CN108288957A - Filter apparatus - Google Patents
Filter apparatus Download PDFInfo
- Publication number
- CN108288957A CN108288957A CN201810001764.0A CN201810001764A CN108288957A CN 108288957 A CN108288957 A CN 108288957A CN 201810001764 A CN201810001764 A CN 201810001764A CN 108288957 A CN108288957 A CN 108288957A
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- China
- Prior art keywords
- busbar
- carrier element
- filter
- filter apparatus
- contact
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- 210000002105 tongue Anatomy 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 21
- 238000004080 punching Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 40
- 238000010586 diagram Methods 0.000 description 15
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/20—Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Filters And Equalizers (AREA)
Abstract
The present invention relates to a kind of filter apparatus, the filter apparatus includes at least one first busbar (2), second busbar (3) and Carrier element (4), it is disposed at least one electric filter component (5 on the Carrier element (4), 6), at least one electric filter component (5, 6) with the busbar (2, at least one of 3) electrical connection, wherein, at least one electric filter component (5, 6) with these busbares (2, at least one of 3) the electrical connection is realized by being the mechanical grip between first busbar (2) and second busbar (3) by the Carrier element (4).
Description
Technical field
The present invention relates to a kind of filter apparatus and a kind of manufacturing method of filter apparatus.
Background technology
The electronic device or electronic filter of AF panel for electrical system and equipment are substantially known.Especially
Ground, in order to meet the Electro Magnetic Compatibility (EMC of electrical system or equipment：Electromagnetic compatibilty) in terms of
Existing requirement, it is known to following filter：In DC network, which filters out the high frequency letter being coupled in DC channel
Number (so-called EMC filters).
Especially in electric vehicle, the problem is that, it is necessary to accumulator (for example, battery unit) and motor it
Between busbar (busbar) on transmission high current (for example, the up to electric current of 500A).Therefore, busbar overheats in order to prevent, busbar
There must be sizable cross section (for example, in cm2In the range of).Electric component (especially capacitor) must be with these mothers
Line connects, so as to filter out High-frequency Interference.In addition, the transition impedance (Ohmic resistance, the parasitic electricity that are generated when connecting capacitor
Sense) it must be as small as possible.
So far, the connection of electric filter component (especially capacitor) is by welding the join domain of capacitor
Be connected on busbar (especially previously passed suitable material processing (for example, drilling or milling) and what is prepared be used for welding procedure
Bus-bar area on) come what is carried out, so that the join domain being formed thinly and busbar can only fused.On the one hand, this is consumed
When and it is of high cost, but on the other hand, error is easy, the reason is that the quality of electrical contact is largely dependent upon phase can occur
When the quality being welded to connect changed greatly.
Invention content
Based on this, the purpose of the present invention is to propose to one kind can by the time efficiently and it is cost-effective in a manner of manufacture and also
It can realize the filter apparatus of the reliable electric contact of filter part.
Described problem is solved by the feature of independent claims 1.Preferred embodiment is the master of dependent claims
Topic.The manufacturing method of filter apparatus is the theme of independent claims 14.
According in a first aspect, the present invention relates to a kind of filter apparatus comprising at least one first busbar, the second busbar
With Carrier element, at least one electric filter component is disposed on the Carrier element, has been specifically arranged at least one
A capacitor, the electrical connection of at least one of at least one electric filter component and the busbar.Described at least one
The electrical connection of at least one of a electric filter component and these busbares is by the Carrier element in institute
It states the mechanical grip between the first busbar and second busbar and occurs.
The key advantages that filter apparatus according to the present invention provides are, can be simple by mechanical erection and with advantageous
Cost generates the electrical connection between busbar and filter part.It as a result, particularly, can be to avoid the bonding pad of filter part
Welding of the domain on busbar.This aspect can cause the reduction of contact fault, on the other hand will produce the manufacture of filter apparatus
On cost advantage.
In preferred exemplary implementation scheme, the busbar extends parallel to each other and one is arranged in another it
On.Thus, it is possible to by the Carrier element for making busbar support each other come fixed and arranged between busbar, and busbar and filter
Electrical contact between component is by making contact site realize against each other during the mechanical support.
In preferred exemplary implementation scheme, the Carrier element is configured to band-like.Particularly, Carrier element
Can have (being measured transverse to the longitudinal axis of busbar) length less than Carrier element (along the longitudinal axis of busbar
Orientation measurement) width.Band-like Carrier element can be disposed between busbar, to be mechanically supported on these busbares
Between.
In preferred exemplary implementation scheme, the longitudinal axis of the Carrier element extends transversely with, and especially hangs down
Directly extend in the longitudinal axis of the busbar.In the region that busbar and Carrier element intersect, the electricity that busbar can occur connects
Touch with at least one filter part electrical couplings.
In preferred exemplary implementation scheme, the Carrier element is laterally projecting in the both sides of the busbar, and
Filter part, especially capacitor are respectively arranged on outburst area.Outburst area serves as the connection of filter part as a result,
Region.Thus, it is possible to which the electric wiring between busbar and filter part is made to keep very short.
In preferred exemplary implementation scheme, first filter component (especially capacitor) will first busbar and
Component coupling with reference potential.Particularly, reference potential can have ground potential.Thus, it is possible to via the filter
Component shifts the High-frequency Interference being present on the first busbar, it is possible thereby to filter out High-frequency Interference.
In preferred exemplary implementation scheme, second filter component (especially capacitor) will second busbar and
Component coupling with reference potential.Particularly, reference potential can have ground potential.Thus, it is possible to via the filter
Component shifts the High-frequency Interference being present on the second busbar, it is possible thereby to filter out High-frequency Interference.
Preferably, the first busbar and the second busbar are coupled with the filter part of same size.These filter parts are excellent
Selection of land is arranged with being mutually symmetrical (especially mirror symmetry) about the longitudinal axis of busbar.Thus, it is possible to obtain two kinds of busbares pair
The AF panel of common-mode signal (common mode filtering).
In preferred exemplary implementation scheme, the busbar and the conductive region that is arranged on the Carrier element it
Between electrical connection be via contact site (contact spring) realize, the contact site have it is at least one with spring-like fashion structure
At contact area.When the Carrier element to be clamped between the busbar, this is connect with what spring-like fashion was constituted
It flexible deformation or can correspondingly be compressed at least partly in tactile region.Thus, it is possible to realize the improved electrical contact of busbar.
In preferred exemplary implementation scheme, the contact site has multiple contact tongues.The contact tongue can be with
Central plane relative to the contact site is projected upwards or is protruded up and down at least partly.The contact tongue it is same
When up and down protrusion be for example achieved in the following ways：Longitudinal axis of these contact tongues preferably along them
It rotates at least partly so that fringe region protrudes up and down relative to the central plane of contact site.The contact tongue
Such as the rotation before being clamped between the Carrier element and the busbar can between 30 ° and 60 °, such as
Between 40 ° and 50 °, especially from about 45 °.Then, this angle of rotation can be by the Carrier element and the busbar
Between clamping and reduce at least partly.Alternatively, the contact site can also be with the contact zone of different elastically deformables
Domain, for example, in the form of the helically contact area of spring shape existing for contact area.
In preferred exemplary implementation scheme, between the Carrier element and the busbar, in the contact site
Region in be provided at least one gasket, the deformation for the contact area that the gasket limitation is constituted with spring-like fashion.
Only deformed to a certain extent with the contact area that spring-like fashion is constituted thus, it is possible to realize, and with make the busbar that
The power of this support is unrelated, and the contact area cannot fully be pressed against the Carrier element.
In preferred exemplary implementation scheme, in two Carrier component sides relative to each other of the Carrier element
On face, it is respectively arranged with contact site.As a result, by the clamping of Carrier element, electricity while each busbar can occur
Contact, for example, the electrical contact of the first busbar occurs by the contact site positioned at downside and by means of the contact site positioned at upside
And the electrical contact of the second busbar occurs.
In preferred exemplary implementation scheme, the Carrier element be include electrical isolation printed circuit board Carrier and
The printed circuit board in the conductor path region of multiple conductions.Via the conductor path region, can busbar and capacitor it
Between or be in electrical contact between capacitor and component with reference potential (especially ground potential).The conductor path region
Can the entire width of the printed circuit board or substantially entire width (particularly,>80%) extend on.Thus, it is possible to
Realize the optimization transfer of interference.
In preferred exemplary implementation scheme, the Carrier element has the Carrier of non-conducting material, and described
Punching press sheet metal part is disposed on Carrier.Here, punching press sheet metal part is in for filter part towards busbar and direction
The corresponding electrical contact of the component of reference potential.Thus, it is possible to be further reduced the manufacturing cost of filter apparatus.
In preferred exemplary implementation scheme, punching is provided integrally at the contact area that spring-like fashion is constituted
It presses on sheet metal part, the busbar is connected to the filter part by the punching press sheet metal part.In other words, with spring-like shape
The contact area that formula is constituted forms the whole portion of the punching press sheet metal part for the contact between busbar and filter part
Point.Thus, it is possible to avoid contact with the soldering of element and the punching press sheet metal part, this will produce low transition resistance and thus can
Generate improved filter characteristic.
In preferred exemplary implementation scheme, the filter apparatus includes multiple Carrier elements, the Carrier
Element is separated from each other along the busbar, and each Carrier element includes at least one filter part.In these Carriers member
Between part, it is provided with choke coil, the choke coil is formed by toroidal core or the belt carcass of winding (in particular, nanocrystalline belt carcass)
's.Particularly, the choke coil can have the inner opening of the cross section for the busbar for being suitable for being clamped each other so that institute
Stating choke coil can slide on the busbar.By inductive effect of the magnetic core on the busbar, choke coil is realized
Effect.
According on the other hand, the present invention relates to a kind of manufacturing method of filter apparatus, the filter apparatus includes
At least one first busbar, the second busbar and Carrier element are disposed at least one electric filter on the Carrier element
Device component, the electrical connection of at least one of at least one electric filter component and the busbar.It is described at least one
Electric filter component is by mechanical grip of the Carrier element between first busbar and second busbar
With the electrical connection of at least one of these busbares.
" filter part " in the sense of the present invention is understood to can be used for any electricity of the AF panel of busbar
Gas component.Particularly, filter part can be capacitor but it is also possible to be inductance or resistor.
Term " approximation " in the sense of the present invention, " basic " refer to " about " respectively and exact value deviation is +/-
10%, preferably deviation +/- 5%, and/or in the form of the inappreciable variation for function existing for deviation.
Other development, advantage and application possibilities of the present invention also will be from the description of following exemplary embodiment and attached drawing
In show.Here, have been described above and/or all features that vision is presented individually or with any desired combination substantially
It is subject of the present invention, in the claims and the grouping in their subsequent references but regardless of them.Moreover, claim
Content as explanation component part.
Description of the drawings
Hereinafter, the present invention will be further expalined by the attached drawing in exemplary implementation scheme.
The stereogram of the first embodiment of filter apparatus has been illustrated by way of example in Fig. 1；
Cross-section diagram of the filter apparatus shown in Fig. 1 along section line X-X has been illustrated by way of example in Fig. 2；
Fig. 3 be illustrated by way of example between busbar pair and Carrier element by the dashed circle in Fig. 2
The detailed diagram of the clamp area marked；
The diagram of the upside for the Carrier element for being provided with capacitor has been illustrated by way of example in Fig. 4；
The diagram of the downside for the Carrier element for being provided with capacitor has been illustrated by way of example in Fig. 5；
The stereogram of the second embodiment of filter apparatus has been illustrated by way of example in Fig. 6；
Cross-section diagram of the filter apparatus shown in Fig. 6 along section line X-X has been illustrated by way of example in Fig. 7；
Fig. 8 be illustrated by way of example between busbar pair and Carrier element by the dashed circle in Fig. 7
The detailed diagram of the clamp area marked；
The carrier wave for being provided with capacitor according to the second exemplary implementation scheme has been illustrated by way of example in Fig. 9
The diagram of the upside of device element；
The load for being provided with capacitor according to the second exemplary implementation scheme has been illustrated by way of example in Figure 10
The diagram of the downside of wave device element；
The schematic block diagram of the exemplary filters device for filtering out interference has been illustrated by way of example in Figure 11.
Specific implementation mode
Fig. 1 to Fig. 5 shows the first exemplary implementation scheme of filter apparatus 1 in a different view.With reference to that
The cartesian coordinate system of this vertical axis (that is, x-axis, y-axis and z-axis) carries out following illustrate to filter apparatus 1.Filter fills
It includes the busbar pair with the first busbar 2 and the second busbar 3 to set 1.In the diagram according to Fig. 1, the first busbar 2 is illustrated only.
It should be understood that more than two busbar, which can also be arranged, carrys out shaping filter device 1.
For example, the busbar 2,3 of filter apparatus 1 is constituted is connected to customer by energy-storage units (for example, battery)
The positive electric conductor and negative electricity conductor of (electrical consumer) (for example, motor).In shown exemplary embodiment party
In case, busbar 2,3 be arranged in a z-direction one on top of the other, and with the edges in parallel with each other their longitudinal axis L AS
The directions y extend.Preferably, it is semicircle that busbar 2,3, which is configured to cross section, and busbar 2,3 is arranged to the flat of them
Side is separated from each other and facing with each other so that it is circular that the busbar 2,3 of an arrangement on top of the other, which forms cross section,
Busbar pair.Busbar 2,3 can pass through suitable insulating materials spaced-apart.
Include Carrier (carrier) element 4 to inhibit the interference of busbar 2,3, filter apparatus 1, in Carrier member
It is provided at least one capacitor on part 4, in shown exemplary implementation scheme, two are provided on Carrier element 4
A capacitor 5,6.In shown exemplary implementation scheme, Carrier element 4 is configured to belt-like form, wherein carrier wave
The width of device element 4 is less than length of the Carrier element 4 along its longitudinal axis L AT.This Carrier element 4 is disposed in two
Between a busbar 2,3 so that the longitudinal axis L AT of Carrier element 4 is laterally extended, in particular perpendicular to the longitudinal direction of busbar 2,3
Axis LAS (in shown exemplary implementation scheme, in the x direction) extends.Carrier element 4 is between busbar 2,3
Fixation is realized by mechanical grip Carrier element 4.Here, the upside of the flat configuration of the first lower part busbar 2 is against load
The downside of wave device element 4, and the downside of the flat configuration of the second upper bus 3 abuts the upside of Carrier element 4.
Carrier element 4 is arranged to two of identical or essentially identical length relative to the first busbar 2 and the second busbar 3
Carrier element area 4a, 4b is from busbar to being protruded towards different sides.By way of example, first carrier device element area 4a
It protrudes to the left side, the second Carrier element area 4b is protruded towards right side.Here, the first capacitor 5 is arranged on the first load
In wave device element area 4a, the second capacitor 6 is arranged in the second Carrier element area 4b.Thus, it is possible to realize about
The symmetrical filter apparatus of the longitudinal axis L AS mirror symmetries or base image of busbar 2,31.Such as according to the exemplary implementation of Fig. 1
Shown in scheme, capacitor 5,6, which can be arranged, to be suspended on Carrier element 4, that is, on the direction of the first busbar 2 downwards
It is prominent.
In order to by busbar 2,3 and capacitor 5,6 electrical couplings to inhibit the interference of busbar 2,3, in the upper of Carrier element 4
Side 4 ' and " conductive region is above respectively set in downside 4.In Fig. 1 to exemplary implementation scheme illustrated in fig. 5, Carrier element 4
It is formed by printed circuit board 4.1, multiple conductor path regions is provided on the upper side and lower side of printed circuit board 4.1
4.2。
Particularly, ' and downside 4 " can above be respectively arranged with contact site 8 it can be noted that upside 4 such as in Fig. 3 to Fig. 5
‘、8“.This contact site 8 ', 8 " via conductor path region 4.2 respectively with capacitor 5,6 electrical couplings.Busbar 2,3 as a result,
Electrical connection can be formed between capacitor 5,6.Thus, for example, contact site 8 ' is arranged on the upside 4 of Carrier element 4
' on, the second busbar 3 by contact site 8 ' and be electrically connected with the first capacitor 5, and contact site 8 " is arranged on Carrier element
4 downside 4 " on, the first busbar 2 by contact site 8 " and with the second capacitor 6 be electrically connected.It should be understood that there is also
The possibility of Opposite direction connection.
Contact site 8 ', 8 " there is the contact area 8.1 that is constituted with spring-like fashion.In shown exemplary implementation scheme
In, contact area 8.1 is with projecting upwards or the comb shape of multiple contact tongues 8.2 outstanding is constituted up and down.
When being clamped in Carrier element 4 between two busbares 2,3, these contact tongues 8.2 can upspring in the side of horizontal aligument
Property deformation or correspondingly deform so that contact tongue 8.2 pass through restoring force be pressed against busbar 2,3.Conductor path region 4.2 as a result,
With contact site 8 ', 8 " between there is low ohm transition resistance, as a result, formed capacitor 5,6 and busbar 2,3 low ohm company
It connects, that is, do not use soldering connection or be welded to connect.Other than contact tongue, other contacts for being constituted with spring-like fashion
Regional variety is also possible, for example, the contact area 8.1 of the contact element with helical spring form.
Using printed circuit board 4.1, contact site 8 ', 8 " can be by being for example soldered to conductor path region
Contact spring element on 4.2 is formed.Alternatively, contact spring element only can loosely be placed into conductor path region 4.2
Above or it is adhered on conductor path region 4.2.Electrical contact between conductor path region 4.2 and corresponding busbar 2,3 is to pass through
Contact site 8 ', 8 " realization so that the contact area 8.1 constituted with spring-like fashion can be used, contact area 8.1 is for example logical
It crosses contact tongue 8.2 outstanding up and down and is in electrical contact with conductor path region 4.2 and busbar 2,3.Particularly, described
Protrusion can be realized by 45 ° of fore-aft axis around contact tongue 8.2 or substantially 45 ° up and down.
In order to shift interference, particularly, such as in fig. 2 it can be noted that capacitor 5,6 passes through the company away from busbar 2,3
Region is connect with 7 electrical couplings of component, the shell that component 7 is for example made of an electrically conducting material is formed.For example, this component 7 has
Reference potential, especially ground potential.It can be connected through a screw thread with the electrical connection of component 7 or similar connection and by capacitance
The join domain of device 5,6 is connected electrically to the conductor path region 4.2 of component 7 to realize.Threaded connection can also be generated for example
The fixation of the free end of Carrier element 4.As depicted in figs. 1 and 2, one or more holders 10 can be used, so as to fixed female
Line 2,3.
Particularly, as can be seen in Figure 3, contact tongue 8.2 can turn relative to x-y plane at least partly
It is dynamic, that is, particularly, around the rotary shaft rotation for being parallel to y-axis extension.The fringe region of contact tongue 8.2 is relative to connecing as a result,
Remaining region for touching tongue piece 8.2 projects upwards, and whereby when busbar 2,3 to be clamped each other, busbar 2,3 may be implemented on these sides
At edge region against.Contact site 8,8 can also be improved as a result, ' with the electrical contact between busbar 2,3.
Contact site 8 ', 8 " region in, gasket 9 can be provided with.This gasket 9 can be surrounded for example and be connect accordingly
Contact portion 8 ', 8 " frame-like form extend or this gasket 9 can it is only point-by-point or partially around contact site 8 ', 8 " set
It sets.It can select the height of gasket 9 so that the deformation of contact tongue 8.2 is restricted, that is, contact tongue 8.2 is not to pass through folder
It holds busbar 2,3 and is completely against on Carrier element 4, but at least part of interval is kept with it (referring to Fig. 3).
In the case where component 7 is formed by the shell constituted in the form of a cup, this shell can use suitable cast
Material is poured into a mould, for example, epoxy resin or similar material.Thus, it is possible to protective condenser 5,6 and Carrier element area
The influence of 4a, 4b (if applicable) from moisture and vibration.
Fig. 6 to Figure 10 shows another exemplary implementation scheme of filter apparatus 1 according to the present invention.Here, root
Correspond to the diagram in Fig. 1 according to the diagram of Fig. 6, the diagram, etc. in Fig. 2 is corresponded to according to the diagram of Fig. 7.Is only explained below
Difference of two exemplary implementation schemes compared with the first exemplary implementation scheme.Other aspects, previous statement are also applied for the
Two exemplary implementation schemes.
The main distinction between first exemplary implementation scheme and the second exemplary implementation scheme is Carrier element 4
Construction.In the second exemplary implementation scheme, Carrier element 4 is formed by the Carrier 4.3 of non-conducting material, in carrier wave
Multiple punching press sheet metal parts 4.4 (also referred to as punching press grid) are disposed on device 4.3.Here, " punching press sheet metal part " is understood
To pass through any sheet metal part of punching press or other materials processing (for example, laser cutting) manufacture.These punching press sheet metal parts
4.4 are disposed in by suitable interconnection technique on Carrier 4.3.Thus, for example, punching press sheet metal part 4.4 can be pushed into
Or it is correspondingly inserted into the recess portion being arranged on Carrier.It is also contemplated that being fixed by injection, casting or bonding.
As in figure 6 and figure 7 it can be noted that the join domain of capacitor 5,6 can be electrically connected for example, by soldering
On the other hand ensure capacitor to punching press sheet metal part 4.4 on the one hand to ensure contact of the capacitor 5,6 towards busbar 2,3
5,6 towards component 7 contact.
Contact site 8 ', 8 " can advantageously be formed on punching press sheet metal part, i.e., particularly, be integrally formed.For example,
The contact area 8.1 with contact tongue 8.2 can be manufactured by being stamped or cut out.Therefore, particularly, punching press sheet metal part
4.4 there is contact area 8.1, contact area 8.1 there is contact tongue 8.2, contact tongue 8.2 to connect adjacent with busbar 2,3
Tactile region is connected electrically to the busbar 2,3.By contact site 8 ', 8 " Construction integration, may be implemented in contact site 8 ' with 8
" between do not need soldering point, be not in the transition resistance caused by brazed portions as a result,.
As described in having been combined the first exemplary implementation scheme, gasket 9 can be arranged on contact site 8 ', 8 " region
In.Particularly, as in figures 7 and 8 it can be noted that particularly, these gaskets 9 may be integrally formed in Carrier 4.3
On.Alternatively, gasket 9 can also be arranged (for example, bonding) to Carrier 4.3 by suitable connection method.
The filter that can be formed according to previously described exemplary implementation scheme has been illustrated by way of example in Figure 11
The schematic block diagram of device 1.Positive (+) shown in Figure 11 and negative (-) conductor are formed by busbar 2,3.Multiple capacitor C1 are extremely
C5 is connected on these busbares 2,3, to realize the AF panel of busbar 2,3.Capacitor C1 passes through the first join domain
(Pin) it is connected electrically to the first busbar 2 and the second busbar 3 is connected electrically to by the second join domain.Capacitor C1 (X capacitances
Device) so-called differential mode filter 10 is formed, it (is recommended by differential mode filter 10 to compensate the high-frequency electrical pressure difference between busbar 2,3
Formula interference voltage).
Capacitor C2, C3 with together with inductor L2 and capacitor C4, C5 form so-called common mode together with inductor L3
Filter 11,11 ', by common-mode filter 11,11 ' to filter out the common mode interference occurred with same phase in busbar 2,3.For
This, capacitor C2 to C5 is connected to reference potential (particularly, ground potential) by join domain.
As it was earlier mentioned, the electrical contact of capacitor 5,6 is by by 4 mechanical grip of Carrier element between busbar 2 and 3
Occur.
Particularly, inductor L1, L2, L3 can be mounted to the busbar formed by busbar 2,3 to upper.Particularly, inductance
The magnetic core that device L1, L2, L3 can be structured to annular form and be made of nanocrystalline strip.Inductor L1, L2, L3 as a result,
Effect can be significantly improved.
Here, magnetic core and the Carrier element 4 with filter part can be installed to busbar to upper one by one,
Particularly, it is alternately installed to busbar one by one to upper so that the simple installation of filter apparatus 1 may be implemented.Magnetic core
It can be integrally formed, i.e., it is inseparable.
Illustrate the present invention in an exemplary embodiment above.It should be understood that not departing from the present invention's
In the case of inventive concept, many changes and modifications can be generated.
It is assumed above：Capacitor 5,6 is directly coupled to the component 7 positioned at reference potential.It should be understood that depending on
(the filtering of multiple filter parts can also be arranged in required filter characteristic between busbar and component 7 in reference potential
Device component group) or corresponding filter cell (there is complicated filter construction), to realize desired filter effect.So
And this electrical contact of filter part group or corresponding filter cell in the region of busbar via previously described in mother
Mechanical grip in the region of line and realize.
Reference numerals list
1 filter apparatus
2 first busbares
3 second busbares
4 Carrier elements
4 ' upsides
4 " downsides
4a, 4b Carrier element area
4.1 printed circuit board
4.2 conductor path regions
4.3 Carrier
4.4 punching press sheet metal parts
5 first capacitors
6 second capacitors
7 components
8 ', 8 " contact sites
8.1 contact area
8.2 contact tongue
9 gaskets
10 differential mode filters
11 common-mode filters
The longitudinal axis of LAS busbares
The longitudinal axis of LAT Carrier elements
Claims (14)
1. a kind of filter apparatus, the filter apparatus includes at least one first busbar (2), the second busbar (3) and carrier wave
Device element (4) is disposed at least one electric filter component (5,6), at least one electricity on the Carrier element (4)
At least one of gas filter part (5,6) and the busbar (2,3) are electrically connected, wherein at least one electrical filter
The electrical connection of at least one of wave device component (5,6) and these busbares (2,3) is by the Carrier element (4)
Mechanical grip between first busbar (2) and second busbar (3) and obtain, which is characterized in that the busbar
Electrical connection between (2,3) and conductive region on the Carrier element (4) is realized by contact site (8 ', 8 ")
, the contact site (8 ', 8 ") has at least one contact area (8.1) constituted with spring-like fashion.
2. filter apparatus according to claim 1, which is characterized in that the busbar (2,3) extend parallel to each other and
One arrangement is on top of the other.
3. filter apparatus according to claim 1 or 2, which is characterized in that the Carrier element (4) is configured to band
Shape form.
4. filter apparatus according to any one of the preceding claims, which is characterized in that the Carrier element (4)
Longitudinal axis (LAT) extends transverse to the longitudinal axis (LAS) of the busbar (2,3).
5. filter apparatus according to any one of the preceding claims, which is characterized in that the Carrier element (4) exists
The both sides of the busbar (2,3) are laterally projecting, and the filter part (5,6) is arranged in outburst area (4a, 4b)
In each.
6. filter apparatus according to any one of the preceding claims, which is characterized in that first filter component (5) will
First busbar (2) couples with the component (7) with reference potential.
7. filter apparatus according to any one of the preceding claims, which is characterized in that second filter component (6) will
Second busbar (3) couples with the component (7) with reference potential.
8. filter apparatus according to any one of the preceding claims, which is characterized in that the contact site (8 ', 8 ") packet
Multiple contact tongues (8.2) are included, the multiple contact tongue (8.2) projects upwards or protrudes up and down.
9. filter apparatus according to any one of the preceding claims, which is characterized in that in the Carrier element (4)
Between the busbar (2,3), be provided at least one gasket (9) in the region of the contact site (8 ', 8 "), it is described at least
The deformation for the contact area (8.1) that one gasket (9) limitation is constituted with spring-like fashion.
10. filter apparatus according to any one of the preceding claims, which is characterized in that in the Carrier element
(4) in each in relative to each other two Carrier element sides (4 ', 4 "), it is provided with the contact site (8 ', 8 ").
11. filter apparatus according to any one of the preceding claims, which is characterized in that the Carrier element (4)
It is the printed circuit board (4.1) with multiple conductor path regions (4.2).
12. the filter apparatus according to any one of preceding claims 1 to 10, which is characterized in that the Carrier member
Part (4) has the Carrier (4.3) of non-conducting material, and punching press sheet metal part (4.4) is disposed on the Carrier (4.3).
13. filter apparatus according to claim 12, which is characterized in that the contact zone constituted with spring-like fashion
Domain (8.1) is provided integrally on punching press sheet metal part (4.4), and the punching press sheet metal part (4.4) connects the busbar (2,3)
It is connected to the filter part (5,6).
14. a kind of manufacturing method of filter apparatus (1), the filter apparatus (1) include at least one first busbar (2),
Second busbar (3) and Carrier element (4), be disposed on the Carrier element (4) at least one electric filter component (5,
6), at least one of at least one electric filter component (5,6) and the busbar (2,3) are electrically connected, wherein institute
At least one electric filter component (5,6) is stated by the Carrier element (4) in first busbar (2) and described second
Mechanical grip between busbar (3) and with the electrical connection of at least one of these busbares (2,3), which is characterized in that the mother
Electrical connection between line (2,3) and conductive region on the Carrier element (4) is realized by contact site (8 ', 8 ")
, the contact site (8 ', 8 ") has at least one contact area (8.1) constituted with spring-like fashion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017100381.9A DE102017100381A1 (en) | 2017-01-10 | 2017-01-10 | A filter assembly |
| DE102017100381.9 | 2017-01-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108288957A true CN108288957A (en) | 2018-07-17 |
| CN108288957B CN108288957B (en) | 2021-10-15 |
Family
ID=60574430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810001764.0A Active CN108288957B (en) | 2017-01-10 | 2018-01-02 | Filter device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10404040B2 (en) |
| EP (1) | EP3349344B1 (en) |
| CN (1) | CN108288957B (en) |
| DE (1) | DE102017100381A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225037A (en) * | 2021-03-26 | 2021-08-06 | 洛坦电子科技(上海)有限公司 | Filter for silicon carbide high-frequency controller |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202016104468U1 (en) * | 2016-08-12 | 2016-08-24 | Schaffner Emv Ag | Filter with printed circuit board and busbars |
| DE102017109499A1 (en) * | 2017-05-03 | 2018-11-08 | Valeo Siemens Eautomotive Germany Gmbh | inverter |
| DE102018215576A1 (en) * | 2018-09-13 | 2020-03-19 | Bayerische Motoren Werke Aktiengesellschaft | Current-compensated choke, filter, high-voltage electrical system and motor vehicle |
| US10476381B1 (en) * | 2018-11-13 | 2019-11-12 | Rockwell Automation Technologies, Inc. | Power conversion system and filter therefor |
| DE102019131382B3 (en) * | 2019-11-20 | 2021-05-12 | Bohländer + Rau Fahrzeugteile GbR (vertretungsberechtigte Gesellschafter: Cyril Bohländer, 63165 Mühlheim und Willi Rau, 55218 Ingelheim) | Noise filter |
| DE102019133954B4 (en) * | 2019-12-11 | 2021-08-05 | Hanon Systems | Arrangement for filtering disturbances |
| DE102020111801A1 (en) | 2020-04-30 | 2021-11-04 | Tdk Electronics Ag | Busbar |
| CN111613974B (en) * | 2020-05-19 | 2024-04-26 | 中国电力工程顾问集团西南电力设计院有限公司 | Alternating current filter field arrangement structure with optimized arrangement |
| CN214281344U (en) * | 2020-08-26 | 2021-09-24 | 沙夫纳 Emv 股份公司 | Stackable EMI filter |
| DE102021214279A1 (en) | 2021-12-14 | 2023-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | Device for the electrical filtering of an input DC voltage of an inverter |
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| CN113225037B (en) * | 2021-03-26 | 2024-03-29 | 洛坦电子科技(上海)有限公司 | Filter for silicon carbide high-frequency controller |
Also Published As
| Publication number | Publication date |
|---|---|
| US10404040B2 (en) | 2019-09-03 |
| EP3349344B1 (en) | 2021-02-17 |
| CN108288957B (en) | 2021-10-15 |
| EP3349344A2 (en) | 2018-07-18 |
| DE102017100381A1 (en) | 2018-07-12 |
| EP3349344A3 (en) | 2018-08-01 |
| US20180198261A1 (en) | 2018-07-12 |
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