CN108215008A - A kind of electronic component mounting base mold - Google Patents
A kind of electronic component mounting base mold Download PDFInfo
- Publication number
- CN108215008A CN108215008A CN201711354223.8A CN201711354223A CN108215008A CN 108215008 A CN108215008 A CN 108215008A CN 201711354223 A CN201711354223 A CN 201711354223A CN 108215008 A CN108215008 A CN 108215008A
- Authority
- CN
- China
- Prior art keywords
- workbench
- mounting base
- electronic component
- component mounting
- base mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of electronic component mounting base mold, the electronic component mounting base mold includes:Bottom plate;Workbench, the workbench are arranged on the upper surface of bottom plate, and the workbench section is isosceles trapezoid, and the inclined-plane of the workbench both sides has upwardly extended reinforcement support panel, and the both sides of the workbench are respectively equipped with several radiating grooves;Several baffles, these baffles are even away from the upper surface for being arranged on workbench respectively, and are connect respectively with strengthening support panel positioned at the baffle of the leftmost side and the rightmost side;Several spacing blocks, it is often even away from equipped at least two spacer blocks between two neighboring baffle.Integral strength of the present invention is high, can be adapted to fit the electronic component of various weight.Present invention mounting base after molding is unlikely to deform, and integral strength is high.
Description
Technical field
The present invention relates to a kind of mounting bases, and in particular to a kind of electronic component mounting base mold.
Background technology
The existing electronic component mounting base mold generally rectangular cross-section shape of electronic component mounting base after molding, is internally provided with
If that forming tank, electronic component are placed in forming tank.This mounting base is yielding, and integral strength is not high.
Invention content
The present invention to solve the above-mentioned problems, so as to provide a kind of electronic component mounting base mold.
In order to achieve the above objectives, technical scheme is as follows:
A kind of electronic component mounting base mold, the electronic component mounting base mold include:
Bottom plate;
Workbench, the workbench are arranged on the upper surface of bottom plate, and the workbench section is isosceles trapezoid, the molding
The inclined-plane of platform both sides has upwardly extended reinforcement support panel, and the both sides of the workbench are respectively equipped with several radiating grooves;
Several baffles, these baffles are even away from the upper surface for being arranged on workbench respectively, and positioned at the leftmost side and the rightmost side
Baffle respectively with strengthen support panel connect;
Several spacing blocks, it is often even away from equipped at least two spacer blocks between two neighboring baffle.
In a preferred embodiment of the invention, the baffle section is isosceles trapezoid.
In a preferred embodiment of the invention, the spacing block is rectangular-shaped.
The beneficial effects of the invention are as follows:
Present invention mounting base after molding is unlikely to deform, and integral strength is high.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural diagram of the present invention;
Fig. 2 is the side view of the present invention.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Conjunction is specifically illustrating, and the present invention is further explained.
Referring to Fig. 1 and Fig. 2, electronic component mounting base mold provided by the invention, including bottom plate 100, workbench 200,
Several baffles 300 and several spacing blocks 400.
Bottom plate 100, is a rectangular panel, and workbench 200 can be placed in the upper surface of bottom plate 100, can improve molding
The integral strength of platform 200.
In addition, being equipped with several wavy heat sink strips in the bottom surface of bottom plate 100, heat sink strip can improve dissipating for bottom plate 100
The thermal efficiency, and can also improve the non-skid property of bottom plate 100.
The section of workbench 200 in the application is isosceles trapezoid, and is upwardly extended on the inclined-plane of 200 both sides of workbench
There is molding panel 210, the section of electronic component mounting base after molding so is also isosceles trapezoid, relative to rectangular cross-section
Electronic component mounting base is greatly improved support strength so that electronic component mounting base is unlikely to deform.
In addition, being respectively equipped with several radiating grooves 220 on the side of 200 both sides of workbench, radiating groove 220 can be further
Improve the radiating efficiency of workbench 200.
Several baffles 300, these baffles 300 are used to form the baffle of electronic component mounting base, these baffles 300 are can
The upper surface of workbench 200 is divided into several independent installation regions.
These baffles 300 are arranged on the upper surface of workbench 200, and the baffle 300 positioned at the leftmost side and the rightmost side is distinguished
It is set up directly on molding panel 210, the section of these baffles 300 is also isosceles trapezoid.
Several spacing blocks 400, these spacing blocks 400 respectively it is even away from two neighboring baffle 300 is arranged between, spacing block
400 be for each installation region that baffle 300 separates being separated again so as to form several forming tanks 410, these into
Type groove 410 can form the resettlement groove of electronic component mounting base, and electronic component can be placed in resettlement groove.
In addition, the end due to some automotive components is pointed, when automotive components are placed in resettlement groove after molding,
Since the section of baffle after molding is isosceles trapezoid, the tip of such automotive components is easily by the inclined-plane crimp of baffle.
The application is respectively equipped with the reinforcement block 411 of two parallelogram like by the both sides in each forming tank 410,
Inclined-plane of the side of reinforcement block 411 just with baffle 300 is bonded, each resettlement groove of the electronic component mounting base after being formed in this way
There are reinforcement block in interior both sides, and reinforcement block can prevent automotive components from damaging baffle by pressure.
For the ease of electronic component mounting base after molding is directly taken out out of electronic component mounting base mold, positioned at
Several spill spin blocks 310 are respectively equipped on the baffle 300 of the leftmost side and the rightmost side, are specifically internally provided with resettlement groove in baffle 300,
Shaft is equipped in resettlement groove, spill spin block 310 is arranged on the end of shaft, need to only give in electronic component mounting base in-mold molding
Electronic component mounting base one afterwards slightly upwards put forward power, electronic component mounting base after molding can be rapidly from electronics member
It is popped up in part mounting base mold.
The basic principles, main features and the advantages of the invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. a kind of electronic component mounting base mold, which is characterized in that the electronic component mounting base mold includes:
Bottom plate;
Workbench, the workbench are arranged on the upper surface of bottom plate, and the workbench section is isosceles trapezoid, the workbench two
The inclined-plane of side has upwardly extended reinforcement support panel, and the both sides of the workbench are respectively equipped with several radiating grooves;
Several baffles, these baffles are even away from the upper surface for being arranged on workbench respectively, and positioned at the gear of the leftmost side and the rightmost side
Plate is connect respectively with strengthening support panel;
Several spacing blocks, it is often even away from equipped at least two spacer blocks between two neighboring baffle.
2. a kind of electronic component mounting base mold according to claim 1, which is characterized in that the baffle section is isosceles
It is trapezoidal.
3. a kind of electronic component mounting base mold according to claim 1, which is characterized in that the spacing block is rectangle
Shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711354223.8A CN108215008A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic component mounting base mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711354223.8A CN108215008A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic component mounting base mold |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108215008A true CN108215008A (en) | 2018-06-29 |
Family
ID=62652210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711354223.8A Pending CN108215008A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic component mounting base mold |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108215008A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103359386A (en) * | 2012-03-26 | 2013-10-23 | 深圳欧菲光科技股份有限公司 | Touch screen package box and production method thereof |
CN207599261U (en) * | 2017-11-29 | 2018-07-10 | 上海隆利安包装材料有限公司 | A kind of electronic component mounting base |
-
2017
- 2017-12-15 CN CN201711354223.8A patent/CN108215008A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103359386A (en) * | 2012-03-26 | 2013-10-23 | 深圳欧菲光科技股份有限公司 | Touch screen package box and production method thereof |
CN207599261U (en) * | 2017-11-29 | 2018-07-10 | 上海隆利安包装材料有限公司 | A kind of electronic component mounting base |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |
|
RJ01 | Rejection of invention patent application after publication |