, obtained sealing group
Close object (1).
It is coated with gained composition for sealing (1) on the glass substrate and forms film (1) (thickness:100 μm), and utilize water
Silver-colored light irradiation ultraviolet light (exposure:1600mJ/cm2).Before measuring irradiation ultraviolet light, after ultraviolet light irradiation just, it is purple
30 minutes viscosity after outside line irradiation has been calculated after being irradiated to ultraviolet light since just terminating ultraviolet light irradiation 30 points by following formula
Viscosity rising degree during clock.
The viscosity after viscosity/ultraviolet light irradiation just when 30 minutes after viscosity rising degree=ultraviolet light irradiation
Then, the film (1) after ultraviolet light being irradiated heats 1 hour in 100 DEG C, has obtained solidfied material (1) (rear solidification).
For gained solidfied material (1), capacity and water vapo(u)r transmission are had rated using following methods.
Embodiment 2~4, comparative example 1~3
Other than changing formula as described in table, composition for sealing is obtained similarly to Example 1, is obtained
To film and solidfied material is obtained.
For gained solidfied material, capacity and water vapo(u)r transmission are had rated using following methods.
<Capacity>
Capacity (the unit from cure retarder of solidfied material:Ppm) it has been proceed as follows measurement：In phial
Solidfied material 60mg is added, carries out UV irradiations (2000mJ/cm2), 1 hour is stood under conditions of 100 DEG C, then in phial
Capacity be determined.Wherein, using toluene titer [as the toluene of standard substance:100ppm, solvent:Hexane
(60mg)] make standard curve.In addition, as sensing equipment, trade name " HP-6890N " (Hewlett- has been used
Packard corporations), chromatographic column has used trade name " DB-624 " (Agilent corporations).
<Moisture resistance>
For the moisture resistance of solidfied material, based on JIS L 1099 and JIS Z 0208 (Kapp Method) in 60 DEG C, 90%RH items
Solidfied material (thickness is measured under part:100 μm) vapor transfer rate (g/m2Dayatm it) is evaluated.
[table 1]
[table 2]
The compound used in Examples and Comparative Examples is as described below.
(cation-curable compound)
(A)-1：(3,4,3 ', 4 '-diepoxy) joins hexamethylene
(light cationic polymerization initiator)
(B)-1：Four (pentafluorophenyl group) borate of 4- (4- xenyls sulfenyl) phenyl -4- xenyl phenyl sulfonium
(cure retarder)
(C)-1：1,3,4,6- four glycidyl groups glycoluril, trade name " TG-G ", four countries' chemical conversion industry (strain) system
(C)-2：1,3,4,6- tetraallyls glycoluril, trade name " TA-G ", four countries' chemical conversion industry (strain) system
(C)-3：N, N, N ', N '-four glycidyl group -1,3- benzene two (methylamine), trade name " TETRAD-X ", Mitsubishi's gas
Chemical (strain) system
(C)-4：Crown ether, trade name " 18-Crown-6 ", Japanese Cao make up to (strain)
(C)-5：Bis- (triethylene glycol glycidyl ether) ethers of bisphenol-A, trade name " RIKARESIN BEO-60E ", new day
This physics and chemistry (strain) is made
(C)-6：1,3,5- tri- (4,5- epoxypentyls) -1,3,5- triazine -2,4,6- triketones, trade name " TEPIC-VL ",
Nissan Chemical Industries (strain) are made
(inorganic filling material)
(D)-1：Talcum, 1.5 μm of average grain diameter, tabular particle, trade name " FG-15 ", Nippon Talc (strain) systems
(D)-2：Mica, 3.4~5.5 μm of average grain diameter, tabular particle, trade name " MK-100 ", CO-OP
Chemical (strain) makes
(other cation-curable compounds)
(E)-1：Liquid bisphenol F diglycidyl ethers, trade name " YL-983U ", Mitsubishi Chemical's (strain) system
(E)-2：O-phenyl phenol glycidyl ether, trade name " SY-OPG ", slope this pharmaceutical industries (strain) system
Industrial applicibility
For the organic EL element composition for sealing of the present invention, even if being formed in the box dam irradiation covered to coating
UV can also inhibit cured progress, even if with having between the substrate of organic EL element until implementing the until of heating
Fitting operation it is slow, will not cause because losing cementability be bonded become difficult.In turn, by implementing to heat after fitting
Processing, can be such that solidification carries out, and can implement sealing in the case where organic EL element not being directly exposed in UV.In addition,
It is excellent while having the solidfied material of low venting quality, energy that the organic EL element composition for sealing of the present invention can form moisture resistance
Enough prevent the deterioration of the organic EL element caused by being vented.
Therefore, organic EL element composition for sealing of the invention can be suitable for as organic using the sealing of box dam completion method
Box dam materials'use when EL element (especially top emission type organic EL element).
Claims (8)
1. sealing organic electroluminescent element composition is when sealing organic electroluminescent device using box dam completion method
Composition as box dam materials'use, wherein the composition contains following compositions (A), ingredient (B), ingredient (C), ingredient
(D),
Ingredient (A)：There are 2 or more in 1 molecule and be selected from alicyclic epoxy group, the group of oxygen heterocycle butane ring, epithio base and second
The cation-curable compound (belonging to except the compound of ingredient (C)) of one or more of alkenyl ether group；
Ingredient (B)：Light cationic polymerization initiator；
Ingredient (C)：Selected from least one of N- glycidyl compounds, N- vinyl compounds and N- allyl compounds
Compound (except N- glycidyl isocyanurates)；
Ingredient (D)：Inorganic filler.
2. sealing organic electroluminescent element composition according to claim 1, wherein ingredient (C) is following formula (c-
1) compound represented and/or following formula (c-2) compound represented：
In formula (c-1),
RaIt indicates from the structural formula of hydrocarbon, the structural formula of heterocycle or by hydrocarbon and heterocycle via being removed in structural formula made of singly bound
Group made of t hydrogen atom,
RbIndicate hydrogen atom or selected from alkyl, heterocycle and by these groups via the group in group made of singly bound,
RcIt indicates selected from least one of glycidyl, vinyl and allyl group,
S indicates 1 or 2,
T indicates 1 or more integer,
In the case that t is 2 or more, the group in 2 or more square brackets respectively can be the same or different；
In formula (c-2),
Ring Z indicates the heterocycle for including nitrogen-atoms,
RcIt indicates selected from least one of glycidyl, vinyl and allyl group,
U indicates 1 or more integer,
In the case that u is 2 or more, 2 or more nitrogen-atoms for including in ring Z can be with Direct Bonding, can also be via other atoms
Bonding.
3. sealing organic electroluminescent element composition according to claim 1 or 2, wherein relative to ingredient (B) 1
The content of parts by weight, ingredient (C) is 0.05~3 parts by weight.
4. sealing organic electroluminescent element composition described in any one of claim 1 to 3, further contains
Following compositions (E),
Ingredient (E)：The compound with 1 or more glycidyl ether (belongs to the change of ingredient (A) and ingredient (C) in 1 molecule
Except conjunction object).
5. sealing organic electroluminescent element composition according to any one of claims 1 to 4, wherein ingredient (D)
It is the inorganic filler that average grain diameter is 0.001~30 μm.
6. sealing organic electroluminescent element composition according to any one of claims 1 to 5, wherein ingredient (D)
For flat inorganic filler.
7. the manufacturing method of organic electroluminescence device, with the sealing organic electroluminescent element work for including following 1~3
Sequence,
1：It is formed covering coating sealing organic electroluminescent element composition according to any one of claims 1 to 6
Box dam；
2：Illumination is implemented to box dam；
3：Fitting is provided with the substrate of organic electroluminescent device and implements to heat on the lid with the box dam after illumination.
8. organic electroluminescence device is had to be configured in a manner of the periphery for surrounding organic electroluminescent device and be wanted by right
Seek the composition for the box dam that the solidfied material of the sealing organic electroluminescent element composition described in any one of 1~6 formed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-239493 | 2015-12-08 | ||
| JP2015239493 | 2015-12-08 | ||
| PCT/JP2016/086168 WO2017099055A1 (en) | 2015-12-08 | 2016-12-06 | Sealing composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108293282A true CN108293282A (en) | 2018-07-17 |
Family
ID=59014154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680069787.4A Pending CN108293282A (en) | 2015-12-08 | 2016-12-06 | composition for sealing |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2017099055A1 (en) |
| KR (1) | KR20180089496A (en) |
| CN (1) | CN108293282A (en) |
| TW (1) | TW201730271A (en) |
| WO (1) | WO2017099055A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113755046A (en) * | 2020-06-03 | 2021-12-07 | 三星Sdi株式会社 | Composition for encapsulating organic light emitting diode and organic light emitting diode display including organic layer formed therefrom |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6570011B2 (en) * | 2017-08-07 | 2019-09-04 | 恒夫 萩原 | Optical three-dimensional resin composition |
| CN107884972A (en) * | 2017-09-16 | 2018-04-06 | 合肥惠科金扬科技有限公司 | A kind of cooling component of liquid crystal panel manufacture process drier coating machine |
| JPWO2021010226A1 (en) * | 2019-07-17 | 2021-01-21 | ||
| JPWO2022270536A1 (en) * | 2021-06-24 | 2022-12-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4193343B2 (en) * | 1999-08-12 | 2008-12-10 | 三井化学株式会社 | Photocurable resin composition for sealing agent and sealing method |
| JP4384509B2 (en) | 2003-01-09 | 2009-12-16 | 積水化学工業株式会社 | Method for sealing organic electroluminescent element and organic electroluminescent element |
| JP2013157204A (en) * | 2012-01-30 | 2013-08-15 | Sekisui Chem Co Ltd | Sealant for organic electroluminescent display element |
| JP5967654B2 (en) * | 2012-11-28 | 2016-08-10 | 日本化薬株式会社 | Resin composition and cured product thereof (2) |
| JP6430787B2 (en) * | 2013-11-20 | 2018-11-28 | 四国化成工業株式会社 | Optical semiconductor device |
| JP2015151528A (en) * | 2014-02-19 | 2015-08-24 | 株式会社ダイセル | curable composition |
| KR20220098297A (en) * | 2014-05-20 | 2022-07-11 | 세키스이가가쿠 고교가부시키가이샤 | Sealing agent for organic electroluminescence display element |
-
2016
- 2016-12-06 KR KR1020187019062A patent/KR20180089496A/en unknown
- 2016-12-06 WO PCT/JP2016/086168 patent/WO2017099055A1/en active Application Filing
- 2016-12-06 JP JP2017555066A patent/JPWO2017099055A1/en active Pending
- 2016-12-06 CN CN201680069787.4A patent/CN108293282A/en active Pending
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113755046A (en) * | 2020-06-03 | 2021-12-07 | 三星Sdi株式会社 | Composition for encapsulating organic light emitting diode and organic light emitting diode display including organic layer formed therefrom |
| TWI794827B (en) * | 2020-06-03 | 2023-03-01 | 南韓商三星Ｓｄｉ股份有限公司 | Composition for encapsulation of organic light-emitting diodes and organic light-emitting diode display comprising organic layer formed of same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017099055A1 (en) | 2018-09-27 |
| TW201730271A (en) | 2017-09-01 |
| KR20180089496A (en) | 2018-08-08 |
| WO2017099055A1 (en) | 2017-06-15 |
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