CN108281428A - A kind of metal wire and flexible display panels - Google Patents
A kind of metal wire and flexible display panels Download PDFInfo
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- CN108281428A CN108281428A CN201710011154.4A CN201710011154A CN108281428A CN 108281428 A CN108281428 A CN 108281428A CN 201710011154 A CN201710011154 A CN 201710011154A CN 108281428 A CN108281428 A CN 108281428A
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- 239000002184 metal Substances 0.000 title claims abstract description 112
- 239000004020 conductor Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 97
- 238000000034 method Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 17
- 230000007935 neutral effect Effects 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 13
- 230000006978 adaptation Effects 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000004425 Makrolon Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
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- 230000005611 electricity Effects 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of metal wires, solving its resistance is influenced by miniature deformation and is changed and the technical problem of its caused circuit stability difference, the embodiment of the present invention additionally provides a kind of flexible display panels, wherein at least one layer of metal layer is made of above-mentioned metal wire, solves the technical issues of its display effect or power consumption are influenced by metal wire miniature deformation.Metal wire provided by the invention, including insulating film, the signal conductor being set to above or below the insulating film and the mechanics fit line for being set to the insulating film below or above, it is provided with through-hole on the insulating film, metal is accommodated in through-hole, the mechanics fit line is connect with signal conductor by the metal ohmic in through-hole.Flexible display panels provided by the invention, including flexible substrate are arranged alternately insulating layer and metal layer in the flexible substrate, and at least one layer of metal layer is made of above-mentioned metal wire.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of metal wire and flexible display panels.
Background technology
Flexible display because of it with high lightness, fine definition, rich in color, response is fast, flexible, easy to carry etc.
Advantage is more and more paid close attention to by people, becomes the hot spot of international research.Flexible display generally include display panel and
Peripheral circuit for driving display panel, wherein display panel include pel array and metal wire, peripheral circuit and pixel battle array
The electric connection of each pixel unit is completed by metal wire in row.However metal wire can be used with flexible display
Rolling or being bent and generating deformation in the process, although during small strain, deformation will not cause to be broken and generate and ruin
Going out property electricity fails, but elongating or shortening for metal wire also results in its resistance and become larger or reduce, to the stabilization to circuit
Property, the display effect of flexible display and power consumption etc. have adverse effect on.
The protective film of industry generally use increase at present, adjusting neutral line position, the methods of making hole comes over the metal lines
The ductility of metal wire is improved, but these methods can only reduce the possibility of metal thread breakage, remain difficult to avoid strain to it
It is influenced caused by resistance, to be difficult the display effect or power consumption for improving device when by small strain.
Invention content
In view of this, an embodiment of the present invention provides a kind of metal wire, solve its resistance is influenced by miniature deformation
And the technical problem of its caused circuit stability difference, the embodiment of the present invention additionally provide a kind of flexible display panels, wherein
At least one layer of metal layer is made of above-mentioned metal wire, solves the skill that its display effect or power consumption are influenced by metal wire miniature deformation
Art problem.
A kind of metal wire that one embodiment of the invention provides, including insulating film, be set to above or below the insulating film
Signal conductor and be set to the mechanics fit line of the insulating film below or above, be provided with through-hole on the insulating film,
Metal is accommodated in through-hole, the mechanics fit line is connect with signal conductor by the metal ohmic in through-hole；
Wherein, the transition zone that the metal uniaxial stress is zero is neutral line, the signal conductor and mechanics fit line about
Neutral line is in mechanics symmetrical structure；
Wherein, the mechanics fit line is identical as the material of signal conductor, width, thickness and length；
Wherein, the metal wire forms metal layer, and the metal layer includes that signal conductor layer, insulating film layer and mechanics are suitable
With layer, wherein the signal conductor forms signal conductor layer, and the insulating film forms insulating film layer, and the mechanics adaptation is linear
At mechanics adaptation layer；
Wherein, the signal conductor and mechanics fit line are by copper, aluminium, titanium, molybdenum or copper alloy, aluminium alloy, titanium alloy, molybdenum
A kind of material in alloy is made；
Wherein, the signal conductor and/or mechanics fit line pass through chemical vapor deposition method, physical vapour deposition (PVD) work
A kind of technique in skill, spin coating proceeding, spraying process or sputtering process is formed；
Wherein, the insulating film includes polyimides, makrolon, polyacrylate, polyetherimide, polyether sulfone, gathers
It is one or more in ethylene glycol terephthalate or polyethylene naphthalate；
Wherein, the through-hole is formed by dry etching or wet-etching technology.
A kind of flexible display panels that one embodiment of the invention provides, including flexible substrate, in the flexible substrate alternately
Setting insulating layer and metal layer, at least one layer of metal layer are made of the metal wire of any description above；
Wherein, the metal layer includes barrier metal layer and/or Source and drain metal level；The insulating layer includes gate insulation layer, layer
Between it is one or more in insulating layer, buffer layer, passivation layer, flatness layer or pixel confining layer.
Metal wire provided in an embodiment of the present invention, by material, width, thickness and length all same, be symmetrically distributed in
The signal conductor and mechanics fit line of neutral line upper and lower are formed by connecting, and when the metal wire is by small strain, resistance value is not
It can change, to be had an impact to the stability of circuit and the performance of flexible display device, enhance Flexible Displays
Display effect of device when by miniature deformation, reduces its power consumption.
Flexible display panels provided in an embodiment of the present invention, one or more layers metal layer therein is by above-mentioned metal wire structure
At avoiding its influence generated to flexible display panels display performance in small deformation, improve display effect, reduce work(
The loss of rate.
Description of the drawings
Fig. 1 show a kind of structural schematic diagram of metal wire of one embodiment of the invention offer.
Fig. 2 show a kind of structure principle chart of metal wire of one embodiment of the invention offer.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show a kind of structural schematic diagram of metal wire of one embodiment of the invention offer.As shown in Figure 1, the metal
Line includes insulating film 1, signal conductor 2 and mechanics fit line 3, which is set to the top of insulating film 1, and mechanics is suitable
Wiring 3 is set to the lower section of insulating film 1, and through-hole 4 is offered on insulating film 1, accommodates metal in through-hole 4, mechanics fit line 3 with
Signal conductor 2 is attached by the metal in through-hole 4, forms Ohm connection, certainly, in other embodiments, can also
Mechanics fit line 3 is set to the top of insulating film 1 by selection, and signal conductor 2 is set to the lower section of insulating film 1, as long as ensureing letter
Number conducting wire 2 and mechanics fit line 3 are respectively at the both up and down of insulating film 1.Then it is distributed in the letter of 1 upper and lower of insulating film
Number conducting wire 2 and mechanics fit line 3 can cancel out each other some because by the resistance variations caused by tensile stress/compression, to
Strain is improved to a certain extent on being influenced caused by whole metal wire.
The transition zone that the metal uniaxial stress is zero is neutral line, and in an embodiment of the present invention, signal conductor 2 and mechanics are suitable
Wiring 3 is in mechanics symmetrical structure about neutral line.It should be appreciated by those skilled in the art neutral line is material in bending process
In neither by pulling force, also not by the transition zone of pressure, be for convenience of calculate and propose concept, actually and be not present, so
Fail to indicate in Fig. 1.In an embodiment of the present invention, the material of mechanics fit line 3 and signal conductor 2, width, thickness and
The items property parameters all same such as length, it is symmetrical that with mechanics fit line 3 mechanics can be realized in the signal conductor 2.In the present invention
In one embodiment, which forms signal conductor layer, and insulating film 1 forms insulating film layer, and mechanics fit line 3 forms mechanics
Adaptation layer, i.e., a plurality of metal wire can form metal layer, wherein metal layer includes that signal conductor layer, insulating film layer and mechanics are suitable
With layer.Metal wire provided in this embodiment when being stressed, above the electricity that is generated by smaller stretching strain of signal conductor 2
Resistive and the mechanics fit line 3 of lower section are because the resistance variations that smaller compressive strain generates can cancel out each other, so that metal
Line not will produce electricity variation on the whole, i.e., its resistance will not be influenced by small strain, and then improve circuit
Display effect and power consumption when by miniature deformation of stability and flexible display device.It is equally possible that selection will
Mechanics fit line 3 is set to the top of insulating film 1, and signal conductor 2 is symmetrically disposed on the lower section of insulating film 1, as long as ensureing signal
Conducting wire 2 and mechanics fit line 3 are in the symmetrical position of mechanics centered on neutral line.
It will be specifically described principle based on the technical solution that above-described embodiment provides below.As shown in Fig. 2, h is insulation
The thickness of film 1, r is radius of curvature of the neutral line in bending, because signal conductor 2 is equal with the thickness of mechanics fit line 3, and it
Thickness all very littles it is negligible, and neutral line is typically in the center on material thickness, thus they with it is neutral
The distance of interlayer is equal, can all regard as h/2, then when metal wire is bent downward, the signal conductor 2 of 1 top of insulating film can be by
Certain tensile stress, the corresponding stretching strain generated are εt(wherein, ρ is the radius of curvature of neutral line to=y/ ρ=h/2r, and y is to be measured
Object is at a distance from neutral interlayer), ratio R/R of resistance and initial resistance0For (1+ εt)2；Correspondingly, below insulating film 1
Mechanics fit line 3 can be by certain compression, and the compressive strain generated is εc=y/ ρ=h/2r, resistance and initial resistance
Ratio R/R0For (1- εc)2.Because of parameters such as material, width, thickness and the length of signal conductor 2 and mechanics fit line 3
It is all identical and formed Ohm connection, then whole metal wire in response to the ratio for becoming the resistance and initial resistance value generated into：
Because of εt=εc, and for small strain, εt、εc0 is may approximately equal to, then R/R0≈ 1 is that is, equal by each property parameters
, whole metal wire that the signal conductor 2 for being symmetrically distributed in neutral line upper and lower and mechanics fit line 3 are formed by connecting by
When small strain, resistance value can't change, to be produced to the stability of circuit and the performance of flexible display device
It is raw to influence, display effect of flexible display device when by miniature deformation is enhanced, its power consumption is reduced.
It, can be by copper, aluminium, titanium, molybdenum or copper alloy, aluminium alloy, titanium for the material of signal conductor 2 and mechanics fit line 3
A kind of material in alloy, molybdenum alloy is made.For the width, thickness and length of signal conductor 2 and mechanics fit line 3,
Concrete numerical value can do different set according to different needs, as long as ensureing the parameters phase of signal conductor 2 and mechanics fit line 3
Deng the present invention is not specifically limited this.For the preparation method of signal conductor 2 and mechanics fit line 3, chemistry can be used
Any one of gas-phase deposition, physical gas-phase deposition, spin coating proceeding, spraying process or sputtering process technique, two
Same technique had both can be used in person, and different technique can also be used and prepared, the present invention is not specifically limited this.
For the generation type of through-hole 4, in an embodiment of the present invention, etching method can be used, for example, dry etch process
Or wet-etching technology, and metal is accommodated in through-hole 4, then signal conductor 2 and mechanics fit line 3 can be by through-holes 4
Metal forms Ohm connection.
For the material of insulating film 1, in an embodiment of the present invention, polyimides, makrolon, polypropylene may be selected
It is one or more in acid esters, polyetherimide, polyether sulfone, polyethylene terephthalate or polyethylene naphthalate
Material.
One embodiment of the invention additionally provides a kind of flexible display panels, which includes flexible substrate, should
In flexible substrate alternately be provided with insulating layer and metal layer, wherein at least one layer of metal layer by any description above metal wire
It constitutes.For insulating layer, it may include in gate insulation layer, interlayer insulating film, buffer layer, passivation layer, flatness layer or pixel confining layer
It is one or more, material may be selected one or more in silica, silicon nitride, silicon oxynitride, aluminium oxide or titanium oxide.
The present invention is not specifically limited the number of plies and material of insulating layer.For metal layer or one or more layers, the present invention couple
The number of plies of metal layer is also not specifically limited.In addition, when flexible display panels include more metal layers, can select therein
One layer is made of above-mentioned metal wire, other metal layers still use metal wire in the prior art, and multilayer or all also may be selected
Layer is all made of above-mentioned metal wire and is made, and is used for example as barrier metal layer and/or Source and drain metal level etc..
For the preparation method of flexible display panels, prepare flexible substrate first, if on directly preparing on flexible substrates
It states metal wire and forms metal layer (such as grid layer), then reserved location on substrate is needed to pass through chemical vapor deposition method, object
Physical vapor deposition technique, spin coating proceeding, spraying process or sputtering process prepare mechanics fit line 3, the then shape of a plurality of mechanics fit line 3
At mechanics adaptation layer.Prepare insulating film layer on substrate again, by etching technics formation through-hole 4 in insulating film layer, and
Metal is accommodated in through-hole 4.Signal conductor 2 is prepared on the reserved location of insulating film layer again, similarly, signal conductor 2 can also lead to
Cross any one work in chemical vapor deposition method, physical gas-phase deposition, spin coating proceeding, spraying process or sputtering process
Skill is formed, and signal conductor 2 can select to join with attributes such as 3 material having the same of mechanics fit line, width, thickness and length
Number, then a plurality of signal conductor 2 forms signal conductor layer.Mechanics fit line 3 and signal conductor 2 are passed through into the gold in through-hole 4 again
Belong to carry out Ohm connection, then mechanics adaptation layer, insulating film layer and signal conductor layer just form metal layer, the metal layer i.e. by
Above-mentioned a plurality of metal wire is constituted.Insulating layer and other metal layers alternately are prepared successively on the metal layer again, as previously mentioned, its
His metal layer can be selected preparation method similar to the above and prepare, and existing preparation method can also be used and formed.If by above-mentioned reality
When applying the metal wire described in example as other metal layer (such as Source and drain metal levels) for forming display panel, it is with Source and drain metal level
Example then needs the position reserved on polysilicon semiconductor layer thereunder to prepare mechanics fit line 3, then in polysilicon semiconductor
Insulating film layer is prepared on layer and opens up through-hole 4, is accommodated metal, is then prepared signal conductor 2 in the reserved location of insulating film layer, then
The signal conductor 2 can be connect by the metal in through-hole 4 with mechanics fit line 3 by form metal wire, a plurality of metal wire, that is, structure
At Source and drain metal level.
Flexible display panels provided in this embodiment and preparation method thereof, one or more layers metal layer therein by material,
Width, thickness and length all same, mechanics is symmetrically distributed in the signal conductor of neutral line upper and lower and mechanics fit line connects
Metal wire made of connecing is constituted, and the resistance of the metal wire can't change in miniature deformation, so as to avoid to flexibility
The influence of display panel display performance improves its display effect in miniature deformation, reduces the loss of power.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Within god and principle, made by any modification, equivalent replacement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of metal wire, which is characterized in that including insulating film, the signal conductor being set to above or below the insulating film with
And it is set to the mechanics fit line of the insulating film below or above, it is provided with through-hole on the insulating film, is accommodated in through-hole
Metal, the mechanics fit line are connect with signal conductor by the metal ohmic in through-hole.
2. metal wire according to claim 1, which is characterized in that the transition zone that the metal uniaxial stress is zero is neutral
Layer, the signal conductor and mechanics fit line are in mechanics symmetrical structure about neutral line.
3. metal wire according to claim 2, which is characterized in that material, the width of the mechanics fit line and signal conductor
Degree, thickness and length are identical.
4. metal wire according to claim 1, which is characterized in that the metal wire forms metal layer, the metal layer packet
Include signal conductor layer, insulating film layer and mechanics adaptation layer, wherein the signal conductor forms signal conductor layer, the insulation
Film forms insulating film layer, and the mechanics fit line forms mechanics adaptation layer.
5. metal wire according to claim 1, which is characterized in that the signal conductor and mechanics fit line by copper, aluminium,
A kind of material in titanium, molybdenum or copper alloy, aluminium alloy, titanium alloy, molybdenum alloy is made.
6. metal wire according to claim 1, which is characterized in that the signal conductor and/or mechanics passing through of fit line
A kind of technique learned in gas-phase deposition, physical gas-phase deposition, spin coating proceeding, spraying process or sputtering process is formed.
7. metal wire according to claim 1, which is characterized in that the insulating film includes polyimides, makrolon, gathers
One kind in acrylate, polyetherimide, polyether sulfone, polyethylene terephthalate or polyethylene naphthalate or
It is a variety of.
8. metal wire according to claim 1, which is characterized in that the through-hole passes through dry etching or wet-etching technology
It is formed.
9. a kind of flexible display panels, including flexible substrate, which is characterized in that be arranged alternately in the flexible substrate insulating layer and
Metal layer, at least one layer of metal layer are made of any metal wire of claim 1 to 8.
10. flexible display panels according to claim 9, which is characterized in that the metal layer include barrier metal layer and/or
Source and drain metal level；The insulating layer includes gate insulation layer, interlayer insulating film, buffer layer, passivation layer, flatness layer or pixel confining layer
In it is one or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710011154.4A CN108281428A (en) | 2017-01-06 | 2017-01-06 | A kind of metal wire and flexible display panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710011154.4A CN108281428A (en) | 2017-01-06 | 2017-01-06 | A kind of metal wire and flexible display panels |
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| Publication Number | Publication Date |
|---|---|
| CN108281428A true CN108281428A (en) | 2018-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710011154.4A Pending CN108281428A (en) | 2017-01-06 | 2017-01-06 | A kind of metal wire and flexible display panels |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620166A (en) * | 2019-08-26 | 2019-12-27 | 合肥工业大学 | Method for preparing ultra-flexible optical detector on neutral plane with zero stress |
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| CN103715171A (en) * | 2013-12-24 | 2014-04-09 | 京东方科技集团股份有限公司 | Conductive metal interconnection wire and manufacturing method thereof |
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| CN106206613A (en) * | 2016-08-24 | 2016-12-07 | 昆山工研院新型平板显示技术中心有限公司 | A kind of flexible display substrates and preparation method thereof |
| CN106252380A (en) * | 2016-08-31 | 2016-12-21 | 上海天马有机发光显示技术有限公司 | Flexible display panels and device |
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2017
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Application publication date: 20180713 |