CN108292592A - Imprinting apparatus and method - Google Patents
Imprinting apparatus and method Download PDFInfo
- Publication number
- CN108292592A CN108292592A CN201680068257.8A CN201680068257A CN108292592A CN 108292592 A CN108292592 A CN 108292592A CN 201680068257 A CN201680068257 A CN 201680068257A CN 108292592 A CN108292592 A CN 108292592A
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- China
- Prior art keywords
- mould
- substrate
- plasma treatment
- transferred
- pine oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 122
- 239000000758 substrate Substances 0.000 claims abstract description 141
- 238000009832 plasma treatment Methods 0.000 claims abstract description 65
- 230000004048 modification Effects 0.000 claims abstract description 52
- 238000012986 modification Methods 0.000 claims abstract description 52
- 238000000926 separation method Methods 0.000 claims abstract description 50
- 230000008569 process Effects 0.000 claims description 82
- 239000010665 pine oil Substances 0.000 claims description 44
- 238000012546 transfer Methods 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 230000033228 biological regulation Effects 0.000 claims description 17
- 229920002799 BoPET Polymers 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 13
- 238000010422 painting Methods 0.000 claims description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- 238000004528 spin coating Methods 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001127 nanoimprint lithography Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002094 self assembled monolayer Substances 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2632—Stampers; Mountings thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Invention describes a kind of imprinting apparatus and methods.The present invention imprinting apparatus include：Surface modification portion, the surface to forming figuratum mould carry out plasma treatment；Engaging portion, in a manner of enabling the pattern for the mould for having carried out plasma treatment to be stamped in substrate, in conjunction with the mould and the substrate；And separation unit, detach the mould being combined and the substrate.
Description
Technical field
The present invention relates to a kind of to be coated on the resin of substrate surface to transfer imprinting apparatus and the side of pattern with mould pressurization
Method.
Background technology
Nano-imprint lithography engineering is a kind of not only economical but also can effectively make nanostructure (nano-
Structure technology) is spin coating (spin-coating) or spot printing (dispensing) tree on base material (substrate)
Fat, and will be formed and figuratum be molded to resin surface to transfer the technology of (transfer) pattern.
Nano-imprint lithography engineering can substantially be divided into heated type (thermal-type) and ultraviolet light radiation modality.
Heated type engineering is referred to as thermal transfer (Hot Embossing) or thermal imprint lithography (Thermal Imprint
Lithography), be it is a kind of so that mould is contacted with the base material for being formed with macromolecule layer after, heating and to macromolecule layer provide flowing
Property, and apply pressure the method for producing desired pattern on macromolecule layer.This heated type engineering exists because of thermal deformation
And the problem of being difficult to carry out Multilayer aligned, and due to needing higher pressure to imprint the larger resin of viscosity, thus deposit
In the frangible problem of pattern.
It is to improve the nano-imprint lithography engineering of ultraviolet light radiation modality developed the problem of this heated type engineering
A method of the ultraviolet light using low viscosity photocurable resin and for hardening it, since work can be executed with Room-temperature low-pressure
Journey, thus suitable for carrying out multiple stratification and mass production.
In the nano-imprint lithography engineering of previous ultraviolet light radiation modality, if first coating UV cured use on substrate
It after resin, is pressed using mould, then hardening resin will be filled up between the pattern of mould.At this point, since viscosity is low, even if lower
It can be also easy with resin between the pattern for filling up mould under pressure.Later, if being felt to resin by transparent mould by UV light sources
Light, then resin be hardened.Later, if taking mould, remnant layer will be remained between pattern, is ashed by oxygen and removes the remnant layer
To complete engineering.
In the engineering of above-mentioned previous ultraviolet light radiation modality, also self-assembled monolayer can be coated on the surface of mould
Improve release property, but there are problems that the required coating processing time is longer, productivity of product declines.
In addition, in the case where carrying out other coating processing to mould, there are price competitiveness declines, and be additionally formed
Coat can be sticky in the separation of substrate and mould so that the shortcomings that mould is difficult to reuse.
Further, it since the re-usability of mould declines, needs only to transfer mould to a direction, thus productivity declines, and
Resin application process etc. carries out leading to not carry out in other place or equipment successional engineering, thus exist need compared with
More working spaces, and the problem of need the more activity duration.
It is served only for promoting the understanding of the background to the present invention as the item illustrated by above-mentioned background technology, should not be understood as
Approval belongs to the known prior art of general technical staff to this field.
Existing technical literature
Patent document 1：KR 10-2012-0127731(2012.11.23)
Invention content
Technical problem
The purpose of the present invention is to provide a kind of imprinting apparatus and method for improving release property and capable of reusing mould.
Technical solution
For reach this purpose the present invention imprinting apparatus include：Surface modification portion, to forming figuratum mould
Surface carry out plasma treatment；Engaging portion so that the pattern for having carried out the mould of plasma treatment can be stamped in
The mode of substrate, in conjunction with the mould and the substrate；And separation unit, detach the mould being combined and the substrate.
The imprinting apparatus is characterized in that the plasma is to including one in air, argon gas, oxygen and nitrogen
A above gas applies RF and generates.
The imprinting apparatus is characterized in that, further includes transferred unit, transfers the mould, the transferred unit will be at described point
From part from the mould be transferred to surface modification portion, be reused described so that plasma treatment can be carried out to the mould
Mould.
The imprinting apparatus further includes control unit, combination to the mould and the substrate or detaches number and counts
Number, and the transferred unit is controlled according to set number, the mould is changed to new mould.
The imprinting apparatus further includes control unit, check the separate section from mould surface state, according to institute
It states surface state and controls the transferred unit and the mould is changed to new mould.
The imprinting apparatus is characterized in that, between surface modification portion, engaging portion and the spaced regulation of separation unit
Transfer direction away from and along the mould is arranged in order.
The imprinting apparatus is characterized in that, between the engaging portion, surface modification portion and the spaced regulation of separation unit
Transfer direction away from and along the mould is arranged in order.
The mould includes spaced regulation spacing and is set to the first mould in the transferred unit and the second mould, the table
Face modification portion includes being respectively separated regulation spacing across the engaging portion and the first surface modification portion being arranged and second surface change
Property portion, the separation unit include across the engaging portion and the surface modification moiety not Jian Ge regulation spacing and be arranged first
Separation unit and the second separation unit, the transferred unit will be detached in any of described first, second separation unit described first
Or second mould be transferred to any of described first, second surface modification portion.
The imprinting apparatus further includes painting part, and the substrate top is coated with resin.
The painting part includes：Spin coating portion, on the substrate portion's applying liquid resin；And drying section, drying
The resin.
The engaging portion includes：Chamber maintains low vacuum state, can prevent foreign matter from flowing into；And hardening portion,
Make the hardening of resin on the substrate.
The imprinting apparatus is characterized in that the transferred unit includes：PET film；First roller supplies the one of the PET film
It holds in conjunction with and winds；And second roller, for the PET film the other end in conjunction with and wind and provided with first roller interval
Spacing and configure, the mould is formed on the PET film.
The imprinting apparatus includes：Surface modification portion, the surface to forming figuratum mould carry out plasma treatment；With
And work department, the stamping is pressed on the substrate, so that the pattern for having carried out the mould of plasma treatment can be rushed
It is pressed on substrate, and from mould described in the substrate pine oil.
A kind of method for stamping, including：The mistake that plasma treatment is carried out to be modified to the surface for forming figuratum mould
Journey；The pattern die of the mould of plasma treatment will have been carried out in the process of substrate；And it is loose from the substrate being stamped
Release the process of the mould.
The method for stamping is characterized in that, executes the process of the plasma treatment, can reuse through the pine
The mould for the process released.
The method for stamping further includes that set punching press or pine oil will be performed in the mould of the process through the pine oil
Several moulds is changed to the process of new mould.
A kind of method for stamping, which is characterized in that including：Carry out plasma treatment with to formed the surface of figuratum mould into
The modified process of row；The mould is transferred to a direction and the pattern die of the mould that will carry out plasma treatment is in substrate
Process；The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；Institute is transferred to other direction
It states mould and carries out plasma treatment with to the process being modified by the surface of the mould of pine oil；The mould is transferred to a direction
And the pattern die of the mould of plasma treatment will be carried out in the process of new substrate；And transfer the mould to a direction
And from the process of mould described in the new substrate pine oil being stamped, each process is carried out repeatedly and continuously.
A kind of method for stamping, which is characterized in that including：Carry out plasma treatment with to formed the surface of figuratum mould into
The modified process of row；The mould is transferred to other direction and the pattern die of the mould that will carry out plasma treatment is in substrate
Process；The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；It is transferred to other direction
The mould and to by the mould of pine oil surface carry out plasma treatment process；Transfer the mould to other direction and will be into
Gone plasma treatment the mould pattern die in the process of new substrate；And to a direction transfer the mould and from quilt
The process of mould, each process described in the new substrate pine oil of punching press are carried out repeatedly and continuously.
A kind of method for stamping, using forming the figuratum more than two substrates of first, second die stamping, the coining side
Method is characterized in that, carries out plasma treatment so that the surface to first mould is modified and first stamping is pressed on the
One substrate, and after plasma treatment is modified with the surface to second mould, rushed from the first substrate pine oil
While first mould of pressure, second stamping for having carried out plasma treatment is pressed on second substrate.
The method for stamping is characterised by comprising：Plasma treatment is carried out with the surface to first mould to change
The process of property；First mould is transferred to a direction and will carry out the pattern die of first mould of plasma treatment in
The process of one substrate；First, second mould is transferred to a direction and carries out plasma treatment with the surface to second mould
The process being modified；First, second mould is transferred to a direction and from the first mould described in the substrate pine oil being stamped
While, the pattern die of second mould of plasma treatment will have been carried out in the process of second substrate；It is moved to other direction
It send first, second mould and carries out plasma treatment with to the process being modified by the surface of first mould of pine oil；
And transfer first, second mould to other direction and the pattern die of first mould that plasma treatment will have been carried out in
While third substrate, from the process of the second mould described in the second substrate pine oil being stamped, each process is anti-
It continuously carries out again.
The method for stamping is characterized in that the plasma is to including one in air, argon gas, oxygen and nitrogen
A above gas applies RF and generates.
A kind of imprinting apparatus, which is characterized in that including：Engaging portion, so that the pattern energy for the mould being surface-treated
It is enough stamped in substrate；Separation unit detaches the mode of the mould and the substrate that are combined, in conjunction with the mould and the base
Plate；And transferred unit, transfer the mould, the transferred unit by the separate section from the mould be transferred to the combination
Portion and reuse the mould.
A kind of method for stamping, which is characterized in that including：By the pattern die for the mould being surface-treated in the mistake of substrate
Journey；The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；Described in other direction transfer
Mould and by the pattern die for the mould being surface-treated in the process of new substrate；And transfer the mould to a direction
And from the process of mould described in the new substrate pine oil being stamped, each process is carried out repeatedly and continuously.
The effect of invention
In accordance with the invention it is possible to realize following multi-effect.
First, improve the release property of mould.
Second, have the advantages that engineering time and expense can be shortened.
Third has the advantages that mould can be reused.
Description of the drawings
Fig. 1 is the figure for the imprinting apparatus for showing the embodiment of the present invention 1；
Fig. 2 is the figure for the method for stamping for showing the embodiment of the present invention 1；
Fig. 3 is the figure for the method for stamping for showing the embodiment of the present invention 1；
Fig. 4 is the figure for the method for stamping for showing the embodiment of the present invention 1；
Fig. 5 is the figure for the imprinting apparatus for showing the embodiment of the present invention 2；And
Fig. 6 is the figure for the method for stamping for showing the embodiment of the present invention 2.
Symbol description
The engaging portions 10-, 12- pressing parts, 14- hardening portion, 16- chambers, the surfaces 20- modification portion, 22- first surfaces are modified
Portion, 24- second surface modifications portion, 30- separation units, the first separation units of 32-, the second separation units of 34-, 40- transferred unit, 50- coatings
Portion, 52- spin coatings portion, 54- drying sections, the first moulds of M1-, the second moulds of M2-, B1- first substrates, B2- second substrates, B3- third bases
Plate, B- substrates, R1, R2- a pair of rolls.
Specific implementation mode
The purpose of the present invention, some specific advantages and new feature will be from the relevant following detailed descriptions of attached drawing and in fact
It applies in example and becomes more apparent upon.It should be noted that in this specification, it is right when the inscape to each figure adds reference marks
It makes it have and is identically numbered as possible in identical inscape, if even if being shown in other figures.In addition, first, second etc.
Term can be used in a variety of inscapes of explanation, but these inscapes should not be limited to these terms.These terms are only used
Make the purpose of one inscape and another inscape of differentiation.In addition, during illustrating the present invention, when being judged as to phase
Pass known technology illustrates it is possible that when unnecessarily the gist of the invention being made not know, description is omitted.
The embodiment of the present invention is illustrated with reference to the accompanying drawings.
As illustrated in Fig. 1 to Fig. 6, imprinting apparatus of the invention include surface modification portion 20, engaging portion 10, separation unit 30 with
And transferred unit 40.
The present invention imprinting apparatus and method be the surfaces mould M are modified to improve the release property of mould M and substrate B, and
Reciprocal transfer mould M, so as to reuse the technology of mould M.
Mould M is functionally divided into master mold (Master mold) and backed stamper (replica mold) and distinguishes, and can be with
According to there are many material sections, such as Si moulds, Ni moulds, Resin moulds etc..
In the present invention, mould M can be formed on PET film, and according to the intention of designer, above-mentioned mould M could be formed with a variety of
Pattern can also make selected from multiple material.
Transferred unit 40 plays the function that above-mentioned mould M is transferred to positive direction or reverse direction.The case where mould M is formed in PET film
Under, above-mentioned transferred unit 40 can be designed as include a pair of rolls R1, R2 structure, the both ends of PET film are being individually fixed in one
In the state of two pairs of rollers R1, R2, if by a pair of rolls R1, R2 side direction (hereinafter, claim " positive direction ") or side from right to left from left to right
Direction (hereinafter, claiming " reverse direction ") rotation, then the mould M for being formed in PET film are also moved to positive direction or reverse direction, can be carried out
Reciprocal transfer.
At this point, the mould M detached in separation unit 30 can be transferred to surface modification portion 20 by transferred unit 40, can carry out etc.
Ion processing and reuse.
This transferred unit 40 can be replaced by various mechanisms such as conveyer belt or mechanical arms.
Surface modification portion 20 is modified and improves the release property of mould M to forming the surfaces figuratum mould M, plays big
The function of carrying out plasma treatment under air pressure to the surfaces mould M, preferably to including air (Air) or argon gas (Ar), oxygen (O2), nitrogen
Gas (N2) any of gas apply RF (radio frequency, Radio Frequency) to form plasma, and to the surfaces mould M into
Row is modified.
When carrying out plasma treatment, if more than 80 DEG C, mould M can melt or be bent, thus preferably in 80 DEG C or less low temperature
Lower carry out plasma treatment.
In addition, to improve the modified effect on the surfaces mould M, preferably applied between the RF antennas and RF power supply of atmos plasma
Add plasma adaptation (Matcher) to make load impedance and source impedance match.
Engaging portion 10 includes pressing part 12, and punching press has carried out the mould M of plasma treatment, so that pattern can be needed on
Substrate B.
Separation unit 30 plays after pattern is needed on substrate, from the function of substrate pine oil mould M.
In this way, in order to combine, splitting die M and substrate B, although engaging portion 10 and separation unit 30 can be separately provided,
It can introduce while play the work department (not shown) of punching press and pine oil function.
For example, if work department (not shown) by opening/closing control by that can carry out length elongation and the piston of diminution
Bar or even mechanical arm are constituted, then mould M will with being acted come stamping substrate downwards by work department (not shown), and with
It works and is detached from from substrate upward.
In addition, work department (not shown) can also be embodied in the structure that can be moved using transferred unit 40, that is, when
When positioned at chamber 16, decline mould M under opening (ON) state and suppress substrate B to carry out punching course, and is detached when being located at
When portion 30, restore to original position to detach with substrate B from closing (OFF) state to carry out pine oil process.
On the other hand, imprinting apparatus of the invention further includes control unit (not shown).
In order to reuse mould M, control unit controls transferred unit so that existing mould to be changed to new mould.Specifically, control
Portion to the combination of mould M and substrate or can also detach number and be counted and be changed to mould M according to set number new
Mould.Mould M is changed to according to surface state by new mould in the mould M surface state that separation unit 30 detaches alternatively, can also check.
[embodiment 1]
In the imprinting apparatus of the embodiment of the present invention, as illustrated in fig. 1, surface modification portion 20, engaging portion 10 and point
From portion 30 can spaced regulation spacing and set gradually along positive direction, as shown in Fig. 2, engaging portion 10, face modification portion 20 with
And separation unit 30 can also spaced regulation spacing and the positive direction along mould M is set gradually.
In addition, as illustrated in fig. 3, the position in the surface modification portion 20 and separation unit 30 that can also make Fig. 1 it is displaced from one another and
Setting.
The position in this surface modification portion 20, engaging portion 10 and separation unit 30 can carry out more according to the intention of designer
Kind deformation setting.
On the other hand, imprinting apparatus of the invention further includes painting part 50.
Substrate B is periodically provided to engaging portion 10, painting part 50 uses resin coated base after painting part 50 is coated
The tops plate B, and according to the present invention, have the advantages that the successional engineering for being coated to pattern and transferring from substrate B can be carried out.
Painting part 50 includes spin coating portion 52 and drying section 54, and spin coating portion 52 plays rotary plate and resin is made to pass through centrifugal force
It is uniformly coated in the function on substrate B, drying section 54 plays drying and is uniformly coated in the work(of the resin on substrate B
Energy.
In this way, if resin is uniformly coated in substrate B and drying, substrate B is transferred to engaging portion 10.
Other than pressing part 12, engaging portion 10 may include：Chamber 16 maintains low vacuum state, different can prevent
Logistics enters；And hardening portion 14, make the hardening of resin on substrate B.
The method for stamping of the present invention is illustrated with reference to the accompanying drawings.
It is illustrated as shown in Figure 1, Figure 2, it rotates first substrate B1 in the spin coating portion 52 of painting part 50 and resin is made to pass through centrifugal force
It is uniformly coated on substrate B, and dries the resin being uniformly coated in drying section 54.
In the state that resin is coated and dries, first substrate B1 is provided to the low vacuum chamber 16 of engaging portion 10.
On the other hand, atmospheric plasma processes are carried out to mould M by surface modification portion 20 with mould M, at plasma
The mould M for managing and having carried out surface modification will be pressed with being transferred to positive direction on low vacuum chamber 16, and with passing through
The action in portion 12 processed makes mould M and substrate B be needed on the punching course of substrate B in conjunction with and into exercising the pattern of mould M.
The mould M and substrate B combined in chamber 16 is moved to positive direction again with the action of transferred unit 40, mould M and substrate B
Separation unit 30 will be located at the state being combined, and make mould M and substrate B separation in separation unit 30.
Later, plasma is carried out to the surfaces mould M again from upper side direction to the left (hereinafter, claiming " reverse direction ") transfer mould M
Processing, and again to positive direction transfer mould M and so that mould M patterns is stamped after new substrate B, to positive direction transfer mould M and it is loose
New substrate is released, this process is carried out repeatedly and continuously.
On the other hand, the embodiment of the method for stamping of the present invention is illustrated with reference to Fig. 3.
As illustrated in fig. 3, method for stamping of the invention is carried out with following process：It is carried out to forming the surfaces figuratum mould M
Plasma treatment, and mould M is transferred by M pattern dies after substrate B to reverse direction, transfer mould M and pine oil substrate to positive direction
B。
Later, the process for carrying out plasma treatment is executed, the mould M of the process through pine oil can be reused.
Specifically, transfer mould M to reverse direction and plasma treatment is carried out to the surfaces mould M again, and again to reverse direction
Mould M is transferred by mould M pattern dies after new substrate B, mould M is transferred and the new substrate of pine oil to positive direction.
Repeatedly and continuity carry out above-mentioned each process so as to shorten engineering time, and improve productivity.
It is also possible to include that will perform set punching press or pine oil number in the mould of the process through pine oil
Mould be changed to the process of new mould.Specifically, more to change the mold, transferred unit 40 is acted so as to be adjacent to the new of existing mould
Mould come the position of existing mould.
On the other hand, Fig. 4 is the another embodiment of the method for stamping of the present invention.According to an above-mentioned embodiment (with reference to Fig. 2)
Apparatus structure, this method for stamping is different only in sequence of movement, thus to be replaced to the explanation of an above-mentioned embodiment.
[embodiment 2]
Hereinafter, during illustrating embodiment 2, for convenience, saying to structure same as Example 1 will be omitted
It is bright.
As illustrated in fig. 5, in the imprinting apparatus of another embodiment of the present invention, mould M include spaced regulation spacing and
It is set to the first mould M1 and the second mould M2 of the setting in transferred unit 40, surface modification portion 20 includes between the difference of engaging portion 10
Every the first surface modification portion 22 and second surface modification portion 24 that regulation spacing is arranged, separation unit 30 includes across engaging portion 10
The first separation unit 32 and the second separation unit 34 for being respectively separated regulation spacing with surface modification portion 20 and being arranged.In addition, transferred unit
The first or second mould M1 or M2 that are detached in the first, second separation unit 32, any of 34 are transferred to the first, second table by 40
Face modification portion 22, any of 24.
Specifically, side direction (hereinafter, claiming " positive direction ") is fixedly installed the second separation unit 34, the second table from left to right
Face modification portion 24, engaging portion 10, first surface modification portion 22 and the first separation unit 32.
Transferred unit 40 moves back and forth on this fixed line to positive direction or reverse direction, and first is provided in transferred unit 40
Mould M1 and the second mould M2.
First mould M1 and the second mould M2 carries out surface modification in first surface modification portion 22, second surface modification portion 24, and
Respectively after engaging portion 10 is combined with substrate B, detached respectively from substrate B in the first separation unit 32 and the second separation unit 34, substrate B
After painting part 50 is coated, it is periodically provided to engaging portion 10.
Fig. 5 and Fig. 6 illustrates another embodiment of the method for stamping of the present invention with reference to the accompanying drawings.
Another embodiment of the present invention is to utilize to form the more than two bases of figuratum first, second mould M1, M2 punching press
The method for stamping of plate, is technically characterized in that, is carried out at the same time the process to first, second mould M1, M2 punching press respectively and pine oil
Process.Thereby, it is possible to improve productivity.
That is, plasma treatment is carried out to be modified to the first surfaces mould M1, and punching press is in first substrate B1, and carry out etc.
After ion processing is to be modified the second surfaces mould M2, from the first mould M1 that first substrate B1 pine oils are stamped while, will
The second mould M2 punching presses of plasma treatment have been carried out in second substrate B2.
The method for stamping of the imprinting apparatus using Fig. 5 is specifically described below as process.
First substrate B1 is rotated so that resin is uniformly coated by centrifugal force in base in the spin coating portion 52 of painting part 50
On plate B, and the resin being uniformly coated is dried in drying section 54.
In the state that resin is coated and dries, first substrate B1 is provided to the low vacuum chamber 16 of engaging portion 10.
On the other hand, first mould M1 is carried out at atmos plasma by second surface modification portion 24 with the first mould M1
Reason, the first mould M1 that is plasma treated and having carried out surface modification will be located at low vacuum chamber with being transferred to positive direction
On 16, and as the action by pressing part 12 makes the first mould M1 and first substrate B1 combine, into the pattern for exercising the first mould M1
It is needed on the punching course of first substrate B1.
At this point, the second mould M2 for being spaced regulation spacing on identical PET film with the first mould M1 and being arranged will be located at second
In separation unit 34, and the second separation unit 34 is not acted separately, but maintains wait state.
The the first mould M1 and first substrate B1 combined in chamber 16 is moved to positive direction again with the action of transferred unit 40.
If the first mould M1 and first substrate B1 is moved to first surface modification portion 22, the second mould M2 with the state being combined
Second surface modification portion 24 will be located at.
At this point, first surface modification portion 22 does not work separately, the only work of second surface modification portion 24 comes to the second mould M2
Surface carries out plasma treatment and is modified.
If the second surfaces mould M2 are modified, task transfers the second mould M2, the state being combined to transferred unit 40 again
First mould M1 and first substrate B1, the first mould M1 and first substrate B1 will be located at the first separation unit 32 with the state being combined, the
Two mould M2 are transferred to engaging portion 10.
Later, the first mould M1 is made to be detached with first substrate B1 in the first separation unit 32.
While carrying out the separation process of the first mould M1 and first substrate B1, the second mould M2 is applied in painting part 50
It covers processing and is combined in the 16 waiting second substrate B2 in inside of chamber, to make the pattern of the second mould M2 be needed on the second base
Plate B2.
After the separation of first mould M1 and first substrate B1 and the cohesive process of the second mould M2 and second substrate B2, move
Sending portion 40 to transfer the first mould M1, the second mould M2 of the state being combined and second substrate B2, the first mould M1 to reverse direction will be located at
First surface modification portion 22, the second mould M2 and second substrate B2 will be located at second surface modification portion 24 with the state being combined.
At this point, first surface modification portion 22 is to open ON states, and plasma treatment is carried out to the first surfaces mould M1.Into
In a period of the row process, second surface modification portion 24 is to close (OFF) state, is not acted separately.
If the plasma treatment on the first surfaces mould M1 terminates, transferred unit 40 is carried out to reverse direction again, in the first mould M1
While positioned at 16 inside of chamber of engaging portion 10, the second mould M2 and second substrate B2 will be located at the second separation unit 34.
Later, the first mould M1 is combined in the 16 waiting third substrate B3 in inside of chamber, and is solved in the second separation unit 34
Except the bonding state of the second mould M2 and second substrate B2.
On the other hand, the imprinting apparatus of another embodiment of the present invention is technically characterized in that, although to improve release property
Using the physics mode of such as plasma treatment, but be surface-treated using the chemical mode formed by such as coat
Mould.
The imprinting apparatus of above-mentioned specific descriptions includes：Engaging portion, to make by having carried out surface in a manner of physically or chemically
The pattern of the mould of processing can be stamped in the mode of substrate, in conjunction with mould and substrate；Separation unit detaches the mould and base being combined
Plate；And transferred unit, transfer mould.In addition, transferred unit be configured to by separate section from mould be transferred to engaging portion and make again
Use mould.
Method for stamping using this imprinting apparatus includes：The mould that will be surface-treated by physically or chemically mode
Pattern die in the process of substrate；To direction transfer mould from the process for the substrate pine oil mould being stamped；To other direction
Transfer mould and by the pattern die for the mould being surface-treated in the process of new substrate；And to a direction transfer mould and from
The process of mould described in the new substrate pine oil being stamped.In addition, this each process is carried out repeatedly and continuously.
It, can be based on the embodiment of the present invention to upper although being illustrated centered on the embodiment of the present invention above
It states number or configuration of the inscape of surface modification portion, engaging portion, separation unit etc. etc. and carries out various deformation, it is clear that
Ground, this variation are also fallen into the interest field of the present invention.
Claims (23)
1. a kind of imprinting apparatus, which is characterized in that including：
Surface modification portion carries out plasma treatment to forming figuratum mould surface；
Engaging portion, in a manner of enabling the pattern for the mould for having carried out plasma treatment to be stamped in substrate, in conjunction with institute
State mould and the substrate；And
Separation unit detaches the mould being combined and the substrate.
2. imprinting apparatus according to claim 1, which is characterized in that
The plasma is generated to applying RF including the more than one gas in air, argon gas, oxygen and nitrogen.
3. imprinting apparatus according to claim 1, which is characterized in that
Further include transferred unit, transfer the mould,
The transferred unit by the separate section from the mould be transferred to surface modification portion, with can to the mould into
Row plasma treatment and reuse the mould.
4. imprinting apparatus according to claim 3, which is characterized in that
Further include control unit, combination to the mould and the substrate or detach number and count, and according to set
Number controls the transferred unit and the mould is changed to new mould.
5. imprinting apparatus according to claim 3, which is characterized in that
Further include control unit, check the separate section from mould surface state, according to the surface state control described in
The mould is changed to new mould by transferred unit.
6. imprinting apparatus according to claim 3, which is characterized in that
Surface modification portion, engaging portion and the spaced regulation spacing of separation unit and arranged successively along the transfer direction of the mould
Row.
7. imprinting apparatus according to claim 3, which is characterized in that
The engaging portion, surface modification portion and the spaced regulation spacing of separation unit and arranged successively along the transfer direction of the mould
Row.
8. imprinting apparatus according to claim 3, which is characterized in that
The mould includes spaced regulation spacing and is set to the first mould in the transferred unit and the second mould,
Surface modification portion include be respectively separated regulation spacing across the engaging portion and the first surface modification portion that is arranged and
Second surface modification portion,
The separation unit include across the engaging portion and the surface modification moiety not Jian Ge regulation spacing and be arranged first
Separation unit and the second separation unit,
The first or second mould detached in any of described first, second separation unit is transferred to institute by the transferred unit
State any of first, second surface modification portion.
9. imprinting apparatus according to claim 3, which is characterized in that
Further include painting part, the substrate top is coated with resin.
10. imprinting apparatus according to claim 9, which is characterized in that
The painting part includes：
Spin coating portion, on the substrate portion's applying liquid resin；And
Drying section dries the resin.
11. imprinting apparatus according to claim 3, which is characterized in that
The engaging portion includes：
Chamber maintains low vacuum state, can prevent foreign matter from flowing into；And
Hardening portion makes the hardening of resin on the substrate.
12. imprinting apparatus according to claim 11, which is characterized in that
The transferred unit includes：
PET film；
First roller, for the PET film one end in conjunction with and wind；And
Second roller, for the PET film the other end in conjunction with and wind and with first roller interval regulation spacing and configure,
The mould is formed on the PET film.
13. a kind of imprinting apparatus, which is characterized in that including：
Surface modification portion carries out plasma treatment to forming figuratum mould surface；And
Work department will be described in a manner of so that the pattern for the mould for having carried out plasma treatment is stamped in substrate
Stamping is pressed on the substrate, and from mould described in the substrate pine oil.
14. a kind of method for stamping, which is characterized in that including：
The process that plasma treatment is carried out to be modified to the surface for forming figuratum mould；
The pattern die of the mould of plasma treatment will have been carried out in the process of substrate；And
From the process of mould described in the substrate pine oil being stamped.
15. method for stamping according to claim 14, which is characterized in that
The process for executing the plasma treatment, the mould of the process through the pine oil can be reused.
16. method for stamping according to claim 14, which is characterized in that
Further include will be performed in the mould of the process through the pine oil set punching press or pine oil number mould be changed to it is new
The process of mould.
17. a kind of method for stamping, which is characterized in that including：
The process that plasma treatment is carried out to be modified to the surface for forming figuratum mould；
The mould is transferred to a direction and the pattern die of the mould that will carry out plasma treatment is in the process of substrate；
The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；
The mould is transferred to other direction and carries out plasma treatment with to the mistake being modified by the surface of the mould of pine oil
Journey；
The mould is transferred to a direction and the pattern die of the mould that will carry out plasma treatment is in the process of new substrate；
And
Transfer the mould to a direction and from the process of mould described in the new substrate pine oil being stamped,
Each process is carried out repeatedly and continuously.
18. a kind of method for stamping, which is characterized in that including：
The process that plasma treatment is carried out to be modified to the surface for forming figuratum mould；
The mould is transferred to other direction and the pattern die of the mould that will carry out plasma treatment is in the process of substrate；
The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；
To other direction transfer the mould and to being carried out the process of plasma treatment by the surface of the mould of pine oil；
The mould is transferred to other direction and the pattern die of the mould that will carry out plasma treatment is in the mistake of new substrate
Journey；And
Transfer the mould to a direction and from the process of mould described in the new substrate pine oil being stamped,
Each process is carried out repeatedly and continuously.
19. a kind of method for stamping, using forming the figuratum more than two substrates of first, second die stamping, the coining side
Method is characterized in that,
Plasma treatment is carried out to be modified with the surface to first mould and first stamping is pressed on first substrate, and
It carries out after plasma treatment is modified with the surface to second mould, described the to be stamped from the first substrate pine oil
While one mould, second stamping for having carried out plasma treatment is pressed on second substrate.
20. method for stamping according to claim 19, which is characterized in that including：
Carry out the process that plasma treatment is modified with the surface to first mould；
First mould is transferred to a direction and the pattern die of first mould that will carry out plasma treatment is in the first base
The process of plate；
First, second mould is transferred to a direction and carries out what plasma treatment was modified with the surface to second mould
Process；
Transfer first, second mould to a direction and from described in the substrate pine oil being stamped while the first mould, will be into
Gone plasma treatment second mould pattern die in the process of second substrate；
First, second mould is transferred to other direction and carries out plasma treatment with to by the surface of first mould of pine oil
The process being modified；And
Transfer first, second mould to other direction and the pattern die of first mould that plasma treatment will have been carried out in
While third substrate, from the process of the second mould described in the second substrate pine oil being stamped,
Each process is carried out repeatedly and continuously.
21. the method for stamping according to any one of claim 14 to 20, which is characterized in that
The plasma is generated to applying RF including the more than one gas in air, argon gas, oxygen and nitrogen.
22. a kind of imprinting apparatus, which is characterized in that including：
Engaging portion, in a manner of so that the pattern for the mould being surface-treated is stamped in substrate, in conjunction with the mould and
The substrate；
Separation unit detaches the mould being combined and the substrate；And
Transferred unit transfers the mould,
The transferred unit by the separate section from the mould be transferred to the engaging portion and reuse the mould.
23. a kind of method for stamping, which is characterized in that including：
By the pattern die for the mould being surface-treated in the process of substrate；
The mould is transferred to a direction and from the process of mould described in the substrate pine oil being stamped；
The mould is transferred to other direction and by the pattern die for the mould being surface-treated in the process of new substrate；
And
Transfer the mould to a direction and from the process of mould described in the new substrate pine oil being stamped,
Each process is carried out repeatedly and continuously.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0174408 | 2015-12-08 | ||
| KR20150174408 | 2015-12-08 | ||
| KR10-2015-0174416 | 2015-12-08 | ||
| KR20150174416 | 2015-12-08 | ||
| KR10-2016-0166099 | 2016-12-07 | ||
| KR1020160166099A KR20170067665A (en) | 2015-12-08 | 2016-12-07 | Apparatus and method for imprinting |
| PCT/KR2016/014375 WO2017099492A1 (en) | 2015-12-08 | 2016-12-08 | Imprint device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108292592A true CN108292592A (en) | 2018-07-17 |
| CN108292592B CN108292592B (en) | 2022-04-01 |
Family
ID=59012750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680068257.8A Active CN108292592B (en) | 2015-12-08 | 2016-12-08 | Imprint apparatus and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108292592B (en) |
| WO (1) | WO2017099492A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4057066A1 (en) * | 2021-03-11 | 2022-09-14 | Obducat AB | Apparatus and method for surface treatment of an imprint stamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004148494A (en) * | 2002-10-24 | 2004-05-27 | Hewlett-Packard Development Co Lp | Hardening nano-imprinting stamp |
| JP2008179034A (en) * | 2007-01-24 | 2008-08-07 | Toppan Printing Co Ltd | Imprint mold, imprint mold manufacturing method, and surface reforming device |
| JP2011146447A (en) * | 2010-01-12 | 2011-07-28 | Canon Inc | Imprint apparatus and article manufacturing method |
| KR20140081975A (en) * | 2012-12-21 | 2014-07-02 | (주) 에이와케이 | Apparatus for manufacturing film used micro size pattern and method using the same |
| CN104094379A (en) * | 2012-02-07 | 2014-10-08 | 佳能株式会社 | Imprint apparatus and method of manufacturing article |
| US20150001746A1 (en) * | 2013-06-28 | 2015-01-01 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and method for manufacturing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110277922A1 (en) * | 2009-02-03 | 2011-11-17 | Konica Minolta Holdings, Inc. | Base material manufacturing method, nanoimprint lithography method and mold duplicating method |
| JP2010184485A (en) * | 2009-02-13 | 2010-08-26 | Seiko Epson Corp | Mold for imprint, method for manufacturing mold for imprint, and method for reproducing mold for imprint |
-
2016
- 2016-12-08 WO PCT/KR2016/014375 patent/WO2017099492A1/en active Application Filing
- 2016-12-08 CN CN201680068257.8A patent/CN108292592B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004148494A (en) * | 2002-10-24 | 2004-05-27 | Hewlett-Packard Development Co Lp | Hardening nano-imprinting stamp |
| JP2008179034A (en) * | 2007-01-24 | 2008-08-07 | Toppan Printing Co Ltd | Imprint mold, imprint mold manufacturing method, and surface reforming device |
| JP2011146447A (en) * | 2010-01-12 | 2011-07-28 | Canon Inc | Imprint apparatus and article manufacturing method |
| CN104094379A (en) * | 2012-02-07 | 2014-10-08 | 佳能株式会社 | Imprint apparatus and method of manufacturing article |
| KR20140081975A (en) * | 2012-12-21 | 2014-07-02 | (주) 에이와케이 | Apparatus for manufacturing film used micro size pattern and method using the same |
| US20150001746A1 (en) * | 2013-06-28 | 2015-01-01 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and method for manufacturing device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017099492A1 (en) | 2017-06-15 |
| CN108292592B (en) | 2022-04-01 |
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