CN108178900A - It can collapse and be unfolded the preparation method of composite material support bar epoxy resin-base - Google Patents
It can collapse and be unfolded the preparation method of composite material support bar epoxy resin-base Download PDFInfo
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- CN108178900A CN108178900A CN201711414839.XA CN201711414839A CN108178900A CN 108178900 A CN108178900 A CN 108178900A CN 201711414839 A CN201711414839 A CN 201711414839A CN 108178900 A CN108178900 A CN 108178900A
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- epoxy resin
- composite material
- support bar
- parts
- bisphenol
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of preparation methods collapsed and composite material support bar epoxy resin-base is unfolded, belong to advanced composite material technical field.The resin matrix is in terms of mass fraction, including 10 80 parts of modifying epoxy resin by organosilicon, 70 100 parts of composition epoxy resins, 0 30 parts of toughener, 5 50 parts of curing agent and 1 10 parts of accelerating agents；Wherein, composition epoxy resin mass fraction meter, composition epoxy resin is by 20 80 parts of liquid-state epoxy resins, 80 20 parts of solid-state or semisolid epoxy resin compositions.Support construction of the present invention as Large-scale satellite satellite antenna, the composite material support bar that can be collapsed and be unfolded need for a long time in orbit, to be irradiated for a long time by space radiations such as elemental oxygen, ultraviolet lights.The present invention one is had the advantages that by introducing the modifying epoxy resin by organosilicon monomer containing silicon oxygen bond, to improve the resistance to space radiation performance of epoxy resin-base, so as to improve the service life of composite material support bar and satellite antenna.
Description
Technical field
The present invention relates to a kind of preparation methods collapsed and composite material support bar epoxy resin-base is unfolded, belong to
Advanced composite material technical field.
Background technology
It can collapse and the support construction that composite material support bar is Large-scale satellite film antenna is unfolded, be stored by carrier rocket
The mechanisms such as the limitation in space, Large-scale satellite film antenna need close stored collapsed in payload bay, after reaching planned orbit,
By composite material support bar natural resiliency, entire film antenna is driven to be unfolded.At present, satellite antenna is intended to enlargement, light
The direction of quantization is developed, and the rigidity supporting structure of traditional satellite antenna is difficult to meet very large antenna use demand.Carbon fiber
The polymer matrix composites of enhancing have the characteristics that light-weight, excellent in mechanical performance, designability are strong, become large-scale satellite antenna
The ideal material of support construction.
Satellite antenna in orbit when, can for a long time be irradiated by high-energy rays such as elemental oxygen, ultraviolet lights.With regard to composite wood
For expecting supporting rod, composition is mainly made of two kinds of components of epoxy resin-base and carbon fiber, and carbon fiber is a kind of inorganic material
Material, is influenced little by space radiation.And epoxy resin-base is a kind of organic material, is affected by space radiation, it is long
The radiation of time can accelerate its degradation, cause the reduction of composite material support bar performance and used life, entirely be defended so as to reduce
The reduction of star film antenna service life.Therefore, it is badly in need of improving the resistance to space radiation performance of epoxy resin-base, it is compound to ensure
The performance and used life of materials for support bar and satellite antenna.
Contain silicon oxygen bond in organic siliconresin, be a kind of with resistance to space radiation, high-low temperature resistant, there is excellent stability
Resin.But the compatibility of organic siliconresin and epoxy resin is very poor, it is impossible to form uniform system, mixed resin system exists
Mechanical property after being heating and curing is poor.
Invention content
The purpose of the present invention is to provide a kind of resistance to space radiations, can be used as Large-scale satellite satellite antenna composite material support
The preparation method of the resin matrix of bar, to improve the resistance to space radiation performance of composite material support bar, so as to improve spaceborne day
The service life of line.
The technical solution of the present invention：
The resin matrix is in terms of mass fraction, including 10-80 parts of modifying epoxy resin by organosilicon, 70-100 parts of asphalt mixtures modified by epoxy resin
Oil/fat composition, 0-30 part toughener, 5-50 parts of curing agent and 1-10 parts of accelerating agents；Wherein, composition epoxy resin mass fraction
Meter, composition epoxy resin is by 20-80 parts of liquid-state epoxy resins, 80-20 parts of solid-state or semisolid epoxy resin compositions.
The modifying epoxy resin by organosilicon is the bisphenol-A-type epoxy resin containing silicon oxygen bond, the Bisphenol F containing silicon oxygen bond
Type epoxy resin, the bisphenol f type epoxy resin containing silicon oxygen bond, contains silicon oxygen bond at the bisphenol-s epoxy resin containing silicon oxygen bond
Novolac epoxy resin, the trifunctional epoxy resin containing silicon oxygen bond, in the four-functional group epoxy resin containing silicon oxygen bond
One or more of combinations.
The liquid-state epoxy resin is bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, double
One or more of phenol F types epoxy resin, novolac epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin
Combination.
The solid-state or semisolid epoxy resin is bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol S type epoxy
The combination of one or more of resin, bisphenol f type epoxy resin, novolac epoxy resin.
The toughener is polyurethane, polyphenylene sulfide, poly(aryl ether ketone), polyether-ether-ketone, polysulfones, polyether sulfone, thermoplasticity polyamides
The combination of the one or more such as imines, makrolon, polyamide, polyureas.
The curing agent is dicyandiamide, the curing of modified dicyandiamine, aliphatic amine, aromatic amine, imidazoles, hydrazides
The combination of the one or more such as agent.
The accelerating agent group one or more of for organic urea and its derivative, imidazoles and imidazole salts, phenol accelerant etc.
It closes.
The method that composite material support bar epoxy resin-base can be collapsed and be unfolded by preparing includes the following steps：
(1) modifying epoxy resin by organosilicon prepared and composition epoxy resin are mixed and heated to 40-120 DEG C of temperature
Degree carries out mechanical agitation, until mixture becomes clear transparent solutions；
(2) into dissolved matter obtained by step (1), under the conditions of 40-90 DEG C, toughener, curing agent and accelerating agent are added in, and
Mechanical agitation is carried out under 1000-1500 revs/min of rotating speed, it is spare after stirring 10-30 minutes；
(3) mixture obtained by step (2) is transferred in three-roll mill and milled, milled 3-5 times, obtain to collapse
It is spare with expansion composite material support bar epoxy resin-base.
The present invention has the advantage that and advantageous effect：
The present invention provides a kind of composite material support bar epoxy resin for collapsing and being unfolded of resistance to space radiation performance
The preparation method of matrix.As the support construction of Large-scale satellite satellite antenna, the composite material support bar that can be collapsed and be unfolded needs
It to be irradiated for a long time by space radiations such as elemental oxygen, ultraviolet lights in orbit for a long time.A beneficial effect of the invention
It is by introducing the modifying epoxy resin by organosilicon monomer containing silicon oxygen bond, to improve the resistance to space radiation of epoxy resin-base
Can, so as to improve the service life of composite material support bar and satellite antenna.Large-scale satellite antenna developed area is flat up to 400
Rice, is limited by carrier rocket memory space, and large-scale satellite antenna needs are crimped gathering on ground, are relied on after injection
Supporting rod itself elasticity carry out antenna expansion, thus need composite material support bar occur large curved deformation when not
It destroys.The present invention using the silicon oxygen bond in the modifying epoxy resin by organosilicon monomer containing silicon oxygen bond there is larger deformation to revolve
Turn ability, the toughness of resin matrix can be improved, so as to improve the crooked deformability of composite material support bar and damage capability, this
It is another advantageous effect of the invention.The composite material support bar epoxy resin-base of resistance to space radiation proposed by the present invention,
The resistance to space radiation performance of supporting rod is not only improved, and the moulding process of supporting rod can be met, keeps higher mechanical property, from
And the service life of large-scale satellite antenna is improved, it can be widely applied in spatial compounding material structure.
Specific embodiment
The following instance content that the present invention is furture elucidated, these embodiments are merely to illustrate the present invention, and unrestricted
The range of invention.
Resin is made of the raw material of following parts by weight：
Modifying epoxy resin by organosilicon：10-80 parts
Composition epoxy resin：70-100 parts (composition epoxy resin in terms of mass fraction, composition epoxy resin by
20-80 parts of liquid-state epoxy resins, 80-20 parts of solid-state or semisolid epoxy resin)
Toughener：1-30 parts
Curing agent：5-50 parts
Accelerating agent：0-10 parts
The modifying epoxy resin by organosilicon is the bisphenol-A-type epoxy resin containing silicon oxygen bond, the Bisphenol F containing silicon oxygen bond
Type epoxy resin, the bisphenol f type epoxy resin containing silicon oxygen bond, contains silicon oxygen bond at the bisphenol-s epoxy resin containing silicon oxygen bond
Novolac epoxy resin, the trifunctional epoxy resin containing silicon oxygen bond, in the four-functional group epoxy resin containing silicon oxygen bond
One or more of combinations.The liquid-state epoxy resin is bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol S type ring
One kind in oxygen resin, bisphenol f type epoxy resin, novolac epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin
Or several combination.The solid-state or semisolid epoxy resin is bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol S
The combination of one or more of type epoxy resin, bisphenol f type epoxy resin, novolac epoxy resin.The toughener is poly- ammonia
Ester, polyphenylene sulfide, poly(aryl ether ketone), polyether-ether-ketone, polysulfones, polyether sulfone, thermoplastic polyimide, makrolon, polyamide, polyureas
Deng one or more of combinations.The curing agent is dicyandiamide, modified dicyandiamine, aliphatic amine, aromatic amine, imidazoles
The combination of the one or more such as class, hydrazides curing agent.The accelerating agent for organic urea and its derivative, imidazoles and imidazole salts,
The combination of the one or more such as phenol accelerant.
The preparation method of composite material support bar epoxy resin-base can be collapsed and be unfolded, including step：
(1) modifying epoxy resin by organosilicon, composition epoxy resin in constant weight ratio are mixed, is heated to a constant temperature
Degree until mixture becomes uniform solution, obtains dissolved matter；
(2) into dissolved matter obtained by step (1), a certain amount of toughener, curing agent, accelerating agent is sequentially added and is stirred equal
It is even, obtain semisolid mixture.
(3) mixture of gained in step (2) is turned fully to be milled under certain rotating speed using three-roll mill,
Then it packages spare.
Embodiment 1
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of polyether sulfone toughener are added in after into uniform solution, and are stirred evenly, form suspension.10 grams of double cyanogen are added in into suspension
Amine hardener and 3 grams of polyureas accelerating agents, and stir evenly.Obtained suspension is transferred to three-roll mill, is milled repeatedly 5 times
After take out, refrigeration it is spare.
Embodiment 2
40 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 20 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of polyether-ether-ketone toughener are added in after into uniform solution, and are stirred evenly, form suspension.10 grams pairs are added in into suspension
Cyanamide curing agent and 3 grams of polyureas accelerating agents, and stir evenly.Obtained suspension is transferred to three-roll mill, mills 5 repeatedly
It is taken out after secondary, refrigeration is spare.
Embodiment 3
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of polyphenylene sulfide toughener are added in after into uniform solution, and are stirred evenly, form suspension.10 grams are added in into suspension to change
Property dicy-curing agent and 3 grams of polyureas accelerating agents, and stir evenly.Obtained suspension is transferred to three-roll mill, repeatedly
It is taken out after milling 5 times, refrigeration is spare.
Embodiment 4
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams polyurethane toughened dose is added in after into uniform solution, and is stirred evenly, forms suspension.10 grams of double cyanogen are added in into suspension
Amine hardener and 3 grams of 2-ethyl-4-methylimidazole accelerating agents, and stir evenly.Obtained suspension is transferred to three rollers to mill
Machine takes out after milling repeatedly 5 times, and refrigeration is spare.
Embodiment 5
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of polyamide toughener are added in after into uniform solution, and are stirred evenly, form suspension.10 grams of 2- second are added in into suspension
Base -4-methylimidazole curing agent, and stir evenly.Obtained suspension is transferred to three-roll mill, is taken after milling repeatedly 5 times
Go out, refrigeration is spare.
Embodiment 6
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of thermoplastic polyimide toughener are added in after into uniform solution, and are stirred evenly, form suspension.It is added in into suspension
10 grams of dicy-curing agents and 3 grams of 2-ethyl-4-methylimidazole accelerating agents, and stir evenly.Obtained suspension is transferred to
Three-roll mill is taken out after milling repeatedly 5 times, and refrigeration is spare.
Embodiment 7
30 grams of modifying epoxy resin by organosilicon monomer (Chinese Academy of Sciences's mistakes are added in the beaker equipped with mechanical agitation, thermometer
Journey institute product), 30 grams of E54 epoxy monomers, after 40 grams of E20 epoxy monomers, after stirring and beginning heat to 70 DEG C, shape
3 grams of thermoplastic polyimide toughener are added in after into uniform solution, and are stirred evenly, form suspension.It is added in into suspension
30 grams of 4,4'-diaminodiphenyl sulfone curing agent, and stir evenly.Obtained suspension is transferred to three-roll mill, is ground repeatedly
It is taken out after grinding 5 times, refrigeration is spare.
Claims (8)
1. one kind can collapse and be unfolded composite material support bar epoxy resin-base, which is characterized in that the resin matrix with
Mass fraction meter, including 10-80 parts of modifying epoxy resin by organosilicon, 70-100 parts of composition epoxy resins, 0-30 parts of toughener,
5-50 parts of curing agent and 1-10 parts of accelerating agents；Wherein, composition epoxy resin mass fraction meter, composition epoxy resin is by 20-
80 parts of liquid-state epoxy resins, 80-20 parts of solid-state or semisolid epoxy resin compositions.
2. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
It is, the modifying epoxy resin by organosilicon is the bisphenol-A-type epoxy resin containing silicon oxygen bond, the bisphenol-f type containing silicon oxygen bond
Epoxy resin, the bisphenol f type epoxy resin containing silicon oxygen bond, contains silicon oxygen bond at the bisphenol-s epoxy resin containing silicon oxygen bond
Novolac epoxy resin, the trifunctional epoxy resin containing silicon oxygen bond, one in the four-functional group epoxy resin containing silicon oxygen bond
Kind or several combinations.
3. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
It is the liquid-state epoxy resin for bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, bisphenol-f type
The combination of one or more of epoxy resin, novolac epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin.
4. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
It is the solid-state or semisolid epoxy resin for bisphenol-A-type epoxy resin, bisphenol f type epoxy resin, bisphenol S type epoxy tree
The combination of one or more of fat, bisphenol f type epoxy resin, novolac epoxy resin.
5. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
Be the toughener for polyurethane, polyphenylene sulfide, poly(aryl ether ketone), polyether-ether-ketone, polysulfones, polyether sulfone, thermoplastic polyimide,
The combination of the one or more such as makrolon, polyamide, polyureas.
6. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
It is the curing agent for dicyandiamide, modified dicyandiamine, aliphatic amine, aromatic amine, imidazoles, hydrazides curing agent etc.
One or more of combinations.
7. one kind according to claim 1 can collapse and be unfolded composite material support bar epoxy resin-base, feature
It is the accelerating agent combination one or more of for organic urea and its derivative, imidazoles and imidazole salts, phenol accelerant etc..
8. a kind of method that composite material support bar epoxy resin-base can be collapsed and be unfolded described in claim 1 for preparing includes
Following steps：
(1) modifying epoxy resin by organosilicon prepared and composition epoxy resin are mixed and heated to 40-120 DEG C of temperature,
Mechanical agitation is carried out, until mixture becomes clear transparent solutions；
(2) into dissolved matter obtained by step (1), under the conditions of 40-90 DEG C, addition toughener, curing agent and accelerating agent, and
Mechanical agitation is carried out under 1000-1500 revs/min of rotating speed, it is spare after stirring 10-30 minutes；
(3) mixture obtained by step (2) is transferred in three-roll mill and milled, milled 3-5 times, obtain to collapse and opening up
It is spare to open composite material support bar epoxy resin-base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711414839.XA CN108178900A (en) | 2017-12-22 | 2017-12-22 | It can collapse and be unfolded the preparation method of composite material support bar epoxy resin-base |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711414839.XA CN108178900A (en) | 2017-12-22 | 2017-12-22 | It can collapse and be unfolded the preparation method of composite material support bar epoxy resin-base |
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| CN108178900A true CN108178900A (en) | 2018-06-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117487497A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High-temperature-resistant epoxy resin composition for PCB |
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| CN102675826A (en) * | 2012-04-25 | 2012-09-19 | 北京化工大学常州先进材料研究院 | Temperature-resistant high-strength high-toughness composite epoxy resin and manufacturing method thereof |
| CN102827458A (en) * | 2012-09-21 | 2012-12-19 | 中国科学技术大学 | Low-temperature-resistant high-energy-radiation-resistant epoxy resin material and preparation method thereof |
| CN107446315A (en) * | 2017-09-18 | 2017-12-08 | 原晋波 | A kind of preparation method of Composite anti-radiation material |
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2017
- 2017-12-22 CN CN201711414839.XA patent/CN108178900A/en active Pending
Patent Citations (3)
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| CN102675826A (en) * | 2012-04-25 | 2012-09-19 | 北京化工大学常州先进材料研究院 | Temperature-resistant high-strength high-toughness composite epoxy resin and manufacturing method thereof |
| CN102827458A (en) * | 2012-09-21 | 2012-12-19 | 中国科学技术大学 | Low-temperature-resistant high-energy-radiation-resistant epoxy resin material and preparation method thereof |
| CN107446315A (en) * | 2017-09-18 | 2017-12-08 | 原晋波 | A kind of preparation method of Composite anti-radiation material |
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| CN117487497A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High-temperature-resistant epoxy resin composition for PCB |
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