CN108235604A - PCB presses material temperature automatic control system and its control method - Google Patents
PCB presses material temperature automatic control system and its control method Download PDFInfo
- Publication number
- CN108235604A CN108235604A CN201810026678.5A CN201810026678A CN108235604A CN 108235604 A CN108235604 A CN 108235604A CN 201810026678 A CN201810026678 A CN 201810026678A CN 108235604 A CN108235604 A CN 108235604A
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- Prior art keywords
- temperature
- control system
- data
- module
- processing module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000012546 transfer Methods 0.000 claims description 22
- 239000000446 fuel Substances 0.000 claims description 18
- 238000003825 pressing Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1925—Control of temperature characterised by the use of electric means using a combination of auxiliary electric and non-electric power
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of PCB pressing material temperature automatic control systems and its control method, including hot press, data collecting system and temperature control system；The data acquisition module is including for detecting the temperature sensor and data reception module of the temperature of the platen of the hot press, the temperature sensor is connect with the data reception block signal；The temperature control system includes data processing module and heating module, and the heating module is used to heat the platen of the hot press.The present invention can improve the pressing effect of pcb board, improve yields.
Description
Technical field
The present invention relates to wiring board art, especially a kind of PCB pressings material temperature automatic control system.
Background technology
Pcb board, that is, PCB circuit board（Printed circuit board）, also known as printed circuit board or printed circuit
Plate is the supplier of electronic component electrical connection.In general, printed circuit board：It is that one is covered on non-conductive substrate
Layer/bis- layers of copper foil（Conductive layer）--- it is referred to as mono-/bis-face circuit board, then using the method for printing, by designed circuit
Connect the lines printing that need to retain（Corrosion-resistant medium）On copper foil, it is immersed in corrosive liquids and erodes no protective coating
Copper foil, wash corrosivity raffinate, positional punch coats scaling powder etc., that is, accuse complete.The effect of pcb board is like crops
Need growth in the soil：First, electrical connection is provided between each other for electronic component by copper foil lines；Second is that for electricity
Sub- component provides physical support.Major advantage using pcb board is to greatly reduce the mistake of wiring and assembling, is improved automatic
Change horizontal and labor productivity.
At this stage, in the pressing working procedure of pcb board, especially for 2 layers and 2 layers or more pcb board products, pressing working procedure master
To include hot pressing and cold pressing.Hot pressing is by heating prepreg（Such as epoxide resin material）, and apply certain pressure such as
200-500PSI/cm2 melts prepreg and is frozen into the multilayer circuit board of needs.It is pressed in existing copper foil conductive heater
In machine, all it is by continuous winding copper foil conductive heater wiring board, and respectively has one piece of heating dish up and down in cavity, it is main
Effect is that auxiliary heating is done to pcb board product.The shortcomings that existing pcb board laminating machine is primarily present has：Most of existing laminating machinees
Heating method used is heated for electrical bar, and service life is short, and maintenance difficulty is big, and thermo-lag is larger, is not easy accurate temperature controlling；And
Pcb board needs to carry out the setting and control of temperature curve according to the physical property of material, current most of layers in lamination process
Pressure pressure is merely able to the temperature of autonomous control pressing platen, but can not carry out effective reality for the temperature of practical pcb board
When control, can not ensure the pressing stability of pcb board.
Invention content
Based on this, it is necessary to a kind of PCB pressing material temperature automatic control system and its control method are provided, including hot press,
Data collecting system and temperature control system；The data acquisition module include for detect the hot press platen temperature
Temperature sensor and data reception module, the temperature sensor connect with the data reception block signal；The temperature
Control system includes data processing module and heating module, and the heating module is used to heat the platen of the hot press.
During pressing, platen is pressed on pcb board, is in close contact with pcb board, so as to which pcb board be heated so that on pcb board
Prepreg melt so that the pcb board to contact with each other is freezing together to form multilayer circuit board.Wherein, one side of hot press
It is provided with data collecting system, the temperature sensor in data collecting system for detecting the temperature of the pcb board on platen in real time
And the real time temperature detected is sent to data reception module, real time temperature information is sent temperature control system by data module again
Data processing module in system, processing module according to the specific heat capacity and thermal conductivity factor for being pre-entered into material to be laminated therein with
And the real time temperature that temperature sensor measurement arrives, it calculates material to be laminated and reaches the required heat of preset temperature value, and
The calorie value is converted to the flow value of the heat transfer oil in thermal conductive pipe, and flow value information is sent to circulating pump, is recycled
The corresponding adjustment uninterrupted of pump；The temperature value that wherein preset temperature value changes for a passage at any time.
Preferably, the heating module includes the fuel reserve tank, thermal conductive pipe and circulating pump for storing heat transfer oil, described
Circulating pump is connect with the data processing module signal, and the both ends of the thermal conductive pipe are connected with the fuel reserve tank, described to lead
Heat pipe is connected with the platen, and the circulating pump position is connected with the thermal conductive pipe, and positioned at the platen and the fuel reserve tank
Between.
Circulating pump is used to control the real-time traffic size of the heat transfer oil in thermal conductive pipe, is transmitted so as to change heat transfer oil
To the heat of platen, achieve the purpose that adjust the temperature of material to be laminated in real time；In addition the heat transfer oil in thermal conductive pipe is flowing
After platen, the thermal conductive pipe that can pass through platen rear is flow back into fuel reserve tank, is recycled heat transfer oil, is saved cost.
Further, it is provided with constent temperature heater in the fuel reserve tank.
Constent temperature heater avoids carrying out for the heat transfer oil in fuel reserve tank to be made to remain at a fixed temperature
Change the temperature of the inside heat transfer oil of oil storage after heat transfer oil stream time fuel reserve tank after heat exchange.
Further, the constent temperature heater is connect with the data processing module signal.
Data processing module can receive constent temperature heater set temperature value, while can also change constent temperature heater
Set temperature value, convenient for processing module according to the stream of the temperature computation thermal conductive pipe heat conduction oil of fuel reserve tank heat conduction oil
Amount；And the temperature when material to be laminated needs calorie value larger in adjustment fuel reserve tank, it is more than heat-transfer pipe to avoid required flow
The bearing capacity in road.
Preferably, the temperature sensor is micro thermocouple sensor.
Another object is to provide a kind of PCB pressings material temperature control method, which is characterized in that includes the following steps：
S1, will be in the specific heat capacity of material to be laminated, the thermal conductivity factor input data processing module of material；
S2, temperature in use sensor measure the real time temperature of material to be laminated, and real time temperature is sent to data reception module,
Then real time temperature data are sent to data processing module by data reception module；
S3, data processing module according to the specific heat capacity of material to be laminated, the thermal conductivity factor of material to be laminated, material to be laminated reality
Shi Wendu calculates the real-time heat that material to be laminated is heated to pressing-in temp needs, and according to the temperature of heat transfer oil, will
The real-time heat value needed is converted to the real-time flow data of heat transfer oil；
The real-time flow data of heat transfer oil is sent to circulating pump by S4, data processing module, and circulating pump correspondingly adjusts heat transfer
The real-time traffic size of oil.
The principle of the present invention, effect are further illustrated with reference to above-mentioned technical proposal：
The present invention can be controlled the practical material temperature of pcb board by temperature control system, and material temperature and target temperature are designed to allow
Line of writing music is consistent.Data processing module can automatically adjust the flow of thermal conductive pipe heat conduction oil.To ensure pcb board in each rank
The heat of Duan Suoxu is accurately set, so that pcb board is pressed under optimal design material temperature always, improves the pressure of pcb board
Effect is closed, improves yields.
Description of the drawings
Fig. 1 is the structure diagram that PCB described in the embodiment of the present invention presses material temperature automatic control system；
Reference sign：
11- platens, 21- data reception modules, 22- temperature sensors, 31- fuel reserve tanks, 311- constent temperature heaters, 32- heat conducting pipes
Road, 33- circulating pumps, 34- data processing modules.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, the present invention is done further in detail below in conjunction with attached drawing and embodiment
Thin description：
Such as Fig. 1, a kind of PCB pressing material temperature automatic control systems and its control method, including hot press, data collecting system and temperature
Spend control system；The data acquisition module include for detect the hot press platen 11 temperature temperature sensor 22
With data reception module 21, the temperature sensor 22 is connect with 21 signal of data reception module；The temperature control system
System includes data processing module 34 and heating module, and the heating module is used to heat the platen 11 of the hot press.
One of which embodiment, the heating module include fuel reserve tank 31, the thermal conductive pipe 32 for storing heat transfer oil
With circulating pump 33, the circulating pump 33 is connect with 34 signal of data processing module, the both ends of the thermal conductive pipe 32 with
The fuel reserve tank 31 connects, and the heat conducting pipe is connected with the platen 11, and the circulating pump 33 connects with the thermal conductive pipe 32
It is logical, and between the platen 11 and the fuel reserve tank 31.
One of which embodiment is provided with constent temperature heater 311 in the fuel reserve tank 31.
One of which embodiment, the constent temperature heater 311 are connect with 34 signal of data processing module.
One of which embodiment, the temperature sensor 22 are micro thermocouple sensor.
One of which embodiment, a kind of PCB press material temperature control method, which is characterized in that include the following steps：
S1, will be in the specific heat capacity of material to be laminated, the thermal conductivity factor input data processing module 34 of material；
S2, temperature in use sensor 22 measure the real time temperature of material to be laminated, and real time temperature is sent to data reception
Block 21, then data reception module 21 real time temperature data are sent to data processing module 34；
S3, data processing module 34 are according to the specific heat capacity of material to be laminated, the thermal conductivity factor of material to be laminated, material to be laminated
Real time temperature calculates the real-time heat that material to be laminated is heated to pressing-in temp needs, and according to the temperature of heat transfer oil,
The real-time heat value of needs is converted into the real-time flow data of heat transfer oil；
The real-time flow data of heat transfer oil is sent to circulating pump 33 by S4, data processing module 34, and circulating pump 33 correspondingly adjusts
The real-time traffic size of heat transfer oil.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of PCB presses material temperature automatic control system, which is characterized in that including hot press, data collecting system and temperature control
System processed；The data acquisition module for detecting the temperature sensor of the temperature of the platen of the hot press and data including connecing
Module is received, the temperature sensor is connect with the data reception block signal；The temperature control system includes data processing
Module and heating module, the heating module are used to heat the platen of the hot press.
2. PCB according to claim 1 presses material temperature automatic control system, which is characterized in that the heating module includes
For storing the fuel reserve tank of heat transfer oil, thermal conductive pipe and circulating pump, the circulating pump connects with the data processing module signal
It connects, the both ends of the thermal conductive pipe are connected with the fuel reserve tank, and the heat conducting pipe is connected with the platen, the circulating pump position
It is connected with the thermal conductive pipe, and between the platen and the fuel reserve tank.
3. PCB according to claim 2 presses material temperature automatic control system, which is characterized in that is set in the fuel reserve tank
There is constent temperature heater.
4. PCB according to claim 3 presses material temperature automatic control system, which is characterized in that the constent temperature heater with
The data processing module signal connection.
5. PCB according to claim 1 presses material temperature automatic control system, which is characterized in that the temperature sensor is
Micro thermocouple sensor.
6. a kind of PCB presses material temperature control method, which is characterized in that includes the following steps：
S1, will be in the specific heat capacity of material to be laminated, the thermal conductivity factor input data processing module of material；
S2, temperature in use sensor measure the real time temperature of material to be laminated, and real time temperature is sent to data reception module,
Then real time temperature data are sent to data processing module by data reception module；
S3, data processing module are according to the specific heat capacity of material to be laminated, the thermal conductivity factor of material to be laminated and material to be laminated
Real time temperature, calculate the real-time heat that material to be laminated is heated to pressing-in temp needs, and by the real-time heat of needs
Value is converted to the real-time traffic of thermal conductive pipe heat conduction oil；
The real-time flow data of heat transfer oil is sent to circulating pump by S4, data processing module, and circulating pump correspondingly adjusts heat transfer
The real-time traffic size of oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026678.5A CN108235604A (en) | 2018-01-11 | 2018-01-11 | PCB presses material temperature automatic control system and its control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026678.5A CN108235604A (en) | 2018-01-11 | 2018-01-11 | PCB presses material temperature automatic control system and its control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108235604A true CN108235604A (en) | 2018-06-29 |
Family
ID=62642060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810026678.5A Pending CN108235604A (en) | 2018-01-11 | 2018-01-11 | PCB presses material temperature automatic control system and its control method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108235604A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364161A (en) * | 2022-01-13 | 2022-04-15 | 深圳市昶东鑫线路板有限公司 | Automatic control system for circuit board production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810965A (en) * | 1997-04-07 | 1998-09-22 | Fwu; Jason | Thermal embossing/laminating system of printing machine |
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| CN101125386A (en) * | 2006-08-18 | 2008-02-20 | 群康科技(深圳)有限公司 | Hot press device and hot press method using the same |
| CN201811431U (en) * | 2010-06-02 | 2011-04-27 | 浙江省常山液压机有限公司 | Heat-conducting oil heating plate capable of adjusting temperature |
| CN202126420U (en) * | 2011-06-10 | 2012-01-25 | 金安国纪科技（珠海）有限公司 | Heat resistance detecting component for PCB (Printed circuit board) |
| CN203331544U (en) * | 2013-07-04 | 2013-12-11 | 哈尔滨理工大学 | Laminating machine |
| KR20140044500A (en) * | 2012-10-05 | 2014-04-15 | 차재국 | Autoclave for manufacturing pcb |
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| CN105346187A (en) * | 2015-11-16 | 2016-02-24 | 嘉兴市上村电子有限公司 | Copper-clad plate energy storage circulation hydraulic pressure forming device |
| KR20160035386A (en) * | 2014-09-23 | 2016-03-31 | 우관수 | Heating Roller with Simple Structure |
| CN206514879U (en) * | 2017-01-20 | 2017-09-22 | 广上科技(广州)有限公司 | The hot press of temperature and pressure can be monitored |
| CN208113113U (en) * | 2018-01-11 | 2018-11-16 | 广合科技（广州）有限公司 | PCB presses material temperature automatic control system |
-
2018
- 2018-01-11 CN CN201810026678.5A patent/CN108235604A/en active Pending
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| KR20160035386A (en) * | 2014-09-23 | 2016-03-31 | 우관수 | Heating Roller with Simple Structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364161A (en) * | 2022-01-13 | 2022-04-15 | 深圳市昶东鑫线路板有限公司 | Automatic control system for circuit board production |
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Address after: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant after: Guangzhou Guanghe Technology Co., Ltd Address before: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |