CN108192508A - A kind of high temperature resistant bi-component acrylic sqtructural adhesive - Google Patents

A kind of high temperature resistant bi-component acrylic sqtructural adhesive Download PDF

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Publication number
CN108192508A
CN108192508A CN201711386339.XA CN201711386339A CN108192508A CN 108192508 A CN108192508 A CN 108192508A CN 201711386339 A CN201711386339 A CN 201711386339A CN 108192508 A CN108192508 A CN 108192508A
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CN
China
Prior art keywords
parts
component
acrylic
high temperature
temperature resistant
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Pending
Application number
CN201711386339.XA
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Chinese (zh)
Inventor
黄冰
肖日升
魏国才
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SHANGHAI KANGDA NEW MATERIALS CO Ltd
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SHANGHAI KANGDA NEW MATERIALS CO Ltd
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Priority to CN201711386339.XA priority Critical patent/CN108192508A/en
Publication of CN108192508A publication Critical patent/CN108192508A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70Chelates

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a kind of high temperature resistant bi-component acrylic sqtructural adhesive, which includes A, B component, the component A be by:15 parts of acrylic acid, 30 60 parts of acrylic ester monomers, 15 30 parts of toughener, 13 parts of reducing agents, 0.3 3 parts of curable epoxide catalyst compositions;B component is by 30 50 parts of epoxy resin, 4 10 parts of oxidant compositions.A kind of high temperature resistant bi-component acrylic sqtructural adhesive temperature in use of the present invention is at 40 DEG C 180 DEG C, and performance does not reduce after high temperature, has good cementability, flexibility and weatherability.

Description

A kind of high temperature resistant bi-component acrylic sqtructural adhesive
Technical field
The invention belongs to acrylic acid structure adhesive fields, and in particular to one kind can room temperature fast-curing, and using temperature The degree high temperature resistant bi-component acrylic sqtructural adhesive that performance does not reduce after -40 DEG C -180 DEG C, high temperature.
Background technology
Presently commercially available two-component acrylate structural adhesive is mostly rubber toughened system, rapid curing or is passed through at room temperature It is appropriate to heat to accelerate solidified and located, cross-linked structure is formed, is suitble to binding metal, engineering plastics and other base materials.Acrylic acid Ester gum stick can provide the performance of high shear strength, peel strength, impact strength and chemical resistance, cohesible base material range Extensively, required surface treatment is lacked.Since it is with good flexibility, for different substrate materials bonding when, being glued workpiece will not Bond failure is caused due to linear expansion coefficient difference, this advantage is also that other structures adhesive is incomparable.
But it is more and more extensive with the application of adhesive, client is to the performance of adhesive it is also proposed that higher and higher will It asks.The temperature tolerance of adhesive is exactly one of them.Such as in automobile manufacture industry, vehicle body need to pass through electrophoresis process, environment temperature Up to 180 DEG C, used structure glue should be able to provide certain intensity in this period, and its performance should not after electrophoresis Less than performance before electrophoresis.The temperature tolerance for improving acrylic acid structure glue is generally filled out using the high Tg monomers of addition, heatproof resin and heatproof The modes such as material.Epoxy structural rubber has better temperature tolerance relative to acrylic acid structure glue, but epoxy structural rubber has construction And the shortcomings of curing mode is relative complex, and toughness is inadequate after curing.The present invention is organic with epoxy resin by acrylic acid structure glue It is combined together, improves the temperature tolerance and weatherability of system.
Invention content
Higher-strength is still kept during to solve the problems, such as that adhesive uses at high temperature, the present invention provides a kind of high temperature resistants Bi-component acrylic sqtructural adhesive, have can room temperature fast-curing, temperature in use performance after -40 DEG C -180 DEG C, high temperature It does not reduce, the advantages that good weatherability.
A kind of high temperature resistant bi-component acrylic sqtructural adhesive of the present invention, the adhesive include A, B component, the A groups Point be by:1-5 parts of acrylic acid, 30-60 parts of acrylic ester monomers, 15-30 parts of toughener, 1-3 parts of reducing agents, 0.3-3 parts of rings Oxygen curing catalysts form;B component is by 30-50 parts of epoxy resin, 4-10 parts of oxidant compositions.
A kind of high temperature resistant bi-component acrylic sqtructural adhesive temperature in use of the present invention is after -40 DEG C -180 DEG C, high temperature Performance does not reduce, and has good cementability, flexibility and weatherability.
Above-mentioned acrylic acid is at least one of acrylic acid and methacrylic acid.
Above-mentioned acrylic ester monomer for methyl methacrylate, Isobutyl methacrylate, isodecyl methacrylate, Hydroxyethyl methacrylate, cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, bisphenol-A epoxy dimethacrylate Ester, two kinds of dimethacrylate and two or more mixtures.
Above-mentioned high temperature resistant bi-component acrylic sqtructural adhesive, the curable epoxide catalyst are three core oxygen heart trivalent chromiums Complex compound.
Above-mentioned curable epoxide catalyst has following structure:
Wherein, R1-R9Can be identical or different, and independent be selected from:Hydrogen and straight chain, branch or cricoid are satisfied And/or undersaturated alkyl.
Above-mentioned epoxy resin is general purpose epoxy resin, such as bisphenol A epoxide resin, bisphenol F epoxy resin, aliphatic epoxy Resin etc..
This technology is mainly characterized by formula containing 0.3-3 parts of curable epoxide catalyst, the curable epoxide catalyst Ability with catalysis epoxy and carboxylic acid or anhydride reaction at room temperature, due to containing 1-5 parts of (methyl) acrylic acid in formula, provides Carboxylic acid functional can be crosslinked with the epoxy resin cure of addition.
The present invention combines epoxy resin and acrylic acid structure glue, passes through the work of curable epoxide catalyst With when acrylic system cures, epoxy resin and (methyl) acrylic acid crosslinking curing improve the intensity of adhesive at room temperature And heat-resisting quantity, and improve the weatherability of product.
Specific embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit Determine the scope of the present invention.
Embodiment 1:
A kind of high temperature resistant bi-component acrylic sqtructural adhesive, comprising A, B component, the component A be by:3 parts (methyl) Acrylic acid, 50 parts of (methyl) acrylic ester monomers, 20 parts of toughener, 2 parts of reducing agents, 1 part of curable epoxide catalyst composition;B Component is by 50 parts of epoxy resin, 8 parts of oxidant compositions.
To further demonstrate that the invention advantage, the performance difference of following control group, comparative example and control group is set
Control group 1
A kind of bi-component acrylic sqtructural adhesive, comprising A, B component, the component A be by:3 parts of (methyl) acrylic acid, 50 parts of (methyl) acrylic ester monomers, 20 parts of toughener, 2 parts of reducing agent compositions;B component is by 10 parts of plasticizer, 8 parts of oxidations Agent forms.
Control group 2
A kind of bi-component acrylic sqtructural adhesive, comprising A, B component, the component A be by:3 parts of (methyl) acrylic acid, 50 parts of (methyl) acrylic ester monomers, 20 parts of toughener, 2 parts of reducing agent compositions;B component is by 50 parts of epoxy resin, 8 parts of oxygen Agent forms.
Control group 3
A kind of bi-component acrylic sqtructural adhesive, comprising A, B component, the component A be by:3 parts of (methyl) acrylic acid, 50 parts of (methyl) acrylic ester monomers, 10 parts of bisphenol-A epoxy two (methyl) acrylate, 20 parts of toughener, 2 parts of reducing agent groups Into;B component is by 10 parts of plasticizer, 8 parts of oxidant compositions.
Performance test data is as shown in table 1:
Table 1
The various aspects of performance that can be seen that embodiment by 1 data of table is superior to control group.Control group 1 is not added with epoxy Resin and epoxy monomer, colloid is damaged under high temperature, no heat-resisting quantity.Control group 2 only adds epoxy resin, because of epoxy resin room Do not cure under temperature, room temperature curing low strength, resistance to ag(e)ing is also poor.Control group 3 adds acrylated epoxy, gained glue Sample brittleness is larger, and high temperature resistant and weatherability are poor.Therefore the high temperature resistant bi-component acrylic sqtructural adhesive of the present invention solves The heatproof sex chromosome mosaicism of acrylic acid structure glue, and with good weatherability.

Claims (6)

1. a kind of high temperature resistant bi-component acrylic sqtructural adhesive, which is characterized in that comprising A, B component, the component A be by: 1-5 parts of acrylic acid, 30-60 parts of acrylic ester monomers, 15-30 parts of toughener, 1-3 parts of reducing agents, 0.3-3 parts of curable epoxides are urged Agent forms;B component is by 30-50 parts of epoxy resin, 4-10 parts of oxidant compositions.
A kind of 2. high temperature resistant bi-component acrylic sqtructural adhesive as described in claim 1, which is characterized in that acrylic acid third At least one of olefin(e) acid and methacrylic acid.
A kind of 3. high temperature resistant bi-component acrylic sqtructural adhesive as described in claim 1, which is characterized in that the acrylic acid Esters monomer for methyl methacrylate, Isobutyl methacrylate, isodecyl methacrylate, hydroxyethyl methacrylate, Cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, bisphenol-A epoxy dimethylacrylate, diethylene glycol dimethyl Two kinds of acrylate and two or more mixtures.
A kind of 4. high temperature resistant bi-component acrylic sqtructural adhesive as described in claim 1, which is characterized in that the epoxy Curing catalysts are three core oxygen heart trivalent chromium complex.
A kind of 5. high temperature resistant bi-component acrylic sqtructural adhesive as described in claim 1, which is characterized in that the epoxy Curing catalysts have following structure:
Wherein, R1-R9Can be identical or different, and independent be selected from:Hydrogen and straight chain, branch or cricoid, saturation or Undersaturated alkyl.
A kind of 6. high temperature resistant bi-component acrylic sqtructural adhesive as described in claim 1, which is characterized in that the epoxy Resin is bisphenol A epoxide resin, bisphenol F epoxy resin, one kind in aliphatic epoxy resin or arbitrary two or more mixing.
CN201711386339.XA 2017-12-20 2017-12-20 A kind of high temperature resistant bi-component acrylic sqtructural adhesive Pending CN108192508A (en)

Priority Applications (1)

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CN201711386339.XA CN108192508A (en) 2017-12-20 2017-12-20 A kind of high temperature resistant bi-component acrylic sqtructural adhesive

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Application Number Priority Date Filing Date Title
CN201711386339.XA CN108192508A (en) 2017-12-20 2017-12-20 A kind of high temperature resistant bi-component acrylic sqtructural adhesive

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11739172B2 (en) 2020-12-17 2023-08-29 3M Innovative Properties Company Composition including monomer with a carboxylic acid group, monomer with a hydroxyl group, and crosslinker and related articles and methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978026A (en) * 1972-02-18 1976-08-31 Aerojet-General Corporation Catalysts of the oxirane-anhydride reaction
CN102286253A (en) * 2011-06-21 2011-12-21 北京天山新材料技术股份有限公司 Novel two-component acrylate structural adhesive and preparation method thereof
CN102898963A (en) * 2012-10-18 2013-01-30 上海康达化工新材料股份有限公司 Acrylate structure adhesive and preparation method thereof
CN104327752A (en) * 2014-10-15 2015-02-04 烟台德邦科技有限公司 Acrylic acid structural adhesive with good weatherability and stability
CN106634641A (en) * 2017-01-04 2017-05-10 烟台信友新材料股份有限公司 Double-component crylic acid adhesive and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978026A (en) * 1972-02-18 1976-08-31 Aerojet-General Corporation Catalysts of the oxirane-anhydride reaction
CN102286253A (en) * 2011-06-21 2011-12-21 北京天山新材料技术股份有限公司 Novel two-component acrylate structural adhesive and preparation method thereof
CN102898963A (en) * 2012-10-18 2013-01-30 上海康达化工新材料股份有限公司 Acrylate structure adhesive and preparation method thereof
CN104327752A (en) * 2014-10-15 2015-02-04 烟台德邦科技有限公司 Acrylic acid structural adhesive with good weatherability and stability
CN106634641A (en) * 2017-01-04 2017-05-10 烟台信友新材料股份有限公司 Double-component crylic acid adhesive and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
傅桂香等: "系列同三核铬、锰、铁羧酸配合物的FAB-MS研究", 《结构化学》 *
朱振国: "铬(Ⅲ)络合物催化环氧树脂与丙烯酸的酯化反应", 《粘接》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11739172B2 (en) 2020-12-17 2023-08-29 3M Innovative Properties Company Composition including monomer with a carboxylic acid group, monomer with a hydroxyl group, and crosslinker and related articles and methods

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Address after: 201419 No. 169, Leizhou Road, Shanghai, Fengxian District

Applicant after: Shanghai Kangda Chemical New Material Group Co., Ltd.

Address before: 201419 No. 169, Leizhou Road, Shanghai, Fengxian District

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Application publication date: 20180622