CN108248026A - Projection-type laser heating system and 3D printer - Google Patents
Projection-type laser heating system and 3D printer Download PDFInfo
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- CN108248026A CN108248026A CN201810094966.4A CN201810094966A CN108248026A CN 108248026 A CN108248026 A CN 108248026A CN 201810094966 A CN201810094966 A CN 201810094966A CN 108248026 A CN108248026 A CN 108248026A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/22—Driving means
- B22F12/226—Driving means for rotary motion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/10—Auxiliary heating means
- B22F12/13—Auxiliary heating means to preheat the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/20—Cooling means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
- B22F12/43—Radiation means characterised by the type, e.g. laser or electron beam pulsed; frequency modulated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The present invention discloses a kind of projection-type laser heating system and 3D printer, and wherein projection-type laser heating system includes infrared laser, laser power regulating device, beam splitting microscope group, projecting subassembly and the workbench equipped with preheating device and for being laid with powder body material；Wherein, laser power regulating device including the first rotation clamp assemblies, power meter and the first half-wave plate arranged successively in the same direction, polarization spectroscope and expands microscope group；First half-wave plate is mounted on the described first rotation clamp assemblies；The projecting subassembly is no less than two groups and is respectively arranged on the exit direction of the beam splitting microscope group, and every group of projecting subassembly includes a dmd chip；Control system is further included, the control system controls the first rotation clamp assemblies and the dmd chip, and the individually projection of shape of each dmd chip of control and direction, so that the shape that each dmd chip is projected on workbench is identical and overlaps.Technical solution of the present invention can realize that projection-type laser heats in 3D printing.
Description
Technical field
The present invention relates to 3D printing field, more particularly to a kind of projection-type laser heating system and 3D printer.
Background technology
From after the Theodore Maiman in nineteen sixty California, USA Hughes laboratory realize beam of laser, because
The characteristic of laser itself, makes it be rapidly developed in multiple fields, until nineteen ninety laser is applied to manufacturing industry, has only used 30
Year.The manufacturing industry that is introduced as of laser brings new life, and reluctant fine processing problems all may be used in traditional manufacture
Perfectly to be solved using laser.
3D printing technique from 1986 American scientist CharlesHull develop First business 3D printing machines after hair
It opens up and brings a new direction to manufacturing industry, with development in recent years, the product that 3D printing can be used is more and more, and 3D is beaten
It is also more and more extensive to print the production field set foot in.Wherein, the digital optical processing techniques of DLP (Digital Light Processing)
Being applied to 3D printing later can carry out liquid photosensitive resin the molding processing of 3D, and DLP plane projections radiation can make photosensitive
Resin rapid shaping, print speed is fast, but the DLP shadow casting techniques used in 3D printing at present can only be cold for photosensitive resin progress
Working process, it is impossible to be heated to material, the scope of application is narrow, and material cost is high；Also SLS (Selected Laser
Sintering) selective laser sintering technology, the raw material of 3D printing is dusty material, carries out heat-agglomerating to dusty material, makes
It cures, and needs dusty material being heated to molten condition, be taken out after solidification cooling.SLS technologies can be applicable in 3D printing
Plurality of raw materials, but SLS technologies are point type heating, path scanning is longer heating cycle, restricts the promotion of the efficiency of 3D printing.
Invention content
The main object of the present invention is to propose a kind of projection-type laser heating system, it is intended to solve existing DLP technologies application
Low-power can only be used to export in 3D printing system, can not realize the problem of heating to material, while solve mesh
Preceding laser beam can only carry out dotted line scanning heating in 3D printing system and can not realize at the heating simultaneously of material two dimensional surface
The problem of reason.
To achieve the above object, projection-type laser heating system proposed by the present invention, including providing linear polarized light light source
Infrared laser, for adjust infrared laser projection output power laser power regulating device, for will through it is described swash
Laser beam after optical power adjusting regulating device is adjusted is divided into the beam splitting microscope group of multi beam, for will be through the laser light after beam splitter beam splitting
The projecting subassembly of Shu Jinhang projections and the workbench equipped with preheating device and for being laid with powder body material；Wherein, the laser work(
Rate regulating device includes the first rotation clamp assemblies, power meter and the first half-wave plate arranged successively in the same direction, polarization
Spectroscope and expand microscope group；First half-wave plate is mounted on the described first rotation clamp assemblies；The power meter is located at institute
State the side of polarization spectroscope；The projecting subassembly is no less than two groups；The projecting subassembly is respectively arranged on the beam splitting microscope group
Exit direction, and every group of projecting subassembly includes a dmd chip, each dmd chip are respectively provided with the first projecting direction and the
Two projecting directions；The projection-type laser heating system further includes control system, control system control first rotation
Clamp assemblies and the dmd chip, and the individually projection of shape of each dmd chip of control and direction, so that each described
The shape that dmd chip is projected on workbench is identical and overlaps.
Preferably, the projection-type laser heating system further includes the second rotation clamp assemblies, and the polarization spectroscope is consolidated
Clamp assemblies, the control system control second rotation clamp assemblies and first rotating clamp are rotated due to described second
Component cooperation is held, the micro mirror reflecting surface of the dmd chip is parallel to the polarization direction for controlling the incident light of the dmd chip.
Preferably, the first rotation clamp assemblies include level-one rotating clamp fastener and two level rotating clamp fastener；Described
Half of wave plate is fixed on the level-one rotating clamp fastener, and the level-one rotating clamp fastener is rotatablely connected with the two level rotation
Turn clamper, also, the angular resolution of the level-one rotating clamp fastener is more than the angular resolution of the two level rotating clamp fastener.
Preferably, each dmd chip forms the first view field on the workbench, each first projection
Area coincidence.
Preferably, projecting subassembly described in every group also includes delustring component, and delustring component is correspondingly arranged at described in every group
On second projecting direction of each dmd chip.
Preferably, the workbench has the side wall enclosed；The light that the delustring component includes being attached at the side wall is inhaled
Receive component and the reflecting assembly for the light beam of second projecting direction to be reflexed to the light absorption component.
Preferably, radiator is equipped on each dmd chip, each radiator includes liquid nitrogen and recycles
Cooling line and the heat-conducting block for being attached at the dmd chip, each heat-conducting block offer through-hole, and the through-hole connects institute
State liquid nitrogen circulating cooling pipeline.
Preferably, the infrared laser is CO2Pulse laser.
The present invention also proposes a kind of 3D printer, including projection-type laser heating system, the projection-type laser heating system
System includes providing the infrared laser of linear polarized light light source, the laser power for adjusting infrared laser projection output power
Regulating device, for the laser beam after laser power regulating device adjusting to be divided into the beam splitting microscope group of multi beam, is used for
Projecting subassembly that laser beam after beam splitter beam splitting is projected and equipped with preheating device and for being laid with powder body material
Workbench；Wherein, the laser power regulating device includes the first rotation clamp assemblies, power meter and in a first direction
The first half-wave plate for arranging successively, polarization spectroscope and expand microscope group；First half-wave plate is mounted on first rotating clamp
It holds on component；The power meter is located at the side of the polarization spectroscope；The projecting subassembly is no less than two groups；The projection group
Part is respectively arranged on the exit direction of the beam splitting microscope group, and every group of projecting subassembly includes a dmd chip, each DMD cores
Piece is respectively provided with the first projecting direction and the second projecting direction；The projection-type laser heating system further includes control system, described
The control system control first rotation clamp assemblies and the dmd chip, and the individually projection of each dmd chip of control
Shape and direction, so that the shape that each dmd chip is projected on workbench is identical and overlaps.
Technical solution of the present invention reduces the absorptivity of dmd chip and by expanding by using the laser of infrared band
Microscope group and the reduction of beam splitting microscope group are mapped to the optical power density on dmd chip, to reduce the rate of heat production of dmd chip；Pass through simultaneously
Multigroup projecting subassembly is projected out shape that is identical and being completely superposed and on the table by setting preheating device on the table,
The demand to laser light source power of reduction, dmd chip is made to be maintained in laser of the projection for heating material to be processed can be with
Within the temperature range of normal work；So as to realize projection-type laser heating in 3D printing.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Structure according to these attached drawings obtains other attached drawings.
Fig. 1 is the structure diagram of projection-type laser heating system of the present invention.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 100 | Infrared laser | 300 | Projecting subassembly |
| 200 | First half-wave plate | 301 | Dmd chip |
| 201 | First rotation clamp assemblies | 302 | Heat-conducting block |
| 202 | Polarization spectroscope | 400 | Workbench |
| 203 | Power meter | 401 | Preheating device |
| 204 | Expand microscope group | 500 | Control device |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
If it is to be appreciated that related in the embodiment of the present invention directionality instruction (such as up, down, left, right, before and after ...),
Then directionality instruction be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each component,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, it is somebody's turn to do " first ", " second " etc.
Description be only used for description purpose, and it is not intended that instruction or implying its relative importance or implicit indicating indicated skill
The quantity of art feature." first " is defined as a result, and the feature of " second " can be expressed or implicitly includes at least one spy
Sign.In addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
Based on enough realizations, the knot of this technical solution is will be understood that when the combination appearance of technical solution is conflicting or can not realize
Conjunction is not present, also not the present invention claims protection domain within.
3D printing technique is increasingly mature, and application also gradually starts generally, and in 3D printing field, application is than wide now
Be using DLP projecting ultraviolet lights irradiate liquid photosensitive resin, cure the photosensitive resin in irradiated area, after multiple layers of cured
Form 3D printing product.The core of DLP projections is dmd chip, and dmd chip has many micro mirror reflecting surface (micro mirror reflectings surface
Quantity it is related with resolution ratio, for example, the image if you need to be projected out 4K resolution ratio, then theoretically at least need 4096 × 2160=
8847360 micro mirror reflectings surface), the controller of DMD can individually control the direction of each micro mirror reflecting surface, and accurate projection goes out to need
The figure wanted.DLP shadow casting techniques are mainly used in domestic or commercial projection, such as common projecting apparatus and the throwing that occurs in recent years
Shadow TV etc..DLP shadow casting techniques can realize quick and accurate 3D printing, but because the core of DLP projections in 3D printing field
Center portion part dmd chip is more to the absorption of light, and when the power of projected light is larger, dmd chip can fail due to high temperature, so, mesh
Application of the preceding DLP shadow casting techniques in 3D printing is only limitted to the situation for using liquid photosensitive resin as printing raw material, uncomfortable
For dusty material is used to be melted or sintering curing so as to fulfill 3D printing situation.For this purpose, the present invention proposes a kind of throwing
Shadow formula laser heating system, to extend application range of the DLP shadow casting techniques in 3D printing.
The present invention proposes a kind of projection-type laser heating system and the 3D printer using the projection-type laser heating system,
Projection-type laser heating system therein, please refers to Fig. 1, including providing the infrared laser 100 of linear polarized light light source, being used for
It adjusts infrared laser 100 and projects the laser power regulating device of output power, for will be through the laser power regulating device
Laser beam after adjusting is divided into the beam splitting microscope group of multi beam, the throwing for the laser beam after beam splitter beam splitting to be projected
Shadow component 300 and the workbench 400 equipped with preheating device 401, the workbench are used to be laid with powder raw material；Wherein, it is described
Laser power regulating device include first rotation clamp assemblies 201, power meter 203 and arrange successively in the same direction first
Half-wave plate 200, polarization spectroscope 202 and expand microscope group 204；First half-wave plate 200 is mounted on the described first rotation and clamps
On component 201；The power meter 203 is located at the side of the polarization spectroscope 202；The projecting subassembly 300 is no less than two groups；
The projecting subassembly 300 is respectively arranged on the exit direction of the beam splitting microscope group, and every group of projecting subassembly 300 includes one has the
The dmd chip 301 of one projecting direction and the second projecting direction；The projection-type laser heating system further includes control system, institute
State the control system control first rotation clamp assemblies 201 and the dmd chip 301, and the individually each DMD cores of control
The projection of shape of piece 301 and direction, so as to project to shape on workbench 400 identical and again for each dmd chip 301
It closes.
Specifically, the laser in the present embodiment uses the laser of infrared band, and it is linearly polarized photon to export laser.
After by half-wave plate, polarization direction can rotate linear polarized light, and rotation angle is incident light polarization direction and half
Twice of wave plate optical axis included angle.Therefore the rotation of half-wave plate can be utilized to change the polarization direction of linear polarized light.Polarization spectro
Linear polarized light can be divided into two beams by mirror 202, and a branch of is the first laser component propagated along former direction, and another beam is to deviate original
The second laser component in direction, wherein, the power of first laser component is effective heating output power, is not considering loss
In the case of, the sum of power of first laser component and second laser component is equal to the work(for the light beam for being incident on polarization spectroscope 202
Rate.Power meter 203 detects the power of second laser component, and effective output work of first laser component is obtained according to general power
Rate, and the ratio of first laser component and second laser component depends on being incident on the polarization side of the light beam of polarization spectroscope 202
To the angle with 202 interface of polarization spectroscope, therefore can be by changing the optical axis of half-wave plate and the folder in incident light polarization direction
Angle changes the output power of first laser component.The present embodiment is using the first half-wave plate 200 and the first rotation clamp assemblies
201, under control of the control system, the first rotation clamp assemblies 201 drive the first half-wave plate 200 to rotate, to change the first half
The direction of 200 optical axis of wave plate so as to change the polarization direction of laser beam, and then changes first using polarization spectroscope 202 and swashs
The output power of light component.First laser component after power regulation is by expanding the diameter of 204 expanded light beam of microscope group, to reduce
The power density of first laser component.
First laser component is split after expanding microscope group 204 and expanding, then through beam splitting microscope group, by first laser component point
Into multi beam, the power density per beam laser components is further reduced, but keep the general power of first laser component constant simultaneously.It throws
Shadow component 300 be correspondingly arranged with the first laser component after beam splitting it is multigroup, every group of projecting subassembly 300 include a dmd chip
301, every beam laser components of first laser component are all projected on workbench 400.Preheating device is set on workbench 400
401, the powder body material to be processed being layed on workbench is preheated.
The present embodiment projection heating system has a control device 500, which is uniformly controlled projection and adds
Hot systems.
The control and the control of dmd chip 301 that control system integration laser power is adjusted.Control system is according to preset
The rotation of laser output power control the first rotation clamp assemblies 201, the second laser component detected according to power meter 203
Power confirms whether the power of first laser component reaches preset value.The polarization direction for the laser that laser generates in itself and power
Fixed, when the first rotation clamp assemblies 201 are in initial position, the power of first laser component is minimum, that is to say control system
Gradually increase laser power regulating device is controlled when effective output minimum；Control system individually controls each DMD
The micro mirror reflecting surface of chip 301.Dmd chip 301 project shape determined by the inclined direction of micro mirror reflecting surface, dmd chip 301
Micro mirror reflecting surface quantity it is more, the resolution ratio of projecting figure is higher.The each dmd chip 301 of the present embodiment is in workbench
View field on 400 is identical, and control system controls the micro mirror reflecting surface of each dmd chip 301 that each dmd chip 301 is made to exist
Projecting figure on workbench 400 is completely superposed.
In other embodiments, projection-type laser heating system can also use infrared laser 100, laser power to adjust
Device, projecting subassembly 300 are used as one group of laser output source, and whole system sets multigroup laser output source, and every group of laser output
Projecting figure of the source on workbench 400 is completely superposed.
The laser light source positioned at infrared band that technical solution of the present invention is generated by using infrared laser 100 is as energy
Output source is measured, the micro mirror reflecting surface of dmd chip 301 can be effectively reduced to the absorption of laser so as to reduce high power light source directive
During MD chips, the fever of dmd chip 301.The micro mirror reflecting surface of dmd chip 301 is using metallic aluminium, and metallic aluminium is to electromagnetic wave
Reflectivity increase with the increase of electromagnetic wavelength, in infrared band, the theoretic reflectivity of high purity metal aluminium can be with
Reach 100%, that is to say absorptivity is zero.But in commercial Application, it is difficult to reach ideal conditions, even if the projection of dmd chip 301 is red
The laser of wave section, still can have certain absorption, but its absorptivity to infrared band electromagnetic wave is well below can
See light can ultraviolet band absorptivity, therefore, using infrared laser as projection input light source, dmd chip 301 is due to absorption
Caused by power attenuation well below using ultraviolet band as input light source when power attenuation.Projection heating is to one
The heating in region, the power needed is very high, the maximal input of significantly larger than routine DLP projections, and restricts the bright of DLP projections
One critically important factor of degree is exactly the heating problem of dmd chip 301, as most accurate optical element, dmd chip 301
One to famous with " enervated ", and maximum operating temperature only has tens degree, using the laser illumination dmd chip of conventional heating
301, the micro mirror reflecting surface moment of dmd chip 301 can be melted, can not be thrown laser by dmd chip 301 at all
It penetrates.The present embodiment uses laser light source as infrared laser light source, and by expanding expanding and beam splitting microscope group for microscope group 204
After beam splitting, optical power density density greatly reduces, at the same time, in addition high reflectance of the dmd chip 301 to infrared light,
The laser beam of high power infrared band is irradiated to after dmd chip 301 in the present embodiment, and dmd chip 301 can only absorb seldom
Part energy can radiate to keep dmd chip 301 in continuous firing by achievable radiating mode, temperature
Degree can keep working normally not higher than maximum tolerable temperature.
In addition, the fever further to reduce dmd chip 301, the present embodiment set preheating device on workbench 400
401 pairs of raw materials to be heated carry out the pre-heat treatment, and the temperature of raw material is heated, and the temperature of raw material is made to be in melting or burn
Within the scope of one below junction temperature, such as the temperature of raw material can be heated to arrive than melting or low 10 DEG C of sintering temperature
50 DEG C, only need relatively low power fast in this way, laser projection heating makes material temperature improve to melting or sintering temperature
Speed is realized, so as to reduce the requirement to laser light source power, the relatively low laser light source of power may be used as output source, reduce
The calorific value of dmd chip 301, further to reduce the operating temperature of dmd chip 301.
It is linear polarized light through the first laser component that polarization spectroscope 202 projects, reflecting medium is to linear polarized light
Reflectivity is related with the angle of reflecting surface with incidence angle and polarization direction, and when being parallel to reflecting surface in polarization direction, absorptivity is most
It is low, reflectivity highest.
After process expands microscope group 204 and beam splitting microscope group, it can be varied from per the polarization direction of beam first laser component,
And according to the installation position of dmd chip 301, when being irradiated on dmd chip 301 per beam first laser component with dmd chip 301
The angle of micro mirror reflecting surface can difference, for expanding the polarization side of microscope group 204 and beam splitting microscope group to first laser component
To influence and when position and the angle of each dmd chip 301 are targetedly set, can be by adjusting polarization spectroscope 202
Angle, in a manner of making its light path by first laser component for shaft rotation synchronous adjustment per beam first laser component, make through
Its polarization direction and corresponding DMD cores when being irradiated on dmd chip 301 per a branch of first laser component after beam splitter component beam
Angle between the micro mirror reflecting surface of piece 301 is zero, and then further improves the reflectivity of micro mirror reflecting surface.It is for this purpose, of the invention
It proposes another embodiment, the second rotation clamp assemblies is set on polarization spectroscope 202, to drive polarization spectroscope 202 around the
The direction of one laser components light path rotates, and synchronous adjustment makes it to corresponding DMD cores per the polarization direction of beam first laser component
The micro mirror reflecting surface of piece 301 is parallel.This programme can be on the basis of a upper embodiment by increasing first laser component in DMD
The reflection of the micro mirror reflecting surface of chip 301 is to reduce absorptivity of the dmd chip 301 to first laser component, so as to further subtract
The heat that few dmd chip 301 is generated when absorbing radiation of light source.In other embodiments, when projection-type laser heating system
Specific setting is not suitable for making by the way of the position and angle for targetedly adjusting dmd chip 301 in the present embodiment every beam the
It, can be by every beam the when the angle of the polarization direction of one laser components and the micro mirror reflecting surface of corresponding dmd chip 301 synchronizes
Second half-wave plate in the light path of one laser components is set and drives second half-wave plate with corresponding per beam first laser component
Light path the modes of clamp assemblies is rotated for the third of axis rotation, individually adjust the polarization direction of every beam first laser component with it is right
The angle between the micro mirror reflecting surface of dmd chip 301 is answered, when making to be injected into dmd chip 301 per a branch of first laser component,
Polarization direction is parallel with the micro mirror reflecting surface of dmd chip 301.
When heating to dusty raw materials, the excessively high fineness that can influence to melt or be sintered edge of temperature is made
Into excessive melting or excess agglomeration, burr is formed in finished surface, and temperature is too low that can cause can not be complete in preset time
Into melting or sintering, finished surface is made to generate notch, thus projection-type laser heating system need to the power of projection laser into
Row is accurate to be controlled, another embodiment of present invention proposition, and the first rotation clamp assemblies 201 in the present embodiment include level-one rotating clamp
Holder and two level rotating clamp fastener；First half-wave plate 200 is fixed on level-one rotating clamp fastener, and level-one rotating clamp fastener is rotatable
Be connected to the two level rotating clamp fastener, and the angular resolution of level-one rotating clamp fastener is more than the two level rotating clamp fastener
Angular resolution.
In one timing of power of infrared laser 100 itself, the rotation of the first half-wave plate 200 determines present invention hair projection
The effective output of formula laser heating system, the rotation that the first half-wave plate 200 is driven by the rotation of the first clamp assemblies are real
The adjusting of existing output power, the control accuracy of rotational angle determine the accuracy of laser output power, and photograph is realized to reduce
The laser power and the deviation of preset value being mapped on workbench 400 need accurately to adjust the rotation angle of the first half-wave plate 200.
The present embodiment is meeting the quick situation for adjusting power by way of setting the rotating clamp fastener of two-stage difference angular resolution
Under, and can realize the power regulation to become more meticulous, to reduce the deviation of real output and preset value, increase workbench 400
The fineness of upper sintering edges of regions, avoids the generation of finished surface burr and notch.
The dmd chip 301 of the present invention is only used for first laser component projecting workbench 400 by way of reflection
On, and the micro mirror reflecting surface of dmd chip 301 can only be in ± 12 ° of two location deflections with 301 surface of dmd chip, therefore work as
When the whole micro mirror reflecting surface of one dmd chip 301 is in 12 ° of angle states with 301 surface of dmd chip, projecting direction the
One projecting direction, corresponding view field be the first view field, when whole micro mirror reflectings surface with 301 surface of dmd chip in-
During 12 ° of angles, projecting direction is the second projecting direction, and corresponding view field is the second view field.Each DMD cores of the invention
First view field of piece 301 is in workbench 400, also, by the way that the specific location of DMD is set to make each dmd chip 301
Each first view field on workbench 400 is completely superposed.Control system can individually control each dmd chip 301 to exist
Projecting figure on workbench 400, and make projecting figure overlapping of each dmd chip 301 on workbench 400.It is at this point, corresponding
For beam first laser component, projecting figure and first view field's area ratio on workbench 400 are effectively heating work(
The ratio between rate and first laser component power, in the case where first laser component power is constant, projecting figure on workbench 400
It is constant to project power density.If first laser component power is P, view field's area on workbench 400 is S, is thrown in work
The area of figure on shadow to workbench 400 is S0, then the optical power density projected on workbench 400 is：ρ=P/S, and add
Hot rate is proportional to power density.At this point, the power projected in the second view field is P1=P- ρ S0, in real work,
S under normal conditions0Less than (S-S0), it that is to say under normal conditions, the power of the second view field of projection, which is more than, projects to the first throwing
The power in shadow zone domain.
This part projects to the power of the second view field other than causing waste, can also influence entire projection-type laser
Heating system, it is therefore desirable to handle the light beam for projecting the second view field.The present embodiment workbench has the side enclosed
Wall, and delustring component is set on the second projecting direction of each dmd chip 301, project to second to eliminate dmd chip 301
The light beam of view field.The specific form that reflecting assembly and the combination of light absorption component may be used, light absorption component are sticked in work
Make the side wall of platform 400, reflecting assembly can set multigroup plane or curved reflector, and dmd chip 301 is projected to the second throwing
The light beam in shadow zone domain is reflected on light absorption component, and temperature increases after light absorption component absorbs this segment beam energy, for adding
The bottom of hot workbench 400 can be used as auxiliary heating, this partial capability is used, makes powder raw material on workbench 400
Molten sintering it is quicker.
In the above-described embodiments, for realize projection-type laser heating system can be used for melting or be sintered routine powder material
Material, employing the laser of infrared band wavelength reduces the light absorption of dmd chip 301, and it is close that increase lasing beam diameter reduces luminous power
Degree, further reduces optical power density using beam splitting microscope group, to realize that dmd chip 301 can be in the range of normal working temperature
Powerful laser projection is realized, but for some heat safe material to be processed such as cermets etc., if realizing metal and pottery
The sintering of the heat-resisting materials such as porcelain needs more powerful laser to export, at this point, the temperature difficulty or ease of dmd chip 301 maintain just
In normal operating temperature range, the present embodiment radiates to dmd chip 301 using liquid nitrogen circulating cooling system, and liquid nitrogen cycle is cold
But system includes the heat-conducting block 302 set on 301 back of dmd chip, and through-hole, through-hole connection liquid nitrogen cycle are equipped in heat-conducting block 302
Pipeline.When 301 temperature of dmd chip is increased to and will exceed normal working temperature range, control system control liquid nitrogen cyclic system
System starts liquid nitrogen cycle.Liquid nitrogen cooling back installation is equipped with fluid reservoir and circulating pump, and when starting cycle, liquid nitrogen, which is pumped to, to follow
Endless tube road is quickly passed out the heat generated on dmd chip 301 by heat-conducting block 302, when terminate liquid nitrogen cycle, pipe
Liquid nitrogen reflux in road enters fluid reservoir.In the present embodiment the pipeline of circulation line for bilayer, internal layer for liquid flowing, outer layer with it is interior
Interlayer is equipped between layer, to prevent outer layer pipe condensation or frosting when starting liquid nitrogen cycle.The present embodiment uses CO simultaneously2Arteries and veins
Rush laser, CO2The optical maser wavelength of laser is 10.6 μm, and the aluminum micro mirror reflecting surface of dmd chip 301 is in theory to 10.6
μm ELECTROMAGNETIC RADIATION REFLECTION rate can reach 100%, can make dmd chip 301 assemble heat it is less；And use the side of pulse
It is because material to be sintered is powdered on workbench 400 that formula, which carries out heating, and the heat conduction of itself is poor, and pulse type laser is still
Can make it is fusion melt or material temperature to be sintered rises to melting or sintering temperature, and 301 thermal conductivity of dmd chip is good, equally
When dusty material to be processed can be made to melt or be sintered, pulse type laser is more conducive to the temperature that dmd chip 301 keeps relatively low
Degree.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every at this
The equivalent structure transformation made under the inventive concept of invention using description of the invention and accompanying drawing content or directly/utilization indirectly
It is included in the scope of patent protection of the present invention in other related technical areas.
Claims (9)
1. a kind of projection-type laser heating system, which is characterized in that including：
Infrared laser generates linear polarized light；
Laser power regulating device, the laser power regulating device include the first half-wave plate, the first rotation clamp assemblies, polarization
Spectroscope, power meter and expand microscope group；First half-wave plate is installed on the first rotation clamp assemblies；First half-wave
It piece, polarization spectroscope and expands microscope group and arranges successively in the same direction；
Beam splitting microscope group will expand the laser beam that microscope group expands and be divided into no less than two beams described in warp；
Projecting subassembly, the projecting subassembly are no less than two groups, are respectively arranged on the exit direction of the two beam splitting microscope groups；Described in every group
Projecting subassembly includes a dmd chip with the first projecting direction and the second projecting direction；
Workbench, positioned at the first projecting direction of the dmd chip, for being laid with powder body material, and the workbench is additionally provided with
Preheating device；
Control system, for controlling the first rotation clamp assemblies and the dmd chip；Individually control is every for the control system
The projection of shape of a dmd chip and direction, so that the shape that each dmd chip is projected on the workbench is identical
And it overlaps.
2. projection-type laser heating system as described in claim 1, which is characterized in that the projection-type laser heating system is also
Including the second rotation clamp assemblies, the polarization spectroscope is fixed on the second rotation clamp assemblies, the control system control
The second rotation clamp assemblies and the described first rotation clamp assemblies cooperation are made, to control the incident light of the dmd chip
Polarization direction is parallel to the micro mirror reflecting surface of the dmd chip.
3. projection-type laser heating system as described in claim 1, which is characterized in that the first rotation clamp assemblies include
Level-one rotating clamp fastener and two level rotating clamp fastener；First half-wave plate is fixed on the level-one rotating clamp fastener, described
Level-one rotating clamp fastener is rotatablely connected with the two level rotating clamp fastener, also, the angle of the level-one rotating clamp fastener point
Resolution is more than the angular resolution of the two level rotating clamp fastener.
4. projection-type laser heating system as described in claim 1, which is characterized in that each dmd chip is in the work
Make to form the first view field on platform, each first view field overlaps.
5. projection-type laser heating system as claimed in claim 4, which is characterized in that projecting subassembly described in every group also includes
Delustring component, and delustring component described in every group is correspondingly arranged on the second projecting direction of each dmd chip.
6. projection-type laser heating system as claimed in claim 5, which is characterized in that the workbench has the side enclosed
Wall；The delustring component includes the light absorption component for being attached at the side wall and for by the light beam of second projecting direction
Reflex to the reflecting assembly of the light absorption component.
7. projection-type laser heating system as described in claim 1, which is characterized in that be equipped on each dmd chip
Radiator, each radiator include liquid nitrogen circulating cooling pipeline and are attached at the heat-conducting block of the dmd chip, often
A heat-conducting block offers through-hole, and the through-hole connects the liquid nitrogen circulating cooling pipeline.
8. projection-type laser heating system as described in claim 1, which is characterized in that the infrared laser is CO2Pulse swashs
Light device.
9. a kind of 3D printer, which is characterized in that swash including the projection as described in any one of claim 1 to 8 claim
Light heating system.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094966.4A CN108248026B (en) | 2018-01-30 | 2018-01-30 | Projection type laser heating system and 3D printer |
| PCT/CN2018/082749 WO2019148653A1 (en) | 2018-01-30 | 2018-04-12 | Projection laser heating system and 3d printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094966.4A CN108248026B (en) | 2018-01-30 | 2018-01-30 | Projection type laser heating system and 3D printer |
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| Publication Number | Publication Date |
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| CN108248026A true CN108248026A (en) | 2018-07-06 |
| CN108248026B CN108248026B (en) | 2020-06-05 |
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| WO (1) | WO2019148653A1 (en) |
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| CN115519138A (en) * | 2022-09-23 | 2022-12-27 | 华南理工大学 | Low-melting-point metal printing device and method based on DMD micro-lens group |
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Also Published As
| Publication number | Publication date |
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| CN108248026B (en) | 2020-06-05 |
| WO2019148653A1 (en) | 2019-08-08 |
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