CN108148409B - Polyimide composition, polyimide film, and circuit board - Google Patents

Polyimide composition, polyimide film, and circuit board Download PDF

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CN108148409B
CN108148409B CN201611095933.9A CN201611095933A CN108148409B CN 108148409 B CN108148409 B CN 108148409B CN 201611095933 A CN201611095933 A CN 201611095933A CN 108148409 B CN108148409 B CN 108148409B
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徐茂峰
黄黎明
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Zhen Ding Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04—Polyurethanes
    • C08J2475/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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Abstract

A polyimide composition is prepared from photosensitive polymer, photosensitive monomer and photoinitiator through photosensitive polymerizing reaction, and the composition contains S compound chosen from 4, 6-bis (octylthiomethyl) o-cresol, 2, 4-bis (dodecylthiomethyl) -6-methylphenol and 4- [ (4, 6-dioctylthio-1, 3, 5-triazin-2-yl) amino ] -2, 6-ditert-butylphenol, and has-COOH. The polyimide composition effectively improves the alkali resistance of a covering film of a circuit board by adding a sulfur-containing compound and enabling the sulfur-containing compound and polyimide with-COOH to have a thermal crosslinking reaction when the covering film is manufactured. In addition, the invention also provides a polyimide film prepared from the polyimide composition, and a circuit board prepared by applying the polyimide film.

Description

Polyimide composition, polyimide film, and circuit board
Technical Field
The present invention relates to a polyimide composition, a polyimide film and a circuit board made of the polyimide composition.
Background
In recent years, flexible circuit boards are increasingly used in electronic products. In the manufacturing process of the flexible circuit board, after a circuit is etched on a substrate, a layer of polyimide film is required to be attached to the circuit for blocking moisture and preventing a metal circuit from being oxidized and corroded. The polyimide film can also protect the circuits from being damaged by high temperature during assembly, enhance the insulation resistance among the circuits and separate the areas of the flexible circuit board which need to be assembled and welded.
The common photosensitive polyimide film has the advantages of bending resistance, heat resistance and high alignment precision. However, photosensitive polyimide compositions having a functional group of-COOH, which are currently used in the industry, have poor resistance to strong alkali.
Disclosure of Invention
In view of the above, there is a need for a novel polyimide composition.
In addition, it is necessary to provide a polyimide film prepared by using the polyimide composition.
In addition, a circuit board prepared by applying the polyimide film is also needed to be provided.
A polyimide composition comprises polyimide and a high polymer, wherein the high polymer is formed by photosensitive polymerization reaction of a photosensitive polymer, a photosensitive monomer and a photoinitiator through light irradiation treatment, the polyimide composition also comprises a sulfur-containing compound, the sulfur-containing compound is selected from one or more of 4, 6-bis (octylthiomethyl) o-cresol, 2, 4-bis (dodecylthiomethyl) -6-methylphenol and 4- [ (4, 6-dioctylthio-1, 3, 5-triazine-2-yl) amino ] -2, 6-di-tert-butylphenol, and the polyimide has a-COOH functional group.
A polyimide film comprising the above polyimide composition.
A circuit board comprises a substrate, a metal sheet fixed on the substrate, and a cover film combined on the surface of the substrate provided with the metal sheet, wherein two ends of the metal sheet are covered by the cover film, the cover film is formed by a polyimide film subjected to thermal crosslinking reaction through heat treatment, and the polyimide film comprises the polyimide composition.
The polyimide composition is added with the sulfur-containing compound, and the sulfur-containing compound and the polyimide with-COOH are subjected to thermal crosslinking reaction during the preparation of the covering film of the circuit board, so that the strong basicity resistance of the covering film is effectively improved, the service life of the covering film is prolonged, and resources are saved.
Drawings
FIG. 1 shows a polyimide film according to a preferred embodiment of the present invention.
FIG. 2 is a circuit board according to a preferred embodiment of the present invention.
Description of the main elements
Polyimide film 10
Release film 20
Cover film 200
Circuit board 300
Substrate 301
Metal sheet 302
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The preferred embodiment of the present invention provides a polyimide composition, which is mainly used for manufacturing the polyimide film 10 shown in fig. 1, the coverlay film 200 shown in fig. 2, and the circuit board 300. The polyimide composition comprises polyimide, a sulfur-containing compound and a high polymer, wherein the high polymer is formed by photosensitive polymerization reaction of a photosensitive polymer, a photosensitive monomer and a photoinitiator through light treatment. The polyimide has a-COOH functional group. The sulfur-containing compound is selected from 4, 6-di (octylthiomethyl) o-cresol (molecular formula is C)25H44OS2) 2, 4-bis (dodecylthiomethyl) -6-methylphenol (molecular formula C)33H60OS2) And 4- [ (4, 6-dioctylthio-1, 3, 5-triazin-2-yl) amino group]-2, 6-di-tert-butylphenol (molecular formula C)33H56N4OS2) One or more of them.
Wherein the structural formula of the 4, 6-di (octylthiomethyl) o-cresol is shown in the specification
Figure GDA0002372316130000031
The structural formula of the 2, 4-di (dodecyl sulfur methyl) -6-methylphenol is shown in the specification
Figure GDA0002372316130000032
The structural formula of the 4- [ (4, 6-dioctylthio-1, 3, 5-triazin-2-yl) amino ] -2, 6-di-tert-butylphenol is shown in the specification
Figure GDA0002372316130000033
When the polyimide composition is prepared, the mass fraction of the polyimide used is 50-70%, the mass fraction of the sulfur-containing compound is 1-5%, the mass fraction of the photosensitive polymer is 10-30%, the mass fraction of the photosensitive monomer is 10-30%, and the mass fraction of the photoinitiator is 1-5%.
The structural formula of the polyimide with-COOH (PI-COOH for short) is as follows:
Figure GDA0002372316130000034
wherein X1And X3Are identical or different organic functional groups having four covalent bonds; x2And X4Are identical or different organic functional groups having a double covalent bond; m and n are the number of repeating units, wherein m and n are integers from 10 to 1000.
X1And X3Each selected from one of the following functional groups:
Figure GDA0002372316130000041
X2one of the following functional groups:
Figure GDA0002372316130000042
Figure GDA0002372316130000043
and
Figure GDA0002372316130000044
wherein R is1Is COOH; r2Selected from OH, OH,
Figure GDA0002372316130000045
And
Figure GDA0002372316130000046
r is H or CH3P and q are integers of 1 to 20; y is1Selected from-O-, -CO-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-、-(CH2)n1-、-O(CH2)n2O-、-COO(CH2)n3OCO-、
Figure GDA0002372316130000047
And
Figure GDA0002372316130000048
wherein n1, n2, n3 are integers from 1 to 10.
When X is present4And X2When not the same, X4One of the following functional groups:
Figure GDA0002372316130000049
Figure GDA00023723161300000410
wherein, Y1And Y2Are respectively selected from-O-, -CO-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-、-(CH2)n1-、-O(CH2)n2O-、-COO(CH2)n3OCO-、
Figure GDA00023723161300000411
And
Figure GDA00023723161300000412
wherein n1, n2, n3 are integers from 1 to 10; r3Is H, CH3Ethyl or phenyl, r, s and t are integers from 1 to 30.
The photosensitive polymer is selected from one or more of aliphatic polyurethane acrylate, aromatic polyurethane acrylate, polyether polyol-aliphatic polyurethane acrylate, epoxy acrylate, 2-hydroxy-3-phenoxypropyl acrylic acid, epoxy soybean oil acrylate, aliphatic modified polyester hexaacrylate and polyester acrylate. The photosensitive polymer is used to improve physical properties such as bending resistance and heat resistance of the polyimide film 10 formed of the polyimide composition.
The photosensitive monomer is selected from one or more of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, dipentaerythritol hexaacrylate (DPHA), tripropylene glycol diacrylate (TPGDA), hexanediol diacrylate (HDDA), diethylene glycol diacrylate Phthalate (PDDA) and neopentyl glycol diacrylate (NPGDA). The photosensitive monomer is used to improve the viscosity and adhesion of the polyimide composition.
The photoinitiator is selected from the group consisting of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinyl-1-propanone, 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, benzoin bis-methyl ether, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxy-cyclohexyl-phenyl ketone, toluoyl derivatives, benzophenone, 4-benzoyl-4' -methyl-diphenyl sulfide, methyl 2-benzoylbenzoate, a mixture of 2-isopropylthioxanthone and 4-isopropylthioxanthone, ethyl 4- (N, N-dimethylamino) benzoate, methyl-L-hydroxy-phenyl ether, N-methyl-ethyl-phenyl-1-propanone, N-methyl-phenyl-1-hydroxy, One or more of 4- (N, N-dimethylamino) isooctyl benzoate, tertiary amine acrylate and amine modified epoxy acrylate. The photoinitiator can initiate the reaction of the photosensitive polymer and the photosensitive monomer under the action of ultraviolet light.
When the polyimide composition is prepared, the photosensitive monomer and the photosensitive polymer are uniformly mixed, then the photoinitiator is added and uniformly mixed, the photosensitive monomer, the photosensitive polymer and the photoinitiator are subjected to photopolymerization reaction by illumination to generate a high polymer, and then the polyimide and the sulfur-containing compound are added and uniformly mixed. The light irradiation may be conventionally used UV light irradiation or the like. The sulfur-containing compound and the polyimide are dispersed in the high polymer.
Referring to fig. 1, a polyimide film 10 is mainly used for manufacturing a cover film 200 on a circuit board 300. The polyimide film 10 is formed by coating the polyimide composition on the surface of a substrate (shown in the figure); or the polyimide film 10 is formed by coating the polyimide composition on the surface of a substrate and then performing a prepreg process.
The polyimide film 10 is subjected to a heat treatment to cause a thermal crosslinking reaction between the polyimide containing-COOH in the polyimide film 10 and a sulfur-containing compound, thereby obtaining the cover film 200 having a high resistance to strong alkaline. Wherein the reaction temperature of the thermal crosslinking reaction is preferably 100-150 ℃, and the reaction mechanism is as follows:
Figure GDA0002372316130000061
wherein R is3Is composed of
Figure GDA0002372316130000062
R4is-C8H17(ii) a Or R3Is composed of
Figure GDA0002372316130000063
R4is-C12H25(ii) a Or R3Is composed of
Figure GDA0002372316130000064
R4is-C8H17。
The coating film 200 formed after the heat treatment does not substantially contain-COOH which is easily reacted with an alkaline compound, and has strong alkali resistance.
The polyimide composition of the present invention will be further illustrated by the following examples.
Example 1
In this example, the structural formula of PI-COOH used was
Figure GDA0002372316130000065
The polyimide composition of this example was prepared from the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-propenoic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, 4, 6-bis (octylthiomethyl) o-cresol, and 1-hydroxycyclohexylphenylketone. Wherein the mass fraction of PI-COOH is 59%, the mass fraction of aliphatic polyurethane triacrylate is 19%, the mass fraction of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester is 19%, the mass fraction of 4, 6-bis (octylthiomethyl) o-cresol is 1%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.
Example 2
In this example, the structural formula of PI-COOH used was
Figure GDA0002372316130000071
The polyimide composition of this example was prepared from the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-propenoic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, 4, 6-bis (octylthiomethyl) o-cresol, and 1-hydroxycyclohexylphenylketone. Wherein the mass fraction of PI-COOH is 58%, the mass fraction of aliphatic polyurethane triacrylate is 19%, the mass fraction of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester is 19%, the mass fraction of 4, 6-bis (octylthiomethyl) o-cresol is 2%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.
Example 3
In this example, the structural formula of PI-COOH used was
Figure GDA0002372316130000072
The polyimide composition of this example was prepared from the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-propenoic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, 4, 6-bis (octylthiomethyl) o-cresol, and 1-hydroxycyclohexylphenylketone. Wherein the mass fraction of PI-COOH is 57%, the mass fraction of aliphatic polyurethane triacrylate is 19%, the mass fraction of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester is 19%, the mass fraction of 4, 6-bis (octylthiomethyl) o-cresol is 3%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.
Comparative example
In this example, the structural formula of PI-COOH used was
Figure GDA0002372316130000081
The polyimide composition of this example was prepared from the above-described PI-COOH, aliphatic polyurethane triacrylate, 2-propenoic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, and 1-hydroxycyclohexyl phenyl ketone. Wherein the mass fraction of PI-COOH is 60%, the mass fraction of aliphatic polyurethane triacrylate is 19%, the mass fraction of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester is 19%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.
The polyimide compositions of examples 1 to 3 and the comparative example were each formed into a coverlay 200; then, the prepared cover film 200 was immersed in NaOH solutions having a molar concentration of 10% respectively to perform a strong alkali resistance test. The detection results are shown in the first table.
Table one: strong basicity resistance test of covering film prepared from polyimide composition
Example 1 Example 2 Example 3 Comparative example
Time to start stripping 13min 20min >3h 5min
As can be seen from the above table, the film peeling start time of the coverlay 200 made of the polyimide composition to which the sulfur compound 4, 6-bis (octylthiomethyl) o-cresol is added is later than that of the coverlay 200 made of the polyimide composition to which no sulfur compound is added, and the film peeling start time is later as the amount of the sulfur compound 4, 6-bis (octylthiomethyl) o-cresol added increases. That is, the cover film 200 made of the polyimide composition containing the sulfur compound 4, 6-bis (octylthiomethyl) o-cresol has strong resistance to strong alkali. It is thus understood that the addition of the sulfur-containing compound to the polyimide composition can effectively improve the strong alkali resistance of the coverlay film 200 produced from the polyimide composition.
Referring to fig. 1, it can be understood that a release film 20 can be further bonded to at least one surface of the polyimide film 10 for protecting the polyimide film 10.
Referring to fig. 2, a circuit board 300 using the cover film 200 is disclosed, wherein the circuit board 300 is applied to an electronic device such as a computer, an electronic reader, a tablet computer, and a smart watch. The circuit board 300 includes a substrate 301, a plurality of metal sheets 302 fixed on at least one surface of the substrate 301, and a plurality of cover films 200. The cover films 200 and the metal sheets 302 are arranged at intervals, and the surfaces of the cover films 200 and the metal sheets 302, which are combined with each other, are completely covered. Both ends of each metal sheet 302 are covered with the adjacent cover film 200. It will be appreciated that other electronic components commonly used in circuit boards are also assembled onto the circuit board 300.
The polyimide composition is added with the sulfur-containing compound, and the sulfur-containing compound and the polyimide with-COOH are subjected to thermal crosslinking reaction when the cover film 200 of the circuit board 300 is manufactured, so that the strong basicity resistance of the cover film 200 is effectively improved, the service life of the cover film 200 is prolonged, and resources are saved.

Claims (9)

1. A polyimide composition comprises polyimide and a high polymer, wherein the high polymer is formed by photosensitive polymerization reaction of a photosensitive polymer, a photosensitive monomer and a photoinitiator through light treatment, and is characterized in that: the polyimide composition also comprises a sulfur-containing compound, wherein the sulfur-containing compound is one or more selected from 4, 6-bis (octylthiomethyl) o-cresol, 2, 4-bis (dodecylthiomethyl) -6-methylphenol and 4- [ (4, 6-dioctylthio-1, 3, 5-triazin-2-yl) amino ] -2, 6-di-tert-butylphenol, and the polyimide has a-COOH functional group.
2. The polyimide composition of claim 1, wherein: the structural formula of the polyimide is shown in the specification
Figure FDA0002372316120000011
Wherein m and n are integers from 10 to 1000; x1And X3Are respectively selected from
Figure FDA0002372316120000012
One of (1); x2Is selected from
Figure FDA0002372316120000013
And
Figure FDA0002372316120000014
wherein R is1Is COOH, R2Selected from OH, OH,
Figure FDA0002372316120000015
Figure FDA0002372316120000021
And
Figure FDA0002372316120000022
r is H or CH3P and q are integers of 1 to 20; y is1Selected from-O-, -CO-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-、-(CH2)n1-、-O(CH2)n2O-、-COO(CH2)n3OCO-、
Figure FDA0002372316120000023
And
Figure FDA0002372316120000024
wherein n1, n2, n3 are integers from 1 to 10; x4Is selected from
Figure FDA0002372316120000025
Figure FDA0002372316120000026
And
Figure FDA0002372316120000027
wherein Y is1And Y2Are respectively selected from-O-, -CO-, -S-, -SO2-、-CH2-、-C(CH3)2-、-C(CF3)2-、-(CH2)n1-、-O(CH2)n2O-、-COO(CH2)n3OCO-、
Figure FDA0002372316120000028
And
Figure FDA0002372316120000029
wherein n1, n2 and n3 are integers from 1 to 10, and R is3Is H, CH3Ethyl or phenyl, r, s and t are integers from 1 to 30.
3. The polyimide composition of claim 1, wherein: the polyimide composition is prepared from 50-70% of polyimide, 1-5% of sulfur-containing compound, 10-30% of photosensitive polymer, 10-30% of photosensitive monomer and 1-5% of photoinitiator.
4. The polyimide composition of claim 1, wherein: the photosensitive polymer is selected from one or more of aliphatic polyurethane acrylate, aromatic polyurethane acrylate, polyether polyol-aliphatic polyurethane acrylate, epoxy acrylate, 2-hydroxy-3-phenoxypropyl acrylic acid, epoxy soybean oil acrylate, aliphatic modified polyester hexaacrylate and polyester acrylate.
5. The polyimide composition of claim 1, wherein: the photosensitive monomer is selected from one or more of 2-acrylic acid-2- [ [ (butylamino) -carbonyl ] oxo ] ethyl ester, dipentaerythritol hexaacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, diethylene glycol diacrylate phthalate and neopentyl glycol diacrylate.
6. The polyimide composition of claim 1, wherein: the photoinitiator is selected from the group consisting of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinyl-1-propanone, 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, benzoin bis-methyl ether, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxy-cyclohexyl-phenyl ketone, toluoyl derivatives, benzophenone, 4-benzoyl-4' -methyl-diphenyl sulfide, methyl 2-benzoylbenzoate, a mixture of 2-isopropylthioxanthone and 4-isopropylthioxanthone, ethyl 4- (N, N-dimethylamino) benzoate, methyl-L-hydroxy-phenyl ether, N-methyl-ethyl-phenyl-1-propanone, N-methyl-phenyl-1-hydroxy, One or more of 4- (N, N-dimethylamino) isooctyl benzoate, tertiary amine acrylate and amine modified epoxy acrylate.
7. A polyimide film comprising the polyimide composition according to any one of claims 1 to 6.
8. The polyimide film of claim 7, wherein: at least one surface of the polyimide film is combined with a release film.
9. A circuit board comprises a substrate, a metal sheet fixed on the substrate, and a covering film combined on the surface of the substrate provided with the metal sheet, wherein two ends of the metal sheet are covered by the covering film, and the covering film is formed by a polyimide film after thermal crosslinking reaction through heat treatment, and is characterized in that: the polyimide film comprising the polyimide composition according to any one of claims 1 to 6.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204657A (en) * 1992-07-16 1994-07-22 Toshiba Chem Corp Composition for adhesive for flexible printed circuit board
CN1396212A (en) * 2001-06-28 2003-02-12 大日本油墨化学工业株式会社 Active energy line solidified polyimide resin composition
JP2010077382A (en) * 2008-08-29 2010-04-08 Dic Corp Thermosetting polyimide resin composition
CN105802122A (en) * 2016-05-12 2016-07-27 王尧尧 Cable insulation material comprising nano magnesium oxide/low-density polyethylene/modified bentonite and application thereof
CN106104381A (en) * 2014-03-17 2016-11-09 旭化成株式会社 Photosensitive polymer combination, the manufacture method of cured relief pattern and semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204657A (en) * 1992-07-16 1994-07-22 Toshiba Chem Corp Composition for adhesive for flexible printed circuit board
CN1396212A (en) * 2001-06-28 2003-02-12 大日本油墨化学工业株式会社 Active energy line solidified polyimide resin composition
JP2010077382A (en) * 2008-08-29 2010-04-08 Dic Corp Thermosetting polyimide resin composition
CN106104381A (en) * 2014-03-17 2016-11-09 旭化成株式会社 Photosensitive polymer combination, the manufacture method of cured relief pattern and semiconductor device
CN105802122A (en) * 2016-05-12 2016-07-27 王尧尧 Cable insulation material comprising nano magnesium oxide/low-density polyethylene/modified bentonite and application thereof

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