CN108181323A - Integrated circuit plate fault detection method and system based on electromagnetic signature - Google Patents
Integrated circuit plate fault detection method and system based on electromagnetic signature Download PDFInfo
- Publication number
- CN108181323A CN108181323A CN201711348739.1A CN201711348739A CN108181323A CN 108181323 A CN108181323 A CN 108181323A CN 201711348739 A CN201711348739 A CN 201711348739A CN 108181323 A CN108181323 A CN 108181323A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- circuit plate
- electromagnetic
- electromagnetic induction
- intensity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention belongs to integrated circuit plate fault detection technique fields, provide a kind of integrated circuit plate fault detection method and system based on electromagnetic signature.This method includes：The current electromagnetic induction of each position of integrated circuit plate is obtained by imaging sensor and Hall sensor；The current electromagnetic induction is amplified and analog-to-digital conversion process, obtains target electromagnetic induction；The target electromagnetic induction with pre-stored initial electromagnetic induction is compared, obtains the fault message of integrated circuit plate, the fault message includes the position of trouble point on integrated circuit plate；Export the integrated circuit plate fault message.This method is acquired by the electromagnetic intensity to integrated circuit plate, and effectively the position broken down on integrated circuit plate can be detected, maintenance personal is enable fast and accurately to be repaired to integrated circuit plate.
Description
Technical field
The present invention relates to the fault detection technique fields of integrated circuit plate, and in particular to a kind of integrated based on electromagnetic signature
Board failure detection method and system.
Background technology
The defects of integrated circuit plate, is detected, detection method common at present is exactly AOI (Automatic Optic
Inspection) automatic optics inspection, AOI automatic optics inspections be based on optical principle come to integrated circuit plate because welding give birth to
The common deficiency encountered in production is detected.When being detected according to the method for AOI automatic optics inspections, often through camera
Automatically scanning PCB integrated circuit plates acquire image, and the qualified parameter in the solder joint and database of test is compared, and is passed through
Image procossing checks defect on PCB, and passes through display or Automatic Logos and defect is shown or marked, for repair
Personnel modify.Integrated circuit plate is detected using AOI automatic optical detection methods, although defect can be quickly found,
It is helpless for the functional detection such as component internal damage on integrated circuit plate.Additionally, due to AOI automated opticals
The equipment volume of detection method is larger, expensive, therefore is only suitable for being used as industrial factory testing equipment.
At present, repair on the electronic devices, such as the repair of circuit board of mobile phone, often by the experience of maintenance personal
Failure judgement range is carried out, maintenance personal is detected by equipment such as multimeter, oscillograph lamps, since maintenance personal needs repeatedly
It replaces element and booting is tested, the time for making repair is long, and repairs and be easy to cause secondary damage, such maintenance efficiency
Under, maintenance time it is long, can not quickly and efficiently repair.
Invention content
For the defects in the prior art, the integrated circuit plate fault detection method provided by the invention based on electromagnetic signature
And system, the non-detectable blank of integrated circuit plate functional fault information can be made up, enables maintenance personal quick and precisely
Ground repairs integrated circuit plate.
In a first aspect, a kind of integrated circuit plate fault detection method based on electromagnetic signature provided by the invention, including such as
Lower step：
The current electromagnetic induction of each position of integrated circuit plate is obtained by imaging sensor and Hall sensor；
The current electromagnetic induction is amplified and analog-to-digital conversion process, obtains target electromagnetic induction；
The target electromagnetic induction with pre-stored initial electromagnetic induction is compared, obtains integrated electricity
The fault message of road plate, the fault message include the position of trouble point on integrated circuit plate；
Export the integrated circuit plate fault message.
Further, the current electromagnetic sense of each position of integrated circuit plate is obtained by imaging sensor and Hall sensor
The step of answering intensity specifically includes：
Image scanning is carried out to integrated circuit plate by imaging sensor, obtains the first image information；
Image procossing is carried out to described first image information, described image processing includes feature extraction, obtains multiple points
Location information；
Electromagnetic induction scanning is carried out to integrated circuit plate by Hall sensor, obtains the first electromagnetic intensity；
According to the location information and the first electromagnetic intensity of multiple points of extraction feature, obtain each on integrated circuit plate
The current electromagnetic induction of position.
Further, the target electromagnetic induction is compared with pre-stored initial electromagnetic induction, obtains
Specific steps to the position of the trouble point of integrated circuit plate include：
Target electromagnetic induction and pre-stored initial electromagnetic intensity are subjected to difference operation, obtain difference electromagnetism sense
Answer intensity；
When the difference electromagnetic intensity is in threshold range, then judge that integrated circuit plate event does not occur in the point
Barrier；
When the difference electromagnetic intensity is outside threshold range, then judge that integrated circuit plate breaks down in the point.
Further, described image sensor and Hall sensor are that integrated circuit plate is obtained by way of linear scan
The current electromagnetic induction of each position.
Second aspect, a kind of integrated circuit plate fault detection system based on electromagnetic signature provided by the invention, including：
Imaging sensor for carrying out image scanning to integrated circuit plate, obtains the first image information；
Hall sensor for carrying out electromagnetic induction scanning to integrated circuit plate, obtains the first electromagnetic intensity；
Acquiring unit, for according to described first image information and the first electromagnetic intensity, obtaining integrated circuit plate
The current electromagnetic induction of upper each position；
Electromagnetic signal processing unit for being amplified to current electromagnetic induction and analog-to-digital conversion process, obtains mesh
Mark electromagnetic intensity；
Comparing unit, for the target electromagnetic induction and pre-stored initial electromagnetic induction to be compared
It is right, the fault message of integrated circuit plate is obtained, includes the position of the trouble point on integrated circuit plate；
Output unit, for exporting the fault message of the integrated circuit plate.
Further, the acquiring unit further includes image processing unit, and described image processing unit is used for described the
One image information carries out image procossing, and described image processing includes carrying out feature extraction to the first image information, obtains integrated electricity
The location information of multiple points on the plate of road；The acquiring unit is additionally operable to the position letter according to multiple points on obtained integrated circuit plate
Breath and first electromagnetic intensity obtain the current electromagnetic induction of each position on integrated circuit plate.
Further, the comparing unit further includes：
Difference operation unit, it is poor for target electromagnetic induction and pre-stored initial electromagnetic induction to be carried out
It is worth operation, obtains difference electromagnetic intensity；
Judging unit, for the difference electromagnetic intensity threshold range to be compared, when the difference electromagnetism sense
When answering intensity in threshold range, then judge that integrated circuit plate does not break down in the point；When the difference electromagnetic induction is strong
When degree is outside threshold range, then judge that integrated circuit plate breaks down in the point.
Further, described image sensor and Hall sensor carry out integrated circuit plate by way of linear scan
Image scanning and electromagnetic induction scanning.
The advantageous effect of the embodiment of the present invention：The present invention implements the integrated circuit plate failure based on electromagnetic signature that body provides
Detection method and system, will be described integrated with reference to the electromagnetic intensity of integrated circuit plate and the image information of integrated circuit plate
The specific location of circuit board is determined, and according to the electromagnetic intensity of each point on integrated circuit plate with it is pre-stored
The electromagnetic intensity of integrated circuit plate is compared, and the result of comparison is exported, and obtains the functionality event of integrated circuit plate
Hinder information, can detect the fault message of integrated circuit plate, realize the quickly and accurately repairing to integrated circuit plate.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar element
Or part is generally identified by similar reference numeral.In attached drawing, each element or part might not be drawn according to practical ratio.
The flow chart of the integrated circuit plate fault detection method based on electromagnetic signature that Fig. 1 is provided by embodiment 1；Fig. 2
The connection diagram of the integrated circuit plate fault detection system based on electromagnetic signature provided by embodiment 2.
Specific embodiment
The embodiment of technical solution of the present invention is described in detail below in conjunction with attached drawing.Following embodiment is only used for
Clearly illustrate technical scheme of the present invention, therefore be only used as example, and the protection model of the present invention cannot be limited with this
It encloses.It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application are should be belonging to the present invention
The ordinary meaning that field technology personnel are understood.
It should be appreciated that ought use in this specification and in the appended claims, term " comprising " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, element, component and/or its presence or addition gathered.
It is also understood that the term used in this description of the invention is merely for the sake of the mesh for describing specific embodiment
And be not intended to limit the present invention.As description of the invention and it is used in the attached claims, unless on
Other situations are hereafter clearly indicated, otherwise " one " of singulative, "one" and "the" are intended to include plural form.
It will be further appreciated that the term "and/or" used in description of the invention and the appended claims is
Refer to any combinations and all possible combinations of one or more of the associated item listed, and including these combinations.
Embodiment 1：
Embodiment 1 provides a kind of integrated circuit plate fault detection method based on electromagnetic signature, as shown in Figure 1, including
Following steps：
S1：The current electromagnetic sensing that each position of integrated circuit plate is obtained by imaging sensor and Hall sensor is strong
Degree.
Specifically, described image sensor carries out image scanning to integrated circuit plate, the first image information is obtained, described the
One image information includes the image information of each position on integrated circuit plate, and described first image information may further include integrated electricity
The image information of each position outside the plate of road, optionally, described image sensor may be configured as CCD optocoupler components, utilize
Multiple CCD optocoupler components carry out image scanning to integrated circuit plate, obtain the first image information.
Then image procossing is carried out to described first image information again, described image processing includes feature extraction, collected
The location information of multiple points on into circuit board, the location information of multiple points on the integrated circuit plate include the multiple point minute
More specific location information that Wei Yu be in described image, obtained the multiple point should be the characteristic point on integrated circuit plate, than
Such as the point on the integrated circuit plate upper side frame, point on the edge of the component on integrated circuit plate etc..Specifically, the spy
Sign extraction includes edge detection, Corner Detection, region detection etc., and edge detection can detect on the marginal position of integrated circuit plate
Multiple, the point that the Corner Detection can change greatly image information mean curvature is detected.The concrete mode of feature extraction
It can be determined according to the component and the outer shape of integrated circuit plate welded on integrated circuit plate.Described image processing may be used also
Including filtering, signal amplification, binaryzation, image cutting etc..
Finally the location information further according to obtained multiple points and multiple points should be located at the position on the integrated circuit plate
Confidence ceases, and further accurately obtains the specific location of integrated circuit plate.When in order to obtain the point on integrated circuit plate edge
During position, feature extraction is carried out to described first image information using the method for edge detection, obtains the side of integrated circuit plate
The location information of multiple points on edge, obtaining multiple points at this time should all be located at the marginal position of the integrated circuit plate, Ke Yigen
Straight line is extracted according to multiple points of acquisition, obtains the frame of integrated circuit plate, then the specific location of the integrated circuit plate is exactly
Inside the frame, the specific location of integrated circuit plate is just obtained.
The Hall sensor carries out integrated circuit plate to integrated circuit plate and carries out integrated circuit plate electromagnetic induction scanning, obtains
To the first electromagnetic intensity, first electromagnetic intensity further includes the electromagnetic induction sense of each position on integrated circuit plate
Intensity is answered, first electromagnetic intensity may further include the electromagnetic intensity of each position outside integrated circuit plate, institute
Stating Hall sensor can be integrated in electromagnetic induction chip, can also be scanned using Hall sensor, it is preferred that the electricity
Magnetic induction part may be configured as AK8975C (BGA) Hall magnetic field sensor, and AK8975C (BGA) the Hall magnetic field sensor can
To realize three axis electromagnetic detections, and precision can be realized as 0.3 μ T, range ability is -1200 μ T to the measurement of 1200 μ T, is collected
Into the electromagnetic intensity of each position on circuit board.
According to the specific location of integrated circuit plate and the first electromagnetic intensity of acquisition, you can obtain integrated circuit plate
On each position current electromagnetic induction.
The Hall sensor and imaging sensor are respectively to carrying out electromagnetic induction scanning and image on integrated circuit plate
During scanning, the position range of their scanning should be consistent, and the position of point that they are scanned is consistent, than
Such as when the point that the Hall sensor scans is a respectively1,a2…anDuring point, the point of described image sensor scanning should also be
a1,a2…anPoint, a of the scanning1,a2…anThe image information and electromagnetic intensity of point are respectively Pa1,Pa2…PanWith
La1,La2…Lan, according to the position of integrated circuit plate, for example point on the specific location of integrated circuit plate is a2…an-2, at this time
The current electromagnetic induction that just can obtain each position on integrated circuit plate is exactly La2…Lan-2.It should be understood that figure
As the point that sensor scans and the specific location of point that Hall sensor scans be in the form of matrix coordinate show,
Such as point anSpecific location be (bn,bm)。
Preferably, described image sensor and Hall sensor sweep integrated circuit plate with the mode of linear scan
It retouches.When being scanned using Hall sensor, the electromagnetic intensity of acquisition can be one direction or multiple directions.
S2：The current electromagnetic induction is amplified and analog-to-digital conversion process, obtains target electromagnetic induction.
Specifically, being amplified to electromagnetic intensity and digital-to-analogue conversion process, amplify the signal of electromagnetic intensity, and
The signal of the electromagnetic intensity is converted into digital signal.To the electromagnetic intensity in the process of processing,
The signal of the electromagnetic intensity can be also filtered, electromagnetic intensity is i.e. available after a series of processing is carried out
Target electromagnetic induction on integrated circuit plate.When use AK8975C (BGA) Hall magnetic field sensors to integrated circuit plate into
After row electromagnetic intensity is scanned, due to the Hall magnetic field sensor collection analog circuit, digital circuit, power module,
The electromagnetic intensity of acquisition can be handled, obtained after processing in one, the Hall magnetic field sensor by interface module
Integrated circuit plate electromagnetic intensity.Specifically, the processing of the signal of the electromagnetic intensity of acquisition is put including signal
Greatly, A/D analog-to-digital conversions, filtering process etc. are amplified using triode the signal of the electromagnetic intensity of the acquisition
Signal is amplified by amplifying circuit or integrated transporting discharging chip, and the A/D analog-to-digital conversions can utilize the AK8975C (BGA) suddenly
A/D converter built in your magnetic field sensor chip can carry out A/D digital-to-analogue conversions to integrated circuit plate.The A/D analog-to-digital conversions
A/D moduluses also are carried out to the signal of electromagnetic intensity using the circuit of the chips such as external chip such as microcontroller, XS128 composition
Conversion can also be used external hardware circuit and the signal of electromagnetic intensity carried out A/D analog-to-digital conversions, to electromagnetic intensity
The filtering of signal is also filtered using capacitance.
S3：The target electromagnetic induction with pre-stored initial electromagnetic induction is compared, is collected
Into the fault message of circuit board, the fault message includes the position of trouble point on integrated circuit plate.
Specifically, the target electromagnetic induction and pre-stored initial electromagnetic induction are carried out operation, obtain
To the fault message of integrated circuit plate, the fault message includes the position of the trouble point of integrated circuit plate；Optionally, the mesh
The operation that mark electromagnetic intensity and pre-stored initial electromagnetic induction carry out can be difference operation or ratio operation,
Preferential select is compared using difference operation method, and the difference operation method specifically includes：
Target electromagnetic induction and pre-stored initial electromagnetic intensity are subjected to difference operation, obtain difference electromagnetism sense
Answer intensity；Optionally, the pre-stored initial electromagnetic induction can be the electromagnetism sense of all the points on integrated circuit plate
Intensity is answered, can also only store the electromagnetic intensity of the key point on integrated circuit plate, the key point refers to integrated circuit
Plate changes bigger point with the electromagnetic intensity before failure after failure, it is preferred that described pre-stored initial
Electromagnetic intensity of the electromagnetic intensity for the key point of integrated circuit plate, and when carrying out difference operation, only to integrated electricity
Key point on the plate of road carries out difference operation.
When the difference electromagnetic intensity is in threshold range, then judge that integrated circuit plate event does not occur in the point
Barrier；When the difference electromagnetic intensity is outside threshold range, then judges that integrated circuit plate breaks down in the point, collected
Into the fault message of circuit board, the position of failure point including integrated circuit plate.
Optionally, when carrying out difference operation and obtaining difference electromagnetic intensity, it should be understood that the difference operation can be with
It is that target electromagnetic induction and pre-stored initial electromagnetic intensity are directly subjected to difference operation, obtains difference electromagnetic induction
Intensity the corresponding zoom of carry out can also obtain difference induction before and after the difference operation.
Optionally, the electromagnetic intensity of the pre-stored integrated circuit plate is stored in the matrix form, such as
Point a on integrated circuit platem, its position is (bm,cm), corresponding electromagnetic intensity is Lam。
In comparison process between electromagnetic intensity, it should be noted that absolute force and the electrical current of input are to obtaining
Electromagnetic intensity influence, such as：When absolute force is in the range of 0.5-0.6G, during cell phone standby, loud speaker
Maximum electromagnetic intensity is 620G, and the electric current of electrified wire often increases 100mA, and magnetic induction intensity probably increases 0.05G.It is integrated
Integrated circuit plate on circuit board such as mobile phone, when mobile phone integrated circuit plate under normal circumstances, in it is standby, booting or letter
During the different conditions of number transmitting, the current conditions on the integrated circuit plate of interior of mobile phone are also different, under normal circumstances, booting moment
Electric current about 200mA or so, standby current about 50-100mA or so, electric current is 300mA during transmitting, so being obtained in comparison process
The electromagnetic intensity of integrated circuit plate with pre-stored electromagnetic intensity should be obtained under same state
's.When electromagnetic intensity is scanned, position of the electromagnetic induction element on circuit board should be kept to be consistent, preferentially
The position of chosen distance integrated circuit plate 1cm.
S4：Export the integrated circuit plate fault message.
Specifically, the fault message of the integrated circuit plate includes the position of failure point information of integrated circuit plate, utilization is defeated
Go out the fault message of equipment output integrated circuit plate, the position of the trouble point including integrated circuit plate.
Specifically, the fault message of obtained integrated circuit plate is exported, shown using printer, display screen, LED numbers
Show that the output equipments such as pipe carry out display output, when display screen is used to be exported, the display screen can will scan first
The image information either image information output of each position on integrated circuit plate and in described first image information or integrated
The position of trouble point is identified in the image information of each position on circuit board, make maintenance personal convenient to circuit board into
Row repair.
A kind of integrated circuit plate fault detection method based on electromagnetic signature provided in an embodiment of the present invention, by integrated
Circuit board carries out electromagnetic induction scanning and image scanning, and the image information of acquisition is handled, and accurately obtains integrated electricity
Electromagnetic intensity on integrated circuit plate, is accurately detected, obtains by the electromagnetic intensity of each position on the plate of road
Fault message on to integrated circuit plate, makes maintenance personal rapidly place under repair to integrated circuit plate.
Embodiment 2：
A kind of integrated circuit plate fault detection system based on electromagnetic signature that the embodiment of the present invention 2 provides, such as Fig. 2 institutes
Show, including：
Imaging sensor for being scanned to integrated circuit plate, obtains the first image information.
Specifically, described image sensor may be configured as CCD optocoupler components, using CCD optocoupler components to collection
Linear scan is carried out into circuit board, obtains the first image information, described first image information includes each on integrated circuit plate
The image information of position is also possible that the image information of each position outside integrated circuit plate in described first image information.
Further, the integrated circuit plate fault detection system based on electromagnetic signature, further includes：
Hall sensor for the integrated circuit plate to be carried out electromagnetic induction scanning, obtains the first electromagnetic intensity.
Specifically, AK8975C (BGA) Hall magnetic field sensors can be selected to the integrated circuit plate in the Hall sensor
Carry out electromagnetic induction scanning.Preferably, the Hall sensor carries out electromagnetism by way of linear scan to integrated circuit plate
Sensitive scanning obtains the first electromagnetic intensity, and the first electromagnetic intensity at this time includes the electromagnetism sense on integrated circuit plate
Intensity is answered, first electromagnetic intensity can also include the electromagnetic intensity of each position outside integrated circuit plate.
Further, the integrated circuit plate fault detection system based on electromagnetic signature, further includes：
Acquiring unit, for according to described first image information and the first electromagnetic intensity, obtaining integrated circuit plate
The current electromagnetic induction of upper each position.
Specifically, the acquiring unit includes image processing unit, described image processing unit is used for first figure
As information progress image procossing, described image processing includes feature extraction, obtains the position letter of multiple points on integrated circuit plate
Breath.The feature extraction includes edge detection, Corner Detection, region detection etc., and edge detection can detect the side of integrated circuit plate
Multiple points on edge position, the point that the Corner Detection can change greatly image information mean curvature are detected.Feature extraction
Concrete mode can be determined according to the concrete shape of integrated circuit plate, described image processing further includes filtering, signal amplification, two-value
Change, image cutting etc..Preferably, multiple points on the integrated circuit plate of acquisition are by certain image procossing, are obtained at this time
Point be the point for having certain rule.
The acquiring unit is additionally operable to further determine that the collection according to the location information of multiple points on integrated circuit plate
Into the more specific location information of circuit board, and according to the more specific location information and the first electromagnetic intensity of integrated circuit plate, obtain
The current electromagnetic induction of each position on integrated circuit plate.Such as using edge detection to the frame of integrated circuit plate into
During row detection, the location information of multiple points detected at this time is exactly the location information of multiple points at integrated circuit plate edge, root
According to the location information of multiple points on integrated circuit plate, straight line can be extracted, forms a frame, the frame is exactly integrated circuit
The marginal position of plate, so that it is determined that the specific location of integrated circuit plate, is then integrated further according to the first electromagnetic intensity
The current electromagnetic induction of each position on circuit board.
It should be understood that the range that the Hall sensor and imaging sensor are scanned the integrated circuit plate
Should be consistent, and the point being scanned should be identical, such as when the point that the Hall sensor scans is a respectively1,a2…
anDuring point, the point of described image sensor scanning should also be a1,a2…anPoint, a of the scanning1,a2…anThe image letter of point
Breath and electromagnetic intensity correspond to Pa respectively1,Pa2…PanAnd La1,La2…Lan, according to the position of integrated circuit plate and first
Point on electromagnetic intensity, such as the specific location of integrated circuit plate is a2…an-2, just can obtain on integrated circuit plate at this time
Each position current electromagnetic induction La2…Lan-2。
Further, the integrated circuit plate fault detection system based on electromagnetic signature, further includes：
Electromagnetic signal processing unit, for electromagnetic intensity current on the integrated circuit plate to be amplified and modulus
Conversion process obtains target electromagnetic induction.
The electromagnetic signal processing unit is used to carry out the current electromagnetic induction of position each on integrated circuit plate
Amplification and digital-to-analogue conversion process, the signal of the current electromagnetic induction of each position on amplification circuit plate, and will described in
The signal of electromagnetic intensity is converted into digital signal.To the electromagnetic intensity in the process of processing, can also be right
The signal of the electromagnetic intensity is filtered, and electromagnetic intensity can obtain integrated circuit after carrying out a series of processing
Target electromagnetic induction on plate.Electromagnetism sense is carried out to integrated circuit plate when using AK8975C (BGA) Hall magnetic field sensors
After intensity is answered to be scanned, due to the AK8975C (BGA) Hall magnetic field sensor collection analog circuit, digital circuit, power supply mould
In one, the Hall magnetic field sensor can also be by the electromagnetic intensity progress for scanning and directly obtaining for block, interface module
Signal amplifies, A/D analog-to-digital conversions, and the processing such as filtering, the signal of the electromagnetic intensity of the acquisition is amplified also available
Signal is amplified by transistor amplifier or integrated transporting discharging chip, and the AK8975C (BGA) can be used in the analog-to-digital conversion
A/D converter built in Hall magnetic field sensor chip makes current electromagnetic induction by analog signal.The A/D moduluses turn
It changes and A/D moulds also is carried out to the signal of electromagnetic intensity using the circuit that the chips such as external chip such as microcontroller, XS128 form
Number conversion can also be used external hardware circuit and the signal of electromagnetic intensity carried out A/D analog-to-digital conversions, to electromagnetic intensity
The filtering of signal be also filtered using capacitance.
Further, the integrated circuit plate fault detection system based on electromagnetic signature, further includes：
Comparing unit, for the target electromagnetic induction and pre-stored initial electromagnetic induction to be compared
It is right, the fault message of integrated circuit plate is obtained, includes the position of the trouble point on integrated circuit plate.
Specifically, the comparing unit further includes difference operation unit and judging unit, the difference operation unit is used for
Target electromagnetic induction and pre-stored initial electromagnetic induction are subjected to difference operation, it is strong to obtain difference electromagnetic induction
Degree；The judging unit, for the difference electromagnetic intensity threshold range to be compared, when the difference electromagnetic induction
When intensity is in threshold range, then judge that integrated circuit plate does not break down in the point；When the difference electromagnetic intensity
When outside threshold range, then judge that integrated circuit plate breaks down in the point.
Further, the integrated circuit plate fault detection system based on electromagnetic signature, further includes：
Output unit, for exporting the fault message of the integrated circuit plate.
Specifically, the output unit exports the fault message of the integrated circuit plate, the integrated circuit for display
The output unit of plate may be configured as digital display module, display screen, alarm module, when the output unit is set as display screen
When, the display screen can show the first image information, and again be identified the position of the trouble point on the integrated circuit plate,
Maintenance personal is made intuitively to find out the position of trouble point on integrated circuit plate.
Sensitive scanning is carried out for convenience of to integrated circuit plate, the integrated circuit plate and described image sensor when making scanning
It makes a relative move, the Hall sensor and imaging sensor can be integrated on same customization plate, institute with Hall sensor
It states customization plate and may be configured as a length of 120mm, width 4mm, described customize can set a line Hall sensor and a line CCD light on plate
Charge coupled device, the customization plate are set on an erecting bed, and the integrated circuit plate is fixed on the erecting bed, the customization
Plate is gone back in the either above or below of the integrated circuit plate, the integrated circuit plate fault detection system based on electromagnetic signature
Including motor control unit and stepper motor, the motor control unit controls the stepper motor rotation, and controls customization plate
Linear scan is carried out to integrated circuit plate.
The integrated circuit plate fault detection system based on electromagnetic signature further includes storage unit, and the storage unit is used
The electromagnetic intensity of integrated circuit plate when the integrated circuit plate is normally carried out work stores, i.e. initial electromagnetic
Induction, the storage unit can also be by the threshold ranges of the electromagnetic intensity on position each on the integrated circuit plate
It is stored, the storage unit can also store the first image information, image information on integrated circuit plate etc..Preferably, institute
State the first image information, the image information of integrated circuit plate is stored in the matrix form.It is believed that the storage unit can
It is set as plug-in type hard disk, intelligent memory card (Smart Media Card, SMC), secure digital (Secure Digital, SD)
Card, flash card (Flash Card) etc..
It should be noted that when being scanned to integrated circuit plate, it is contemplated that ground magnetic influence sum aggregate into circuit board
Energized state is handled, and the electromagnetic induction that the electromagnetic intensity of the integrated circuit plate of acquisition should be stored with memory module is strong
Degree obtains under same energized state, is needed if not when being compared to the electromagnetic intensity of integrated circuit plate
It is corrected processing.
It should be appreciated that the acquiring unit, electromagnetic signal processing unit, comparing unit, difference operation unit and judgement
Unit can be handled using processor, and the processor can be central processing unit (Central Processing
Unit, CPU), which can also be other general processors, digital signal processor (Digital Signal
Processor, DSP), it is application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), existing
Into programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic device, discrete
Door or transistor logic, discrete hardware components etc..General processor can be that microprocessor or the processor also may be used
To be any conventional processor etc..
Integrated circuit plate fault detection system provided in an embodiment of the present invention based on electromagnetic signature, passes through Hall sensor
Electromagnetic induction scanning and image scanning are carried out to integrated circuit plate respectively, and the image information of acquisition is carried out with imaging sensor
Processing, and the electromagnetic intensity of each position on integrated circuit plate is accurately obtained, obtain the failure letter of integrated circuit plate
Breath, makes maintenance personal rapidly place under repair to integrated circuit plate.
Those of ordinary skill in the art may realize that each exemplary lists described with reference to the embodiments described herein
Member and algorithm steps can be realized with the combination of electronic hardware, computer software or the two, in order to clearly demonstrate hardware
With the interchangeability of software, each exemplary composition and step are generally described according to function in the above description.This
A little functions are performed actually with hardware or software mode, specific application and design constraint depending on technical solution.Specially
Industry technical staff can realize described function to each specific application using distinct methods, but this realization is not
It is considered as beyond the scope of this invention.
It is apparent to those skilled in the art that for convenience of description and succinctly, the dress of foregoing description
The specific work process with unit is put, the corresponding process in preceding method embodiment can be referred to, details are not described herein.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in various equivalent modifications or replace
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection domain subject to.
Claims (8)
1. a kind of integrated circuit plate fault detection method based on electromagnetic signature, which is characterized in that include the following steps：
The current electromagnetic induction of each position of integrated circuit plate is obtained by imaging sensor and Hall sensor；
The current electromagnetic induction is amplified and analog-to-digital conversion process, obtains target electromagnetic induction；
The target electromagnetic induction with pre-stored initial electromagnetic induction is compared, obtains integrated circuit plate
Fault message, the fault message include integrated circuit plate on trouble point position；
Export the integrated circuit plate fault message.
2. the integrated circuit plate fault detection method according to claim 1 based on electromagnetic signature, which is characterized in that pass through
The step of imaging sensor and Hall sensor obtain the current electromagnetic induction of each position of integrated circuit plate specifically includes：
Image scanning is carried out to integrated circuit plate by imaging sensor, obtains the first image information；
Image procossing is carried out to described first image information, described image processing includes feature extraction, obtains the position of multiple points
Information；
Electromagnetic induction scanning is carried out to integrated circuit plate by Hall sensor, obtains the first electromagnetic intensity；
According to the location information and the first electromagnetic intensity of multiple points of extraction feature, each position on integrated circuit plate is obtained
Current electromagnetic induction.
3. the integrated circuit plate fault detection method according to claim 1 based on electromagnetic signature, which is characterized in that described
Target electromagnetic induction is compared with pre-stored initial electromagnetic induction, obtains the trouble point of integrated circuit plate
The specific steps of position include：
Target electromagnetic induction and pre-stored initial electromagnetic intensity are subjected to difference operation, it is strong to obtain difference electromagnetic induction
Degree；
When the difference electromagnetic intensity is in threshold range, then judge that integrated circuit plate does not break down in the point；
When the difference electromagnetic intensity is outside threshold range, then judge that integrated circuit plate breaks down in the point.
4. according to integrated circuit plate fault detection method of the claim 1-3 any one of them based on electromagnetic signature, feature
It is, described image sensor and Hall sensor are that working as each position of integrated circuit plate is obtained by way of linear scan
Preceding electromagnetic intensity.
5. a kind of integrated circuit plate fault detection system based on electromagnetic signature, which is characterized in that including：
Imaging sensor for carrying out image scanning to integrated circuit plate, obtains the first image information；
Hall sensor for carrying out electromagnetic induction scanning to integrated circuit plate, obtains the first electromagnetic intensity；
Acquiring unit, for according to described first image information and the first electromagnetic intensity, obtaining each on integrated circuit plate
The current electromagnetic induction of a position；
Electromagnetic signal processing unit for being amplified to current electromagnetic induction and analog-to-digital conversion process, obtains target electricity
Magnetic induction intensity；
Comparing unit, for the target electromagnetic induction to be compared with pre-stored initial electromagnetic induction,
The fault message of integrated circuit plate is obtained, includes the position of the trouble point on integrated circuit plate；
Output unit, for exporting the fault message of the integrated circuit plate.
6. the integrated circuit plate fault detection system according to claim 5 based on electromagnetic signature, which is characterized in that described
Acquiring unit further includes image processing unit, and described image processing unit is used to carry out at image described first image information
Reason, described image processing include carrying out feature extraction to the first image information, obtain the position letter of multiple points on integrated circuit plate
Breath；The acquiring unit is additionally operable to according to the location information of multiple points and first electromagnetic induction on obtained integrated circuit plate
Intensity obtains the current electromagnetic induction of each position on integrated circuit plate.
7. the integrated circuit plate fault detection system according to claim 5 based on electromagnetic signature, which is characterized in that described
Comparing unit further includes：
Difference operation unit, for target electromagnetic induction and pre-stored initial electromagnetic induction to be carried out difference fortune
It calculates, obtains difference electromagnetic intensity；
Judging unit, for the difference electromagnetic intensity threshold range to be compared, when the difference electromagnetic induction is strong
When degree is in threshold range, then judge that integrated circuit plate does not break down in the point；When the difference electromagnetic intensity exists
When outside threshold range, then judge that integrated circuit plate breaks down in the point.
8. according to integrated circuit plate fault detection system of the claim 5-7 any one of them based on electromagnetic signature, feature
It is, described image sensor and Hall sensor carry out image scanning and electricity by way of linear scan to integrated circuit plate
Magnetic induction scans.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711348739.1A CN108181323A (en) | 2017-12-15 | 2017-12-15 | Integrated circuit plate fault detection method and system based on electromagnetic signature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711348739.1A CN108181323A (en) | 2017-12-15 | 2017-12-15 | Integrated circuit plate fault detection method and system based on electromagnetic signature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108181323A true CN108181323A (en) | 2018-06-19 |
Family
ID=62546167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711348739.1A Pending CN108181323A (en) | 2017-12-15 | 2017-12-15 | Integrated circuit plate fault detection method and system based on electromagnetic signature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108181323A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000915A (en) * | 2021-03-04 | 2021-06-22 | 白荣益 | Device for automatically adjusting milling groove depth of circuit board by utilizing electromagnetic strength |
| CN113740709A (en) * | 2021-09-02 | 2021-12-03 | 广州普庆电子科技有限公司 | Circuit board fault device detection method based on electromagnetic scanning |
| CN114264933A (en) * | 2021-12-21 | 2022-04-01 | 厦门宇昊软件有限公司 | Fault detection method and fault detection system of integrated circuit board |
| CN115014427A (en) * | 2021-03-05 | 2022-09-06 | 奥特斯(中国)有限公司 | Measuring physical properties of component carriers based on design data |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101033958A (en) * | 2007-02-01 | 2007-09-12 | 华中科技大学 | Mechanical vision locating method |
| CN102173296A (en) * | 2011-01-26 | 2011-09-07 | 北京交通大学 | Synchronized drive wheel type electromagnetic rail detecting device |
| CN103499022A (en) * | 2013-09-30 | 2014-01-08 | 清华大学 | Sensor for distinguishing whether corrosion defects belong to inner surface of pipeline or outer surface of pipeline |
| CN104407043A (en) * | 2014-12-03 | 2015-03-11 | 江苏大学 | On-line defect detection device for steel cords based on electromagnetic induction and detection method thereof |
| CN204630983U (en) * | 2015-01-26 | 2015-09-09 | 黄景德 | A kind of circuit board internal structural defects signal processing apparatus based on electromagnetic induction |
| CN105527339A (en) * | 2016-03-01 | 2016-04-27 | 江南大学 | Nondestructive detection method based on combined U-shaped pulse electromagnetic sensor |
| CN107255874A (en) * | 2017-08-10 | 2017-10-17 | 国网重庆市电力公司电力科学研究院 | A kind of electric energy meter liquid-crystal apparatus fault detection method and system |
-
2017
- 2017-12-15 CN CN201711348739.1A patent/CN108181323A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101033958A (en) * | 2007-02-01 | 2007-09-12 | 华中科技大学 | Mechanical vision locating method |
| CN102173296A (en) * | 2011-01-26 | 2011-09-07 | 北京交通大学 | Synchronized drive wheel type electromagnetic rail detecting device |
| CN103499022A (en) * | 2013-09-30 | 2014-01-08 | 清华大学 | Sensor for distinguishing whether corrosion defects belong to inner surface of pipeline or outer surface of pipeline |
| CN104407043A (en) * | 2014-12-03 | 2015-03-11 | 江苏大学 | On-line defect detection device for steel cords based on electromagnetic induction and detection method thereof |
| CN204630983U (en) * | 2015-01-26 | 2015-09-09 | 黄景德 | A kind of circuit board internal structural defects signal processing apparatus based on electromagnetic induction |
| CN105527339A (en) * | 2016-03-01 | 2016-04-27 | 江南大学 | Nondestructive detection method based on combined U-shaped pulse electromagnetic sensor |
| CN107255874A (en) * | 2017-08-10 | 2017-10-17 | 国网重庆市电力公司电力科学研究院 | A kind of electric energy meter liquid-crystal apparatus fault detection method and system |
Non-Patent Citations (7)
| Title |
|---|
| 宋昀岑: "印制电路板光学自动检测中的配准算法研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
| 尹文心 等: "用霍尔传感器测量磁感应强度", 《中学物理教学参考》 * |
| 张桂南 等: "基于角点匹配与谱聚类的接触网绝缘子破损/夹杂异物故障检测", 《仪器仪表学报》 * |
| 杨理践 等: "金属板缺陷的低频电磁检测", 《无损检测》 * |
| 武万辉 等: "管道漏磁检测技术及应用", 《管道技术与设备》 * |
| 毛端海 等: "基于磁场映像的印制电路板故障诊断方法研究", 《上海航天》 * |
| 高同辉 等: "基于LabVIEW的非接触式电路板短路检测系统设计", 《实验室研究与探索》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000915A (en) * | 2021-03-04 | 2021-06-22 | 白荣益 | Device for automatically adjusting milling groove depth of circuit board by utilizing electromagnetic strength |
| CN113000915B (en) * | 2021-03-04 | 2022-07-15 | 恩达电路(深圳)有限公司 | Device for automatically adjusting milling groove depth of circuit board by using electromagnetic strength |
| CN115014427A (en) * | 2021-03-05 | 2022-09-06 | 奥特斯(中国)有限公司 | Measuring physical properties of component carriers based on design data |
| CN113740709A (en) * | 2021-09-02 | 2021-12-03 | 广州普庆电子科技有限公司 | Circuit board fault device detection method based on electromagnetic scanning |
| CN114264933A (en) * | 2021-12-21 | 2022-04-01 | 厦门宇昊软件有限公司 | Fault detection method and fault detection system of integrated circuit board |
| CN114264933B (en) * | 2021-12-21 | 2024-02-13 | 厦门宇昊软件有限公司 | Fault detection method and fault detection system for integrated circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108181323A (en) | Integrated circuit plate fault detection method and system based on electromagnetic signature | |
| CN100376867C (en) | Film detection apparatus, inspection system, and method of inspecting printed circuit board | |
| CN103399248A (en) | PCB (printed circuit board) defect mass detection system and method | |
| CN105378700A (en) | Capture and association of measurement data | |
| CN110709905A (en) | Automatic inspection system and control method of automatic inspection system | |
| CN104183517B (en) | Method and system for intelligent weak pattern diagnosis | |
| WO2007144986A1 (en) | Device and method for inspecting external appearance of wire harness | |
| JP4293438B2 (en) | Inspection device | |
| CN103811367B (en) | Product defects detection method | |
| CN113284094A (en) | Method, device, storage medium and equipment for acquiring defect information of glass substrate | |
| JP2019196992A (en) | Reinforcing bar test method and reinforcing bar test system | |
| JP2011060067A (en) | Automatic meter reading system | |
| JP7414797B2 (en) | Manufacturing control method | |
| KR101507223B1 (en) | Inspection system for field equipment using smart device and inspection method for field equipment therefor | |
| CN213457742U (en) | Welding operation monitoring system | |
| CN105278441A (en) | Data interaction system | |
| CN202221452U (en) | Automatic testing system | |
| CN103776385A (en) | Stereo garage frame structure deformation monitoring early-warning system and operation principle thereof | |
| CN115077722B (en) | Partial discharge and temperature comprehensive monitoring system and method applied to high-voltage cabinet | |
| TWI667557B (en) | Instrumentation image analyzing device, system, method, and computer readable medium | |
| KR101559343B1 (en) | management analysis system for Condition Monitoring and facility history of Railway Vehicle | |
| CN115379197A (en) | Method and device for detecting lens surface of camera product on production line | |
| CN112070091A (en) | Image recognition system for equipment detection pipeline | |
| CN110888361A (en) | Hot-line work tool management system and method with tool flaw detection function | |
| JP2002365021A (en) | Strain detection system and strain detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |