CN108226870A - Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement - Google Patents
Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement Download PDFInfo
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- CN108226870A CN108226870A CN201711375989.4A CN201711375989A CN108226870A CN 108226870 A CN108226870 A CN 108226870A CN 201711375989 A CN201711375989 A CN 201711375989A CN 108226870 A CN108226870 A CN 108226870A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
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- Computer Networks & Wireless Communication (AREA)
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- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Waveguides (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The present invention proposes a kind of Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement, including：Sandwich arrangement uses the three-decker of control circuit printing plate, microstrip line and power circuit printing plate, the input terminal of final stage wave control circuit is connected with the photoelectric conversion module inputted by optical fiber, with incoming control signal and serial control data, distribute to each branch output of Digital Microwave power supply composite substrate circuit；Dual-sided perpendicular interconnection power division network is using strip resistance film strips line power division network and the integrated design of dual-sided perpendicular connection-transformation；Final stage power converting circuit converts input voltage into a variety of direct voltage outputs, provides instantaneous power output supply final stage active circuit.The present invention is a complete composite substrate circuit according to " sandwich " formula framework hybrid integrated, can significantly reduce space and the weight requirements of active phased array submatrix module, realizes front small light.
Description
Technical field
The present invention relates to active electricals to sweep array radar technical field, more particularly to a kind of microwave number based on sandwich arrangement
Word power supply composite substrate circuit and feeder means.
Background technology
Connectors for Active Phased Array Radar is the radar form of current most mainstream, and core connotation is by each active to aerial array
Transceiver channel individually carries out amplitude-phase control and realizes that the broadband and wideangle of antenna array wave beam quickly scans, is Sidelobe, anti-interference
Etc. all various advantages, generally front is integrated in a manner that the active submatrix module brick formula of row/column is arranged side by side.
The feeder line design conventional design mode of Connectors for Active Phased Array Radar is by row submatrix or row submatrix work(point/polymer fabric at present
Network, final stage wave control circuit and final stage power circuit independent design, sub-module is configured at active submatrix inside modules, respectively by not
Same mode (CA cable assembly or Surface Mount welding etc.) feeds with the interconnection of multiple T/R components.
Specific array T/R components are constantly increased with working frequency range, and size, which constantly becomes smaller generally to use, depends on active phase
Control the layout type of a period of time array module.The active phased array submatrix module is includes several T/R components, final stage wave control/power supply
The associated components such as circuit, radio frequency work(point/synthesis network, cooling cavities are easily installed, change the standalone module expanded with front.
And as radar working frequency range constantly increases, the requirement of platform load compressed dimension weight, active phased array submatrix inside modules
Space is more and more compacter, and various feed circuits are difficult to be laid out.
Invention content
The purpose of the present invention is intended at least solve one of described technological deficiency.
For this purpose, it is an object of the invention to propose a kind of Digital Microwave power supply composite substrate circuit based on sandwich arrangement
And feeder means.
To achieve these goals, the embodiment of the present invention provides a kind of Digital Microwave power supply based on sandwich arrangement and answers
Substrate circuit is closed, including：The sandwich arrangement is using control circuit printing plate, microstrip line and power circuit printing plate
Three-decker, wherein, final stage wave control circuit on the control circuit printing plate is set, two-sided hang down is set on the microstrip line
Straight interconnection work(point/synthesize network, final stage power converting circuit is set on the power circuit printing plate,
The input terminal of the final stage wave control circuit is connected with the photoelectric conversion module inputted by optical fiber, with access control letter
Number and serial control data, distribute to the output of Digital Microwave power supply composite substrate circuit each branch, the final stage wave control circuit
Output terminal and Connectors for Active Phased Array Radar T/R components, to export control signal corresponding with T/R components；
The dual-sided perpendicular interconnection power division network is using strip resistance film strips line power division network and dual-sided perpendicular connection-transformation one
The design of body, total mouth are arranged in the right side of the Digital Microwave power supply composite substrate circuit, realize total mouth radiofrequency signal to each
The constant amplitude of a branch receives the complex functionality of signal with phase partitioning and each road；
The final stage power converting circuit includes a variety of DC power supply modular converters, converts input voltage into a variety of direct currents
Voltage output provides instantaneous power output supply final stage active circuit, while converts out the comprehensive feed of multiple power sources kind supply
The Digital circuit element of network in itself uses.
Further, the Digital Microwave power supply composite substrate circuit uses 18 layer circuit board structures, the control circuit print
Brush board is 8 layers, positioned at the 1st~8 layer；The microstrip line is 4 layers, positioned at the 9th~12 layer；The power circuit printing plate is
6 layers, positioned at the 13rd~18 layer, three layer circuit boards are compound using multilayer composite sheet lamination.
Further, the thickness after the Digital Microwave power supply composite substrate circuit pressing is 2.8 ± 0.1mm.
Further, the microstrip line uses 1:16 work(point/synthesis network, total mouth are arranged in the right side of composite plate, lead to
It crosses and top level control circuit printing plate turn on window is transformed to microstrip circuitry extraction, positive and negative each 8 work(point/synthesis network point
Mouth is staggeredly arranged in parallel, and passes through circuit board turn on window and realizes that vertical transition is drawn.
Further, middle layer is realized in the edge of the Digital Microwave power supply composite substrate circuit by metal hemming edge mode
The ground connection of microstrip line.
Further, the final stage wave control circuit and final stage power converting circuit, the output of each kind power supply and wave control signal
Mouth is configured at Digital Microwave power supply composite substrate circuit in a manner of the equidistant array arrangement of each 8 group of 21 core pad of tow sides
Top layer and bottom.
Further, each road voltage of the final stage power converting circuit output turns on and off sequence according to as follows：It is open-minded
Sequence is first powered up for low-voltage, and shutdown sequence is first turned off for high voltage.
Further, the dual-sided perpendicular interconnection work(divides/synthesizes network in micro-strip plate graph layer by the way that pcb layer is opened a window
Respectively there are a 8 tunnel microwave signal perpendicular interconnection interfaces in both sides above and below composite substrate, the interface using microwave elastomeric connector complete with
The perpendicular interconnection of T/R components.
The embodiment of the present invention also provides a kind of feeder means of Connectors for Active Phased Array Radar, the base provided including above-described embodiment
In Digital Microwave power supply composite substrate circuit, the multichannel T/R components of sandwich arrangement, wherein, the multichannel T/R component cloth
Office's mode is arranged side by side for levels, between the Digital Microwave power supply composite substrate circuit is embedded in two layers, to be interconnected with T/R components.
Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement according to embodiments of the present invention,
Beam-forming network, final stage wave control circuit and final stage power circuit is complete for one according to " sandwich " formula framework hybrid integrated
Composite substrate circuit, can significantly reduce space and the weight requirements of active phased array submatrix module, realize front light and small
Type.Large area of the present invention, the application MULTILAYER COMPOSITE substrate lamination of high integration, multichannel strip resistance film strips shape line width band
Power division network technology, laminate multichannel dual-sided perpendicular interconnection technique, miniaturization perpendicular connectors technology, by microwave, number, electricity
The a variety of circuits in source are integrated in one piece of composite substrate, are considerably reduced a variety of circuits and are occupied in phased array submatrix module is simulated
Volume and weight, so as to guarantee to greatly reduce the volume of radar complete machine, weight and manufacture cost.
The additional aspect of the present invention and advantage will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Significantly and it is readily appreciated that, wherein：
Fig. 1 is Digital Microwave power supply composite substrate circuit planes (front) schematic diagram according to the embodiment of the present invention；
Fig. 2 is the Digital Microwave power supply composite substrate circuit section schematic diagram according to the embodiment of the present invention；
Fig. 3 is according to the Digital Microwave power supply composite substrate circuit of the embodiment of the present invention and T/R component load connection signals
Figure.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
The present invention provides a kind of Digital Microwave power supply based on sandwich arrangement and meets substrate circuit and feeder means, simulates
The construction of integrated multifunction compound circuit in Connectors for Active Phased Array Radar in radio frequency receiving and transmitting front end and realization, and in particular to simulation has
The comprehensive integration design of the feed circuit of final stage wave control/power supply/microwave in the phased array module of source.The present invention is integrated mixed with one kind
Close circuit integrally substitute to active submatrix mould T/R components in the block provide respectively microwave power distribute/synthesize channel, power supply supply
With the circuit board of several standalone features of wave control input, the active submatrix module built based on the electric hybrid board circuit can be substantially
Reduce the volume of active phased array submatrix module, weight requirements in the prior art.
As depicted in figs. 1 and 2, the electricity of the Digital Microwave power supply composite substrate based on sandwich arrangement of the embodiment of the present invention
Road, including：Sandwich arrangement uses the three-decker of control circuit printing plate, microstrip line and power circuit printing plate, i.e.,
Architecture design is laminated in two media material " sandwich " formula of " printed board+strip line+printed board ".Wherein, control circuit is printed
Final stage wave control circuit on plate is set, dual-sided perpendicular is set to interconnect work(point/synthesis network, power circuit printing plate on microstrip line
Upper setting final stage power converting circuit.
In one embodiment of the invention, Digital Microwave power supply composite substrate circuit uses 18 layer circuit board structures, control
Circuit printing plate processed is 8 layers, positioned at the 1st~8 layer；Microstrip line (microwave circuit composite substrate) is 4 layers, positioned at the 9th~12
Layer；Power circuit printing plate is 6 layers, and positioned at the 13rd~18 layer, three layer circuit boards are compound using multilayer composite sheet lamination.
Preferably, the thickness after the pressing of Digital Microwave power supply composite substrate circuit is 2.8 ± 0.1mm.
That is, the embodiment of the present invention is somebody's turn to do the Digital Microwave power supply composite substrate circuit based on sandwich arrangement, being will be each
After the individually designed emulation of basic circuit schematic diagram of functional circuit, final stage wave control circuit is distributed in 8 layers of upper strata PCB circuitous patterns
In, the work(of microstrip line point/synthesis network microwave circuit is in the layout of in 4 layers of micro-strip plate figure of middle layer, final stage power supply electricity
Road is in the layout of in the PCB circuit layers of bottom 6 floor.
Specifically, the reception and distribution of analogue active phased-array radar T/R component wave control signals are realized based on fpga chip.
The input terminal of final stage wave control circuit is connected with the photoelectric conversion module inputted by optical fiber, with incoming control signal and Serial Control
Data are distributed to each branch output of Digital Microwave power supply composite substrate circuit, the output terminal of final stage wave control circuit and active phase
Battle array radar T/R components are controlled, to export control signal corresponding with T/R components, i.e. output signal is controlled with the T/R components docked and believed
Number demand corresponds to.In one embodiment of the invention, final stage wave control circuit can be according to the control signal that receives and serial
Control data are distributed to 16 branches and are exported.
In one embodiment of the invention, as shown in Fig. 2, final stage wave control circuit and final stage power converting circuit, each product
Kind power supply and the delivery outlet of wave control signal are configured at microwave in a manner of the equidistant array arrangement of each 8 group of 21 core pad of tow sides
The top layer and bottom of digital power composite substrate circuit, the adjacent two interfaces spacing 30mm in front, the projection of two adjacent mouth of positive and negative
Spacing 15mm.
Dual-sided perpendicular interconnection power division network interconnects work(point/synthesis network for X-band dual-sided perpendicular, using strip resistance film strips line
Power division network and the integrated design of dual-sided perpendicular connection-transformation, total mouth are arranged in the right side of Digital Microwave power supply composite substrate circuit
Side realizes that total mouth radiofrequency signal receives the complex functionality of signal to the constant amplitude of each branch with phase partitioning and each road.It is for example, double
The constant amplitude that face perpendicular interconnection power division network can complete total mouth radiofrequency signal to 16 branches receives letter with phase partitioning and 16 tunnels
Number complex functionality.
Specifically, microstrip line uses 1:16 work(point/synthesis network, total mouth are arranged in the right side of composite plate, pass through by
Top level control circuit printing plate pcb board turn on window is transformed to microstrip circuitry extraction, positive and negative each 8 work(point/synthesis network
Mouth is divided to be staggeredly arranged in parallel, passes through PCB circuit board turn on window and realizes that vertical transition is drawn.This layout designs can be with ingenious reality
The perpendicular interconnection of each road low frequency interface and radio frequency interface below small size is showed.
Using microstrip circuit layout as core in comprehensive design, number is reserved by adjusting 50 ohm of line lengths in microstrip circuit design
The FPGA vertical vias region of word circuit.The levels of strip line can be very good to realize shielding isolation in large area, multiple simultaneously
The ground connection of middle layer microstrip circuit is realized by metal hemming edge mode in the edge of plywood.
Dual-sided perpendicular interconnection work(point/synthesis network is in micro-strip plate graph layer by opening a window pcb layer on composite substrate
Respectively there are 8 tunnel microwave signal perpendicular interconnection interfaces in lower both sides, and the interface is complete using a kind of microwave elastomeric connector " Fuzz Button "
Into the perpendicular interconnection with T/R components.
Final stage power converting circuit includes a variety of DC power supply modular converters, converts input voltage into a variety of DC voltages
Output provides instantaneous power output supply final stage active circuit, while converts out the comprehensive feeding network of multiple power sources kind supply
The Digital circuit element of itself uses.
In one embodiment of the invention, final stage power converting circuit can be based on a variety of DC/DC modules by 48V voltages
Input is converted to the output of the multiple power sources such as 8V, ± 5V and provides instantaneous 1440W power outputs supply final stage active circuit, converts simultaneously
Go out the Digital circuit element of the various comprehensive feeding networks of power supply kind supply such as 3.3V, 1.8V, 1.2V in itself to use.End simultaneously
Level power supply translation circuit has over-voltage over-current protection and alarm function.
Specifically, each road voltage of final stage power converting circuit output turns on and off sequence according to as follows：Open sequence
It is first powered up for low-voltage, shutdown sequence is first turned off for high voltage.Final stage power converting circuit, for proof load end T/R components
Normal work, shutdown sequence is opened to each voltage can judge that powering order first adds for low-voltage, and shutdown sequence is high electricity
Pressure is first turned off, and has timing control delay protection function for improper power-off.
As shown in figure 3, the embodiment of the present invention also proposes a kind of feeder means of Connectors for Active Phased Array Radar, including above-mentioned implementation
Digital Microwave power supply composite substrate circuit, the multichannel T/R components based on sandwich arrangement that example provides.Wherein, based on Sanming City
The Digital Microwave power supply composite substrate circuit for controlling framework can be used in the active submatrix module for simulating phased array, multichannel T/R
Assembly layout mode is arranged side by side for levels, between Digital Microwave power supply composite substrate circuit is embedded in two layers, with mutual with T/R components
Even.
To sum up, the Digital Microwave power supply composite substrate circuit based on sandwich arrangement is based on 18 layers of composite substrate circuit
16 road X-band strip line perpendicular interconnection radio frequency power division networks of " printed board+strip line+printed board " framework Ji complete photoelectricity turn
It changes and the digital circuit of parallel control function, integrated large power supply transformation is that multichannel TR components carry out comprehensive feed
Composite multifunction circuit.
Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement according to embodiments of the present invention,
Beam-forming network, final stage wave control circuit and final stage power circuit is complete for one according to " sandwich " formula framework hybrid integrated
Composite substrate circuit, can significantly reduce space and the weight requirements of active phased array submatrix module, realize front light and small
Type.Large area of the present invention, the application MULTILAYER COMPOSITE substrate lamination of high integration, multichannel strip resistance film strips shape line width band
Power division network technology, laminate multichannel dual-sided perpendicular interconnection technique, miniaturization perpendicular connectors technology, by microwave, number, electricity
The a variety of circuits in source are integrated in one piece of composite substrate, are considerably reduced a variety of circuits and are occupied in phased array submatrix module is simulated
Volume and weight, so as to guarantee to greatly reduce the volume of radar complete machine, weight and manufacture cost.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment of the present invention or example.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiments or example in combine in an appropriate manner.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art are not departing from the principle of the present invention and objective
In the case of can make changes, modifications, substitutions and variations to the above described embodiments within the scope of the invention.The scope of the present invention
By appended claims and its equivalent limit.
Claims (9)
- A kind of 1. Digital Microwave power supply composite substrate circuit based on sandwich arrangement, which is characterized in that the sandwich arrangement Using the three-decker of control circuit printing plate, microstrip line and power circuit printing plate, wherein, the control circuit printing Final stage wave control circuit on plate is set, dual-sided perpendicular is set to interconnect work(point/synthesis network, the power supply electricity on the microstrip line Final stage power converting circuit is set on the printing plate of road,The input terminal of the final stage wave control circuit is connected with the photoelectric conversion module inputted by optical fiber, with incoming control signal and Serial control data is distributed to the output of Digital Microwave power supply composite substrate circuit each branch, the final stage wave control circuit it is defeated Outlet and Connectors for Active Phased Array Radar T/R components, to export control signal corresponding with T/R components；The dual-sided perpendicular interconnection power division network is integrated with dual-sided perpendicular connection-transformation using strip resistance film strips line power division network Design, total mouth is arranged in the right side of the Digital Microwave power supply composite substrate circuit, realizes total mouth radiofrequency signal to each The constant amplitude on road receives the complex functionality of signal with phase partitioning and each road；The final stage power converting circuit includes a variety of DC power supply modular converters, converts input voltage into a variety of DC voltages Output provides instantaneous power output supply final stage active circuit, while converts out the comprehensive feeding network of multiple power sources kind supply The Digital circuit element of itself uses.
- 2. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as described in claim 1, which is characterized in that institute Digital Microwave power supply composite substrate circuit is stated using 18 layer circuit board structures, the control circuit printing plate is 8 layers, positioned at the 1st ~8 layers；The microstrip line is 4 layers, positioned at the 9th~12 layer；The power circuit printing plate is 6 layers, positioned at the 13rd~18 Layer, three layer circuit boards are compound using multilayer composite sheet lamination.
- 3. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement, feature exist as claimed in claim 1 or 2 In the thickness after the Digital Microwave power supply composite substrate circuit pressing is 2.8 ± 0.1mm.
- 4. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as described in claim 1, which is characterized in that institute Microstrip line is stated using 1:16 work(point/synthesis network, total mouth is arranged in the right side of composite plate, by the way that top level control circuit is printed Brush board turn on window is transformed to microstrip circuitry extraction, and positive and negative each 8 work(point/synthesis network divides mouth to be staggeredly arranged in parallel, leads to Oversampling circuit plate turn on window realizes that vertical transition is drawn.
- 5. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as described in claim 1, which is characterized in that institute State Digital Microwave power supply composite substrate circuit edge realized by metal hemming edge mode middle layer microstrip line ground connection.
- 6. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as described in claim 1, which is characterized in thatThe delivery outlet of the final stage wave control circuit and final stage power converting circuit, each kind power supply and wave control signal is with tow sides The mode of each equidistant array arrangement of 8 group of 21 core pad is configured at the top layer and bottom of Digital Microwave power supply composite substrate circuit.
- 7. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as claimed in claim 6, which is characterized in that institute Each road voltage for stating the output of final stage power converting circuit turns on and off sequence according to as follows：Sequence is opened for low-voltage first to add Electricity, shutdown sequence are first turned off for high voltage.
- 8. the Digital Microwave power supply composite substrate circuit based on sandwich arrangement as described in claim 1, which is characterized in that institute Dual-sided perpendicular interconnection work(point/synthesis network is stated in micro-strip plate graph layer by by pcb layer windowing both sides above and below composite substrate Respectively there are 8 tunnel microwave signal perpendicular interconnection interfaces, which completes the perpendicular interconnection with T/R components using microwave elastomeric connector.
- 9. a kind of feeder means of Connectors for Active Phased Array Radar, which is characterized in that be based on including claim 1-8 any one of them Digital Microwave power supply composite substrate circuit, the multichannel T/R components of sandwich arrangement, wherein, the multichannel T/R assembly layouts Mode is arranged side by side for levels, between the Digital Microwave power supply composite substrate circuit is embedded in two layers, to be interconnected with T/R components.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711375989.4A CN108226870A (en) | 2017-12-19 | 2017-12-19 | Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711375989.4A CN108226870A (en) | 2017-12-19 | 2017-12-19 | Digital Microwave power supply composite substrate circuit and feeder means based on sandwich arrangement |
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| CN109586757A (en) * | 2018-12-14 | 2019-04-05 | 北京遥测技术研究所 | A kind of transmission duplex drive amplification power division network |
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| CN113437489A (en) * | 2021-06-07 | 2021-09-24 | 深圳市信维通信股份有限公司 | Ultra-wideband dielectric resonator antenna module and electronic equipment |
| CN114070349A (en) * | 2022-01-18 | 2022-02-18 | 成都雷电微力科技股份有限公司 | Double-frequency composite high-power brick type T/R assembly |
| CN114126209A (en) * | 2021-11-05 | 2022-03-01 | 中国电子科技集团公司第二十九研究所 | LTCC microwave multilayer combiner network based on vertical via holes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586757A (en) * | 2018-12-14 | 2019-04-05 | 北京遥测技术研究所 | A kind of transmission duplex drive amplification power division network |
| CN110323561A (en) * | 2019-06-20 | 2019-10-11 | 成都天锐星通科技有限公司 | A kind of printed circuit board integrating a variety of radio-frequency modules and production method |
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| CN114126209A (en) * | 2021-11-05 | 2022-03-01 | 中国电子科技集团公司第二十九研究所 | LTCC microwave multilayer combiner network based on vertical via holes |
| CN114126209B (en) * | 2021-11-05 | 2023-12-01 | 中国电子科技集团公司第二十九研究所 | LTCC microwave multilayer road network based on vertical via holes |
| CN114070349A (en) * | 2022-01-18 | 2022-02-18 | 成都雷电微力科技股份有限公司 | Double-frequency composite high-power brick type T/R assembly |
| CN114070349B (en) * | 2022-01-18 | 2022-04-12 | 成都雷电微力科技股份有限公司 | Double-frequency composite high-power brick type T/R assembly |
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