CN108203762A - Method for efficiently decomposing and leaching precious metal gold in waste circuit board - Google Patents
Method for efficiently decomposing and leaching precious metal gold in waste circuit board Download PDFInfo
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- CN108203762A CN108203762A CN201611215115.8A CN201611215115A CN108203762A CN 108203762 A CN108203762 A CN 108203762A CN 201611215115 A CN201611215115 A CN 201611215115A CN 108203762 A CN108203762 A CN 108203762A
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- circuit board
- printed circuit
- mno
- waste printed
- metal
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- 239000002699 waste material Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 47
- 239000010931 gold Substances 0.000 title claims abstract description 30
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 15
- 238000002386 leaching Methods 0.000 title abstract description 18
- 239000010970 precious metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000000843 powder Substances 0.000 claims abstract description 25
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Inorganic materials O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 17
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 16
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 11
- 239000007853 buffer solution Substances 0.000 claims abstract description 10
- 238000000926 separation method Methods 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000706 filtrate Substances 0.000 claims abstract description 9
- 238000001914 filtration Methods 0.000 claims abstract description 8
- 239000011780 sodium chloride Substances 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 8
- 230000036647 reaction Effects 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 239000011572 manganese Substances 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims description 2
- ZWXOQTHCXRZUJP-UHFFFAOYSA-N manganese(2+);manganese(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Mn+2].[Mn+3].[Mn+3] ZWXOQTHCXRZUJP-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- CQWQOMUKOFWOMW-UHFFFAOYSA-L [C+4].C([O-])([O-])=O.[Na+] Chemical compound [C+4].C([O-])([O-])=O.[Na+] CQWQOMUKOFWOMW-UHFFFAOYSA-L 0.000 claims 1
- VSFYIPJGGXNVQM-UHFFFAOYSA-M azanium sodium hydrogen carbonate Chemical compound [NH4+].[Na+].OC([O-])=O.OC([O-])=O VSFYIPJGGXNVQM-UHFFFAOYSA-M 0.000 claims 1
- YXIZUXGMHQUZQH-UHFFFAOYSA-N diazanium hydrogen carbonate Chemical compound [NH4+].[NH4+].OC([O-])=O.OC([O-])=O YXIZUXGMHQUZQH-UHFFFAOYSA-N 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- DBCAVMLQRAABFF-UHFFFAOYSA-M potassium;carbonic acid;hydrogen carbonate Chemical compound [K+].OC(O)=O.OC([O-])=O DBCAVMLQRAABFF-UHFFFAOYSA-M 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 abstract description 9
- 239000000243 solution Substances 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000009854 hydrometallurgy Methods 0.000 abstract description 2
- 238000004537 pulping Methods 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000011084 recovery Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000004064 recycling Methods 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000011017 operating method Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- -1 ferrous metals Chemical class 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000009853 pyrometallurgy Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a method for efficiently decomposing and leaching precious metal gold in a waste circuit board, which belongs to the technical field of hydrometallurgy process and comprises the following steps: (1) crushing and reselecting the waste circuit board to obtain waste circuit board polymetallic powder; (2) with H2SO4‑MnO2The reaction system carries out pretreatment on the multi-metal powder of the waste circuit board to control H2SO42-6 mol/L, waste circuit board multi-metal powder and MnO2The mass ratio is 0.25-0.5: 1, the liquid-solid mass ratio (L/S) is 3-10: 1, stirring and reacting for 120-240 min at 50-90 ℃, filtering and separating to obtain filtrate and filter residue, (3) the filter residue is put into an electrolytic cell, water is added into the electrolytic cell for pulping, and under the conditions that the NaCl concentration is 2-5 mol/L, the cell voltage is 3-5V, and the L/S is 20-25, the CO is added into the electrolytic cell for pulping3 2‑‑HCO3 ‑Stirring and electrolyzing the mixture in a buffer system (with the pH value of 8.5-9.5) at the temperature of 25-35 ℃ for 150-300 min; (4) and after the electrolytic reaction is finished, carrying out solid-liquid separation to obtain an Au leaching solution. The method has the characteristics of mild conditions, low energy consumption, simple process, high Au leaching rate and the like, and realizes the selective decomposition leaching of the noble metal Au in the all-wet process step.
Description
Technical field
Technical field belonging to the present invention is hydrometallurgical processes process, relates generally to a kind of efficient-decomposition and leaches discarded electricity
The method of noble metal gold in the plate of road.
Background technology
Basis of the printed circuit board as electronics industry is indispensable important component in each electronic product,
Since electronics and the update of information industry product are very fast, lead to the quantity ten of the discarded printed circuit boards generated therewith
Divide huge.Not only containing a large amount of base metal, such as copper, aluminium, lead, tin, iron in waste printed circuit board, while also there are a certain amount of
Noble metal, such as gold, silver, palladium, platinum.According to surveying and determination, the grade for metal being contained in waste printed circuit board is tens times of native deposits
Even hundred times, and the content of metal is up to more than 40%, it is seen then that contain a large amount of valuable non-ferrous metal in waste printed circuit board
Resource, recovery value are far above general municipal garbage, are one important " city mines ".With the quick hair of China's economy
Exhibition, the demand to various resources is increasing, and in the case where high-quality mineral resources are reduced increasingly, rational exploitation and utilization discards electricity
Road plate resource, economic recovery valuable metal resource therein become realize national strategic aim there is an urgent need to, for alleviate
The safety of China's ore resource imbalance between supply and demand and guarantee China's non-ferrous metals industry economy is of great significance.
In recent years, the recovery process for valuable metal in waste printed circuit board is broadly divided into pyrogenic process recycling and hydrometallurgic recovery two
Major class.
Pyrometallurgy has as the technology for being applied to extract metal earliest from electron wastes, at present main technique
Burn dissolving-out process, high-temperature oxydation smelting technology, scum silica frost technology, electric arc furnaces sintering process, microwave heating recovery process etc..Patent
CN1099329C discloses a kind of method that waste printed circuit board is handled using molten state inorganic salts as heating agent.This method had been pyrolyzed
Broken stirring is kept in journey, copper foil is made to be removed from circuit board, and separable glass fibre and other materials, but this method does not solve
Certainly pyrolysis gas pollution problem.Patent CN101423898A discloses one kind by carrying out heating centrifugation to waste printed circuit board
The method for recycling scolding tin, waste printed circuit board is placed in heating in oil bath by this method makes melts soldering tin, then, pass through whizzer
Scolding tin is efficiently separated from waste printed circuit board.Patent CN105274358A discloses a kind of Diversity fused salt caustic fusion and returns
The method for receiving tin in waste printed circuit board powder, this method after mixing, add waste printed circuit board powder and polynary alkaline medium
Heat to 100~300 DEG C, be passed through oxygen carry out 30~100min of melting, water logging is added to go out obtained smelted product, filter to get
To the leachate rich in tin metal, then heating evaporation crystallization, be filtered, washed to get sodium stannate product.
Due to fire reduction technology there is high energy consumption, exhaust environment is seriously polluted the problems such as, waste printed circuit board in recent years
The Research Emphasis of application technology as the second resource is increasingly turned to wet recycling process.It is useless that patent CN104745824A discloses a kind of recycling
The method of copper in circuit board, this method useless circuit board is broken into first it is powdered, by powder, ammonia spirit, ammonium chloride solution
It is sufficiently mixed with water and is prepared into ore pulp, air is passed through in ore pulp, carry out intensified by ultrasonic wave leaching under agitation；Strengthening
Hydrogen peroxide is periodically added in leaching process, copper in useless circuit board is leached after 1h is leached with this, copper in useless circuit board
Leaching rate is up to more than 98%.United States Patent (USP) US20120318681A1 discloses a kind of greening and recycles discarded electricity without cyanogen wet processing
The technique of road plate, the technique is using the metal in Physical separation waste printed circuit board and metallic copper powder casting that is nonmetallic, obtaining
Electrorefining after anode is caused, then noble metal is recycled from the earth of positive pole, physical separation is required in this method high.Patent
The method that CN101864519A discloses valuable metal in a kind of hydrometallurgic recovery waste printed circuit board, this method will be in waste printed circuit boards
Metalliferous material be dissolved in strong acid or other reagents, then from solution extract valuable metal substance, chemical method have it is at low cost,
The features such as purity of recycling metal is high.However, this method is low to the leaching efficiency of part metals, while chemical method will consume largely
Chemical reagent, while generate largely containing waste liquid and the waste residue being corrosive with toxicity and heavy metal, easily cause secondary pollution.
In conclusion in waste printed circuit board during the synthetical recovery of valuable metal, the efficient green point of valuable metal
It is key technology that solution, which leaches,.There is one in varying degrees in decomposition efficiency, isolation and cost etc. for existing method
A little insufficient and problems need to research and develop the new process that valuable metal element recycles in more efficient waste printed circuit board, with full
The active demand of sufficient China's nonferrous production.
Invention content
The object of the present invention is to provide the method that noble metal gold efficient-decomposition in a kind of waste printed circuit board leaches, this method tools
There is the effect that adaptable, simple for process, easy to operate, reaction condition is mild, the golden decomposition leaching efficiency of noble metal is high.
The method that noble metal gold efficient-decomposition leaches in a kind of waste printed circuit board of the present invention, includes the following steps：
(1) waste printed circuit board crushed, the more metal powders of waste printed circuit board obtained after gravity treatment, and more metal powders are continued
It is crushed to less than 100 mesh；
(2) the more metal powders for obtaining (1) step are in H2SO4-MnO2It is pre-processed in reaction system, controls H2SO4
A concentration of 2~6mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.25~0.5: 1, and liquid consolidates mass ratio (L/S)
It is 3~10: 1, after being stirred to react 120~240min at 50~90 DEG C, is separated by filtration to obtain filtrate and filter residue, filtrate can be in copper
It is recycled after ion recycling as solvent；
(3) filter residue that (2) step obtains is fitted into electrolytic cell, adds water slurrying, NaCl concentration be 2~5mol/L, slot
Under conditions of voltage 3~5V, L/S are 20~25, in CO3 2--HCO3 -In buffer system (pH value 8.5~9.5) at 25~35 DEG C
150~300min of stirring electrolysis；
(4) Au leachates are obtained after cell reaction, after separation of solid and liquid.
It is golden for the noble metal in enrichment waste printed circuit board in the present invention, using H2SO4-MnO2Reaction system is to discarding circuit
Plate is pre-processed, to remove the base metal in circuit board.
In the present invention, to reduce production cost, the MnO2Including pyrolusite, psilomelane, hausmannite, braunite, electricity
It is MnO to solve the main components such as Manganese anode slime, oceanic multi-metal manganese nodule or useless manganese oxide catalyst2Mineral.
In the present invention, the decomposition leaching process of noble metal gold is in CO in waste printed circuit board3 2--HCO3 -It is carried out under buffer system,
The decomposition leaching process is carried out in weak basic condition, the largely waste liquid containing strong acid and foreign metal ion will not be generated, to follow-up
Purification run influences smaller.
The decomposition that the method that the present invention uses can be achieved with noble metal gold in waste printed circuit board at a lower temperature is leached,
Have many advantages, such as that low energy consumption, simple for process, easy to operate, leaching rate is high.
Description of the drawings
Fig. 1 is the process flow chart of the present invention
Specific embodiment
The present invention is further illustrated by the following example, but is not restricted by the embodiments.All percentages in embodiment
Unless otherwise specified number refers both to mass percent.
Embodiment 1
Waste printed circuit board is derived from Nanjing Electronics Factory in the present invention, and institute is much through broken, after sorting for waste printed circuit board
Metal powder sieves with 100 mesh sieve.Noble metal gold decomposes extract technology flow as shown in Figure 1, operating procedure is as follows in waste printed circuit board：
(1) in closed reactor, by more metal powders in H2SO4-MnO2It is pre-processed, is controlled in reaction system
H2SO4A concentration of 3mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.5: 1, and it is 5 that liquid, which consolidates mass ratio (L/S):
1, after being stirred to react 200min at 90 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(2) will filter gained filter residue is fitted into electrolytic cell, add water slurrying, NaCl concentration be 3mol/L, tank voltage 5V,
Under conditions of L/S is 20, in CO3 2--HCO3 -Stirring is electrolysed 300min at 30 DEG C in buffer system (pH value 8.5~9.5)；
(3) Au leachates are obtained after cell reaction, after separation of solid and liquid, the leaching rate of Au is up to 95.78%.
Embodiment 2
Waste printed circuit board is same as Example 1, and noble metal gold decomposes extract technology flow such as Fig. 1 institutes in waste printed circuit board
Show, operating procedure is as follows：
(1) in closed reactor, by more metal powders in H2SO4-MnO2It is pre-processed, is controlled in reaction system
H2SO4A concentration of 5mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.5: 1, and it is 8 that liquid, which consolidates mass ratio (L/S):
1, after being stirred to react 160min at 70 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(2) will filter gained filter residue is fitted into electrolytic cell, add water slurrying, NaCl concentration be 2mol/L, tank voltage 3V,
Under conditions of L/S is 25, in CO3 2--HCO3 -Stirring is electrolysed 300min at 25 DEG C in buffer system (pH value 8.5~9.5)；
(3) Au leachates are obtained after cell reaction, after separation of solid and liquid, the leaching rate of Au is up to 89.56%.
Embodiment 3
Waste printed circuit board is same as Example 1, and noble metal gold decomposes extract technology flow such as Fig. 1 institutes in waste printed circuit board
Show, operating procedure is as follows：
(1) in closed reactor, by more metal powders in H2SO4-MnO2It is pre-processed, is controlled in reaction system
H2SO4A concentration of 3mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.5: 1, and it is 5 that liquid, which consolidates mass ratio (L/S):
1, after being stirred to react 240min at 90 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(2) will filter gained filter residue is fitted into electrolytic cell, add water slurrying, NaCl concentration be 4mol/L, tank voltage 4V,
Under conditions of L/S is 25, in CO3 2--HCO3 -Stirring is electrolysed 300min at 25 DEG C in buffer system (pH value 8.5~9.5)；
(3) Au leachates are obtained after cell reaction, after separation of solid and liquid, the leaching rate of Au is up to 94.26%.
Embodiment 4
Waste printed circuit board is derived from Hubei Wuhan Electronics Factory in this example, and waste printed circuit board is through broken, and institute is much golden after sorting
Belong to powder to sieve with 100 mesh sieve.Noble metal gold decomposes extract technology flow as shown in Figure 1, operating procedure is as follows in waste printed circuit board：
(1) in closed reactor, by more metal powders in H2SO4-MnO2It is pre-processed, is controlled in reaction system
H2SO4A concentration of 5mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.5: 1, and it is 5 that liquid, which consolidates mass ratio (L/S):
1, after being stirred to react 240min at 90 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(2) will filter gained filter residue is fitted into electrolytic cell, add water slurrying, NaCl concentration be 4mol/L, tank voltage 4V,
Under conditions of L/S is 20, in CO3 2--HCO3 -Stirring is electrolysed 300min at 25 DEG C in buffer system (pH value 8.5~9.5)；
(3) Au leachates are obtained after cell reaction, after separation of solid and liquid, the leaching rate of Au is up to 91.54%.
Embodiment 5
Waste printed circuit board is same as Example 4, and noble metal gold decomposes extract technology flow such as Fig. 1 institutes in waste printed circuit board
Show, operating procedure is as follows：
(1) in closed reactor, by more metal powders in H2SO4-MnO2It is pre-processed, is controlled in reaction system
H2SO4A concentration of 4mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.3: 1, and it is 6 that liquid, which consolidates mass ratio (L/S):
1, after being stirred to react 200min at 90 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(2) will filter gained filter residue is fitted into electrolytic cell, add water slurrying, NaCl concentration be 4mol/L, tank voltage 4V,
Under conditions of L/S is 20, in CO3 2--HCO3 -Stirring is electrolysed 240min at 30 DEG C in buffer system (pH value 8.5~9.5)；
(3) Au leachates are obtained after cell reaction, after separation of solid and liquid, the leaching rate of Au is up to 96.36%.
Embodiment of above is merely to illustrate the present invention rather than limitation of the present invention.Although with reference to embodiment to this hair
It is bright to be described in detail, it will be understood by those of ordinary skill in the art that, to technical scheme of the present invention carry out it is various combination,
Modification or equivalent replacement, without departure from the spirit and scope of technical solution of the present invention, the right that should all cover in the present invention is wanted
It asks in range.
Claims (4)
1. a kind of method that noble metal gold efficient-decomposition leaches in waste printed circuit board, it is characterised in that：Include the following steps：
(1) waste printed circuit board is crushed, the more metal powders of waste printed circuit board is obtained after gravity treatment；
(2) the more metal powders for obtaining (1) step are in H2SO4-MnO2It is pre-processed in reaction system, controls H2SO4Concentration
For 2~6mol/L, the more metal powders of waste printed circuit board and MnO2Mass ratio is 0.25~0.5: 1, and it is 3 that liquid, which consolidates mass ratio (L/S),
~10: 1, after being stirred to react 120~240min at 50~90 DEG C, it is separated by filtration to obtain filtrate and filter residue；
(3) filter residue that (2) step obtains is fitted into electrolytic cell, adds water slurrying, NaCl concentration be 2~5mol/L, tank voltage 3
Under conditions of~5V, L/S are 20~25, in CO3 2--HCO3 -It is stirred at 25~35 DEG C in buffer system (pH value 8.5~9.5)
It is electrolysed 150~300min；
(4) Au leachates are obtained after cell reaction, after separation of solid and liquid.
2. according to the method described in claim 1, it is characterized in that：MnO in claim 1 described in (1) step2Including soft manganese
Ore deposit, psilomelane, hausmannite, braunite, electrolytic manganese anode mud, oceanic multi-metal manganese nodule or useless manganese oxide catalyst etc. mainly into
It is divided into MnO2Product.
3. according to the method described in claim 1, it is characterized in that：The electrolytic cell is undivided cell.
4. according to the method described in claim 1, it is characterized in that：The CO3 2--HCO3 -Buffer system includes sodium carbonate-carbon
The combinations such as sour hydrogen sodium, ammonium carbonate-ammonium hydrogen carbonate, potassium carbonate-bicarbonate, ammonium carbonate-sodium bicarbonate.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117887977A (en) * | 2024-01-12 | 2024-04-16 | 武汉理工大学 | Method for selectively leaching Au and Ag in electronic waste step by electrochemical oxidation |
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| CN1858277A (en) * | 2006-05-25 | 2006-11-08 | 东华大学 | Method for extracting metal from printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117887977A (en) * | 2024-01-12 | 2024-04-16 | 武汉理工大学 | Method for selectively leaching Au and Ag in electronic waste step by electrochemical oxidation |
| CN117887977B (en) * | 2024-01-12 | 2024-10-18 | 武汉理工大学 | Method for selectively leaching Au and Ag in electronic waste step by electrochemical oxidation |
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