CN108163613B - Thin film capacitive sensor, FOG and method for attaching FOG to 3D product protection cover plate - Google Patents
Thin film capacitive sensor, FOG and method for attaching FOG to 3D product protection cover plate Download PDFInfo
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- CN108163613B CN108163613B CN201611163833.5A CN201611163833A CN108163613B CN 108163613 B CN108163613 B CN 108163613B CN 201611163833 A CN201611163833 A CN 201611163833A CN 108163613 B CN108163613 B CN 108163613B
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- thin film
- cover plate
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- capacitive sensor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
Abstract
The invention discloses a thin film capacitive sensor, an FOG (field of view) and a method for attaching the FOG to a 3D product protection cover plate, relates to the technical field of touch screens, and aims to solve the technical problems that four corners of the existing FOG and 3D product protection cover plate are easy to generate attachment bubbles and edges of the existing FOG and 3D product protection cover plate are easy to wrinkle when the FOG and the 3D product protection cover plate are attached. The invention relates to a method for attaching FOG and a 3D product protection cover plate, which comprises the following steps: double V-shaped notches are formed in four corners of the thin film capacitance sensor, so that the area of the four corners of the thin film capacitance sensor is not larger than that of the four corners of the 3D product protection cover plate. Consequently can avoid because of the laminating fold and the bubble problem that the laminating area difference of four angular positions of film capacitive sensor and 3D product protection apron leads to at the laminating in-process to four corners outward appearance problem when effectively having improved 3D laminating, and perfect 3D laminating technique, and then effectively improved the competitiveness of 3D laminating in market.
Description
Technical Field
The invention relates to the technical field of touch screens, in particular to a thin film capacitive sensor, an FOG and a method for attaching the FOG to a 3D product protection cover plate.
Background
The FOG is a semi-finished product formed by pasting and combining a flexible circuit board and a thin film capacitive sensor, and the FOG needs to be attached to a product protection cover plate when electronic products such as mobile phones are assembled.
Traditional FOG and 2D product protection apron's laminating is laminating between plane and the plane, and film capacitance sensor can expand completely during the laminating, can not appear the problem of corner bubble and fold.
However, with the advance of science and technology, the shapes of electronic products such as mobile phones and the like are in diversified development at present, the 3D curved surface glass products are more and more widely applied, and the 3D product protection cover plate with the curved surface is produced at random. However, the attachment of FOG and 3D product protection apron is the laminating of plane and curved surface, and consequently at the laminating in-process, four angular position of film capacitive sensor can be different with the laminating area of 3D product protection apron to film capacitive sensor can't expand completely in the four corners cambered surface department of 3D product protection apron when leading to the laminating, and then appear fold and bubble when leading to the laminating.
Disclosure of Invention
The invention aims to provide a thin film capacitive sensor, an FOG and a bonding method of the FOG and a 3D product protection cover plate, and aims to solve the technical problems that four corners of the FOG and the 3D product protection cover plate are easy to generate bonding bubbles and edges of the FOG and the 3D product protection cover plate are easy to wrinkle when the FOG and the 3D product protection cover plate are bonded.
The invention provides a method for attaching an FOG (foot on glass) and a 3D (three-dimensional) product protective cover plate, which comprises the following steps of: and making double V-shaped notches at four corners of the thin film capacitance sensor, so that the area of the four corners of the thin film capacitance sensor is not more than that of the four corners of the 3D product protection cover plate.
In practical application, the attaching method of the FOG and the 3D product protection cover plate specifically comprises the following steps: finding out the initial position and the end position of the radian of four corners of the 3D product protection cover plate; calculating the angle of the double V-shaped gap of which the four-corner joint area of the thin-film capacitive sensor is the same as that of the 3D product protection cover plate in any equidistant state, and determining the length of the double V-shaped gap; perfecting an appearance drawing of the thin film capacitance sensor, and manufacturing the thin film capacitance sensor with the double V-shaped notches at four corners; mounting a flexible circuit board and the thin film capacitive sensor to form the FOG; and attaching the FOG and the 3D product protection cover plate.
During specific operation, the starting position and the ending position of the four-corner radian of the 3D product protection cover plate are found out through the combination of 3D software and 2D software.
During specific operation, will the FOG with 3D product protection apron laminates through 3D laminating board or 3D laminating tool.
The double V-shaped gaps are respectively and correspondingly located at the starting position and the ending position of the four corner radians of the 3D product protection cover plate.
Specifically, the edge of the thin film capacitive sensor is taken as a reference, the thickness direction of the touch control plate is taken as a vector, and the unfolding area and the adhering area of the thin film capacitive sensor are kept consistent in any equidistant state.
Further, the length of the double V-shaped notch is not less than the sum of the length of an arc line perpendicular to the edge direction of the thin film capacitive sensor and the tolerance of the minimum 3D attaching position.
In practical application, the film capacitive sensor with the double V-shaped notches at four corners is manufactured in a laser mode.
And when calculating the four-corner joint area of the thin-film capacitive sensor, simultaneously considering the actual line width and the required compensation of laser etching.
Specifically, the FOG and the 3D product protection cover plate are attached in a manner of diffusion from the center to the periphery.
Compared with the prior art, the attaching method of the FOG and the 3D product protection cover plate has the following advantages:
the invention provides a method for attaching an FOG (FOG on glass) to a 3D product protection cover plate, which comprises the following steps of: double V-shaped notches are formed in four corners of the thin film capacitance sensor, so that the area of the four corners of the thin film capacitance sensor is not larger than that of the four corners of the 3D product protection cover plate. Therefore, analysis shows that in the method for bonding the FOG and the 3D product protection cover plate, double V-shaped notches are formed in the four corners of the thin film capacitive sensor, so that the area of the four corners of the thin film capacitive sensor is not larger than that of the four corners of the 3D product protection cover plate, the problems of bonding wrinkles and air bubbles caused by the fact that the four corners of the thin film capacitive sensor are different from that of the 3D product protection cover plate can be avoided in the bonding process, the appearance problem of the four corners in 3D bonding is effectively solved, the 3D bonding technology is perfected, and the competitiveness of 3D bonding in the market is effectively improved.
The invention further provides a thin film capacitive sensor, wherein double V-shaped notches are respectively formed in four corners of the thin film capacitive sensor, so that the area of the four corners of the thin film capacitive sensor is not larger than that of the four corners of the 3D product protection cover plate.
The present invention further provides a FOG, comprising: the thin film capacitive sensor comprises the thin film capacitive sensor and a flexible circuit board attached to the thin film capacitive sensor.
Specifically, the flexible circuit board is arranged on one side of the short side of the thin film capacitance sensor in an extending mode.
Compared with the prior art, the advantages of the thin film capacitive sensor and the attachment method of the FOG and the 3D product protection cover plate are the same, and are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a thin film capacitive sensor according to an embodiment of the present invention;
FIG. 2 is an exploded view of the FOG and the 3D product protection cover plate according to the embodiment of the present invention;
FIG. 3 is an enlarged schematic structural diagram of a corner of a thin film capacitive sensor according to an embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a method for attaching the FOG to the 3D product protective cover plate according to the embodiment of the present invention;
fig. 5 is a schematic structural diagram of an FOG provided in an embodiment of the present invention.
In the figure: 1-a thin film capacitive sensor; 11-double V-shaped notches; 2-3D product protection cover plate; 3-a flexible circuit board; 4-FOG.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection or electrical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Fig. 1 is a schematic structural diagram of a thin film capacitive sensor according to an embodiment of the present invention; FIG. 2 is an exploded view of the FOG and the 3D product protection cover plate according to the embodiment of the present invention; fig. 3 is an enlarged schematic structural diagram of a corner of the thin film capacitive sensor according to the embodiment of the present invention.
Referring to fig. 1 to 3, an embodiment of the present invention provides a method for attaching a FOG to a 3D product protection cover plate, including the following steps: double V-shaped notches 11 are formed in four corners of the thin film capacitive sensor 1, so that the area of the four corners of the thin film capacitive sensor 1 is not larger than that of the four corners of the 3D product protection cover plate 2.
Compared with the prior art, the attaching method of the FOG and the 3D product protection cover plate provided by the embodiment of the invention has the following advantages:
in the method for attaching the FOG to the 3D product protective cover plate according to the embodiment of the present invention, as shown in fig. 1 to 3, the method includes the following steps: double V-shaped notches 11 are formed in four corners of the thin film capacitive sensor 1, so that the area of the four corners of the thin film capacitive sensor 1 is not larger than that of the four corners of the 3D product protection cover plate 2. From this analysis, in the method for attaching the FOG to the 3D product protective cover plate according to the embodiment of the present invention, the double V-shaped notches 11 are formed at the four corners of the thin film capacitive sensor 1, so that the area of the four corners of the thin film capacitive sensor 1 is not greater than the area of the four corners of the 3D product protective cover plate 2, and therefore, the problems of attachment wrinkles and air bubbles caused by the difference between the attachment areas of the four corners of the thin film capacitive sensor 1 and the 3D product protective cover plate 2 can be avoided during the attachment process, thereby effectively improving the appearance problem of the four corners during the 3D attachment, perfecting the 3D attachment technology, and further effectively improving the competitiveness of the 3D attachment in the market.
It should be noted that, the 3D product protection cover 2 may be a glass cover, a polyester cover, or the like.
Fig. 4 is a schematic flow chart illustrating a method for attaching the FOG to the 3D product protective cover plate according to the embodiment of the present invention; fig. 5 is a schematic structural diagram of an FOG provided in an embodiment of the present invention.
In practical application, as shown in fig. 4 and shown in fig. 1 to 3 and 5, the method for attaching the FOG to the 3D product protective cover plate according to the embodiment of the present invention may specifically include the following steps: step S1, finding out the initial position and the end position of the four-corner radian of the 3D product protection cover plate 2 (through the combination of 3D software and 2D software); step S2, calculating the angle of the double V-shaped notch 11, which is the same as the 3D product protection cover plate 2 in the four-corner joint area of the film capacitive sensor 1 in any equidistant state, and determining the length of the double V-shaped notch 11; step S3, perfecting the appearance drawing of the film capacitive sensor 1, and manufacturing the film capacitive sensor 1 with double V-shaped notches 11 at four corners; step S4, the flexible circuit board 3 and the film capacitance sensor 1 are combined into an FOG4 after being mounted; and S5, attaching the FOG4 to the 3D product protection cover plate 2 (through a specific 3D attaching machine or a 3D attaching jig).
Wherein, above-mentioned two V word breach 11 corresponds the initial position and the final position that are located the four corners radian of 3D product protection apron 2 respectively to the film capacitance sensor 1 four corners after effectively guaranteeing the laminating does not have the bubble, the edge does not have the fold, two V word breachs 11 are closed completely.
Specifically, the spread area and the bonded area of the thin film capacitive sensor 1 should be kept consistent in any equidistant state with the edge of the thin film capacitive sensor 1 as a reference and the thickness direction of the touch control plate as a vector, and the angle of the double V-shaped notch 11 can be controlled.
Further, the length of the double V-shaped notch 11 is not less than the sum of the length of an arc line perpendicular to the edge of the thin film capacitive sensor 1 and the tolerance of the minimum 3D attachment position.
In practical application, in the method for attaching the FOG to the 3D product protective cover plate provided by the embodiment of the invention, the thin film capacitive sensor 1 with the double V-shaped notches 11 at four corners can be manufactured in a laser mode.
The basic principle of laser is that a laser generator generates high-energy continuous laser beams, and when laser acts on a printing material, atoms in a ground state transition to a higher energy state; atoms in higher energy state are unstable and will quickly return to the ground state, when the atoms return to the ground state, extra energy is released in the form of photons or quanta, and the light energy is converted into heat energy, so that the surface material is instantaneously melted and even gasified, thereby forming the graphic mark.
When calculating the four-corner joint area of the thin-film capacitive sensor 1, the actual line width etched by the laser and the required compensation need to be considered at the same time.
Specifically, the bonding method of spreading the FOG4 from the center to the periphery may be preferably used in the process of bonding the FOG4 to the 3D product protective cover 2.
The following describes in detail a method for attaching a FOG to a 3D product protection cover plate according to an embodiment of the present invention with reference to fig. 1 to 5, and illustrates an embodiment:
step S1, finding out the initial position and the end position of the radian of the four corners of the 3D product protection cover plate 2 in the horizontal direction by combining the 3D software and the 2D software, and respectively positioning two notches, namely the double-V-shaped notch 11;
step S2, calculating a double-V-shaped notch 11 angle which takes the thickness direction of the touch control plate as a vector and can ensure that the four-corner joint area of the film capacitive sensor 1 is the same as that of the 3D product protection cover plate 2 in any equidistant state, wherein the actual line width of the laser photoetching is required to be considered and necessary compensation is carried out; determining the length of the double V-shaped gap 11, and simultaneously ensuring that the length of the double V-shaped gap 11 is not less than the sum of the tolerance of the arc length perpendicular to the edge direction of the thin film capacitive sensor 1 and the minimum 3D attaching position;
step S3, perfecting the appearance drawing of the film capacitive sensor 1, and manufacturing the corresponding film capacitive sensor 1 with double V-shaped notches 11 at four corners by a laser mode with power of 35 +/-10W and moving speed of 75 +/-10 mm/S;
s4, using a hot-press bonding technology with the pressure of 2-2.5 Mpa, the temperature of 155-165 ℃ and the time of 9-12S to assemble the FOG4 after the flexible circuit board 3 and the film capacitance sensor 1 are mounted;
and S5, attaching the FOG4 and the 3D product protection cover plate 2 through a specific 3D attaching machine or a 3D attaching jig by adopting a vacuum attaching technology and ensuring that the pressure of the cavity is 30kPa and the attaching pressure is 8 kN-10 kN after vacuum pumping.
As shown in fig. 1 and fig. 3, an embodiment of the present invention further provides a thin film capacitive sensor, where four corners of the thin film capacitive sensor 1 are respectively provided with double V-shaped notches 11, so that the area of the four corners of the thin film capacitive sensor 1 is not greater than the area of the four corners of the 3D product protection cover 2.
As shown in fig. 2 and 5, an embodiment of the present invention further provides a FOG, including: the thin film capacitive sensor 1 as described above, and the flexible circuit board 3 attached to the thin film capacitive sensor 1.
Specifically, as shown in fig. 2 and 5, the flexible circuit board 3 may be extended on one side on the short side of the thin film capacitive sensor 1.
In the thin film capacitive sensor and the FOG using the same provided by the embodiment of the invention, the double V-shaped notches 11 are respectively arranged at the four corners of the thin film capacitive sensor 1, so that the area of the four corners of the thin film capacitive sensor 1 is not larger than that of the four corners of the 3D product protection cover plate 2, the problems of attachment wrinkles and air bubbles caused by the difference between the attachment areas of the four corners of the thin film capacitive sensor 1 and the 3D product protection cover plate 2 can be effectively avoided, the appearance problem of the four corners during 3D attachment is effectively improved, the 3D attachment technology is perfected, and the competitiveness of the 3D attachment on the market is effectively improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. The attaching method of the FOG and the 3D product protection cover plate is characterized by comprising the following steps of: making double V-shaped notches at four corners of the thin film capacitive sensor, so that the area of the four corners of the thin film capacitive sensor is not larger than that of the four corners of the 3D product protection cover plate; the method specifically comprises the following steps:
finding out the initial position and the end position of the radian of four corners of the 3D product protection cover plate;
calculating the angle of the double V-shaped gap of which the four-corner joint area of the thin-film capacitive sensor is the same as that of the 3D product protection cover plate in any equidistant state, and determining the length of the double V-shaped gap;
perfecting an appearance drawing of the thin film capacitance sensor, and manufacturing the thin film capacitance sensor with the double V-shaped notches at four corners;
mounting a flexible circuit board and the thin film capacitive sensor to form the FOG;
and attaching the FOG and the 3D product protection cover plate.
2. The method of claim 1, wherein the double V-shaped notches are located at the start position and the end position of the four corner radians of the 3D product protection cover plate, respectively.
3. The method of claim 1, wherein the unfolding area and the attaching area of the thin film capacitive sensor are maintained to be consistent in any equidistant state based on the edge of the thin film capacitive sensor and the thickness direction of the touch control plate as a vector.
4. The method of claim 1, wherein the length of the double V-shaped notch is not less than the sum of the tolerance of the minimum 3D attachment position and the length of the arc perpendicular to the edge of the thin film capacitive sensor.
5. The method of claim 1, wherein the thin film capacitive sensor having the double-V-shaped notches at four corners is manufactured by laser.
6. The method of claim 5, wherein the actual line width and the required compensation of the laser etching are considered when calculating the four corner bonding area of the thin film capacitive sensor.
7. The method of claim 1, wherein the FOG is attached to the 3D product protective cover plate in a manner of diffusion from the center to the periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611163833.5A CN108163613B (en) | 2016-12-15 | 2016-12-15 | Thin film capacitive sensor, FOG and method for attaching FOG to 3D product protection cover plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611163833.5A CN108163613B (en) | 2016-12-15 | 2016-12-15 | Thin film capacitive sensor, FOG and method for attaching FOG to 3D product protection cover plate |
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| Publication Number | Publication Date |
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| CN108163613A CN108163613A (en) | 2018-06-15 |
| CN108163613B true CN108163613B (en) | 2020-02-07 |
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| KR101595344B1 (en) * | 2008-08-01 | 2016-02-18 | 엘지전자 주식회사 | Display module and portable terminal having the same |
| CN104742482B (en) * | 2015-03-31 | 2017-07-28 | 牧东光电科技有限公司 | The prebuckling applying method of curved touch screen |
| CN104808843B (en) * | 2015-04-03 | 2018-03-20 | 业成光电（深圳）有限公司 | Contact panel and touch-control display panel |
| CN105426003B (en) * | 2015-12-03 | 2018-08-07 | 关键禾芯科技股份有限公司 | Touch device with identification of fingerprint |
| CN105808027A (en) * | 2016-03-11 | 2016-07-27 | 惠州Tcl移动通信有限公司 | Touch screen sensing structure, touch screen and narrow-bezel electronic display device |
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