CN108292649B

CN108292649B - EMI shields for electronic packages and related methods

Info

Publication number: CN108292649B
Application number: CN201680067512.7A
Authority: CN
Inventors: R·赞克曼
Original assignee: Intel Corp
Current assignee: Intel Corp
Priority date: 2015-12-18
Filing date: 2016-10-27
Publication date: 2022-03-29
Anticipated expiration: 2036-10-27
Also published as: US20170181334A1; US10765046B2; US10264717B2; WO2017105645A1; US20190200490A1; US9918414B2; CN108292649A; US20180014437A1

Abstract

EMI shielded packages, electronic device packages, and related methods are disclosed. An EMI shielded package is formed by the process of: the method includes applying an insulating material to a first side of a substrate strip, dividing the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form an EMI shielded package. An electronic device package includes a substrate containing electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to an insulating material and a cured conductive paste at least partially surrounding the lateral edges of the substrate. The cured conductive paste electrically connects the solid conductor to the conductive terminal in the side of the substrate.

Description

EMI shields for electronic packages and related methods

Technical Field

The present disclosure may generally relate to the field of electromagnetic interference (EMI) shields for electronic devices, and more particularly to methods of forming EMI shields for electronic device packages.

Background

Electromagnetic interference (EMI) shielding for electronic packages in circuits that include Radio Frequency (RF) components, digital components, or a combination thereof may improve the functionality of the circuit. For example, the RF components may be sensitive to fields induced by other components and/or induce interference fields on other components. Moreover, when switching between extreme values of the voltage potential, digital components may induce a field that may also induce a field on other components in the circuit. EMI shielding may reduce the effects of such fields by electrically isolating sensitive and/or radiating components from other components.

Drawings

Fig. 1A-1C are simplified views of an electronic device package.

Fig. 1A is a simplified plan view of a top side of an electronic device package.

Fig. 1B is a simplified cross-sectional view of the electronic device package taken along line 1B of fig. 1A.

Fig. 1C is a simplified plan view of the bottom side of the package.

Fig. 2 is a simplified flow diagram illustrating a method of forming an electromagnetic interference shield for the electronic device package of fig. 1A-1C.

Fig. 3A-3C are simplified views of an exemplary substrate strip used in the method of fig. 2.

Fig. 3A is a simplified plan view of a first side of a substrate strip.

Fig. 3B is a simplified lateral side view of a substrate strip.

Fig. 3C is a simplified plan view of the second side of the substrate strip.

Fig. 4A-4C are simplified views of the substrate strip of fig. 3A-3C after applying an insulating material to the substrate strip.

Fig. 4A is a simplified plan view of a first side of a substrate strip.

Fig. 4B is a simplified lateral side view of a substrate strip.

Fig. 4C is a simplified plan view of the second side of the substrate strip.

Fig. 5A-5C are simplified views of a cut-out in the substrate strip of fig. 4A-4C creating a section of the strip.

Fig. 5A is a simplified plan view of a first side of a segment.

Fig. 5B is a simplified side view of a segment.

Fig. 5C is a simplified plan view of the second side of the segment.

Fig. 6A and 6B are simplified views of the section of fig. 5A-5C adhered to a solid conductor.

Fig. 6A shows a simplified plan view of a section adhered to a solid conductor.

Fig. 6B shows a simplified side view of a segment adhered to a solid conductor.

Fig. 7A and 7B are simplified views of a conductive paste applied around the segment of fig. 6A and 6B.

Fig. 7A is a simplified plan view showing the conductive paste applied around the segments.

Fig. 7B is a simplified cross-sectional view showing the conductive paste applied around the segment taken along line 7B of fig. 7A.

Fig. 8A and 8B are simplified views of the segments of fig. 7A-7B and the cured conductive paste.

Fig. 8A is a simplified plan view of a segment.

Fig. 8B is a simplified side view of a segment.

Fig. 9A and 9B are simplified views of an individual package produced by the method of fig. 2.

Fig. 9A is a simplified plan view of a package.

Fig. 9B is a simplified side view of a package.

Fig. 10 is another simplified flow diagram illustrating another method of forming the encapsulated electromagnetic radiation shield of fig. 1A-1C.

Fig. 11A and 11B are simplified views of the substrate strip 300 of fig. 4A-4C adhered to a solid conductor.

Fig. 11A is a simplified view of the second side of the substrate strip.

Fig. 11B is a simplified side view of a substrate strip adhered to a solid conductor.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments in which the disclosure may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the disclosure herein. It should be understood, however, that the detailed description and the specific examples, while indicating examples of embodiments of the present disclosure, are given by way of illustration only and not by way of limitation. Various substitutions, modifications, additions, rearrangements, or combinations thereof within the scope of the disclosure may be made in light of the disclosure, and will become apparent to those of ordinary skill in the art.

According to common practice, the various features shown in the drawings may not be drawn to scale. The illustrations presented herein are not meant to be actual views of any particular apparatus (e.g., device, system, etc.) or method, but are merely idealized representations which are employed to describe various embodiments of the present disclosure. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. Moreover, some of the drawings may be simplified for clarity. Thus, the drawings may not depict all of the components of a given apparatus or all of the operations of a particular method.

The information and signals described herein may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof. For clarity of illustration and description, some of the figures may illustrate a signal as a single signal. It will be understood by those of ordinary skill in the art that the signals may represent a bus of signals, where the bus may have various bit widths, and the present disclosure may be implemented on any number of data signals including a single data signal.

The various illustrative logical blocks, modules, circuits, and algorithm acts described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and acts have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the embodiments of the disclosure described herein.

Further, it is noted that embodiments may be described in terms of processes that are depicted as flowcharts, flow diagrams, structural diagrams, signal diagrams, or block diagrams. Although a flowchart or signal diagram may describe the operational acts as a sequential process, many of the acts can be performed in another sequence, in parallel, or substantially concurrently. In addition, the order of the acts may be rearranged. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. Furthermore, the methods disclosed herein may be implemented in hardware, software, or both. If implemented in software, the functions may be stored on or transmitted over as one or more computer-readable instructions (e.g., software code) on a computer-readable medium. Computer-readable media includes both computer storage media (i.e., non-transitory media) and communication media including any medium that facilitates transfer of a computer program from one place to another.

As used herein, the term "conductive paste" refers to a conductive paste, a conductive ink, other conductive fluid, or a combination thereof, which may be dispensed through a nozzle or syringe, or may be spread on a surface with a resilient blade tool (e.g., a "squeegee"), as opposed to a conductor being sputtered or grown onto the surface.

Disclosed herein are EMI shielded packages, electronic device packages, and related methods. EMI shields can be formed on electronic device packages using simple, inexpensive, and size-efficient methods.

In some embodiments, disclosed herein are a plurality of EMI shielded packages formed by the process of: applying an insulating material to a first side of a substrate strip, the substrate strip comprising electronic circuitry located on or in the first side of the substrate strip; dividing the substrate strip into a plurality of sections; adhering the insulating material of the segments to the solid conductor; applying a conductive paste around the sides of the segments; curing the conductive paste; and cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

In some embodiments, disclosed herein are electronic device packages comprising a substrate, an insulating material, and an electromagnetic interference (EMI) shield. The substrate includes electronic circuitry located in or on at least a first side of the substrate and at least one conductive terminal located at a lateral edge of the substrate. An insulating material is formed over the first side of the substrate and the electronic circuitry. The EMI shield includes a solid conductor adhered to an insulating material opposite the first side of the substrate. The insulating material electrically insulates the electronic circuit from the solid conductor. The EMI shield also includes a cured conductive paste that at least partially surrounds the lateral edges of the substrate and electrically connects the conductive terminals to the solid conductors.

In some embodiments, disclosed herein are methods of forming electromagnetic interference (EMI) shields. The method comprises the following steps: applying an insulating material to a first side of a substrate strip, the substrate strip including electrical components formed on and at least one of the first side of the substrate strip; and adhering a solid conductor to the insulating material opposite the first side of the substrate strip. An insulating material electrically insulates the first side of the substrate strip from the solid conductor. The method further includes dividing the substrate strip and the applied insulating material into a plurality of segments and applying a conductive paste at least partially around sides of the plurality of segments between them. The conductive paste electrically connects the solid conductor to the conductive terminal exposed on at least one side of each of the plurality of segments. The method also includes cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

As used herein, the terms "insulating," "insulator," and other forms of the word "insulating" refer exclusively to electrical insulation. Also, as used herein, the terms "conduct," "conductor," and other forms of the word "conduct" refer exclusively to electrical conduction.

Fig. 1A-1C are simplified views of an electronic device package 100 (sometimes referred to herein as a "package" 100). Fig. 1A is a simplified plan view of the top side of package 100. Fig. 1B is a simplified cross-sectional view of the package 100 taken along line 1B of fig. 1A. Fig. 1C is a simplified plan view of the bottom side of package 100. Referring to fig. 1A-1C together, the package 100 includes a substrate 110 (e.g., a semiconductor substrate, a Printed Circuit Board (PCB), etc.), the substrate 110 including electronic circuitry 120 located in or on at least a first side 114 of the substrate 110. The substrate 110 may also include at least one conductive terminal 118 located at the lateral edge 112 of the substrate 110. In some embodiments, the conductive terminals 118 may extend completely around the lateral edges of the substrate. In some embodiments, the conductive terminals 118 may extend only partially around the lateral edges of the substrate. The substrate 110 may also include one or more conductive pads 130 (e.g., pads, pins, solder balls, etc.) located on or in the second side 116 of the substrate 110.

The package 100 may also include an insulating material 400 on the first side 114 of the substrate 110 and the electronic circuit 120. By way of non-limiting example, the insulating material 400 may include an over mold (e.g., plastic, rubber, etc.), an insulating epoxy, an oxide material (e.g., silicon dioxide), other insulating materials, and combinations thereof.

Package 100 also includes electromagnetic interference (EMI) shields 600, 800 that shield first side 114 and lateral edges 112 of substrate 110. The EMI shields 600, 800 include a solid conductor 600 adhered to the insulating material 400 opposite the first side 114 of the substrate 110. Insulating material 400 may electrically insulate electronic circuit 120 from solid conductor 600. In some embodiments, solid conductor 600 may include a conductive foil (e.g., a metal foil). By way of non-limiting example, the conductive foil may include copper foil, aluminum foil, silver foil, gold foil, other foils, or combinations thereof.

The EMI shields 600, 800 also include a cured conductive paste 800 that at least partially surrounds the lateral edges 112 of the substrate 110. In some embodiments, the cured conductive paste 800 may completely surround the lateral edges 112 of the substrate 110. The cured conductive paste 800 may electrically connect the conductive terminal 118 to the solid conductor 600. In some embodiments, the cured conductive paste 800 may include a cured epoxy resin that includes conductive particles that have been cured to form the cured conductive paste 800. By way of non-limiting example, the conductive particles may include at least one of solder and metal (e.g., copper, silver, gold, etc.).

The conductive terminals 118 may be electrically connected to a power source through the substrate 110. In some embodiments, the conductive terminal 118 may be electrically connected to ground (0 volts). Accordingly, the solid conductor 600 and the cured conductive paste 800 may also be electrically connected to ground (e.g., through the conductive terminal 118). In such an embodiment, the solid conductor 600 and cured conductive paste may serve as a faraday cage of the package 100 that shields EMI.

Fig. 2 is a simplified flow diagram illustrating a method 200 of forming the EMI shields 600, 800 of the package 100 of fig. 1A-1C. Fig. 3A-9B are discussed below to illustrate

acts

210 and 260 of the method 200. Fig. 3A-3C are simplified views of an exemplary substrate strip 300 (sometimes referred to herein simply as "strip" 300). The strip 300 includes a substrate 310 including a first side 314 and a second side 316. Fig. 3A is a simplified plan view of the first side 314 of the strip 300. Fig. 3B is a simplified lateral side view of strip 300. Fig. 3C is a simplified plan view of the second side 316 of the strip 300. The strip 300 can include electrical components 320 similar to the electrical components 120 discussed above with reference to fig. 1A and 1B, the electrical components 320 formed on at least one of the first side 314 and the first side 314 of the substrate 310. The strip 300 may also include conductive pads 330 similar to the conductive pads 130 discussed above with reference to fig. 1B and 1C. The strip 300 may also include conductive terminal material 318 similar to the conductive terminals 118 discussed above with reference to fig. 1B.

Referring to fig. 2-3C together, the method 200 may include applying 210 an insulating material 400 (fig. 4A and 4B) to the first side 314 of the strip 300. Fig. 4A-4C are simplified views of the strip 300 after applying 210 an insulating material 400 to the strip 300 of fig. 3A-3C. Fig. 4A is a simplified plan view of first side 314 of strip 300 after applying 210 insulative material 400 to first side 314 of strip 300. Fig. 4B is a simplified lateral side view of strip 300 after applying 210 insulative material 400 to strip 300. Fig. 4C is a simplified plan view of second side 316 of strip 310 after insulative material 400 is applied to strip 300.

Reference is now made to fig. 2 and 4A-4C together. In some embodiments, applying 210 the insulating material 400 may include applying an overmold to the first side 314 of the substrate strip 300. In some embodiments, applying 210 the insulating material 400 to the first side 314 of the substrate strip 300 may include applying an electrically insulating epoxy to the first side 314 of the substrate strip 300. In some embodiments, applying 210 the insulating material 400 to the first side 314 of the substrate strip 300 may include applying an oxide material to the first side 314 of the substrate strip 300.

In some embodiments, as shown in fig. 4A and 4B, the entire first side 314 and circuitry 320 may be completely covered by insulating material 400. In some embodiments, only a portion of first side 314 and circuitry 320 may be covered by insulating material 400.

The method 200 may also include dividing 220 the strip 300 into a plurality of sections 500 (fig. 5A-5C). In some embodiments, dividing 220 the strip 300 into a plurality of sections 500 may include cutting (e.g., with a saw) through the substrate strip 300 and the insulating material 400 to divide the strip 300 into a plurality of electronic device packages. Fig. 5A-5C are simplified views of a cut 550 in the strip 300 of fig. 4A-4C that may produce a section 500 of the strip 300. Fig. 5A is a simplified plan view of first side 314 (fig. 4A-4C) of section 500. Fig. 5B is a simplified side view of segment 500. Fig. 5C is a simplified plan view of the second side 316 (fig. 4A-4C) of the segment 500.

In some embodiments, other methods of separating the strip 300 may be used. By way of non-limiting example, portions of the substrate strip 300 and the insulating material 400 may be removed (e.g., using photolithography, acids, other methods, and combinations thereof).

In the example of fig. 5A-5C, eight sectors 500 are shown (two rows of four sectors 500). It should be noted that any other number of sections 500 is also contemplated by the present disclosure, including one section 500. By way of non-limiting example, the bar 300 may be divided into three rows of ten sections, resulting in thirty sections.

Returning to fig. 2, the method 200 may also include adhering 230 the insulating material of the section 500 to the solid conductor 600. Fig. 6A and 6B are simplified views of a section 500 adhered to a solid conductor 600. Fig. 6A shows a simplified plan view of a section 500 adhered to a solid conductor 600. Fig. 6B shows a simplified side view of a section 500 adhered to a solid conductor 600. Referring to fig. 2, 6A, and 6B together, the sections 500 may be spaced apart from one another such that a space 670 at least partially surrounds each of the sections 500. In the example shown in fig. 6A and 6B, the space 670 completely laterally surrounds each of the sections 500. Insulating material 400 may insulate substrate 310 and circuitry 320 (fig. 3A and 3B) of each section 500 from solid conductors 600.

As previously described, in some embodiments, solid conductor 600 may include a conductive foil (e.g., copper foil, aluminum foil, silver foil, gold foil, other foils, or combinations thereof). In some embodiments, adhering the insulating material 400 of the section 500 to the solid conductor 600 may include adhering the insulating material 400 to the solid conductor 600 with an adhesive (e.g., epoxy, mastic, etc.).

The method 200 may also include applying 240 the conductive paste 700 (fig. 7A and 7B) around the sides of the segment 500 (i.e., in the space 670). Fig. 7A and 7B are simplified views of a conductive paste 700 applied around a segment 500. Fig. 7A is a simplified plan view showing a conductive paste 700 applied around a segment 500. Fig. 7B is a simplified cross-sectional view illustrating the conductive paste 700 applied around a segment taken along line 7B of fig. 7A.

Referring to fig. 2, 7A, and 7B together, the conductive paste 700 may electrically connect the conductive terminals 318 at the sides of the section 500 to the solid conductors 600. In some embodiments, the conductive terminal 318 may extend completely around the sides of the section 500. In some embodiments, the conductive terminals 118 may extend less, without completely surrounding the sides of the section 500.

In some embodiments, as shown in fig. 7A and 7B, the conductive paste 700 may completely surround each of the segments 500. In some embodiments, the conductive paste 700 may only partially surround the segment 500.

In some embodiments, applying 240 conductive paste 700 around the sides of section 500 may include applying conductive paste 700 with a resilient blade tool (e.g., similar to a "squeegee"). In some embodiments, applying 240 the conductive paste 700 around the side of the section 500 may include applying the conductive paste 700 with an injection tool (e.g., similar to a syringe). In some embodiments, applying 240 the conductive paste 700 around the sides of the section 500 may include flowing heated conductive paste around the sides of the section 500.

The method 200 may also include curing 250 the conductive paste 700. Fig. 8A and 8B are simplified views of a segment 500 and cured conductive paste 800. Fig. 8A is a simplified plan view of a segment 500 and cured conductive paste 800. Fig. 8B is a simplified side view of a segment 500 in a cured conductive paste 800.

Referring to fig. 2, 8A, and 8B together, curing 250 the conductive paste 700 (fig. 7A and 7B) may convert the conductive paste 700 into a solid cured conductive paste 800. For example, curing the conductive paste 700 may include heating the conductive paste 700. By way of non-limiting example, if the conductive paste 700 includes an epoxy in which conductive particles are suspended, the epoxy may solidify when cured 250. Also, the conductive particles may melt and form a conductive structure extending through the epoxy. Thus, in some embodiments, the solid cured conductive paste 800 may be a conductive layer suspended in a cured epoxy resin.

The method may also include cutting through 260 the cured conductive paste 800 and solid conductors 600 to form individual EMI shielded packages 100-1 through 100-8 (sometimes collectively referred to herein as "packages" 100, and individually as "packages" 100) (fig. 9A and 9B). Fig. 9A and 9B are simplified views of an individual package 100. Fig. 9A is a simplified plan view of package 100. Fig. 9B is a simplified side view of the package 100. Fig. 9A and 9B show a cut 950 through the cured conductive material 800 and the solid conductor 600. In some embodiments, cutting through 260 the cured conductive paste 800 and solid conductor 600 may include cutting through the cured conductive paste 800 and solid conductor 600 with a saw. The resulting structure of each of the packages 100 of fig. 9A may be similar to the packages 100 discussed above with reference to fig. 1A-1C.

In some embodiments, each of the packages 100 may be encased by the cured conductive paste 800 and solid conductors 600 on all sides except the bottom side of the package 100. Thus, the method 200 may provide a method of shielding the package 100 that is less complex, less intrusive, and less expensive than sputtering metal over the package 100, which requires expensive processing in a professional setting. Moreover, the method 200 may provide a method of shielding the package 100 that may occupy less space than a solid metal shield that is soldered to the package 100.

Fig. 10 is another simplified flow diagram illustrating another method 1000 of forming the EMI shields 600, 800 of the package 100 of fig. 1A-1C. The method 1000 may be similar to the method 200 of fig. 2. For example, method 1000 may include applying 1010 insulative material 400 to first side 314 of substrate strip 300, similar to act 210 of fig. 2. Referring now to fig. 10 and 4A-4C, the bar 300 of fig. 4A-4C may result from act 1010.

In contrast to the method 200 of fig. 2, the method 1000 may include adhering the solid conductor 600 to the insulating material 400 opposite the first side 314 of the substrate strip 300 prior to dividing 1030 the substrate strip 300 into the plurality of sections 500. Fig. 11A and 11B are simplified views of a substrate strip 300 adhered to a solid conductor 600. Fig. 11A is a simplified view of the second side 316 of the substrate strip. Fig. 11B is a simplified side view of substrate strip 300 adhered to solid conductor 600. As shown in fig. 11B, insulating material 400 may be adhered to solid conductor 600.

Referring to fig. 10, 11A, and 11B together, the method 1000 may further include dividing 1030 the substrate strip 300 into a plurality of sections 500 (fig. 6A and 6B). The segments may be segmented in a manner similar to that discussed above with reference to the cuts 550 of fig. 5A-5C. For example, in some embodiments, dividing 1030 the substrate strip 300 into a plurality of sections 500 may include cutting the substrate strip 300 into sections with a saw. The saw may cut at least through the substrate strip 300, and in some cases may even partially cut into the solid conductor 600. In some embodiments, portions of the substrate strip 300 may be removed to form the sections 500. The resulting structure may be similar to the structure discussed above with reference to fig. 6A and 6B.

Method 1000 may also include applying 1040 conductive paste 700 around a side of section 500, which may be similar to act 240 of fig. 2. Method 1000 may also include curing conductive paste 1050, which may be similar to act 250 of fig. 2. Further, the method 1000 may include cutting through 1060 the cured conductive paste 800 and solid conductors 600 to form individual EMI shielded packages 100 (fig. 9A and 9B), which may be similar to act 1060 of fig. 2.

A non-exhaustive list of examples follows. Each of these examples may be combined with any other of the examples and embodiments disclosed herein, except as deemed non-combinable by one of ordinary skill in the art.

Example 1: a plurality of EMI shielded packages formed by the process of: applying an insulating material to a first side of a substrate strip, the substrate strip comprising electronic circuitry located on or in the first side of the substrate strip; dividing the substrate strip into a plurality of sections; adhering the insulating material of the segments to the solid conductor; applying a conductive paste around the sides of the segments; curing the conductive paste; and cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

Example 2: the plurality of EMI shielded packages of example 1, wherein each of the EMI shielded packages includes a conductive terminal in at least one side, and wherein the cured conductive paste electrically connects the conductive terminal to a solid conductor adhered to the insulating material.

Example 3: the plurality of EMI shielded packages of example 2, wherein the conductive terminals are electrically connected to ground through the substrate strip.

Example 4: the plurality of EMI shielded packages according to any one of examples 1-3, wherein the cured conductive paste completely surrounds the sides of the segments.

Example 5: the plurality of EMI shielded packages according to any one of examples 1-4, wherein the cured conductive paste and the solid conductor completely encase the segments on all sides except a bottom side.

Example 6: an electronic device package, comprising: a substrate comprising electronic circuitry in or on at least a first side of the substrate and at least one conductive terminal at a lateral edge of the substrate; an insulating material formed over the first side of the substrate and the electronic circuitry; and an electromagnetic interference (EMI) shield comprising a solid conductor adhered to an insulating material opposite the first side of the substrate, the insulating material electrically insulating the electronic circuit from the solid conductor; and a cured conductive paste at least partially surrounding the lateral edges of the substrate and electrically connecting the conductive terminals to the solid conductors.

Example 7: the electronic device package of example 6, wherein the cured conductive paste comprises a cured epoxy resin including conductive particles.

Example 8: the electronic device package of example 7, wherein the conductive particles comprise at least one of solder and metal.

Example 9: the electronic device package of any of examples 6-8, wherein the at least one conductive terminal extends completely around the lateral edge of the substrate.

Example 10: the electronic device package of any of examples 6-9, wherein at least one conductive terminal is electrically connected to ground.

Example 11: the electronic device package of any of examples 6-10, wherein the solid conductor comprises a metal foil.

Example 12: the electronic device package of example 11, wherein the metal foil comprises at least one metal selected from the group consisting of copper foil, aluminum foil, silver foil, and gold foil.

Example 13: a method of forming an electromagnetic interference (EMI) shield, the method comprising: applying an insulating material to a first side of a substrate strip, the substrate strip including electrical components formed on and at least one of the first side of the substrate strip; adhering a solid conductor to an insulating material opposite a first side of the substrate strip, the insulating material electrically insulating the first side of the substrate strip from the solid conductor; dividing the substrate strip and the applied insulating material into a plurality of sections; applying a conductive paste at least partially around the sides of the plurality of segments, the conductive paste electrically connecting the solid conductor to the conductive terminals exposed on at least one side of each of the plurality of segments; and cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

Example 14: the method of example 13, wherein applying an insulating material to the first side of the substrate strip includes applying an electrically insulating epoxy to the first side of the substrate strip.

Example 15: the method of example 13, wherein applying an insulating material to the first side of the substrate strip includes applying an oxide material to the first side of the substrate strip.

Example 16: the method of any of examples 13-15, wherein adhering the solid conductor to the insulating material and dividing the substrate strip and the applied insulating material into a plurality of sections comprises: the substrate strip and applied insulating material are divided into a plurality of sections prior to adhering the solid conductor to the insulating material opposite the first side of the substrate strip.

Example 17: the method of any of examples 13-16, wherein adhering a solid conductor to an insulating material opposite a first side of the substrate strip includes applying each of a plurality of sections to a conductive foil.

Example 18: the method of any of examples 13-15, wherein adhering the solid conductor to the insulating material and dividing the substrate strip into the plurality of sections comprises: the solid conductor is adhered to the insulating material prior to separating the substrate strip and insulating material into a plurality of sections.

Example 19: the method of any of examples 13-18, wherein applying the conductive paste at least partially around the plurality of electronic packages comprises applying a conductive epoxy at least partially around each of the plurality of electronic packages.

Example 20: the method of any of examples 13-19, wherein applying the conductive paste comprises applying the conductive paste with a resilient blade tool.

Example 21: the method of any of examples 13-19, wherein applying the conductive paste comprises applying the conductive paste with an injection tool.

Example 22: the method of any of examples 13-19, wherein applying the conductive paste comprises flowing heated conductive paste at least partially around a side of the segment.

Example 23: the method of any of examples 13-22, wherein applying the conductive paste includes completely laterally surrounding each of the segments with the conductive paste.

Example 24: the method of any of examples 13-22, further comprising curing the conductive paste into a conductive solid.

Example 25: the method of example 24, wherein curing the conductive paste includes heating the conductive paste.

Example 26: a method of forming an EMI shield for a plurality of electronic device packages, the method comprising: applying an insulating material to a first side of a substrate strip, the substrate strip comprising electronic circuitry located on or in the first side of the substrate strip; dividing the substrate strip into a plurality of sections; adhering the insulating material of the segments to the solid conductor; applying a conductive paste around the sides of the segments; curing the conductive paste; and cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

Example 27: the method of example 26, further comprising electrically connecting the conductive terminal located in the side of each of the segments to a solid conductor adhered to the insulating material.

Example 28: the method of example 27, further comprising electrically connecting a conductive terminal to ground through the substrate strip.

Example 29: the method of any of examples 26-28, wherein the cured conductive paste completely surrounds sides of the segment.

Example 30: the method of any of examples 26-29, further comprising completely encasing the segment on all sides except a bottom side with a cured conductive paste and a solid conductor.

Example 31: an electronic device package, comprising: a substrate comprising electronic circuitry located in or on at least a first side of the substrate and at least one conductive terminal located at a lateral edge of the substrate; an insulating material formed over the first side of the substrate and the electronic circuitry; and an electromagnetic interference (EMI) shield comprising: a solid conductor adhered to an insulating material opposite the first side of the substrate, the insulating material electrically insulating the electronic circuit from the solid conductor; and means for shielding at least a portion of the lateral edge of the substrate and electrically connecting the conductive terminal to the solid conductor without sputtering conductive material onto the substrate.

Example 32: the electronic device package of example 31, wherein the means for shielding at least a portion of the lateral edge of the substrate comprises a cured conductive paste comprising a cured epoxy resin containing conductive particles.

Example 33: the electronic device package of example 32, wherein the conductive particles comprise at least one of solder and metal.

Example 34: the electronic device package of any of examples 31-33, wherein the at least one conductive terminal extends completely around a lateral edge of the substrate.

Example 35: the electronic device package of any one of examples 31-34, wherein at least one conductive terminal is electrically connected to ground.

Example 36: the electronic device package of any of examples 31-35, wherein the solid conductor comprises a metal foil.

Example 37: the electronic device package of example 36, wherein the metal foil comprises at least one metal selected from the group consisting of copper foil, aluminum foil, silver foil, and gold foil.

Example 38: a plurality of electromagnetic interference (EMI) shielded electronic device packages formed by the process of: applying an insulating material to a first side of a substrate strip, the substrate strip including electrical components formed on and at least one of the first side of the substrate strip; adhering a solid conductor to an insulating material opposite a first side of the substrate strip, the insulating material electrically insulating the first side of the substrate strip from the solid conductor; dividing the substrate strip and the applied insulating material into a plurality of sections; applying a conductive paste at least partially around the sides of the plurality of segments, the conductive paste electrically connecting the solid conductor to the conductive terminals exposed on at least one side of each of the plurality of segments; and cutting through the conductive paste and the solid conductor to form a plurality of EMI shielded packages.

Example 39: the plurality of EMI shielded electronic device packages of example 38, wherein the insulating material comprises an electrically insulating epoxy.

Example 40: the plurality of EMI shielded electronic device packages of example 38, wherein the insulating material comprises an oxide material.

Example 41: the plurality of EMI shielded electronic device packages of any one of examples 38-40, wherein the substrate strip and the applied insulating material are separated into a plurality of sections before the solid conductor is adhered to the insulating material.

Example 42: the plurality of EMI shielded electronic device packages of any one of examples 38-41, wherein the solid conductor comprises a conductive foil.

Example 43: the plurality of EMI shielded electronic device packages of any one of examples 38-40 and example 42, wherein the solid conductor is adhered to the insulating material prior to separating the substrate strip and the insulating material into the plurality of sections.

Example 44: the plurality of EMI shielded electronic device packages of any one of examples 38-43, wherein the conductive paste comprises a conductive epoxy.

Example 45: the plurality of EMI shielded electronic device packages of any one of examples 38-44, wherein the conductive paste is applied with a resilient blade tool.

Example 46: the plurality of EMI shielded electronic device packages of any one of examples 38-44, wherein the conductive paste is applied with an injection tool.

Example 47: the plurality of EMI shielded electronic device packages of any one of examples 38-44, the conductive paste comprising a conductive paste that is heated and flows around sides of the segments.

Example 48: the plurality of EMI shielded electronic device packages of any one of examples 38-47, wherein the conductive paste completely laterally surrounds each of the segments.

Example 49: the plurality of EMI shielded electronic device packages of any one of examples 38-48, wherein the conductive paste is cured to form a conductive solid.

Example 50: the plurality of EMI shielded electronic device packages of example 49, wherein the conductive paste is cured by heating the conductive paste.

Example 51: a non-transitory computer-readable storage medium comprising computer-readable instructions stored thereon, the computer-readable instructions configured to instruct a processor to perform any of the methods of examples 13-30.

While certain illustrative embodiments have been described in connection with the accompanying drawings, those of ordinary skill in the art will recognize and appreciate that the embodiments encompassed by the present disclosure are not limited to those explicitly shown and described herein. Rather, many additions, deletions, and modifications to the embodiments described herein may be made without departing from the scope of the embodiments encompassed by the disclosure (e.g., those hereinafter claimed, including legal equivalents). Furthermore, as the inventors contemplate, features from one disclosed embodiment may be combined with features of another disclosed embodiment while still being encompassed within the scope of the embodiments encompassed by the present disclosure.

Claims

1. A plurality of EMI shielded packages formed by the process of:

applying an insulating material to a first side of a substrate strip, the substrate strip comprising electronic circuitry located on or in the first side of the substrate strip;

dividing the substrate strip into a plurality of sections;

adhering the insulating material of the segment to a solid conductor;

applying a conductive paste around the sides of the segments;

curing the conductive paste; and

cutting through the conductive paste and the solid conductors to form the plurality of EMI shielded packages,

wherein a top surface of the conductive paste is coplanar with a top surface of the insulating material.

2. The plurality of EMI shielded packages of claim 1, wherein each of the EMI shielded packages includes a conductive terminal in at least one side, and wherein the cured conductive paste electrically connects the conductive terminal to the solid conductor adhered to the insulating material.

3. The plurality of EMI shielded packages of claim 2, wherein the conductive terminal is electrically connected to ground through the substrate strip.

4. The plurality of EMI shielded packages according to any one of claims 1-3, wherein the cured conductive paste completely surrounds the sides of the segments.

5. The plurality of EMI shielded packages according to any one of claims 1-3, wherein the cured conductive paste and the solid conductors completely encase the segments on all sides except a bottom side.

6. An electronic device package, comprising:

a substrate, comprising:

electronic circuitry located in or on at least a first side of the substrate; and

at least one conductive terminal at a lateral edge of the substrate;

an insulating material formed over the first side of the substrate and the electronic circuitry; and

an electromagnetic interference (EMI) shield comprising:

a solid conductor adhered to the insulating material opposite the first side of the substrate, the insulating material electrically insulating the electronic circuit from the solid conductor; and

a cured conductive paste at least partially surrounding the lateral edges of the substrate and electrically connecting the conductive terminal to the solid conductor,

7. The electronic device package of claim 6, wherein the cured conductive paste comprises a cured epoxy resin containing conductive particles.

8. The electronic device package of claim 7, wherein the conductive particles comprise at least one of solder and metal.

9. The electronic device package of any of claims 6-8, wherein the at least one conductive terminal extends completely around the lateral edge of the substrate.

10. The electronic device package of any of claims 6-8, wherein the at least one conductive terminal is electrically connected to ground.

11. The electronic device package of any of claims 6-8, wherein the solid conductor comprises a metal foil.

12. The electronic device package of claim 11, wherein the metal foil comprises at least one metal selected from the group consisting of copper foil, aluminum foil, silver foil, and gold foil.

13. A method of forming an electromagnetic interference (EMI) shield, the method comprising:

applying an insulating material to a first side of a substrate strip, the substrate strip including electrical components formed on and at least one of the first side of the substrate strip;

adhering a solid conductor to the insulating material opposite the first side of the substrate strip, the insulating material electrically insulating the first side of the substrate strip from the solid conductor;

dividing the substrate strip and applied insulating material into a plurality of sections;

applying a conductive paste at least partially around the sides of the plurality of segments, the conductive paste electrically connecting the solid conductor to conductive terminals exposed on at least one side of each of the plurality of segments; and

cutting through the conductive paste and the solid conductors to form a plurality of EMI shielded packages,

14. The method of claim 13, wherein applying an insulating material to a first side of a substrate strip comprises applying an electrically insulating epoxy to the first side of the substrate strip.

15. The method of claim 13, wherein applying an insulating material to a first side of a substrate strip comprises applying an oxide material to the first side of the substrate strip.

16. The method of claim 13, wherein adhering a solid conductor to the insulating material and dividing the substrate strip and applied insulating material into a plurality of sections comprises: separating the substrate strip and the applied insulating material into the plurality of sections prior to adhering the solid conductor to the insulating material opposite the first side of the substrate strip.

17. The method of claim 16, wherein adhering the solid conductor to the insulating material opposite the first side of the substrate strip comprises applying each of the plurality of sections to a conductive foil.

18. The method of claim 13, wherein adhering a solid conductor to the insulating material and separating the substrate strip into the plurality of sections comprises: adhering the solid conductor to the insulating material prior to separating the substrate strip and the insulating material into the plurality of sections.

19. The method of any of claims 13-18, wherein applying a conductive paste at least partially around the sides of the plurality of segments comprises applying a conductive epoxy at least partially around each of the sides of the plurality of segments.

20. The method of any one of claims 13-18, wherein applying a conductive paste comprises applying the conductive paste with a resilient blade tool.

21. The method of any one of claims 13-18, wherein applying a conductive paste comprises applying the conductive paste with an injection tool.

22. The method of any of claims 13-18, wherein applying a conductive paste comprises flowing heated conductive paste at least partially around the sides of the segments.

23. The method of any of claims 13-18, wherein applying a conductive paste comprises completely laterally surrounding each of the segments with the conductive paste.

24. The method of any of claims 13-18, further comprising curing the conductive paste into a conductive solid.

25. The method of claim 24, wherein curing the conductive paste comprises heating the conductive paste.