CN108193184A - Integral type cathode cover board control panel - Google Patents
Integral type cathode cover board control panel Download PDFInfo
- Publication number
- CN108193184A CN108193184A CN201810187721.6A CN201810187721A CN108193184A CN 108193184 A CN108193184 A CN 108193184A CN 201810187721 A CN201810187721 A CN 201810187721A CN 108193184 A CN108193184 A CN 108193184A
- Authority
- CN
- China
- Prior art keywords
- cover board
- fast
- interface
- cathode cover
- integral type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000498 cooling water Substances 0.000 claims abstract description 29
- 238000004891 communication Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000007789 gas Substances 0.000 claims description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to cathode plants technical field, specifically integral type cathode cover board control panel includes：Panel backboard, monitor, cooling water fast joint, process gas fast joint, communication interface, the fast interface of control and the fast interface of high pressure, integral type cathode cover board control panel provided in an embodiment of the present invention, it will be on each external connection terminal organic concentration to one piece of panel of magnetic control sputtering cathode cover board, facilitate the inspection in production process, and make complicated cathode cover board simplicity to greatest extent；Total interface is all using inserting type interface, simplify the handling steps of the cathode cover board in checking process of beginning to speak, communication interface and control interface are separately handled to the stability for ensureing system communication to greatest extent simultaneously, the present invention in external connecting pin active set and can will carry out the integrated control panel of subregion, it is simple in structure, reasonable design.
Description
Technical field
The present invention relates to the integral type cathode cover board control panels in vacuum magnetron sputtering coating film cavity, belong to cathode plants
Technical field.
Background technology
Vacuum magnetic-control sputtering cathode is by the components group such as target, control system, communication system, cooling water, gas circuit, high-tension circuit
Into these components can be connected by a large amount of external connection, and perhaps multipart connecting pin is wherein integrated in cathode cover board, causes to cover
Plate external linkage is unordered, not only makes it difficult to arrange, and is unfavorable for the heat dissipation of connecting pin, is especially detrimental to different supplier's groups
Into being difficult to reach an agreement.
Between the connecting pin of current cathode cover board different function without apparent subregion, each external connection terminal dispersion is miscellaneous
Disorderly, cause connecting pin unstable, increase the complexity of repair and repair probability, reduce the work longevity of vacuum magnetic-control sputtering cathode
Life.
Therefore, in external connecting pin active set and the integrated integral type cathode lid of subregion will can be carried out there is an urgent need for a kind of
Plate control panel.
Invention content
It in external connecting pin active set and can will be carried out in order to solve the above technical problem, the present invention provides a kind of
The integrated integral type cathode cover board control panel of subregion, simple to install understand that panel control is safe.
Technical scheme is as follows：
Integral type cathode cover board control panel includes：Panel backboard, monitor, cooling water fast joint, process gas connect soon
Head, communication interface, the fast interface of control and the fast interface of high pressure, cooling water fast joint are arranged on the panel backboard leftmost side, technique
Gas fast joint is arranged on the rightmost side of panel backboard, and monitor is arranged on the centre position of panel backboard upper end, monitor bottom
End is followed successively by communication interface, the fast grafting of control and the fast interface of high pressure, monitor, communication interface, the fast grafting of control from left to right
And there is gap between the fast interface of high pressure.
Cooling water fast joint is copper Aviation Connector.
Process gas fast joint includes argon gas fast joint, oxygen fast joint, nitrogen connector fast joint and spare fast joint.
Cooling water fast joint is vertically equipped at least two cooling water fast joint.
Panel backboard top is equipped with the protrusion of isosceles trapezoidal structure, and circular through hole is equipped among protrusion.
The tip side of cooling water fast joint is equipped with sealing ring, and the sealing ring is expanded rubber circle.
The tip side of the fast interface of high pressure is equipped with insulation ring layer, and the insulation ring layer is coated on the appearance of the fast interface of high pressure
Face.
Communication interface is equipped with the spring fastener of inverse Ba type, and the spring fastener is elastic construction.
Panel back plate surface is equipped with plated film.
Panel back plate edges are equipped with fixing end, the fixing end and the angled difference of plane where panel backboard, the angle
In the range of 30 ° -45 ° ranging from clockwise of difference, the fixing end is equipped with through-hole, and the through-hole and fastening screw are mating.
By above technical scheme as it can be seen that integral type cathode cover board control panel provided in an embodiment of the present invention, magnetic control is splashed
It penetrates on each external connection terminal organic concentration to one piece of panel of cathode cover board, facilitates the inspection in production process, and maximum limit
Degree makes complicated cathode cover board simplicity；Total interface all using inserting type interface, is simplified in checking process of beginning to speak
The handling steps of cathode cover board, while communication interface and control interface are separately handled to the stabilization for ensureing system communication to greatest extent
Property, the present invention in external connecting pin active set and can will carry out the integrated control panel of subregion, and simple in structure, design is closed
Reason.
Description of the drawings
Fig. 1 is the structure diagram of integral type cathode cover board control panel of the present invention；
Wherein：1st, panel backboard；2nd, cooling water fast joint；3rd, monitor；4th, process gas fast joint；5th, the fast grafting of high pressure
Mouthful；6th, fast interface is controlled；7th, communication interface.
Specific embodiment
Technical scheme of the present invention is specifically addressed below, it should be pointed out that technical scheme of the present invention is unlimited
In the embodiment described in embodiment, those skilled in the art's reference and the content for using for reference technical solution of the present invention, in this hair
The improvement and design carried out on the basis of bright, should belong to the scope of protection of the present invention.
Embodiment one：
Integral type cathode cover board control panel includes：Panel backboard 1, monitor 3, cooling water fast joint 2, process gas are fast
Connector 4, communication interface 7, the fast interface 6 of control and the fast interface 5 of high pressure, it is most left that cooling water fast joint 2 is arranged on panel backboard 1
Side, process gas fast joint 4 are arranged on the rightmost side of panel backboard 1, and monitor 3 is arranged on the interposition of 1 upper end of panel backboard
It puts, 3 bottom end of monitor is followed successively by communication interface 7, the fast grafting of control and the fast interface 5 of high pressure from left to right, effectively by each function
Interface integration forms integral structure, monitor 3, communication interface 7, the fast grafting of control and the fast grafting of high pressure on panel backboard 1
There is gap between mouth 5, spacing is the bigger the better in the range of 1 resulting structure of panel backboard, facilitates worker's extrapolation connecting pin, and communication connects
Mouth 7 prevents signal interference, the working condition of viewing surface backboard plate 1 is convenient in the setting of monitor 3 with fast interface 6 is controlled to detach.
Cooling water fast joint 2 is copper Aviation Connector, the feelings that cooling water overflows when effectively reducing plug cooling water fast joint 2
Condition.
Process gas fast joint 4 includes argon gas fast joint, oxygen fast joint, nitrogen connector fast joint and spare fast joint.
Cooling water fast joint 2 is vertically equipped at least two cooling water fast joint 2.
1 top of panel backboard is equipped with the protrusion of isosceles trapezoidal structure, and circular through hole is equipped among protrusion.
The tip side of cooling water fast joint 2 is equipped with sealing ring, and the sealing ring is expanded rubber circle.
The tip side of the fast interface 5 of high pressure is equipped with insulation ring layer, and the insulation ring layer is coated on the outer of the fast interface 5 of high pressure
Surface.
Communication interface 7 is equipped with the spring fastener of inverse Ba type, and the spring fastener is elastic construction.
1 surface of panel backboard is equipped with plated film.
1 edge of panel backboard is equipped with fixing end, the fixing end and the 1 angled difference of place plane of panel backboard, the angle
In the range of 30 ° -45 ° ranging from clockwise of degree difference, the fixing end is equipped with through-hole, and the through-hole and fastening screw are mating,
Installing and dismounting and current check is facilitated to safeguard.
Embodiment two：
On the basis of the first above-mentioned inventive embodiments, it is further improved：
Integral type cathode cover board control panel, including：Panel backboard 1, monitor 3, cooling water fast joint 2, process gas
Fast joint 4, communication interface 7, the fast interface 6 of control and the fast interface 5 of high pressure, cooling water fast joint 2 are arranged on panel backboard 1 most
Left side, process gas fast joint 4 are arranged on the rightmost side of panel backboard 1, and monitor 3 is arranged on the centre of 1 upper end of panel backboard
Position, 3 bottom end of monitor are followed successively by communication interface 7, the fast grafting of control and the fast interface 5 of high pressure, monitor 3 and lead to from left to right
There is gap between communication interface 7, the fast grafting of control and the fast interface 5 of high pressure.
Communication interface 7 is semiconductor silicon connector.
Process gas fast joint 4 includes argon gas fast joint, oxygen fast joint, nitrogen connector fast joint and spare fast joint.
Cooling water fast joint 2 is vertically equipped at least two cooling water fast joint 2, and cooling water fast joint 2 is equipped with water inlet end and goes out
Water end (W.E.).
1 top of panel backboard is equipped with the protrusion of isosceles trapezoidal structure, and circular through hole is equipped among protrusion.
The tip side of cooling water fast joint 2 is equipped with sealing ring, and the sealing ring is expanded rubber circle.
The tip side of the fast interface 5 of high pressure is equipped with insulation ring layer, and the insulation ring layer is coated on the outer of the fast interface 5 of high pressure
Surface.
Communication interface 7 is equipped with the spring fastener of inverse Ba type, and the spring fastener is elastic construction.
1 internal layer of panel backboard is equipped with cushion pad, and the cushion pad is slab construction, and cushion pad surface is equipped with cellular heat dissipation
Hole.
1 surface of panel backboard is equipped with plated film, and the plated film on 1 surface of panel backboard is plate glass plated film, more beautiful.Panel
1 edge of backboard is equipped with fixing end, and fixing end is equipped with sliding rail, the fixing end and the 1 angled difference of place plane of panel backboard, described
Expandable strip is equipped on the inside of sliding rail, in maintenance process, when panel backboard 1 is overhauled, is kept away in disassembly process by sliding rail
Exempt from cumbersome process of overhauling, reduce manual labor amount and danger coefficient.
Claims (10)
1. integral type cathode cover board control panel, including：Panel backboard (1), monitor (3), cooling water fast joint (2), technique
Gas fast joint (4), communication interface (7), the fast interface (6) of control and the fast interface of high pressure (5), it is characterised in that：Cooling water
Fast joint (2) is arranged on panel backboard (1) leftmost side, and process gas fast joint (4) is arranged on the rightmost side of panel backboard (1),
Monitor (3) is arranged on the centre position of panel backboard (1) upper end, and monitor (3) bottom end is followed successively by communication interface from left to right
(7), fast grafting and the fast interface of high pressure (5), monitor (3), communication interface (7), the fast grafting of control and the fast grafting of high pressure are controlled
There is gap between mouth (5).
2. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Cooling water fast joint (2) is copper
Matter Aviation Connector.
3. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Process gas fast joint (4) wraps
Include argon gas fast joint, oxygen fast joint, nitrogen connector fast joint and spare fast joint.
4. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Cooling water fast joint (2) is vertical
Equipped at least two cooling water fast joint (2).
5. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Panel backboard (1) top is equipped with
The protrusion of isosceles trapezoidal structure, protrusion centre are equipped with circular through hole.
6. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Cooling water fast joint (2) connect
Head end is equipped with sealing ring, and the sealing ring is expanded rubber circle.
7. integral type cathode cover board control panel as described in claim 1, it is characterised in that：High pressure fast interface (5) connect
Head end is equipped with insulation ring layer, and the insulation ring layer is coated on the outer surface of the fast interface of high pressure (5).
8. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Communication interface (7) is equipped with eight
The spring fastener of font, the spring fastener are elastic construction.
9. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Panel backboard (1) surface is equipped with
Plated film.
10. integral type cathode cover board control panel as described in claim 1, it is characterised in that：Panel backboard (1) edge is equipped with
Fixing end, the angled difference of plane where the fixing end and panel backboard (1), the differential seat angle ranging from clockwise
In the range of 30 ° -45 °, the fixing end is equipped with through-hole, and the through-hole and fastening screw are mating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187721.6A CN108193184A (en) | 2018-03-07 | 2018-03-07 | Integral type cathode cover board control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810187721.6A CN108193184A (en) | 2018-03-07 | 2018-03-07 | Integral type cathode cover board control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108193184A true CN108193184A (en) | 2018-06-22 |
Family
ID=62595127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810187721.6A Pending CN108193184A (en) | 2018-03-07 | 2018-03-07 | Integral type cathode cover board control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108193184A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100003428A (en) * | 2008-07-01 | 2010-01-11 | 이성우 | Cathode of sputtering device |
| CN102358936A (en) * | 2011-09-21 | 2012-02-22 | 太原理工大学 | Preparation method of photonic crystal multilayer film |
| CN103409725A (en) * | 2013-05-22 | 2013-11-27 | 东莞宏威数码机械有限公司 | Rotary alien target cathode mechanism and magnetron sputtering coating device |
| CN203768448U (en) * | 2013-12-24 | 2014-08-13 | 上海子创镀膜技术有限公司 | Novel planar cathode for vacuum magnetron sputtering |
| CN104532199A (en) * | 2014-12-16 | 2015-04-22 | 张家港市铭斯特光电科技有限公司 | Cathode for medium-frequency magnetron sputtering coating |
| CN104894522A (en) * | 2015-05-13 | 2015-09-09 | 安徽普威达真空科技有限公司 | Vacuum film plating device, and film plating method |
| CN208121193U (en) * | 2018-03-07 | 2018-11-20 | 河北物华天宝镀膜科技有限公司 | Integral type cathode cover board control panel |
-
2018
- 2018-03-07 CN CN201810187721.6A patent/CN108193184A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100003428A (en) * | 2008-07-01 | 2010-01-11 | 이성우 | Cathode of sputtering device |
| CN102358936A (en) * | 2011-09-21 | 2012-02-22 | 太原理工大学 | Preparation method of photonic crystal multilayer film |
| CN103409725A (en) * | 2013-05-22 | 2013-11-27 | 东莞宏威数码机械有限公司 | Rotary alien target cathode mechanism and magnetron sputtering coating device |
| CN203768448U (en) * | 2013-12-24 | 2014-08-13 | 上海子创镀膜技术有限公司 | Novel planar cathode for vacuum magnetron sputtering |
| CN104532199A (en) * | 2014-12-16 | 2015-04-22 | 张家港市铭斯特光电科技有限公司 | Cathode for medium-frequency magnetron sputtering coating |
| CN104894522A (en) * | 2015-05-13 | 2015-09-09 | 安徽普威达真空科技有限公司 | Vacuum film plating device, and film plating method |
| CN208121193U (en) * | 2018-03-07 | 2018-11-20 | 河北物华天宝镀膜科技有限公司 | Integral type cathode cover board control panel |
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