CN108288811B - Two-time forming process of Micro USB connector - Google Patents
Two-time forming process of Micro USB connector Download PDFInfo
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- CN108288811B CN108288811B CN201810053705.8A CN201810053705A CN108288811B CN 108288811 B CN108288811 B CN 108288811B CN 201810053705 A CN201810053705 A CN 201810053705A CN 108288811 B CN108288811 B CN 108288811B
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- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Abstract
The invention discloses a Micro USB connector twice forming process, which comprises the following steps: firstly, the method comprises the following steps: placing the metal frame and the plurality of conductive terminals into an injection mold for positioning; II, secondly: closing the die, and performing primary injection molding to form an insulating body to form a first module; thirdly, the method comprises the following steps: the mold is separated, the terminal positioning part is separated from the insulation body, and a hollow part is formed on the tongue plate; fourthly, the method comprises the following steps: drawing the first module to a second molding position of the male mold for a second injection molding, filling plastic into the hollow part to form a terminal separation positioning block, and embedding and molding the terminal separation positioning block and the first module together to form a second module; fifthly: wrapping the shielding shell on the outer surface of the second module, dispensing between the protruding part of the insulating body and the inner wall of the shielding shell to form a waterproof plate, and embedding, molding and fixing the waterproof plate and the semi-finished product together to form a semi-finished product; sixthly, the method comprises the following steps: and finally, mounting the gland on the surface of the shielding shell to form a finished product. The invention has simple assembly process and improves the integral strength of the connector.
Description
Technical Field
The invention relates to the technical field of connectors, in particular to a Micro USB connector twice forming process.
Background
With the rapid development of the electronic industry, portable electronic devices such as cameras, PDAs, mobile phones, etc. have been used in large quantities in daily life. Various electrical connectors, such as Micro-USB connectors, are required to be integrated with various communication devices.
The conventional Micro-USB connector has the following assembling process: firstly, placing a plurality of conductive terminals and metal in an injection mold, pressing and positioning the conductive terminals and the metal through terminal separation positioning blocks, then injection molding to form an insulating body, enabling the terminal separation positioning blocks and the conductive terminals to be embedded and molded with the insulating body, and then coating a shielding shell outside the insulating body; then, the gland is mounted on the surface of the shield case
As can be seen from the above steps, the conventional Micro-USB connector has the disadvantages of complex assembly process, low assembly efficiency, high product reject ratio and low overall strength.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main object of the present invention is to provide a two-step molding process for a Micro USB connector, which effectively solves the problems of complicated assembling process, low assembling efficiency, high defective product rate, and low overall strength of the connector.
In order to achieve the purpose, the invention adopts the following technical scheme:
a Micro USB connector two-time molding process comprises the following steps:
the method comprises the following steps: placing the metal frame and the plurality of conductive terminals into a first forming position of an injection mold for positioning, wherein the injection mold is provided with a male mold and a female mold, the male mold is provided with a plurality of terminal pin separating parts through glue digging, and the female mold is provided with a plurality of terminal positioning parts through glue digging;
step two: the female die and the male die are assembled, and first injection molding is carried out to form an insulating body, a plurality of terminal positioning parts are embedded in the insulating body, a plurality of conductive terminals are embedded on the lower surface of the insulating body, a metal frame is embedded on the upper surface of the insulating body, and the plurality of conductive terminals, the metal frame and the insulating body are embedded, molded and fixed together to form a first module;
step three: separating the female mold and the male mold, and separating the terminal positioning part from the insulation body to form a hollow part on the tongue plate of the insulation body;
step four: drawing the first module to a second molding position of the injection mold for second injection molding, filling plastic into the hollow part to form a terminal separation positioning block, and embedding and molding the terminal separation positioning block and the first module together to form a second module;
step five: wrapping the shielding shell on the outer surface of the second module, dispensing between the protruding part of the insulating body and the inner wall of the shielding shell to form a waterproof plate, and embedding, molding and fixing the waterproof plate and the semi-finished product together to form a semi-finished product;
step six: and finally, mounting the gland on the surface of the shielding shell to form a finished product.
As a preferred scheme, a terminal groove is formed on the lower surface of the tongue plate, the hollow part is communicated with the terminal groove, the contact part of the conductive terminal is embedded and formed with the terminal groove, and the contact part of the conductive terminal is exposed out of the lower surface of the tongue plate.
As a preferred scheme, the metal frame is of an integrated structure, and avoidance holes for avoiding the terminal separation positioning blocks penetrate through the upper surface and the lower surface of the metal frame and are buried in the tongue plate.
As a preferred scheme, the hollow part comprises a first transverse hollow groove, a second transverse hollow groove, two third transverse hollow grooves and two vertical hollow grooves; the terminal separation positioning block comprises a first transverse part, a second transverse part, two third transverse parts and two vertical parts;
the bottom of the first transverse hollow groove is concavely provided with a first groove, the first groove is positioned between two adjacent conductive terminals, and one inner wall of the first transverse hollow groove is concavely provided with a positioning groove; the first transverse part and the first transverse hollow groove are formed in an embedding mode, a first pin separating bump is convexly arranged at the bottom of the first transverse part and is formed with a first groove in an embedding mode, a positioning bump is convexly arranged on the front end face of the first transverse part and is formed with a positioning groove in an embedding mode;
the second transverse hollow groove is positioned behind the first transverse hollow groove, a second groove is concavely arranged at the bottom of the second transverse hollow groove and positioned between two adjacent conductive terminals, and a limiting groove is arranged in the middle of the second transverse hollow groove; the second transverse part and the second transverse hollow groove are formed in an embedding mode, a second pin isolating lug is convexly arranged at the bottom of the second transverse part and is formed with a second groove in an embedding mode, a limiting column is arranged in the middle of the second transverse part and is formed with a limiting groove in an embedding mode;
the two third transverse hollow-out grooves are respectively positioned at the two rear sides of the second transverse hollow-out groove; the two third transverse parts are respectively embedded and formed with the two third transverse hollow grooves;
the two vertical hollow-out grooves are respectively positioned between the conductive terminals adjacent to each other on two sides, and the two vertical hollow-out grooves are respectively communicated with the first transverse hollow-out groove, the second transverse hollow-out groove and the two third transverse hollow-out grooves; the two vertical parts are respectively embedded and molded with the two vertical hollow grooves, and the two vertical parts are respectively connected with the first transverse part, the second transverse part and the two third transverse parts.
Preferably, the upper surface and the lower surface of the protruding part are provided with glue dispensing grooves for facilitating glue flow forming.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
through drawing gluey processing on injection mold's public mould and master model, be formed with the terminal respectively and separate pin portion and terminal location portion, carry out injection moulding for the first time to shaping out insulator, terminal location portion breaks away from insulator, makes insulator's hyoplastron be formed with fretwork portion, carries out the second time injection moulding to fretwork portion and fills the plastic, separates the locating piece with the shaping play terminal, and the bulk strength of connector has been strengthened to this type of processing method, has reduced the packaging strength, has improved production efficiency.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an assembly view of a second step of the preferred embodiment of the present invention;
FIG. 2 is an assembly view of step four of the preferred embodiment of the present invention;
FIG. 3 is an assembly view of step five of the preferred embodiment of the present invention;
FIG. 4 is an assembly view of step six of the preferred embodiment of the present invention;
FIG. 5 is an exploded view of the preferred embodiment of the present invention;
fig. 6 is a perspective view of a terminal separation positioning block according to a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. conductive terminal 20 and metal frame
201. Avoiding hole
30. Insulating body 301 and first transverse hollow groove
302. A second transverse hollow-out groove 303 and a third transverse hollow-out groove
304. Vertical hollow-out groove 305 and first groove
306. Positioning groove 307, second groove
308. Limiting groove 31 and tongue plate
311. Terminal groove 32, protruding part
321. Glue dispensing groove
40. First module 50, terminal separation positioning block
51. A first transverse portion 52, a second transverse portion
53. Third transverse portion 54, vertical portion
55. First pin separating bump 56 and positioning bump
57. Second pin separating lug 58 and limiting column
60. Second module 70, shielding shell
80. Waterproof board 90, semi-finished product
100. And (6) pressing the cover 110 to obtain a finished product.
Detailed Description
Referring to fig. 1 to 6, a forming process according to a preferred embodiment of the present invention is shown, which includes the following steps:
the method comprises the following steps: placing the metal frame 20 and the plurality of conductive terminals 10 into a first molding position of an injection mold for positioning, wherein the injection mold is provided with a male mold and a female mold, the male mold is provided with a plurality of terminal pin separating parts by picking glue, and the female mold is provided with a plurality of terminal positioning parts by picking glue;
step two: the female die and the male die are assembled, and first injection molding is carried out to form the insulating body 30, the terminal positioning parts are embedded in the insulating body 30, the conductive terminals 10 are embedded in the lower surface of the insulating body 30, the metal frame 20 is embedded in the upper surface of the insulating body 30, and the conductive terminals 10, the metal frame 20 and the insulating body 30 are embedded, formed and fixed together to form a first module 40;
step three: separating the female mold from the male mold, and separating the terminal positioning part from the insulation body 30, so that a hollow part is formed on the tongue plate 31 of the insulation body;
step four: pulling the first module 40 to a second molding position of the injection mold for a second injection molding, filling plastic into the hollow portion to form a terminal separation positioning block 50, and forming the second module 60 by the terminal separation positioning block 50 and the first module 40 being fixed together by insert molding;
step five: wrapping the shielding shell 70 on the outer surface of the second module 60, dispensing between the protruding portion 32 of the insulating body 30 and the inner wall of the shielding shell 70 to form a waterproof board 80, and forming and fixing the waterproof board 80 and the semi-finished product together by insert molding to form a semi-finished product 90;
step six: finally, the gland 100 is mounted on the surface of the shield case 70 to form a finished product 110.
The prior Micro USB connector twice molding process comprises the following steps: firstly, placing a plurality of conductive terminals 10 and a metal frame 20 in an injection mold, pressing and positioning the conductive terminals through a terminal separation positioning block 50, then injection molding to form an insulation body 30, so that the terminal separation positioning block 50 and the plurality of conductive terminals 10 are all embedded and molded with the insulation body 30, and then coating a shielding shell 40 outside the insulation body 10; then, the gland 50 is mounted on the surface of the shield case 70. The male die and the female die of the injection mold are respectively provided with the pin separating part and the terminal positioning part through glue digging treatment, the insulation body 30 is formed through first injection molding, the hollow part is formed on the insulation body 30, the hollow part is filled with plastic through second injection molding, and the terminal separating positioning block 50 is formed through second injection molding.
The lower surface of the tongue plate 31 is formed with a terminal groove 311, the hollow portion is communicated with the terminal groove 311, the contact portion of the conductive terminal 10 is embedded and formed with the terminal groove 311, and the contact portion of the conductive terminal 10 is exposed out of the lower surface of the tongue plate 31. The metal frame 20 is of an integrated structure, and the upper and lower surfaces of the metal frame 20 are penetrated with a avoiding hole 201 for avoiding the terminal separation positioning block 50, and the avoiding hole 201 is embedded in the tongue plate 31.
The hollow part comprises a first horizontal hollow-out groove 301, a second horizontal hollow-out groove 302, two third horizontal hollow-out grooves 303 and two vertical hollow-out grooves 304; the terminal partition positioning block 50 includes a first horizontal portion 51, a second horizontal portion 52, two third horizontal portions 53 and two vertical portions 54.
A first groove 305 is concavely formed at the bottom of the first transverse hollow-out groove 301, the first groove 305 is located between two adjacent conductive terminals 20, and a positioning groove 306 is concavely formed on an inner wall of the first transverse hollow-out groove 301; the first transverse portion 51 and the first transverse hollow-out groove 301 are formed in an embedding mode, a first pin separating bump 55 is convexly arranged at the bottom of the first transverse portion 51, the first pin separating bump 55 and the first groove 305 are formed in an embedding mode, a positioning bump 56 is convexly arranged on the front end face of the first transverse portion 51, and the positioning bump 56 and the positioning groove 306 are formed in an embedding mode.
The second horizontal hollow-out groove 302 is positioned behind the first horizontal hollow-out groove 301, a second groove 307 is concavely arranged at the bottom of the second horizontal hollow-out groove 302, the second groove 307 is positioned between two adjacent conductive terminals 20, and a limiting groove 308 is arranged in the middle of the second horizontal hollow-out groove 302; the second transverse portion 52 and the second transverse hollow-out groove 302 are formed in an embedding mode, a second pin separating bump 57 is convexly arranged at the bottom of the second transverse portion 52, the second pin separating bump 57 and the second groove 307 are formed in an embedding mode, a limiting column 58 is arranged in the middle of the second transverse portion 52, and the limiting column 58 and the limiting groove 308 are formed in an embedding mode.
The two third horizontal hollow-out grooves 303 are respectively positioned at two rear sides of the second horizontal hollow-out groove 302; the two third transverse portions 53 are respectively embedded and formed with the two third transverse hollow-out grooves 303.
The two vertical hollow-out grooves 304 are respectively located between the adjacent conductive terminals 20 on the two sides, and the two vertical hollow-out grooves 304 are respectively communicated with the first horizontal hollow-out groove 301, the second horizontal hollow-out groove 302 and the two third horizontal hollow-out grooves 303; the two vertical portions 34 are respectively embedded and formed with the two vertical hollow-out grooves 304, and the two vertical portions 34 are respectively connected with the first horizontal portion 31, the second horizontal portion 32 and the two third horizontal portions 33.
The glue dispensing groove 321 which is beneficial to glue flowing forming is penetrated through the upper surface and the lower surface of the protruding portion 32, and the glue dispensing groove 321 is arranged, so that the glue can flow better, the overall strength of the waterproof board 80 is increased, and the waterproof effect is better.
The design of the invention is characterized in that:
through drawing gluey processing on injection mold's public mould and master model, be formed with the terminal respectively and separate pin portion and terminal location portion, carry out injection moulding for the first time to shaping out insulator, terminal location portion breaks away from insulator, makes insulator's hyoplastron be formed with fretwork portion, carries out the second time injection moulding to fretwork portion and fills the plastic, separates the locating piece with the shaping play terminal, and the bulk strength of connector has been strengthened to this type of processing method, has reduced the packaging strength, has improved production efficiency.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (4)
1. A Micro USB connector twice molding process is characterized in that: the method comprises the following steps:
the method comprises the following steps: placing the metal frame and the plurality of conductive terminals into a first forming position of an injection mold for positioning, wherein the injection mold is provided with a male mold and a female mold, the male mold is provided with a plurality of terminal pin separating parts through glue digging, and the female mold is provided with a plurality of terminal positioning parts through glue digging;
step two: the female die and the male die are assembled, and first injection molding is carried out to form an insulating body, a plurality of terminal positioning parts are embedded in the insulating body, a plurality of conductive terminals are embedded on the lower surface of the insulating body, a metal frame is embedded on the upper surface of the insulating body, and the plurality of conductive terminals, the metal frame and the insulating body are embedded, molded and fixed together to form a first module;
step three: separating the female mold and the male mold, and separating the terminal positioning part from the insulation body to form a hollow part on the tongue plate of the insulation body;
step four: drawing the first module to a second molding position of the injection mold for second injection molding, filling plastic into the hollow part to form a terminal separation positioning block, and embedding and molding the terminal separation positioning block and the first module together to form a second module;
step five: wrapping the shielding shell on the outer surface of the second module, penetrating glue dispensing grooves which are beneficial to glue flowing forming on the upper and lower surfaces of the protruding part of the insulating body, dispensing between the protruding part of the insulating body and the inner wall of the shielding shell to form a waterproof plate, and embedding, forming and fixing the waterproof plate and the second module together to form a semi-finished product;
step six: and finally, mounting the gland on the surface of the shielding shell to form a finished product.
2. The Micro USB connector two-shot molding process of claim 1, wherein: the lower surface of the tongue plate is formed with a terminal groove, the hollow part is communicated with the terminal groove, the contact part of the conductive terminal is embedded and formed with the terminal groove, and the contact part of the conductive terminal is exposed out of the lower surface of the tongue plate.
3. The Micro USB connector two-shot molding process of claim 1, wherein: the metal frame is of an integrated structure, and avoidance holes for avoiding the terminal separation positioning blocks penetrate through the upper surface and the lower surface of the metal frame and are buried in the tongue plates.
4. The Micro USB connector two-shot molding process of claim 1, wherein: the hollow part comprises a first transverse hollow groove, a second transverse hollow groove, two third transverse hollow grooves and two vertical hollow grooves; the terminal separation positioning block comprises a first transverse part, a second transverse part, two third transverse parts and two vertical parts;
the bottom of the first transverse hollow groove is concavely provided with a first groove, the first groove is positioned between two adjacent conductive terminals, and one inner wall of the first transverse hollow groove is concavely provided with a positioning groove; the first transverse part and the first transverse hollow groove are formed in an embedding mode, a first pin separating bump is convexly arranged at the bottom of the first transverse part and is formed with a first groove in an embedding mode, a positioning bump is convexly arranged on the front end face of the first transverse part and is formed with a positioning groove in an embedding mode;
the second transverse hollow groove is positioned behind the first transverse hollow groove, a second groove is concavely arranged at the bottom of the second transverse hollow groove and positioned between two adjacent conductive terminals, and a limiting groove is arranged in the middle of the second transverse hollow groove; the second transverse part and the second transverse hollow groove are formed in an embedding mode, a second pin isolating lug is convexly arranged at the bottom of the second transverse part and is formed with a second groove in an embedding mode, a limiting column is arranged in the middle of the second transverse part and is formed with a limiting groove in an embedding mode;
the two third transverse hollow-out grooves are respectively positioned at the two rear sides of the second transverse hollow-out groove; the two third transverse parts are respectively embedded and formed with the two third transverse hollow grooves;
the two vertical hollow-out grooves are respectively positioned between the conductive terminals adjacent to each other on two sides, and the two vertical hollow-out grooves are respectively communicated with the first transverse hollow-out groove, the second transverse hollow-out groove and the two third transverse hollow-out grooves; the two vertical parts are respectively embedded and molded with the two vertical hollow grooves, and the two vertical parts are respectively connected with the first transverse part, the second transverse part and the two third transverse parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053705.8A CN108288811B (en) | 2018-01-19 | 2018-01-19 | Two-time forming process of Micro USB connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053705.8A CN108288811B (en) | 2018-01-19 | 2018-01-19 | Two-time forming process of Micro USB connector |
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| Publication Number | Publication Date |
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| CN108288811A CN108288811A (en) | 2018-07-17 |
| CN108288811B true CN108288811B (en) | 2020-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810053705.8A Active CN108288811B (en) | 2018-01-19 | 2018-01-19 | Two-time forming process of Micro USB connector |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109038051A (en) * | 2018-08-15 | 2018-12-18 | 富加宜连接器（东莞）有限公司 | A kind of connector and its injection moulding encapsulation method with packaging part in mould |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300262A (en) * | 2013-11-15 | 2015-01-21 | 深圳市长盈精密技术股份有限公司 | USB socket with steel sheet and method for making same |
| CN107394447A (en) * | 2017-06-08 | 2017-11-24 | 深圳市长盈精密技术股份有限公司 | USB socket and its injection molding forming method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263351B (en) * | 2010-05-31 | 2016-09-28 | 中兴通讯股份有限公司 | A kind of USB (universal serial bus) head and preparation method thereof |
| CN204216267U (en) * | 2014-07-15 | 2015-03-18 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN205016742U (en) * | 2015-08-06 | 2016-02-03 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN105680287B (en) * | 2016-03-21 | 2018-05-29 | 东莞市精和电子科技有限公司 | Electric connector and its production method |
| CN107240852B (en) * | 2017-06-20 | 2019-07-09 | 北京小米移动软件有限公司 | A kind of preparation method and USB interface of USB interface |
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2018
- 2018-01-19 CN CN201810053705.8A patent/CN108288811B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300262A (en) * | 2013-11-15 | 2015-01-21 | 深圳市长盈精密技术股份有限公司 | USB socket with steel sheet and method for making same |
| CN107394447A (en) * | 2017-06-08 | 2017-11-24 | 深圳市长盈精密技术股份有限公司 | USB socket and its injection molding forming method |
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