CN108274648A - Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet - Google Patents
Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet Download PDFInfo
- Publication number
- CN108274648A CN108274648A CN201810158882.2A CN201810158882A CN108274648A CN 108274648 A CN108274648 A CN 108274648A CN 201810158882 A CN201810158882 A CN 201810158882A CN 108274648 A CN108274648 A CN 108274648A
- Authority
- CN
- China
- Prior art keywords
- hole
- hollow plastic
- plastic sheet
- solar energy
- cuboid plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002985 plastic film Substances 0.000 title claims abstract description 18
- 239000013078 crystal Substances 0.000 claims abstract description 19
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 12
- 239000010432 diamond Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000004033 plastic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a kind of solar energy Buddha's warrior attendant wire cutting hollow plastic sheets.The hollow plastic sheet is using cuboid plate made of PVC, the cuboid plate penetrates through the through-hole of cuboid plate at equal intervals at least provided with a row in the direction of the width, if cuboid plate width direction is x-axis, cuboid plate short transverse is y-axis, through-hole central point is (h, k), and through-hole major semiaxis is a, through-hole semi-minor axis is b, then：When through-hole >=two rows, the lower half circle of upper layer through-hole and the upper semi-circle of lower via hole form hyperbolic configuration, then：According to the hardness of crystal slab different materials, the hyperbola openings of sizes formed by the eccentricity and levels through-hole that change through-hole offsets all vibration waves in processing.The present invention greatly reduces the cutting quantity of diamond wire, reduces the consumption of diamond wire, shorten clipping time, improve production efficiency, reduce production cost by the way that through-hole is arranged.
Description
Technical field：
The invention belongs to solar energy plastic plate consumptive material production technical field, more particularly to a kind of solar energy Buddha's warrior attendant wire cutting
Use hollow plastic sheet.
Background technology：
Solar cell crystal slab produce cut when, since crystal Stress of plate interior is larger, when cutting, be easy to cause Buddha's warrior attendant
Line breaks, and causes the chipping of crystal slab cut edge, affects the quality of product.People place solid modeling below battery crystal slab
Flitch, stress when for reducing cutting, but which increase diamond wire cutting quantity, diamond wire needs first to cut battery crystal slab again
Solid plastic plate is cut, this adds increased the clipping times of the consumption of diamond wire and crystal slab, reduce production efficiency, improve
Production cost.
Being disclosed in the information of the background technology part, it is only intended to increase understanding of the overall background of the invention, without answering
It has been the prior art well known to persons skilled in the art when being considered as recognizing or imply that the information is constituted in any form.
Invention content：
It is above-mentioned existing to overcome the purpose of the present invention is to provide a kind of solar energy Buddha's warrior attendant wire cutting hollow plastic sheet
The defects of technology.
To achieve the above object, described hollow the present invention provides a kind of solar energy Buddha's warrior attendant wire cutting hollow plastic sheet
Plastic plate is using cuboid plate made of PVC, and the cuboid plate is equidistant at least provided with a row in the direction of the width
The through-hole of cuboid plate is penetrated through, if cuboid plate width direction is x-axis, cuboid plate short transverse is y-axis, and through-hole central point is
(h, k), through-hole major semiaxis are a, and through-hole semi-minor axis is b, then：
When through-hole >=two rows, the lower half circle of upper layer through-hole and the upper semi-circle of lower via hole form hyperbolic configuration, then：
According to the hardness of crystal slab different materials, the hyperbolic formed by the eccentricity and levels through-hole that change through-hole
Line openings of sizes offsets all vibration waves in processing, reduces the vibration effect processed to crystal slab.
Preferably, in technical solution, through-hole is parallel between layers or vertical or cross arrangement.
Preferably, in technical solution, through-hole between layers be parallel arrangement when, arrangement mode be symmetrically arranged or hand over
Mistake arrangement.
Preferably, in technical solution, the shape of through-hole is in circle, ellipse, rectangle, triangle, diamond shape, hyperbola
It is one or more.
Preferably, in technical solution, when the crystal slab vibration frequency of cutting is high, through-hole uses elliptical aperture.
Preferably, in technical solution, when the crystal slab vibration frequency of cutting is low, through-hole uses circular hole.
Preferably, in technical solution, silane coupling agent DOW CORNING z-6030 is added in hollow plastic sheet.
Preferably, in technical solution, this HB-P10101T0 of antistatic agent Shanghai is added in hollow plastic sheet.
Compared with prior art, the present invention has the advantages that：
By the way that through-hole is arranged, the cutting quantity of diamond wire is greatly reduced, the consumption of diamond wire is reduced, shortens cutting
Time improves production efficiency, reduces production cost.According to the hardness of material, by changing the eccentricity of through-hole and upper
The hyperbola openings of sizes that lower via hole is formed offsets all vibration waves in processing, reduces the vibration effect processed to crystal slab.
Description of the drawings：
Fig. 1 is solar energy Buddha's warrior attendant wire cutting hollow plastic plate structure schematic diagram of the present invention；
Reference numeral is：1- cuboids plate, 2- through-holes.
Specific implementation mode：
The specific implementation mode of the present invention is described in detail below, it is to be understood that protection scope of the present invention is not
It is restricted by specific implementation.
Unless otherwise explicitly stated, otherwise in entire disclosure and claims, term " comprising " or its change
It changes such as "comprising" or " including " etc. and will be understood to comprise stated element or component, and do not exclude other members
Part or other component parts.
As shown in Figure 1, a kind of solar energy Buddha's warrior attendant wire cutting hollow plastic sheet, the hollow plastic sheet is to be added using PVC
Added with cuboid plate 1, the cuboid made of silane coupling agent DOW CORNING z-6030, this HB-P10101T0 of antistatic agent Shanghai
Plate 1 penetrates through the through-hole 2 of cuboid plate 1 at equal intervals at least provided with a row in the direction of the width, if 1 width direction of cuboid plate
For x-axis, 1 short transverse of cuboid plate is y-axis, and 2 central point of through-hole is (h, k), and 2 major semiaxis of through-hole is a, and 2 semi-minor axis of through-hole is
B, then：
When through-hole 2 >=two rows, the lower half circle of upper layer through-hole 2 forms hyperbolic configuration with the upper semi-circle of lower via hole 2,
Then：
According to the hardness of crystal slab different materials, formed by the eccentricity and levels through-hole 2 that change through-hole 2 double
Curve openings of sizes offsets all vibration waves in processing, reduces the vibration effect processed to crystal slab.Through-hole 2 is between layers
For parallel or vertical or cross arrangement.Through-hole 2 between layers be parallel arrangement when, arrangement mode be symmetrically arranged or staggeredly
Arrangement.The shape of through-hole 2 is one or more in circle, ellipse, rectangle, triangle, diamond shape, hyperbola.Work as cutting
Crystal slab vibration frequency it is high when, through-hole 2 use elliptical aperture.When the crystal slab vibration frequency of cutting is low, through-hole 2 is using circle
Hole.
By the way that through-hole 2 is arranged, the cutting quantity of diamond wire is greatly reduced, reduces the consumption of diamond wire, shortens and cut
The time is cut, production efficiency is improved, reduces production cost.
The description of the aforementioned specific exemplary embodiment to the present invention is in order to illustrate and illustration purpose.These descriptions
It is not wishing to limit the invention to disclosed precise forms, and it will be apparent that according to the above instruction, can much be changed
And variation.The purpose of selecting and describing the exemplary embodiment is that explaining the specific principle of the present invention and its actually answering
With so that those skilled in the art can realize and utilize the present invention a variety of different exemplary implementation schemes and
Various chooses and changes.The scope of the present invention is intended to be limited by claims and its equivalents.
Claims (6)
1. a kind of solar energy Buddha's warrior attendant wire cutting hollow plastic sheet, it is characterised in that：The hollow plastic sheet of PVC by being made
Cuboid plate, the cuboid plate penetrates through the through-hole of cuboid plate at equal intervals at least provided with a row in the direction of the width,
If cuboid plate width direction is x-axis, cuboid plate short transverse is y-axis, and through-hole central point is (h, k), and through-hole major semiaxis is
A, through-hole semi-minor axis are b, then：
When through-hole >=two rows, the lower half circle of upper layer through-hole and the upper semi-circle of lower via hole form hyperbolic configuration, then：
According to the hardness of crystal slab different materials, the hyperbola formed by the eccentricity and levels through-hole that change through-hole is opened
Mouth size, offsets all vibration waves in processing.
2. solar energy Buddha's warrior attendant wire cutting hollow plastic sheet according to claim 1, it is characterised in that：The layer of the through-hole
It is parallel or vertical or cross arrangement between layer.
3. solar energy Buddha's warrior attendant wire cutting hollow plastic sheet according to claim 2, it is characterised in that：The layer of the through-hole
When being parallel arrangement between layer, arrangement mode is to be symmetrically arranged or be staggered.
4. solar energy Buddha's warrior attendant wire cutting hollow plastic sheet according to any one of claim 1-3, it is characterised in that：Institute
The shape for stating through-hole is one or more in circle, ellipse, rectangle, triangle, diamond shape, hyperbola.
5. solar energy Buddha's warrior attendant wire cutting hollow plastic sheet according to claim 4, it is characterised in that：When the crystal of cutting
When panel vibration frequency is high, through-hole uses elliptical aperture.
6. solar energy Buddha's warrior attendant wire cutting hollow plastic sheet according to claim 4, it is characterised in that：When the crystal of cutting
When panel vibration frequency is low, through-hole uses circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810158882.2A CN108274648A (en) | 2018-02-26 | 2018-02-26 | Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810158882.2A CN108274648A (en) | 2018-02-26 | 2018-02-26 | Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108274648A true CN108274648A (en) | 2018-07-13 |
Family
ID=62808670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810158882.2A Withdrawn CN108274648A (en) | 2018-02-26 | 2018-02-26 | Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108274648A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015983A (en) * | 2019-12-12 | 2020-04-17 | 扬州荣德新能源科技有限公司 | Stick sticking mode for polycrystal cutting hollowed-out plastic board |
| CN111746081A (en) * | 2020-05-21 | 2020-10-09 | 江阴市嘉宇新材料有限公司 | Regional unequal-hardness lining plate for diamond wire cutting and preparation method thereof |
| CN111746082A (en) * | 2020-05-21 | 2020-10-09 | 江阴市嘉宇新材料有限公司 | Easily-cut and easily-adhered double-material hollow solar silicon wafer cutting lining plate and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1229007A1 (en) * | 2001-01-31 | 2002-08-07 | Marocco, Giuseppe | Process for manufacturing composites and for structurally repairing and aesthetically filling slabs of stone material |
| CN1579013A (en) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| CN101722582A (en) * | 2009-12-23 | 2010-06-09 | 常州亿晶光电科技有限公司 | Revolving binding platform special for cutting silicon chip |
| WO2011032599A1 (en) * | 2009-09-18 | 2011-03-24 | Applied Materials, Inc. | Wire saw work piece support device, support spacer and method of sawing using same |
| CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
| CN208438590U (en) * | 2018-02-26 | 2019-01-29 | 江阴市伟欣塑胶有限公司 | Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet |
-
2018
- 2018-02-26 CN CN201810158882.2A patent/CN108274648A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1229007A1 (en) * | 2001-01-31 | 2002-08-07 | Marocco, Giuseppe | Process for manufacturing composites and for structurally repairing and aesthetically filling slabs of stone material |
| CN1579013A (en) * | 2001-10-31 | 2005-02-09 | 三星钻石工业股份有限公司 | Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| WO2011032599A1 (en) * | 2009-09-18 | 2011-03-24 | Applied Materials, Inc. | Wire saw work piece support device, support spacer and method of sawing using same |
| CN101722582A (en) * | 2009-12-23 | 2010-06-09 | 常州亿晶光电科技有限公司 | Revolving binding platform special for cutting silicon chip |
| CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
| CN208438590U (en) * | 2018-02-26 | 2019-01-29 | 江阴市伟欣塑胶有限公司 | Solar energy Buddha's warrior attendant wire cutting hollow plastic sheet |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015983A (en) * | 2019-12-12 | 2020-04-17 | 扬州荣德新能源科技有限公司 | Stick sticking mode for polycrystal cutting hollowed-out plastic board |
| CN111746081A (en) * | 2020-05-21 | 2020-10-09 | 江阴市嘉宇新材料有限公司 | Regional unequal-hardness lining plate for diamond wire cutting and preparation method thereof |
| CN111746082A (en) * | 2020-05-21 | 2020-10-09 | 江阴市嘉宇新材料有限公司 | Easily-cut and easily-adhered double-material hollow solar silicon wafer cutting lining plate and preparation method thereof |
| CN111746081B (en) * | 2020-05-21 | 2022-03-15 | 江阴市嘉宇新材料有限公司 | Regional unequal-hardness lining plate for diamond wire cutting and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180713 |
|
| WW01 | Invention patent application withdrawn after publication |