CN108241452A - A kind of three-dimensional touch substrate and preparation method thereof, three-dimensional touch display panel - Google Patents
A kind of three-dimensional touch substrate and preparation method thereof, three-dimensional touch display panel Download PDFInfo
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- CN108241452A CN108241452A CN201810006680.6A CN201810006680A CN108241452A CN 108241452 A CN108241452 A CN 108241452A CN 201810006680 A CN201810006680 A CN 201810006680A CN 108241452 A CN108241452 A CN 108241452A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a kind of three-dimensional touch substrate and preparation method thereof, three-dimensional touch display panels.Solid touches substrate and includes bottom and adjacent the first side and the second side, and by being bent to form, and under bending state with the substrate of the bottom integral structure, first side and the second side overlap connection for first side and the second side.The solid touches substrate, by the way that the first side and the second side are overlapped connection, so as to which the touch electrode in adjacent side is electrically connected, so that being respectively provided with touch function on adjacent side, being advantageously implemented tool, there are four the three-dimensional touch display panels that touch function is respectively provided on side and four sides.The preparation method of substrate is touched the invention also discloses the solid and the three-dimensional touch display panel of substrate is touched including the solid.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of three-dimensional touch substrate and preparation method thereof, three-dimensional touch
Display panel.
Background technology
At present, flexible panel is generally for two opposite lateral curvatures, will appear circumferential adjacent successively four once in a while
The panel that a side is bent, but such panel only has two wherein opposite sides with touch function, and other two
Side does not have touch function.The main reason for leading to this problem is, touches substrate and is generally plane, when need to realize it is circumferential according to
When secondary four adjacent sides are bent, the intersection of adjacent two sides will appear fold so that two adjacent sides
On touch electrode can not realize connection, lead to that on two adjacent sides touch function can not be respectively provided with.
Invention content
The embodiment of the present invention is the technical problem to be solved is that, providing a kind of three-dimensional touch substrate and preparation method thereof, standing
Body touch display panel, to solve the technical issues of three-dimensional adjacent side for touching substrate can not be respectively provided with touch function.
In order to solve the above-mentioned technical problem, an embodiment of the present invention provides it is a kind of it is three-dimensional touch substrate, including bottom and
Adjacent the first side and the second side, first side and the second side with the substrate of the bottom integral structure by bending
It is formed, and under bending state, first side and the second side overlap connection.
Optionally, first touch electrode and first binding electrode of first side including being located at first surface, first
Touch electrode and the first binding electrode electrical connection, second side include being located at the second touch electrode of first surface and be located at
Second binding electrode of second surface, second touch electrode and the second binding electrode electrical connection, the first binding electrode
With the second binding electrode binding connection so that first touch electrode and the electrical connection of the second touch electrode, the second surface are
The back side of the first surface.
Optionally, first side and the second side portion are respectively included for overlapping first overlapping part and second
Overlapping part, the first binding electrode are located at the first overlapping part, and the second binding electrode is located at the second overlapping part.
Optionally, the second binding electrode includes the conductive column through substrate.
Optionally, the second binding electrode further includes the binding lead positioned at second surface, the binding lead and institute
State conductive column electrical connection.
Optionally, the material of the first binding electrode is included in indium tin oxide, nano silver and metal grill at least
It is a kind of.
In order to solve the above-mentioned technical problem, the embodiment of the present invention additionally provides a kind of three-dimensional preparation method for touching substrate,
Including：
Prepare plane and touch substrate, plane touch substrate include bottom section and the first adjacent lateral region and
Second lateral region；
Along the substrate of the first lateral region and the abutment line cutting substrate of the second lateral region cause the first lateral region and
Second side region disconnecting；
The same side that first lateral region and the second lateral region are respectively facing to substrate bends and overlaps connection.
Optionally, the plane for preparing touches substrate, including：
The first touch electrode, the first binding electrode and the second touch electrode are formed in the first surface of plane substrate, the
One touch electrode and the first binding electrode are electrically connected and are respectively positioned on the first lateral region, and the second touch electrode is located at the second lateral zones
Domain；
Plane substrate second surface formed second binding electrode, second binding electrode be located at the second lateral region and
It is electrically connected with the second touch electrode, second surface is the back side of first surface.
Optionally, described the same side that first lateral region and the second lateral region are respectively facing to substrate bends and overlaps
Connection, including：
The same side that first lateral region and the second lateral region are respectively facing to substrate is bent；
First binding electrode and the second binding electrode binding are connected, so that the first touch electrode and the second touch electrode
Electrical connection.
In order to solve the above-mentioned technical problem, the embodiment of the present invention additionally provides a kind of three-dimensional touch display panel, including with
The upper three-dimensional touch substrate.
The three-dimensional touch substrate that the embodiment of the present invention proposes, by the way that the first side and the second side are overlapped connection, so as to
Touch electrode in adjacent side can be electrically connected so that be respectively provided with touch function on adjacent side, be conducive to reality
Now there are four the three-dimensional touch display panels that touch function is respectively provided on side and four sides for tool.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that being understood by implementing the present invention.The purpose of the present invention and other advantages can be by specification, rights
Specifically noted structure is realized and is obtained in claim and attached drawing.
Description of the drawings
Attached drawing is used for providing further understanding technical solution of the present invention, and a part for constitution instruction, with this
The embodiment of application technical solution for explaining the present invention together, does not form the limitation to technical solution of the present invention.
Fig. 1 is the structure diagram that first embodiment of the invention solid touches substrate；
Fig. 2 is the side section structure diagram that Fig. 1 solids touch substrate；
Fig. 3 is the side section structure diagram that second embodiment of the invention solid touches substrate；
Fig. 4 is the structure diagram that third embodiment of the invention solid touches substrate；
Fig. 5 a are that fourth embodiment of the invention forms the structure diagram after substrate first surface pattern；
Fig. 5 b are the section partial structural diagram of Fig. 5 a；
Fig. 6 a are that fourth embodiment of the invention forms the structure diagram after substrate second surface pattern；
Fig. 6 b are the section partial structural diagram of Fig. 6 a；
Fig. 7 a are that fourth embodiment of the invention forms the structure diagram after cutting gap；
Fig. 7 b are the section partial structural diagram of Fig. 7 a；
Fig. 8 is the first binding electrode and the structure diagram of the second binding electrode binding connection.
Reference sign：
10- bottoms；The first sides of 11-；The second sides of 12-；
The 4th sides of 13- thirds side 14-；The first overlapping parts of 111-；
The first touch electrodes of 112-；113- first binds electrode；The second overlapping parts of 121-；
The second touch electrodes of 122-；123- binds lead；124- conductive columns；
10 '-bottom section；11 '-the first lateral regions；12 '-the second lateral regions；
111 '-the first overlapping regions；121 '-the second overlapping regions；200- cutting gaps.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature mutually can arbitrarily combine.
The technology contents that the present invention will be discussed in detail by specific embodiment below.
Described " patterning processes " include coating photoresist, mask exposure, development, etching, stripping photoresist in embodiment
It is the preparation process of existing maturation Deng processing.
First embodiment：
Fig. 1 is the structure diagram that first embodiment of the invention solid touches substrate.The solid touches substrate and includes bottom
10 and adjacent the first side 11 and the second side 12.First side 11 and the second side 12 by with 10 integral structure of bottom
Substrate is bent to form, and under bending state, the overlapping connection in the first side 11 and the second side 12.From figure 1 it appears that the
One side 11 and the second side 12 are in respectively the angle more than 0 ° with bottom 10, so that the touch film of the present embodiment becomes
Three-dimensional touch film in three dimensions.
The three-dimensional of the embodiment of the present invention touches substrate, by the way that the first side and the second side are overlapped connection, so as to
Touch electrode in adjacent side is electrically connected so that be respectively provided with touch function on adjacent side, be advantageously implemented tool
There are four the three-dimensional touch display panels that touch function is respectively provided on side and four sides.
Fig. 2 is the side section structure diagram that Fig. 1 solids touch substrate.From figure 2 it can be seen that the solid touches base
Plate includes being used to implement the first surface of touch function and the second surface opposite with first surface.First side 11 includes position
In the first touch electrode 112 and the first binding electrode 113 of first surface, the first binding 113 and first touch electrode 112 of electrode
Electrical connection.Second side 12 includes the second touch electrode 122 positioned at first surface and the second binding electricity positioned at second surface
Pole, the second binding electrode are electrically connected with the second touch electrode 122.First binding electrode 113 and second binds electrode binding connection
So that the first touch electrode 112 and the second touch electrode 122 are electrically connected.Such structure passes through the first binding electrode 113 and the
The binding connection of two binding electrodes, realizes the overlapping connection of the first side 11 and the second side 12, so that first touches
112 and second touch electrode 122 of electrode is electrically connected so that has been respectively provided with touch function on the first side 11 and the second side 12.
It is further seen that, the first side 11 and the second side 12 respectively include handing over for overlapping first from Fig. 2
Folded 111 and second overlapping part 121 of part, the first binding electrode 113 are located at the first overlapping part 111, the second binding electrode position
In the second overlapping part 121.It is easily understood that since the first overlapping part 111 is covered by the second overlapping part 121,
The first touch electrode 112 is usually arranged on region except the first overlapping part 111 of the first side 11, is touched to avoid first
Touch function can not be played by the covering of the second overlapping part 121 by touching electrode 112.Meanwhile in order to ensure 11 exposed area of the first side
The integrality of the touch function in domain is needed the first binding electrode 113 being arranged on the first overlapping part 111, be tied up to avoid first
Fixed electrode 113 occupies the exposed area of the first side 11, influences touch function integrality so that the exposed area of the first side 11
It is respectively provided with touch function.In order to realize the integrality of the touch function of the second side 12, usually in the second overlapping part 121
One surface is also equipped with the second touch electrode.
In the present embodiment, the second binding electrode includes the conductive column 124 through film substrate.It is shown in Fig. 2, conductive column
124 and second touch electrode 122 be electrically connected, the first binding electrode 113 and conductive column 124 binding connects.
In the present embodiment, the first binding electrode is preferably by the higher material of optical transmittance, for example, the first binding
The material of electrode can include at least one of indium tin oxide, nano silver and metal grill (Metal Mesh).Conductive column
Material is preferably the preferable material of the electric conductivities such as silver paste.
Second embodiment：
Fig. 3 is the side section structure diagram that second embodiment of the invention solid touches substrate.The solid of the present embodiment
It is identical with the three-dimensional agent structure for touching substrate of first embodiment to touch substrate, unlike, as shown in figure 3, the present embodiment
It is three-dimensional touch substrate, the second binding electrode further includes the binding lead (Bonding lead) 123 positioned at second surface, binding
Lead 123 is arranged on the second surface of the second overlapping part 121 and is electrically connected with conductive column 124.Therefore, in the present embodiment,
It is that the first binding electrode 113 connects with the binding binding of lead 123 that first binding electrode 113 and second, which binds electrode binding connection,
It connects.In the present embodiment, the first binding electrode 113 is connected with the binding binding of lead 123, realize the first binding electrode 113 with
Conductive column 124 connects, and such connection mode can reduce the connection resistance between the first binding electrode 113 and conductive column 124,
So as to reduce the connection resistance of the first touch electrode 112 and the second touch electrode 122, improve the three-dimensional substrate side that touches and touch
Touch the response speed of electrode.
3rd embodiment：
Fig. 4 is the structure diagram that third embodiment of the invention solid touches substrate.Figure 4, it is seen that this implementation
The three-dimensional substrate that touches of example is additionally included in the third side that first surface is both provided with touch electrode on the basis of first embodiment
13 and the 4th side 14 of portion.First side 11, the second side 12,13 and the 4th side part 14 of third side be not circumferential along bottom 10
It sets and overlaps connection successively so that the touch electrode on side connects.
In the present embodiment, the first side 11, the friendship between third side 13, the 4th side 14 respectively of the second side 12
Folded connection structure is identical with the first embodiment, and details are not described herein.
Fourth embodiment：
An embodiment of the present invention provides a kind of three-dimensional preparation method for touching substrate, this method includes：
S1：It prepares plane and touches substrate, plane touches substrate and includes bottom section and the first adjacent lateral zones
Domain and the second lateral region；
S2：Substrate along the first lateral region and the abutment line cutting substrate of the second lateral region causes the first lateral region
With the second side region disconnecting；
S3：The same side that first lateral region and the second lateral region are respectively facing to substrate bends and overlaps connection.
Wherein, it prepares plane and touches substrate, can include：
The first touch electrode, the first binding electrode and the second touch electrode are formed in the first surface of plane substrate, the
One touch electrode and the first binding electrode are electrically connected and are respectively positioned on the first lateral region, and the second touch electrode is located at the second lateral zones
Domain；
Plane substrate second surface formed second binding electrode, second binding electrode be located at the second lateral region and
It is electrically connected with the second touch electrode, second surface is the back side of first surface.
S3 can include：
The same side that first lateral region and the second lateral region are respectively facing to substrate is bent；
First binding electrode and the second binding electrode binding are connected, so that the first touch electrode and the second touch electrode
Electrical connection.
The three-dimensional touch substrate of the embodiment of the present invention will be discussed in detail by the three-dimensional preparation process for touching substrate below
Preparation method.
The first touch electrode 112, first is formed in the first surface of plane substrate bind electrode 113 by patterning processes
With the second touch electrode 122.Plane substrate includes bottom section 10 ', the first lateral region 11 ' and the second lateral region 12 ',
Wherein, the first touch electrode 112 and the first binding electrode 113 are respectively positioned on the first lateral region 11 ', and the first binding electrode 113
It is electrically connected with the first touch electrode 112；Second touch electrode 122 is located at the second lateral region 12 ', as shown in figure 5 a and 5b,
Fig. 5 a are that fourth embodiment of the invention forms the structure diagram after substrate first surface pattern, the section part that Fig. 5 b are Fig. 5 a
Structure diagram.When forming the first touch electrode 112, the second touch electrode 122 and the first binding electrode 113, the is reserved
The abutment line of one lateral region 11 ' and the second lateral region 12 '.Form the first touch electrode, the second touch electrode and first is tied up
The material of fixed electrode is preferably the higher material of optical transmittance, for example, indium tin oxide, nano silver and metal grill
At least one of (Metal Mesh).It can also be seen that the first lateral region 11 ' and the second lateral region 12 ' from Fig. 5 a
It respectively includes for overlapping first overlapping region 111 ' and the second overlapping region 121 '.It is therefore preferred that the first binding
Electrode 113 is located at the first overlapping region 111 ', to avoid the first binding electrode 113 occupy the first lateral region 11 ' for touching
Touch the region of function.In addition, so it is easy to understand that in order to realize bent, the sheet of the first lateral region and the second lateral region
The plane substrate of embodiment is flexible substrates, and the material of substrate can be polyimides, can also be it is other can be formed it is soft
The material of property substrate.
Plane substrate second surface formed second binding electrode, second binding electrode be located at the second lateral region and
It is electrically connected with the second touch electrode, second surface is the back side of first surface.Specially：In the second surface shape of plane substrate
Into the via through substrate, it is preferable that via is located at the second overlapping region；Conductive material is perfused into via, forms conductive column
124, conductive column 124 is electrically connected with the second touch electrode 122；It is electrically connected in the second surface formation of substrate with conductive column 124
Bind lead 123, it is preferable that binding lead 123 is located at the second overlapping region 12 ', and as shown in figures 6 a and 6b, Fig. 6 a are this hair
Bright fourth embodiment forms the structure diagram after substrate second surface pattern, the section partial structurtes signal that Fig. 6 b are Fig. 6 a
Figure.In the present embodiment, patterning processes may be used and form binding lead 123, other manner can also be used to form binding and drawn
Line 123, does not limit herein.It is easily understood that after via is formed, a patterning processes may be used it is formed simultaneously and lead
Electric column 124 and binding lead 123.The conductive material being perfused into via includes silver paste, or other conductive energy
Material.
Substrate along the first lateral region 11 ' and the abutment line cutting substrate of the second lateral region 12 ' causes the first side
Region 11 ' and the separation of the second lateral region 12 ', it is preferable that along the adjoining of the first lateral region 11 ' and the second lateral region 12 '
During the substrate of wire cutting substrate, formation cutting gap 200 causes between the first lateral region 11 ' and the second lateral region 12 '
So that the first lateral region 11 ' and the separation of the second lateral region 12 ', as shown in figs. 7 a and 7b, Fig. 7 a are real for the present invention the 4th
It applies example and forms the structure diagram after cutting gap, Fig. 7 b are the section partial structural diagram of Fig. 7 a.In the present embodiment, it cuts
The width and length of slot gap 200 can be determined according to actual demand.
The same side that first lateral region and the second lateral region are respectively facing to substrate bends and overlaps connection.Specifically
For：First lateral region 11 ' and the second lateral region 12 ' are respectively facing the same side of substrate i.e. first surface to bend, by the
After one lateral region 11 ' and the bending of the second lateral region 12 ', make the first surface and the second crossover region of the first overlapping region 111 '
The second surface in domain 121 ' is opposite；First binding electrode 113 and second is bound into electrode binding connection, i.e., binds electrode by first
113 connect with the binding binding of lead 123, so that the first touch electrode 112 and the second touch electrode 122 are electrically connected, such as Fig. 8 institutes
Show, Fig. 8 is the first binding electrode and the structure diagram of the second binding electrode binding connection.It is easily understood that first is tied up
There are many kinds of fixed electrodes and the mode of the second binding electrode binding connection, can determine specifically to bind connection according to actual needs
Mode in the present embodiment, is tied up using anisotropic conductive film (Anisotropic Conductive Film, ACF) by first
Fixed electrode and the second binding electrode binding connect.
The three-dimensional touch substrate that method through this embodiment is prepared, bottom section form the bottom that the solid touches substrate
Portion, the first lateral region and the second lateral region respectively constitute the solid touch substrate the first side and the second side, first
Overlapping region and the second overlapping region respectively constitute the first overlapping part and the second overlapping part that the solid touches substrate.Pass through
The three-dimensional structure for touching substrate that the present embodiment method is prepared is as shown in Figure 1.
5th embodiment：
An embodiment of the present invention provides a kind of three-dimensional preparation method for touching substrate, this method includes：
It prepares plane and touches substrate, plane touches substrate and includes bottom section and circumferentially disposed along bottom section
The first adjacent lateral region, the second lateral region, third lateral region and the 4th lateral region successively.
Respectively along the substrate of the abutment line cutting substrate of adjacent lateral region, the shape between adjacent lateral region
Into cutting gap so that adjacent lateral region separation, that is, cause the first lateral region, the second lateral region, third lateral zones
Domain and the 4th lateral region are separated from each other；
First lateral region, the second lateral region, third lateral region and the 4th lateral region are respectively facing substrate
The same side is bent and so that adjacent lateral region overlaps connection.
Method through this embodiment prepare it is three-dimensional touch substrate, bottom section forms the bottom of the substrate, first
Lateral region, the second lateral region, third lateral region and the 4th lateral region respectively constitute the first side of the substrate, second
Side, third side and the 4th side.The three-dimensional structure for touching substrate that method is prepared through this embodiment is as shown in Figure 4.
Sixth embodiment：
Inventive concept based on previous embodiment, the embodiment of the present invention additionally provide a kind of three-dimensional touch display panel, should
Three-dimensional touch display panel includes touching substrate using the three-dimensional of previous embodiment.The solid touch display panel is flat in full display
Touch electrode is both provided in face, realizes the touch function in full display plane.Three-dimensional touch display panel can be：Hand
Machine, tablet computer, television set, display, laptop, Digital Frame, navigator etc. be any to be had and touches display function
Product or component.
In the description of the embodiment of the present invention, it is to be understood that term " middle part ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instructions such as " vertical ", " level ", " top ", " bottom ", " interior ", " outer " be based on orientation shown in the drawings or
Position relationship is for only for ease of the description present invention and simplifies description rather than instruction or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the embodiment of the present invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanical connection or electrical connection；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, can above-mentioned art be understood with concrete condition
The concrete meaning of language in the present invention.
Although disclosed herein embodiment as above, the content only for ease of understanding the present invention and use
Embodiment is not limited to the present invention.Technical staff in any fields of the present invention is taken off not departing from the present invention
Under the premise of the spirit and scope of dew, any modification and variation, but the present invention can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. three-dimensional substrate is touched a kind of, which is characterized in that including bottom and adjacent the first side and the second side, described the
One side and the second side with the substrate of the bottom integral structure by being bent to form, and under bending state, first side
Portion and the second side overlap connection.
2. three-dimensional touch substrate according to claim 1, which is characterized in that first side includes being located at first surface
The first touch electrode and the first binding electrode, the first touch electrode and the first binding electrode electrical connection, second side packet
It includes the second touch electrode positioned at first surface and second positioned at second surface and binds electrode, second touch electrode and the
Two binding electrodes electrical connection, it is described first binding electrode and second binding electrode binding connection so that first touch electrode and
Second touch electrode is electrically connected, and the second surface is the back side of the first surface.
3. three-dimensional touch substrate according to claim 2, which is characterized in that first side and the second side portion are wrapped respectively
It including for overlapping first overlapping part and the second overlapping part, the first binding electrode is located at the first overlapping part,
The second binding electrode is located at the second overlapping part.
4. three-dimensional touch substrate according to claim 3, which is characterized in that the second binding electrode is included through substrate
The conductive column of substrate.
5. three-dimensional substrate is touched according to claim 4, which is characterized in that the second binding electrode is further included positioned at the
The binding lead on two surfaces, the binding lead are electrically connected with the conductive column.
6. three-dimensional touch film according to claim 2, which is characterized in that the material of the first binding electrode includes indium
At least one of tin-oxide, nano silver and metal grill.
7. a kind of three-dimensional preparation method for touching substrate, which is characterized in that including：
It prepares plane and touches substrate, plane touches substrate and includes bottom section and adjacent the first lateral region and second
Lateral region；
Substrate along the first lateral region and the abutment line cutting substrate of the second lateral region causes the first lateral region and second
Lateral region detaches；
The same side that first lateral region and the second lateral region are respectively facing to substrate bends and overlaps connection.
8. the method according to the description of claim 7 is characterized in that it is described prepare plane touch substrate, including：
The first touch electrode, the first binding electrode and the second touch electrode are formed in the first surface of plane substrate, first touches
It touches electrode and the first binding electrode electrical connection and is respectively positioned on the first lateral region, the second touch electrode is located at the second lateral region；
The second binding electrode is formed in the second surface of plane substrate, and the second binding electrode is located at the second lateral region and with the
Two touch electrodes are electrically connected, and second surface is the back side of first surface.
9. according to the method described in claim 8, it is characterized in that, described distinguish the first lateral region and the second lateral region
It is bent towards the same side of substrate and overlaps connection, including：
The same side that first lateral region and the second lateral region are respectively facing to substrate is bent；
First binding electrode and the second binding electrode binding are connected, so that the first touch electrode and the second touch electrode are electrically connected
It connects.
10. a kind of solid touch display panel, which is characterized in that touched including the solid described in any one in claim 1-6
Touch substrate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262691A (en) * | 2019-06-20 | 2019-09-20 | 京东方科技集团股份有限公司 | Touch base plate and preparation method thereof and driving method, touch-control display panel |
| CN112799539A (en) * | 2021-02-02 | 2021-05-14 | 业成科技（成都）有限公司 | Touch device and manufacturing method thereof |
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| CN205827303U (en) * | 2015-06-05 | 2016-12-21 | 苹果公司 | Electronic equipment |
| CN206162458U (en) * | 2016-10-11 | 2017-05-10 | 上海天马微电子有限公司 | Flexible touch panel and flexible touch display device |
| CN107479754A (en) * | 2017-08-22 | 2017-12-15 | 武汉天马微电子有限公司 | Flexible touch sensor and flexible touch display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110262691A (en) * | 2019-06-20 | 2019-09-20 | 京东方科技集团股份有限公司 | Touch base plate and preparation method thereof and driving method, touch-control display panel |
| WO2020253617A1 (en) * | 2019-06-20 | 2020-12-24 | 京东方科技集团股份有限公司 | Touch substrate, manufacturing method and driving method therefor, and touch display panel |
| CN110262691B (en) * | 2019-06-20 | 2021-04-16 | 京东方科技集团股份有限公司 | Touch substrate, manufacturing method and driving method thereof, and touch display panel |
| CN112799539A (en) * | 2021-02-02 | 2021-05-14 | 业成科技（成都）有限公司 | Touch device and manufacturing method thereof |
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