CN108177040A - A kind of reinforcing chip debarring process - Google Patents
A kind of reinforcing chip debarring process Download PDFInfo
- Publication number
- CN108177040A CN108177040A CN201711186897.1A CN201711186897A CN108177040A CN 108177040 A CN108177040 A CN 108177040A CN 201711186897 A CN201711186897 A CN 201711186897A CN 108177040 A CN108177040 A CN 108177040A
- Authority
- CN
- China
- Prior art keywords
- reinforcing chip
- burr
- reinforcing
- chip
- grinding head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention relates to a kind of reinforcing chip debarring process, include the following steps：Step 1: fixing band burr reinforcing chip first with auxiliary ground, auxiliary ground need to have a degree of viscosity, anti-stop-band burr reinforcing chip bulk cargo；Step 2: by the band burr reinforcing chip feeding to bearing material platform fixed, assembly is accurately fixed and exposes burr；Step 3: shaft drives grinding head high speed rotation, polish after being accurately positioned and abrasive action is done with certain feed speed and depth, be eliminated after polishing with the burr in burr reinforcing chip, obtain impulse- free robustness reinforcing chip.The reinforcing chip debarring process of the present invention, the burr of specific region is removed using the mode of grinding, obtain impulse- free robustness, the reinforcing chip without burr, and the utilization rate of material can be increased exponentially, a large amount of continuous productions can be realized using the production of this method, the quality and efficiency of reinforcing chip are substantially increased, greatly reduces the production cost of impulse- free robustness reinforcing chip, meets the actual production process requirements of enterprise.
Description
Technical field
The invention belongs to flexible circuit board production, more particularly to a kind of reinforcing chip debarring process.
Background technology
In recent years, with the progress of microelectric technique and development, appearance and the volume of microelectronic product are also required to constantly become
Change and reduce, this requires the arrangement of adagio also needs to become more compact, scientific and reasonable, assembly space is also by tightened up
Limitation, there are the modes such as reflexed/anti-package in assembly method, but such mode burr easily occurs and breaks the serious consequences such as circuit, this
It is jagged to require that reinforcing chip burr small must not even allow, such reinforcing chip generally use etch process is given birth to
Production, but the expenses such as this technique productions process is more, yield is relatively low, equipment and consumptive material are also higher, and effect on environment is tighter
Weight can generate the not environmentally products, and more intractable such as more solid, slag, liquid, gas, therefore production cycle length, cost are higher.
Invention content
It is low that a kind of production cost is provided the invention aims to overcome the deficiencies in the prior art, simple operation, to ring
Border is pollution-free, and the reinforcing chip debarring process that deburring is efficient.
In order to achieve the above objectives, the technical solution adopted by the present invention is：A kind of reinforcing chip debarring process,
Its equipment used includes auxiliary ground, grinding head, shaft and bearing material platform；
Its material used is edge containing jagged band burr reinforcing chip；
Include the following steps：
Step 1: fixing band burr reinforcing chip first with auxiliary ground, auxiliary ground need to have a degree of viscosity, prevent
Stop-band burr reinforcing chip bulk cargo；
Step 2: by the band burr reinforcing chip feeding to bearing material platform fixed, assembly is accurately fixed and exposes burr；
Step 3: shaft drives grinding head high speed rotation, polishing after being accurately positioned, it is dynamic to do grinding with certain feed speed and depth
Make, be eliminated after polishing with the burr in burr reinforcing chip, obtain impulse- free robustness reinforcing chip.
Preferably, the bistrique uses the bistrique of the composition containing diamond.
Preferably, the rotating speed of the grinding head turns/min for 30000-40000.
Due to the utilization of above-mentioned technical proposal, the present invention has following advantages compared with prior art：
The reinforcing chip debarring process of the present invention program, simple operation are removed the burr of specific region using the mode of grinding, obtained
Reinforcing chip to impulse- free robustness, without burr, and the utilization rate of material can be increased exponentially, it can be realized using the production of this method and largely connected
Continuous production, substantially increases the quality and efficiency of reinforcing chip, greatly reduces the production cost of impulse- free robustness reinforcing chip, meet
The actual production process requirements of enterprise.
Description of the drawings
Technical solution of the present invention is described further below in conjunction with the accompanying drawings：
Front view of the attached drawing 1 for the present invention；
Attached drawing 2 is the vertical view of attached drawing 1.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.
A kind of reinforcing chip debarring process of the present invention as shown in attached drawing 1-2, the equipment used include auxiliary
Ground 1, grinding head 3, shaft 31 and bearing material platform 4；Its material used is edge containing jagged 21 band burr reinforcing chip 2；
The step of during concrete operations, is as described below：
Step 1: fixing band burr reinforcing chip 2 first with auxiliary ground 1, auxiliary ground 1 need to have a degree of viscous
Property, so as to which anti-2 bulk cargo of stop-band burr reinforcing chip is on auxiliary ground；
Step 2: by 2 feeding to bearing material platform 4 of band burr reinforcing chip fixed, assembly is accurately fixed and exposes burr
21；
Step 3: shaft 31 drives 3 high speed rotation of grinding head, it is accurately positioned rear grinding head 3 and is done with certain feed speed and depth
Abrasive action, wherein, specific feed speed and depth regard the specific situation adjustment of product, in burr reinforcing chip 2 after polishing
Burr 21 is eliminated, and obtains impulse- free robustness reinforcing chip 5.
Wherein, the bistrique 3) using the bistrique of the composition containing diamond, enhance the hardness and wearability of bistrique；It is described to beat
The rotating speed of bistrique 3 turns/min for 30000-40000, wherein the efficiency highest when the rotating speed of grinding head is 35000 turns/min.
The reinforcing chip debarring process of the present invention, simple operation are removed the burr of specific region using the mode of grinding, obtained
Reinforcing chip to impulse- free robustness, without burr, and the utilization rate of material can be increased exponentially, it can be realized using the production of this method and largely connected
Continuous production, substantially increases the quality and efficiency of reinforcing chip, greatly reduces the production cost of impulse- free robustness reinforcing chip, meet
The actual production process requirements of enterprise.
It the above is only the concrete application example of the present invention, protection scope of the present invention be not limited in any way.All uses
Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.
Claims (3)
1. a kind of reinforcing chip debarring process, it is characterised in that：
Its equipment used includes auxiliary ground (1), grinding head (3), shaft (31) and bearing material platform (4)；
Its material used contains the band burr reinforcing chip (2) of jagged (21) for edge；
Include the following steps：
Step 1: fixing band burr reinforcing chip (2) first with auxiliary ground (1), auxiliary ground (1) need to have to a certain degree
Viscosity, anti-stop-band burr reinforcing chip (2) bulk cargo；
Step 2: by band burr reinforcing chip (2) feeding to bearing material platform (4) fixed, assembly is accurately fixed and exposes
Burr (21)；
Step 3: shaft (31) drives grinding head (3) high speed rotation, be accurately positioned rear grinding head (3) with certain feed speed and
Depth does abrasive action, is eliminated after polishing with the burr (21) in burr reinforcing chip (2), obtains impulse- free robustness reinforcing chip (5).
2. the implementation method of reinforcing chip debarring process according to claim 1, it is characterised in that：The bistrique (3) makes
With the bistrique of the composition containing diamond.
3. the implementation method of reinforcing chip debarring process according to claim 1, it is characterised in that：The grinding head (3)
Rotating speed for 30000-40000 turn/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711186897.1A CN108177040A (en) | 2017-11-24 | 2017-11-24 | A kind of reinforcing chip debarring process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711186897.1A CN108177040A (en) | 2017-11-24 | 2017-11-24 | A kind of reinforcing chip debarring process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108177040A true CN108177040A (en) | 2018-06-19 |
Family
ID=62545211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711186897.1A Pending CN108177040A (en) | 2017-11-24 | 2017-11-24 | A kind of reinforcing chip debarring process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108177040A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100054581A (en) * | 2008-11-14 | 2010-05-25 | 삼성전기주식회사 | Method for treating metal reinforcement plate and flexible printed circuit board using metal reinforcement treated thereby |
| CN102161179A (en) * | 2010-12-30 | 2011-08-24 | 青岛嘉星晶电科技股份有限公司 | Wafer grinding device |
| CN104400347A (en) * | 2014-10-29 | 2015-03-11 | 苏州市金德誉精密机械有限公司 | Processing process for reinforced plates |
| CN106981622A (en) * | 2017-04-19 | 2017-07-25 | 湖北猛狮新能源科技有限公司 | The equipment that electrostatic is removed in pole piece deburring dedusting |
-
2017
- 2017-11-24 CN CN201711186897.1A patent/CN108177040A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100054581A (en) * | 2008-11-14 | 2010-05-25 | 삼성전기주식회사 | Method for treating metal reinforcement plate and flexible printed circuit board using metal reinforcement treated thereby |
| CN102161179A (en) * | 2010-12-30 | 2011-08-24 | 青岛嘉星晶电科技股份有限公司 | Wafer grinding device |
| CN104400347A (en) * | 2014-10-29 | 2015-03-11 | 苏州市金德誉精密机械有限公司 | Processing process for reinforced plates |
| CN106981622A (en) * | 2017-04-19 | 2017-07-25 | 湖北猛狮新能源科技有限公司 | The equipment that electrostatic is removed in pole piece deburring dedusting |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |
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| RJ01 | Rejection of invention patent application after publication |