CN108243077B - Single-wire bidirectional communication circuit and vehicle - Google Patents
Single-wire bidirectional communication circuit and vehicle Download PDFInfo
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- CN108243077B CN108243077B CN201711405503.7A CN201711405503A CN108243077B CN 108243077 B CN108243077 B CN 108243077B CN 201711405503 A CN201711405503 A CN 201711405503A CN 108243077 B CN108243077 B CN 108243077B
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- 230000007175 bidirectional communication Effects 0.000 title claims abstract description 56
- 230000006854 communication Effects 0.000 claims abstract description 54
- 238000004891 communication Methods 0.000 claims abstract description 54
- 239000003990 capacitor Substances 0.000 claims description 27
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 230000001629 suppression Effects 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 102100039435 C-X-C motif chemokine 17 Human genes 0.000 description 4
- 101000889048 Homo sapiens C-X-C motif chemokine 17 Proteins 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40208—Bus networks characterized by the use of a particular bus standard
- H04L2012/40234—Local Interconnect Network LIN
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40267—Bus for use in transportation systems
- H04L2012/40273—Bus for use in transportation systems the transportation system being a vehicle
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Abstract
The invention provides a single-wire two-way communication circuit and a vehicle, wherein the single-wire two-way communication circuit comprises: the device comprises a receiving module, a sending module, a matching module and a serial communication network LIN bus; the first end of the receiving module is connected with the data receiving end of the MCU, the second end of the receiving module is connected with the first end of the matching module, the second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU; the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus. The single-wire bidirectional communication circuit provided by the invention can establish communication connection between the MCU and the LIN bus, realize data communication without a communication chip, reduce communication cost and improve the utilization rate of communication resources.
Description
Technical Field
The invention relates to the technical field of vehicle detection, in particular to a single-wire bidirectional communication circuit and a vehicle.
Background
With the rapid development of vehicle technology, communication networks for transmitting data on vehicles are becoming more and more complex. At present, a communication Network of a vehicle mainly includes a Local Interconnect Network (LIN) of a Controller Area Network (CAN) and a Media Oriented Systems Transport (MOST), and an Electronic Control Unit (ECU) that needs to perform data communication in the communication Network adopts an integrated communication chip, which has a relatively high cost, and when data transmitted by the ECU of the vehicle is relatively small, the resource utilization rate of the communication chip is relatively low. Therefore, the prior art has the problems of higher communication cost and lower communication resource utilization rate.
Disclosure of Invention
The embodiment of the invention provides a single-wire bidirectional communication circuit and a vehicle, and aims to solve the problems of high communication cost and low communication resource utilization rate in the prior art.
In order to solve the technical problem, the invention is realized as follows: in a first aspect, an embodiment of the present invention provides a single-wire bidirectional communication circuit, including:
the device comprises a receiving module, a sending module, a matching module and a serial communication network LIN bus;
the first end of the receiving module is connected with a data receiving end of a Micro Control Unit (MCU), the second end of the receiving module is connected with the first end of the matching module, the second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU;
the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus.
In a second aspect, an embodiment of the present invention further provides a vehicle, including: the single-wire bidirectional communication circuit comprises a receiving module, a transmitting module, a matching module and a serial communication network LIN bus;
the first end of the receiving module is connected with a data receiving end of a Micro Control Unit (MCU), the second end of the receiving module is connected with the first end of the matching module, the second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU;
the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus.
In the embodiment of the invention, a first end of the receiving module is connected with a data receiving end of a Micro Control Unit (MCU), a second end of the receiving module is connected with a first end of the matching module, a second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU; the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus. Therefore, the communication connection between the MCU and the LIN bus can be established through the single-wire bidirectional communication circuit, the first signal on the LIN bus can be transmitted to the MCU, the second signal of the MCU is transmitted to the LIN bus, data communication can be realized without a communication chip, the communication cost is reduced, and the utilization rate of communication resources is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is one of the block diagrams of a single-wire two-way communication circuit provided by embodiments of the present invention;
FIG. 2 is a second block diagram of a single-wire two-way communication circuit according to an embodiment of the present invention;
fig. 3 is a block diagram of a single-wire two-way communication circuit in a vehicle according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a structural diagram of a single-wire bidirectional communication circuit according to an embodiment of the present invention, and as shown in fig. 1, a single-wire bidirectional communication circuit 200 includes: a receiving module 201, a transmitting module 202, a matching module 203 and a serial communication network LIN bus 300;
a first end of the receiving module 201 is connected to the data receiving end 101 of the MCU100, a second end of the receiving module 201 is connected to a first end of the matching module 203, a second end of the matching module 203 is connected to the LIN bus 300, and the receiving module 201 is configured to transmit a first signal input by the LIN bus 300 to the data receiving end 101 of the MCU 100;
a first end of the transmitting module 202 is connected to the data transmitting end 102 of the MCU100, a second end of the transmitting module 202 is connected to a first end of the matching module 203, and the transmitting module 202 is configured to transmit a second signal input by the data transmitting end 102 of the MCU100 to the LIN bus 300.
In the embodiment of the present invention, the MCU100 may establish a communication connection with the LIN bus 300 through the single-wire bidirectional communication circuit, so as to perform data interaction with other MCUs through the LIN bus 300. For example, the MCU100 transmits a first signal for requesting data to the transmitting module 202 through the data transmitting terminal 102, the transmitting module 202 transmits the first signal to the LIN bus 300 through the matching module 203, the LIN bus 300 transmits the first signal to the first MCU, the first MCU receives the first signal from the LIN bus 300 and transmits a second signal responding to the first signal to the LIN bus 300 according to the first signal, the LIN bus transmits the second signal to the receiving module 201 through the matching module 203, and the receiving module 201 outputs the second signal to the data receiving terminal 101 of the MCU, thereby completing data interaction between the MCU and the first MCU.
In this way, in the embodiment of the present invention, the first end of the receiving module is connected to the data receiving end of the MCU, the second end of the receiving module is connected to the first end of the matching module, the second end of the matching module is connected to the LIN bus, and the receiving module is configured to transmit the first signal input by the LIN bus to the data receiving end of the MCU; the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus, transmitting the first signal on the LIN bus to the MCU and transmitting the second signal of the MCU to the LIN bus, data communication can be achieved without a communication chip, communication cost is reduced, and the utilization rate of communication resources is improved.
Referring to fig. 2, fig. 2 is a second structural diagram of a single-wire bidirectional communication circuit according to an embodiment of the present invention. As shown in fig. 2, the single-wire bidirectional communication circuit 500 includes: a receiving module 501, a transmitting module 502, a matching module 503 and a serial communication network LIN bus 600. The receiving module 501 comprises a first resistor R1 and a second resistor R2, the first end of the first resistor R1 is the first end of the receiving module 501, and is connected with the data receiving end 401 of the MCU400, the first end of the first resistor R1 is further connected with the first end of the second resistor R2, the second end of the first resistor R1 is the second end of the receiving module 501, and is connected with the first end of the matching module 503, and the second end of the second resistor R2 is grounded. The second end of the matching module 503 is connected to the LIN bus 600, and the receiving module 501 is configured to transmit the first signal input by the LIN bus 600 to the data receiving end 401 of the MCU 400.
The transmitting module 502 comprises a first triode Q1 and a second triode Q2, wherein a base of the first triode Q1 is a first end of the transmitting module 502 and is connected with the data transmitting end 402 of the MCU 400; the emitting electrode of the first triode Q1 is connected with a first power source VCC1, the collecting electrode of the first triode Q1 is connected with the base electrode of the second triode Q2, the collecting electrode of the second triode Q2 is the second end of the sending module 502, the first end of the matching module 503 is connected, and the emitting electrode of the second triode Q2 is grounded.
It should be noted that the first power supply VCC1 is a main power supply and supplies power to the single-wire bidirectional communication circuit.
Optionally, the sending module 502 further includes a third resistor R3 and a fourth resistor R4, the base of the first triode Q1 is connected to the first power VCC1 through the third resistor R3, and the base of the first triode Q1 is connected to the data sending terminal 402 of the MCU400 through the fourth resistor R4.
In the embodiment of the invention, the third resistor R3 and the fourth resistor R4 can perform the functions of current limiting and voltage stabilizing, so as to ensure that the first transistor Q1 is not damaged by high voltage.
Optionally, the transmitting module further includes a filter capacitor C2, a first terminal of the filter capacitor C2 is connected to the collector of the first transistor Q1, and a second terminal of the filter capacitor C2 is grounded.
In the embodiment of the invention, the filter capacitor C2 can filter high-frequency alternating current and improve the anti-interference capability. Optionally, the sending module 502 further includes a fifth resistor R5, a sixth resistor R6, and a seventh resistor R7, the collector of the first transistor Q1 is connected to the base of the second transistor Q2 through the fifth resistor R5, the first end of the sixth resistor R6 is connected to the base of the second transistor Q2, the second end of the sixth resistor R6 is grounded, and the collector of the second transistor Q2 is connected to the first end of the matching module 503 through the seventh resistor R7.
In the embodiment of the present invention, the fifth resistor R5 and the sixth resistor R6 can perform a voltage reduction function, so as to prevent the second transistor Q2 from being damaged due to an excessive voltage, the base current amplification of the second transistor Q2 is called a collector circuit, and the voltage of the seventh resistor R7 reflects a voltage signal that changes in the same way as the collector current signal, so as to perform a current amplification function.
Optionally, the matching module 503 includes a matching resistor R8 and a matching capacitor C1, the first end of the matching capacitor C1 is the first end of the matching module 503, the second end of the matched capacitor C1 is grounded, the first end of the matching resistor R8 is the second end of the matching module 503, the first end of the matching capacitor C1 and the LIN bus 600 are connected, and the second end of the matching resistor R8 is connected to the second power VCC 2.
In the embodiment of the present invention, specific parameter values of the matching resistor R8 and the matching capacitor C1 of the matching module 503 are determined according to the function of the MCU400, and if the MCU400 is used as a master node, that is, the MCU400 requests data from other MCUs through the LIN bus 600, the matching capacitor is 1nF, the matching resistor is 1K Ω, and if the MCU400 is used as a slave node, that is, the MCU400 requests data from other MCUs through the LIN bus 600, the matching capacitor is 200pF, and the matching resistor is 0 Ω.
Optionally, the single-wire bidirectional communication circuit 500 further includes an electrostatic protection module 504, a first end of the electrostatic protection module 504 is connected to a first end of the matching resistor R8, a second end of the electrostatic protection module 504 is grounded, and the electrostatic protection module 504 is an electrostatic impeder ESD.
Optionally, the ESD is a bidirectional transient suppression TVS diode D1.
In the embodiment of the invention, when the current input by the ESD exceeds the rated voltage, the ESD can be broken down to release excessive electric quantity, thereby playing the role of protecting the circuit.
Optionally, the single-wire bidirectional communication circuit 500 further includes a second diode D2, a cathode of the second diode D2 is connected to a second end of the matching resistor R8, an anode of the second diode D2 is connected to a second power VCC2, the second power VCC2 is 12V, and the second power VCC2 may be a backup power supply on the vehicle.
In this embodiment, the second diode D2 functions to step down when it is turned on in the forward direction and to turn off the circuit when the polarity of the positive electrode and the polarity of the negative electrode are reversed.
The single-wire bidirectional communication circuit provided by the embodiment of the invention can establish communication connection between the MCU and the LIN bus, is convenient for data transmission between the MCU and the LIN bus, can realize data communication without a communication chip, reduces the communication cost and improves the utilization rate of communication resources.
An embodiment of the present invention further provides a vehicle, where the vehicle includes a single-wire bidirectional communication circuit, and the single-wire bidirectional communication circuit includes: the device comprises a receiving module, a sending module, a matching module and a serial communication network LIN bus;
the first end of the receiving module is connected with a data receiving end of a Micro Control Unit (MCU), the second end of the receiving module is connected with the first end of the matching module, the second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU;
the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus.
Optionally, the receiving module includes a first resistor and a second resistor, a first end of the first resistor is a first end of the receiving module, the first end of the first resistor is connected to a first end of the second resistor, a second end of the first resistor is a second end of the receiving module, and a second end of the second resistor is grounded.
Optionally, the sending module includes a first triode and a second triode, and a base of the first triode is a first end of the sending module; the emitter of the first triode is connected with a first power supply, the collector of the first triode is connected with the base of the second triode, the collector of the second triode is the second end of the sending module, and the emitter of the second triode is grounded.
Optionally, the sending module further includes a third resistor and a fourth resistor, the base of the first triode is connected with the first power supply through the third resistor, and the base of the first triode is connected with the data sending end of the MCU through the fourth resistor.
Optionally, the sending module further includes a filter capacitor, a first end of the filter capacitor is connected to a collector of the first triode, and a second end of the filter capacitor is grounded.
Optionally, the sending module further includes a fifth resistor, a sixth resistor and a seventh resistor, the collector of the first triode is connected to the base of the second triode through the fifth resistor, the first end of the sixth resistor is connected to the base of the second triode, the second end of the sixth resistor is grounded, and the collector of the second triode is connected to the first end of the matching module through the seventh resistor.
Optionally, the matching module includes a matching resistor and a matching capacitor, the first end of the matching capacitor is the first end of the matching module, the second end of the matching capacitor is grounded, the first end of the matching resistor is the second end of the matching module, and is connected to the first end of the matching capacitor and the LIN bus, and the second end of the matching resistor is connected to the second power supply.
Optionally, the single-wire bidirectional communication circuit further includes an electrostatic protection module, a first end of the electrostatic protection module is connected to the first end of the matching resistor, a second end of the electrostatic protection module is grounded, and the electrostatic protection module is an electrostatic impeder ESD.
Optionally, the ESD is a bidirectional transient suppression TVS diode.
Optionally, the single-wire bidirectional communication circuit further includes a second diode, a cathode of the second diode is connected to the second end of the matching resistor, an anode of the second diode is connected to a second power supply, and the second power supply is 12V.
Optionally, the number of the single-wire bidirectional communication circuits is at least two.
Referring to fig. 3, fig. 3 is a structural diagram of a single-wire bidirectional communication circuit in a vehicle according to an embodiment of the present invention. As shown in fig. 3, the vehicle includes two single-wire bidirectional communication circuits, wherein one single-wire bidirectional communication circuit is a first single-wire bidirectional communication circuit 800, and the other single-wire bidirectional communication circuit is a second single-wire bidirectional communication circuit 1000, the first single-wire bidirectional communication circuit 800 is connected to a first MCU700, the vehicle further includes a first MCU700 connected to the first single-wire bidirectional communication circuit 800, and a second MCU1100 connected to the second single-wire bidirectional communication circuit 1000.
The first single-wire bidirectional communication circuit 800 includes: a first receiving module 801, a first transmitting module 802, a first matching module 803 and a serial communication network LIN bus 900. A first end of the first receiving module 801 is connected to the first data receiving end 701 of the first MCU700, a second end of the first receiving module 801 is connected to a first end of the first matching module 803, and a second end of the first matching module 803 is connected to the LIN bus 900; a first end of the first sending module 802 is connected to the first data sending end 702 of the first MCU700, and a second end of the first sending module 802 is connected to a first end of the first matching module 803.
The second single-wire bidirectional communication circuit 1000 includes a second receiving module 1001, a second transmitting module 1002, a second matching module 1003, and a serial communication network LIN bus 900. A first end of the second receiving module 1001 is connected to a second data receiving end 1101 of the second MCU module 1100, a second end of the second receiving module 1001 is connected to a first end of the second matching module 1003, and a second end of the second matching module 1003 is connected to the LIN bus 900; a first end of the second sending module 1002 is connected to the second data sending end 1102 of the second MCU1100, and a second end of the second sending module 1002 is connected to the first end of the second matching module 1003.
In the embodiment of the present invention, as shown in fig. 3, the first single-wire bidirectional communication circuit 800 and the second single-wire bidirectional communication circuit 1000 are further connected to a first power supply VCC1 and a second power supply VCC2, and the first single-wire bidirectional communication circuit 800 and the second single-wire bidirectional communication circuit 1000 are further provided with a ground GND correspondingly.
In this embodiment of the present invention, specific parameter values of the matching resistor and the matching capacitor of the first matching module 803 and the matching resistor and the matching capacitor of the second matching module 1003 are determined according to the functions of the first MCU800 and the second MCU 1100. If the first MCU800 is a master node, that is, the first MCU800 requests the second MCU1100 for data through the LIN bus 900, the matching capacitance of the first matching module 803 is 1nF, the matching resistance of the first matching module 803 is 1K Ω, the corresponding second MCU1100 is a slave node, that is, the second MCU1100 transmits data to the first MCU800 through the LIN bus 900, the matching capacitance of the second matching module 1003 is 200pF, and the matching resistance of the second matching module 1003 is 0 Ω.
If the first MCU800 is a slave node, that is, the first MCU800 transmits data to the second MCU1100 through the LIN bus 900, the matching capacitance of the first matching module 803 is 200pF, the matching resistance of the first matching module 803 is 0K Ω, the corresponding second MCU1100 is a master node, that is, the second MCU1100 requests data from the MCU800 through the LIN bus 900, the matching capacitance of the second matching module 1003 is 1nF, and the matching resistance of the second matching module 1003 is 1K Ω. The vehicle comprises the single-wire bidirectional communication circuit, the single-wire bidirectional communication circuit can establish communication connection between the MCU and the LIN bus, data transmission between the MCU and the LIN bus is facilitated, data communication can be achieved without a communication chip, communication cost of the vehicle is reduced, and utilization rate of communication resources of the vehicle is improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (14)
1. A single-wire two-way communication circuit, comprising:
the device comprises a receiving module, a sending module, a matching module and a serial communication network LIN bus;
the first end of the receiving module is connected with a data receiving end of a Micro Control Unit (MCU), the second end of the receiving module is connected with the first end of the matching module, the second end of the matching module is connected with the LIN bus, and the receiving module is used for transmitting a first signal input by the LIN bus to the data receiving end of the MCU;
the first end of the sending module is connected with the data sending end of the MCU, the second end of the sending module is connected with the first end of the matching module, and the sending module is used for transmitting a second signal input by the data sending end of the MCU to the LIN bus;
the matching module comprises a matching resistor and a matching capacitor, the first end of the matching capacitor is the first end of the matching module, the second end of the matching capacitor is grounded, the first end of the matching resistor is the second end of the matching module and is connected with the first end of the matching capacitor and the LIN bus, and the second end of the matching resistor is connected with a second power supply.
2. The single-wire bidirectional communication circuit according to claim 1, wherein the receiving module includes a first resistor and a second resistor, a first end of the first resistor is a first end of the receiving module, a first end of the first resistor is connected to a first end of the second resistor, a second end of the first resistor is a second end of the receiving module, and a second end of the second resistor is grounded.
3. The single-wire bidirectional communication circuit according to claim 1, wherein the transmitting module comprises a first transistor and a second transistor, a base of the first transistor being a first terminal of the transmitting module; the emitter of the first triode is connected with a first power supply, the collector of the first triode is connected with the base of the second triode, the collector of the second triode is the second end of the sending module, and the emitter of the second triode is grounded.
4. The single-wire bidirectional communication circuit according to claim 3, wherein the transmitting module further includes a third resistor and a fourth resistor, the base of the first transistor is connected to the first power supply through the third resistor, and the base of the first transistor is connected to the data transmitting terminal of the MCU through the fourth resistor.
5. The single-wire bidirectional communication circuit according to claim 4, wherein the transmitting module further comprises a filter capacitor, a first terminal of the filter capacitor is connected to a collector of the first transistor, and a second terminal of the filter capacitor is grounded.
6. The single-wire bidirectional communication circuit according to claim 5, wherein the transmitting module further includes a fifth resistor, a sixth resistor and a seventh resistor, the collector of the first transistor is connected to the base of the second transistor through the fifth resistor, a first end of the sixth resistor is connected to the base of the second transistor, a second end of the sixth resistor is grounded, and the collector of the second transistor is connected to the first end of the matching module through the seventh resistor.
7. The single-wire bidirectional communication circuit according to claim 1, further comprising an electrostatic protection module, a first end of the electrostatic protection module being connected to the first end of the matching resistor, a second end of the electrostatic protection module being grounded, the electrostatic protection module being an electrostatic impeder ESD.
8. The single wire bidirectional communication circuit of claim 7, wherein the ESD is a bidirectional transient suppression TVS diode.
9. The single-wire bidirectional communication circuit according to claim 1, further comprising a second diode, a cathode of the second diode being connected to the second terminal of the matching resistor, an anode of the second diode being connected to a second power supply, the second power supply being 12V.
10. A vehicle comprising the single-wire two-way communication circuit of any one of claims 1 to 9.
11. The vehicle of claim 10, characterized in that the number of single-wire two-way communication circuits is at least two.
12. The vehicle according to claim 11, characterized in that the number of the single-wire bidirectional communication circuits is two, wherein one single-wire bidirectional communication circuit is a first single-wire bidirectional communication circuit, and the other single-wire bidirectional communication circuit is a second single-wire bidirectional communication circuit, the first single-wire bidirectional communication circuit being connected to the second single-wire bidirectional communication circuit through a LIN bus, the vehicle further comprising a first MCU connected to the first single-wire bidirectional communication circuit, and a second MCU connected to the second single-wire bidirectional communication circuit.
13. The vehicle of claim 12, wherein the first single-wire two-way communication circuit comprises a first matching module and the second single-wire two-way communication circuit comprises a second matching module, and wherein when the first MCU is set as a master node and the second MCU is set as a slave node, a matching capacitance of the first matching module is 1nF, a matching resistance of the first matching module is 1K Ω, a matching capacitance of the second matching module is 200pF, and a matching resistance of the second matching module is 0 Ω.
14. The vehicle of claim 13, wherein when the first MCU is set as a slave node and the second MCU is set as a master node, the matching capacitance of the first matching module is 200pF, the matching resistance of the first matching module is 0 Ω, the matching capacitance of the second matching module is 1nF, and the matching resistance of the second matching module is 1K Ω.
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| US8731801B2 (en) * | 2011-05-12 | 2014-05-20 | Delphi Technologies, Inc. | Fuel injector heater element control via single data line |
| CN106383801A (en) * | 2016-09-29 | 2017-02-08 | 浙江方大智控科技有限公司 | Single line type UART communication circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8731801B2 (en) * | 2011-05-12 | 2014-05-20 | Delphi Technologies, Inc. | Fuel injector heater element control via single data line |
| CN106383801A (en) * | 2016-09-29 | 2017-02-08 | 浙江方大智控科技有限公司 | Single line type UART communication circuit |
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