Invention content
The present invention is directed at least solve one of technical problem in the prior art.For this purpose, the present invention needs offer one
Kind fingerprint recognition button and electronic device.
The fingerprint recognition button of embodiment of the present invention, including sequentially set gradually cover board, fingerprint recognition module, first
Circuit board, elastic component and second circuit board;The fingerprint recognition module is used to identify finger print information;The first circuit board and institute
State the electrical connection of fingerprint recognition module;The first circuit board is provided with the first pressure sensitivity circuit, and the second circuit board is provided with
Two pressure sensitivity circuits;The fingerprint recognition button further includes pressure-sensing chip, and the pressure-sensing chip is used for according to by described
Elastic component is corresponded on the first pressure sensitivity circuit caused by deforming upon on the second pressure sensitivity circuit between press points
Capacitance variations sense the press points by pressure.
In above-mentioned fingerprint recognition button, since first circuit board is provided with the first pressure sensitivity circuit, second circuit board is provided with
Second pressure sensitivity circuit, therefore, fingerprint recognition button can while finger print information is identified, by pressure-sensing chip according to by
Correspond to the capacitance variations between press points caused by elastic component deforms upon on first pressure sensitivity circuit on the second pressure sensitivity circuit
Sense press points by pressure.
In some embodiments, the first circuit board and the second circuit board are same Rigid Flex bent
Into two parts.
In some embodiments, the first circuit board and the second circuit board are Rigid Flex.
In some embodiments, the first circuit board is Rigid Flex, and the second circuit board is flexible circuit
Plate.
In some embodiments, the first pressure sensitivity circuit is arranged on the close elastic component of the first circuit board
Surface on, the second pressure sensitivity circuit be arranged on the second circuit board close to the elastic component surface on.
In some embodiments, the pressure-sensing chip is arranged on the close elastic component of the second circuit board
Surface on, the pressure-sensing chip is electrically connected with the first circuit board and the second circuit board.
In some embodiments, the pressure-sensing chip is arranged on the close bullet of the same Rigid Flex
On the surface of property part, the pressure-sensing chip is electrically connected with the same Rigid Flex.
In some embodiments, the pressure-sensing integrated chip is in the fingerprint recognition module.
The electronic device of embodiment of the present invention includes ontology and is arranged on the intrinsic fingerprint recognition button.
In above-mentioned electronic device, since first circuit board is provided with the first pressure sensitivity circuit, second circuit board is provided with second
Pressure sensitivity circuit, therefore, fingerprint recognition button can be while finger print information be identified, by pressure-sensing chip according to by elasticity
Correspond to the capacitance variations sensing between press points caused by part deforms upon on first pressure sensitivity circuit on the second pressure sensitivity circuit
Press points by pressure.
In some embodiments, the ontology corresponds to trepanning in the region where the cover board, and the cover board passes through institute
It states hole and exposes described in vitro.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instructions such as needle ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
The description present invention and simplified description rather than instruction imply that signified device or element must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
" first " is defined as a result, and the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected.It can
To be mechanical connection or be electrically connected.It can be directly connected, can also be indirectly connected by intermediary, Ke Yishi
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It please refers to Fig.1 and Fig. 2, embodiment of the present invention fingerprint recognition button 10 can be applied to electronic device 100.Specifically
Ground, electronic device 100 can with but be not limited to smart mobile phone, tablet computer, laptop, digital audio & video players, electricity
Sub- reader, handheld game machine and vehicle electronic device etc..Electronic device 100 includes ontology 20 and fingerprint recognition button 10, refers to
Line key range 10 is arranged in ontology 20.Fingerprint recognition button 10 includes cover board 11, the fingerprint recognition mould that sequence is set gradually
Group 12, first circuit board 13, elastic component 14 and second circuit board 15.
Cover board 11 is used to bear tissue to be detected, such as the pressing of finger.Ontology 20 can be in the region where cover board 11
Corresponding trepanning 22 so that cover board 11 exposes outside ontology 20, convenient for fingerprint recognition button 10 when finger carries out pressing operation into
Row fingerprint recognition and pressure-sensing.The material of cover board 11 can be ceramics or glass, for example, zirconia ceramics, tempered glass etc..
Zirconia ceramics has many advantages, such as that sensitive fingerprint recognition, drop resistant, at low cost and thickness are thin.And tempered glass has preparation process letter
The advantages that single and at low cost.
Fingerprint recognition module 12 is packaged using LGA (Land Grid Array, Background Grid array packages) technology.Fingerprint
Identification module 12 has been internally integrated fingerprint recognition chip.Fingerprint recognition chip can carry out Image Acquisition, spy when finger presses
Sign extraction, aspect ratio are to identify finger print information, then other elements that finger print information is sent to electronic device 100 (are schemed not
Show).
Referring to Fig. 3, for the ease of connection and simplifying structure, first circuit board 13 can be with second circuit board 15
Two parts that same Rigid Flex (FPC+PCB) is bent to form.For example, in some applications, electronic device 100 includes master
Plate, first circuit board 13 and second circuit board 15 also need to connect with mainboard, in this way, when first circuit board 13 and second circuit board
15 be bent to form for same Rigid Flex two parts when, it is only necessary to by first circuit board 13 or second circuit board 15 wherein one
It is a to be connected to mainboard, connection is simplified, also reduces the occupied space of circuit.
When first circuit board 13 and second circuit board 15 are two separated circuit boards, 13 and second electricity of first circuit board
Road plate 15 can all be Rigid Flex.Or it can also be:First circuit board 13 is Rigid Flex, and second circuit board 15 is
Flexible PCB.
The advantages of flexible PCB and Rigid Flex be it is flexible, when first circuit board 13 and second circuit board 15 because
When finger is pressed and deformed upon, circuit structure therein will not change.Flexible PCB has height reliability and can
The characteristics of flexibility and Distribution density are high, light-weight, thickness is thin, bending is good.And the soft or hard existing certain flexible region of combination version
Also there is certain rigid region in domain, to saving interiors of products space, reduces finished-product volume, enhancing product performance has very big side
It helps.
It is appreciated that first circuit board 13 is electrically connected with fingerprint recognition module 12.
The first pressure sensitivity circuit 16 is provided on first circuit board 13.First pressure sensitivity circuit 16 can be arranged on first circuit board
On the surface of 13 close elastic component 14.The second pressure sensitivity circuit 17 is provided on second circuit board 15.Second pressure sensitivity circuit 17 can
To be arranged on the surface of close elastic component 14 of second circuit board 15.
Fingerprint recognition button 10 further includes pressure-sensing chip 18.Pressure-sensing chip 18 is used for basis and is sent out by elastic component 14
It is sensed on the first pressure sensitivity circuit 16 with the capacitance variations between 17 corresponding press points on the second pressure sensitivity circuit caused by raw deformation
Press points by pressure, the other elements (not shown) for then electronic device 100 being sent to by the value of pressure.
In this way, fingerprint recognition button 10 can receive diversified group according to the finger print information of identification and the pressing force of sensing
Close instruction.For example, when electronic device 100 be digital audio & video players when, if fingerprint recognition by and pressing force it is smaller, instruction
Can show as playing next audio or video, if fingerprint recognition by and pressing force it is larger, instruction can show as pause broadcast
It puts.Certainly, in other examples, fingerprint recognition and the pressing force of sensing can also arrange in pairs or groups using other functions are presented.Example
Such as, pressure-sensing chip 18 is used to sense the pressing force of finger, when the pressing force for the finger that pressure-sensing chip 18 senses reaches
One is arrived predetermined threshold, such as 10 Newtonian times, and fingerprint recognition module 12 starts to identify finger print information.In this way, when finger accidentally touches
When encountering fingerprint recognition button 10, fingerprint recognition module 12 will not immediately begin to identification finger print information and cause unnecessary tired
It disturbs, and is conducive to extend the service life of fingerprint recognition module 12.
When first circuit board 13 and second circuit board 15 are two pieces of separated circuit boards, pressure-sensing chip 18 can be set
It puts on the surface of the close elastic component 14 of second circuit board 15.Pressure-sensing chip 18 simultaneously with first circuit board 13 and second
Circuit board 15 is electrically connected.
When two parts that first circuit board 13 and second circuit board 15 are bent to form for same Rigid Flex, feeling of stress
Survey chip 18 can be arranged on the surface of close elastic component 14 of same Rigid Flex, pressure-sensing chip 18 with it is same soft
The plywood that hardens is electrically connected.In other words, pressure-sensing chip 18 is arranged on first circuit board 13 or second circuit board 15 leans on short round
Property part 14 surface on, pressure-sensing chip 18 and first circuit board 13 or second circuit board 15 is one of is electrically connected.
Referring to Fig. 4, when first circuit board 13 and second circuit board 15 for two pieces of separated circuit boards or are same soft or hard
During two parts that board is bent to form, pressure-sensing chip 18 can be integrated in fingerprint recognition module 12.
First pressure sensitivity circuit 16 and the second pressure sensitivity circuit 17 form mutual tolerance.Specially:First pressure sensitivity circuit 16 and the second pressure
Lateral electrod-array and the electrod-array of longitudinal direction are respectively arranged on sense circuit 17, these lateral electrodes and the electrode of longitudinal direction
The place spatially intersected can form capacitance, this capacitance is exactly mutual tolerance, this two arrays of electrodes constitutes the two poles of the earth of capacitance.When need
When detecting the size of mutual tolerance, lateral electrode sends out pumping signal, and longitudinal electrode receives signal, so as to obtain lateral electricity
Pole and the size of the capacitance at the electrode joint of longitudinal direction.
Elastic component 14 is arranged between the first pressure sensitivity circuit 16 and the second pressure sensitivity circuit 17.Elastic component 14 can be with when being pressurized
It deforms upon, and different degrees of deformation is generated according to the size of the pressing force of finger, feature is:It is pressed in the case where there is pressure effect
Contracting, restores to the original state under pressure.The variation of 14 thickness of elastic component can cause on the first pressure sensitivity circuit 16 with the second pressure sensitivity line
The capacitance variations between press points are corresponded on road 17.Then, pressure-sensing chip 18 senses press points according to capacitance variations
By the size of pressure.
Elastic component 14 be specifically as follows elastic double-faced glue, elastic rubber or other can deform upon under the effect of external force and
After external force is cancelled can restorable elastomer, this is not restricted.When elastic component 14 can be played for elastic double-faced glue etc.
During the elastomer of connection function, elastic double-faced glue can fit together first circuit board 13 and second circuit board 15;Work as elasticity
Part 14 for elastic rubber when the elastomer of connectionless effect, can use other connection mode, such as double faced adhesive tape, curing
Glue, optical cement etc. fit together first circuit board 13 and second circuit board 15.
In above-mentioned electronic device 100, since first circuit board 13 is provided with the first pressure sensitivity circuit 16, second circuit board 15 is set
The second pressure sensitivity circuit 17 is equipped with, therefore, fingerprint recognition button 10 can pass through pressure-sensing core while finger print information is identified
Piece 18 according to caused by being deformed upon by elastic component 14 on first pressure sensitivity circuit 16 with 17 on the second pressure sensitivity circuit on it is corresponding pressing
Between point capacitance variations sensing press points by pressure, improve user experience.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature it " on " or it " under "
It can be in direct contact including the first and second features, it is not to be in direct contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " including first spy
Sign is right over second feature and oblique upper or is merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " immediately below second feature and obliquely downward or be merely representative of including fisrt feature
Fisrt feature level height is less than second feature.
Above disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, above the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
In the description of this specification, reference term " certain embodiments ", " is schematically implemented " some embodiments "
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine embodiment or example describe it is specific
Feature, structure, material or feature are contained in at least some of embodiment or example of the present invention.In the present specification, it is right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can in an appropriate manner combine in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
In the case of not departing from the principle of the present invention and objective can these embodiments be carried out with a variety of variations, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.