CN108182888A - A kind of LED display Integral mask based on ink-jet technology - Google Patents
A kind of LED display Integral mask based on ink-jet technology Download PDFInfo
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- CN108182888A CN108182888A CN201810175658.4A CN201810175658A CN108182888A CN 108182888 A CN108182888 A CN 108182888A CN 201810175658 A CN201810175658 A CN 201810175658A CN 108182888 A CN108182888 A CN 108182888A
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- ink
- led display
- integral mask
- jet technology
- mask based
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention relates to LED display fields, more particularly to a kind of LED display Integral mask based on ink-jet technology.PCB substrate including carrying IC, the surface of the PCB substrate are equipped with several COB display screen matrixes units and pass through packaging plastic seal protection, wherein, die bond, bonding wire are carried out to the PCB substrate for carrying IC；PCB substrate after bonding wire is subjected to molding sealing；Inkjet process and ink semi-solid preparation are patterned to the colloid surface of packaging plastic, Integral mask is formed between COB display screen matrix units；Then to ink baking-curing.The present invention can solve the problems, such as piece and aberration between COB display screen difference modules, can also solve to alter optical issue between pixel.
Description
Technical field
The present invention relates to LED display fields, more particularly to a kind of LED display integration based on ink-jet technology
Mask.
Background technology
In small spacing LED display fields, COB display screens become star's product in market.With COB encapsulation technologies into
It is ripe, it is contemplated that the main product that the year two thousand twenty COB will test-manufacture as small spacing, more than 60% market share.The COB that the prior art is realized
Product does not have preferable removing method to the aberration for altering light and module, leads to that client can not be reached on aberration validity
It is required that.
Invention content
The present invention realizes Integral mask using ink-jet technology, carries out inkjet process to COB package surfaces, realizes integration
Mask solves the problems, such as piece and aberration between COB display screen difference modules, can also solve to alter optical issue between pixel.
To achieve these goals, the present invention provides following technical solution：
A kind of LED display Integral mask based on ink-jet technology, the PCB substrate including carrying IC, the table of the PCB substrate
Face is equipped with several COB display screen matrixes units and passes through packaging plastic seal protection, wherein, the PCB substrate for carrying IC is carried out
Die bond, bonding wire；PCB substrate after bonding wire is subjected to molding sealing；Inkjet process is patterned to the film surface of packaging plastic
And ink semi-solid preparation, form Integral mask between COB display screen matrix units；Then to ink baking-curing.
Ink-jet is patterned using Printing techniques realization on the surface of COB modules, makes to realize virtual face between pixel
Cover can greatly reduce the aberration problem between module, and raising displays contrast, degree true to nature.
Preferably, COB display screen matrixes cell spacing is 0.5mm-10mm, and pixel unit is feux rouges, green light, blue light emitting
Chip portfolio forms, and positioned at PCB substrate surface and passes through packaging plastic seal protection, and the width of ink is 0.02mm-1mm.Root
It is adjusted according to COB display screen matrixes cell spacing come the width to ink, enables ink fine when being patterned ink-jet
Ground separates pixel unit, and display screen is made to reduce aberration problem when being shown.
Preferably, graphical ink-jet is " well " font ink, and " well " ink layer is located at encapsulation film surface." well "
Font layer can separate single pixel unit, can also separate multiple pixel units.
Preferably, the packaging plastic is transparent, colourless gum, and transmissivity 75%-99%, transmissivity is high, and light decay reduces,
Brightness is high.
Preferably, ink includes UV cured printing inks or UV semi-solid preparations+thermo-cured ink or thermo-cured ink or other are dark
Ink；Ink property can be the UV photosensitive-inks such as legend ink, anti-solder ink, anti-etching ink.
The beneficial effects of the invention are as follows；The present invention realizes Integral mask using ink-jet technology, and COB package surfaces are carried out
Inkjet process realizes Integral mask, solves the problems, such as piece and aberration between COB display screen difference modules, can also solve pixel
Between alter optical issue.
Description of the drawings
Fig. 1 is the COB positive structure schematics that the prior art is realized.
Fig. 2 is the positive structure schematic of the embodiment of the present invention 1.
Fig. 3 is the side structure schematic diagram of the embodiment of the present invention 1.
Fig. 4 is the positive structure schematic of the embodiment of the present invention 2.
Fig. 5 is the side structure schematic diagram of the embodiment of the present invention 2.
In figure；The virtual mask 1 of " well " word, pixel unit 2, packaging plastic 3, PCB substrate 4.
Specific embodiment
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；It is attached in order to more preferably illustrate the present embodiment
Scheme certain components to have omission, zoom in or out, do not represent the size of actual product；To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable.Being given for example only property of position relationship described in attached drawing
Explanation, it is impossible to be interpreted as the limitation to this patent.
Embodiment 1：
Fig. 1 is the COB module package structures that the prior art is realized, the virtual mask of ink layer is not had, to altering light and module
Aberration there is no preferable removing method, lead to that the requirement of client can not be reached on aberration validity.
To be optimized to existing technology, as shown in Figures 2 and 3, die bond, weldering are carried out to the PCB substrate 4 for carrying IC
Line；PCB substrate 4 after bonding wire is subjected to molding sealing；Inkjet process and ink are patterned to the film surface of packaging plastic 3
Semi-solid preparation forms Integral mask between COB display screen matrixes unit 2；Then to ink baking-curing.
" well " font spray printing is realized using Printing techniques, make to realize between single pixel unit 2 on the surface of COB modules
The virtual mask 1 of " well " word.The spacing of COB display screen matrixes unit 2 is 0.5mm-10mm, and pixel unit 2 is feux rouges, green light, indigo plant
Light luminescence chip combines, and " well " ink layer is located at the film surface of packaging plastic 3, and the width of ink layer can be 0.02mm-
1mm, thickness can be 0.02-0.3mm.
Wherein, packaging plastic is transparent, colourless gum, and transmissivity 75%-99%, transmissivity is high, and light decay reduces, brightness
It is high.
To advanced optimize said program, ink jet-printing is using high durable, antiacid, alkali-resisting black ink.It can be very big
The aberration problem reduced between module have been able to solve module splicing seams aberration, raising display contrast, journey true to nature
Degree.
Embodiment 2
The present embodiment is similar with embodiment 1, and the difference lies in as shown in Figure 4 and Figure 5, on the surface of COB modules using spray for institute
Print technology realizes " well " font spray printing, makes to realize the virtual mask 1 of " well " word between 2*2 pixel units 2.The virtual mask 1 of " well " word
It is inside 4 pixel units 2, and embodiment 1 is single pixel unit 2, it can be according to actual demand effect and the spacing of pixel unit 2
Carry out spray printing.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (7)
1. a kind of LED display Integral mask based on ink-jet technology, the PCB substrate including carrying IC, the PCB substrate
Surface is equipped with several COB display screen matrixes units and passes through packaging plastic seal protection, which is characterized in that carrying the PCB of IC
Substrate carries out die bond, bonding wire；PCB substrate after bonding wire is subjected to molding sealing；The film surface of packaging plastic is patterned
Inkjet process and ink semi-solid preparation form Integral mask between COB display screen matrix units；Then to ink baking-curing.
A kind of 2. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
The spacing of COB display screen matrix units is stated as 0.5mm-10mm, pixel unit combined by feux rouges, green light, blue light emitting chip and
Into.
A kind of 3. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
Graphical ink-jet is stated as " well " font ink, " well " the font layer can separate single pixel unit, also can be by multiple pixels
Unit separates.
A kind of 4. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
Packaging plastic is stated as transparent, colourless gum, transmissivity 75%-99%.
A kind of 5. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
It states ink and includes UV cured printing inks or UV semi-solid preparations+thermo-cured ink or thermo-cured ink or other dark inks.
A kind of 6. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
The width for stating ink is 0.02mm-1mm.
A kind of 7. LED display Integral mask based on ink-jet technology according to claim 1, which is characterized in that institute
It states ink property and includes legend ink or anti-solder ink or anti-etching ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810175658.4A CN108182888A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on ink-jet technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810175658.4A CN108182888A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on ink-jet technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108182888A true CN108182888A (en) | 2018-06-19 |
Family
ID=62553219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810175658.4A Pending CN108182888A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on ink-jet technology |
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| CN (1) | CN108182888A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299083A (en) * | 2019-06-12 | 2019-10-01 | 厦门强力巨彩光电科技有限公司 | A kind of LED display glue-pouring method |
| CN110649011A (en) * | 2019-09-10 | 2020-01-03 | 深圳雷曼光电科技股份有限公司 | Cell board and manufacturing method thereof |
| CN110729311A (en) * | 2019-10-31 | 2020-01-24 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| CN110930890A (en) * | 2018-09-20 | 2020-03-27 | 深圳市海讯高科技术有限公司 | COB display screen mask and operation method thereof |
| CN110931626A (en) * | 2018-09-20 | 2020-03-27 | 深圳市海讯高科技术有限公司 | COB display screen capable of improving black-white contrast and preventing light crosstalk and operation method thereof |
| CN111261054A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Application of black base material in LED spliced screen product |
| CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
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| CN202976707U (en) * | 2012-10-31 | 2013-06-05 | 长春希达电子技术有限公司 | Small-spacing full-color LED integrated three-in-one display module |
| CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
| CN203466189U (en) * | 2013-08-23 | 2014-03-05 | 深圳市奥拓电子股份有限公司 | Micro-size SMD LED light |
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| CN206991672U (en) * | 2017-07-13 | 2018-02-09 | 杭州美卡乐光电有限公司 | LED display modules and LED display |
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| CN202976707U (en) * | 2012-10-31 | 2013-06-05 | 长春希达电子技术有限公司 | Small-spacing full-color LED integrated three-in-one display module |
| CN203466189U (en) * | 2013-08-23 | 2014-03-05 | 深圳市奥拓电子股份有限公司 | Micro-size SMD LED light |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930890A (en) * | 2018-09-20 | 2020-03-27 | 深圳市海讯高科技术有限公司 | COB display screen mask and operation method thereof |
| CN110931626A (en) * | 2018-09-20 | 2020-03-27 | 深圳市海讯高科技术有限公司 | COB display screen capable of improving black-white contrast and preventing light crosstalk and operation method thereof |
| CN110931626B (en) * | 2018-09-20 | 2020-11-20 | 深圳市海讯高科技术有限公司 | COB display screen capable of improving black-white contrast and preventing light crosstalk and operation method thereof |
| CN110299083A (en) * | 2019-06-12 | 2019-10-01 | 厦门强力巨彩光电科技有限公司 | A kind of LED display glue-pouring method |
| CN110299083B (en) * | 2019-06-12 | 2021-10-22 | 厦门强力巨彩光电科技有限公司 | Glue pouring method for LED display screen |
| CN110649011A (en) * | 2019-09-10 | 2020-01-03 | 深圳雷曼光电科技股份有限公司 | Cell board and manufacturing method thereof |
| CN110729311A (en) * | 2019-10-31 | 2020-01-24 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| CN110729311B (en) * | 2019-10-31 | 2023-09-05 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| CN111261054A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Application of black base material in LED spliced screen product |
| CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
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Application publication date: 20180619 |
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