CN108145931A - One kind is used for the molding refrigeration equipment of material - Google Patents
One kind is used for the molding refrigeration equipment of material Download PDFInfo
- Publication number
- CN108145931A CN108145931A CN201711362745.2A CN201711362745A CN108145931A CN 108145931 A CN108145931 A CN 108145931A CN 201711362745 A CN201711362745 A CN 201711362745A CN 108145931 A CN108145931 A CN 108145931A
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- China
- Prior art keywords
- babinet
- mold
- molding
- type
- circulation pipeline
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
Abstract
The invention provides one kind and is used for the molding refrigeration equipment of material, including：Mold case, refrigeration mechanism, heat dissipation tank；Mold case includes two full symmetric babinets, and box house is divided into cold water storage cistern and equipment box by partition board；Heat dissipation tank includes two full symmetric L-type babinets, and the horizontal segment bottom surface of L-type babinet is connected with the top of mold case；Equipment box is internally provided with first circulation pipeline, and the both ends of first circulation pipeline are inserted into inside cold water storage cistern, and first circulation pump is additionally provided on first circulation pipeline；The top of L-type babinet horizontal segment is equipped with second circulation pipeline, and L-type box house is inserted at the both ends of second circulation pipeline, and second circulation pump is additionally provided on second circulation pipeline；Refrigeration mechanism includes protective shell, semiconductor chilling plate and heat-conducting silicone grease.One kind described in the invention can accelerate material by Refrigeration Technique for the molding refrigeration equipment of material and be molded.
Description
Technical field
The invention belongs to cooling apparatus field, and the molding refrigeration equipment of material is used for more particularly, to one kind.
Background technology
Injection molding is also known as injection molding molding, is a kind of important forming method.Injection molding have speed of production it is fast,
The advantages that working efficiency is high, finished size is accurate, is suitable for producing complex-shaped part in enormous quantities.
Existing injection mold radiates merely by cross-ventilation after raw material is poured, causes raw material shaping speed excessively slow,
Working efficiency is reduced, while in mold mouth " early solidifying " phenomenon easily occurs for the raw material of molten state.So it needs to research and develop a kind of high
The Novel injection mold cooling equipment of efficiency.
Invention content
In view of this, the invention is directed to a kind of for the molding refrigeration equipment of material, to improve injection molding
Working efficiency.
In order to achieve the above objectives, the technical solution of the invention is realized in：
One kind is used for the molding refrigeration equipment of material, including：Mold case, refrigeration mechanism, heat dissipation tank；The mold case includes
Two full symmetric babinets, the box house are divide into upper part and lower part by partition board, and top is cold water storage cistern, and lower section is equipment
Case, cold water storage cistern are internally provided with heat transferring medium；Mold slot is equipped in the side of babinet, two babinets carry the one of mold slot
Side fits, and forms mold space；The top of the mold case is equipped with injecting hole, and the injecting hole runs through the upper end of mold case simultaneously
Connect mold space；The heat dissipation tank includes two full symmetric L-type babinets, and the L-type box house is equipped with heat transferring medium,
The horizontal segment bottom surface of L-type babinet is connected with the top of the mold case；Channel slot is equipped on one end of L-type babinet horizontal segment,
Two L-type babinets fitting on one side with channel slot, forms injection channel, and the injection channel is connected with injecting hole
It is logical；The refrigeration mechanism includes protective shell, semiconductor chilling plate and heat-conducting silicone grease, and the semiconductor chilling plate overlapping is positioned over guarantor
In protective case, the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate is towards the hot face of previous semiconductor chilling plate, in two adjacent semiconductors
The heat-conducting silicone grease is equipped between cooling piece；The cold end of the refrigeration mechanism is inserted into cold water storage cistern, the system from the outside of cold water storage cistern
L-type babinet is inserted into the hot junction of cold structure from the inside of L-type babinet vertical section；The cold end of refrigeration mechanism can absorb the heat in environment
Amount is the heat transferring medium refrigeration inside cold water storage cistern, and the hot junction of refrigeration mechanism can be L-type box house to Environment release heat
Heat transferring medium heats；Front and rear two surface of the mold case is equipped with fixed lock, and the fixed lock can be in the note of the present apparatus
It is moulded into type and plays position-limiting action in the process.
Further, the equipment box is internally provided with first circulation pipeline, and the both ends of the first circulation pipeline are inserted into
Inside cold water storage cistern, first circulation pump is additionally provided on first circulation pipeline, the first circulation pump can promote changing in cold water storage cistern
Thermal medium flows, and accelerates process of refrigerastion；The top of the L-type babinet horizontal segment is equipped with second circulation pipeline, the second circulation
L-type box house is inserted at the both ends of pipeline, and second circulation pump is additionally provided on second circulation pipeline, and the second circulation pumps energy
The heat transferring medium in L-type babinet is promoted to flow, accelerates heat transfer process.
Further, thermal insulation board is equipped between the mold box top and heat dissipation tank horizontal ends, the thermal insulation board can prevent
The heat exchange of heat dissipation tank and mold case.
Further, the fitting position of the two tanks is equipped with sealing strip, is additionally provided on babinet and is matched with sealing strip
Groove；The sealing strip is placed in groove, can guarantee the leakproofness of the present apparatus.
Further, the side wall of the injection channel can facilitate injection raw material to enter with vertical plane there are 10 ° of inclination angle
Mold space.
Further, the internal box wall in the mold space is equipped with 3 ° of demoulding oblique angle, contributes to the demoulding of finished product.
Further, the inner wall of the protective shell is equipped with grooving, and the grooving can limit semiconductor chilling plate；
The inner wall size of the protective shell is less than semiconductor refrigerating chip size, can prevent refrigeration mechanism inner inlet from short circuit occurs.
Relative to the prior art, one kind described in the invention has following excellent for the molding refrigeration equipment of material
Gesture：
One kind described in the invention is used for the molding refrigeration equipment of material, simple in structure easily operated, can accelerate note
Mould molding cooling procedure；For the present apparatus using semiconductor chilling plate as refrigeration mechanism, temperature control is accurate, can be different originals
Material selects its suitable cooling temperature；The injection channel of the present apparatus is effectively utilized the hot junction heat of semiconductor chilling plate, can keep away
Exempt from early coagulation phenomena.
Description of the drawings
The attached drawing for forming the part of the invention is used for providing further understanding the invention, present invention wound
The illustrative embodiments and their description made do not form the improper restriction to the invention for explaining the invention.
In attached drawing：
Fig. 1 is the trimetric drawing of the invention；
Fig. 2 is the front section view of the invention；
Fig. 3 is the side sectional view of the invention；
Fig. 4 is the babinet of the invention and sealing strip schematic diagram；
Fig. 5 is the L-type babinet schematic diagram of the invention；
Fig. 6 is the refrigeration mechanism cut-away illustration of the invention.
Reference sign：
1- mold casees；11- babinets；111- grooves；112- sealing strips；113- mold slots；12- cold water storage cisterns；13- equipment boxs；
14- injecting holes；15- fixes lock；16- partition boards；2- refrigeration mechanisms；21- protective shells；22- semiconductor chilling plates；23- thermal conductive silicons
Fat；3- heat dissipation tanks；31-L molding box bodies；32- injection channels；33- channel slots；4- molds space；5- first circulation pipelines；51-
One circulating pump；6- second circulation pipelines；61- second circulations pump；7- thermal insulation boards.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the invention can
To be combined with each other.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " on ", " under ",
The orientation or position relationship of the instructions such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of description the invention and simplifies description rather than instruction
Or imply that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore be not understood that
For the limitation to the invention.In addition, term " first ", " second " etc. are only used for description purpose, and it is not intended that instruction
Or imply relative importance or the implicit quantity for indicating indicated technical characteristic." first ", " second " etc. are defined as a result,
Feature can express or implicitly include one or more this feature.In the description of the invention, unless separately
It is described, " multiple " are meant that two or more.
In the description of the invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanical connection or electrical connection；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, on being understood by concrete condition
State concrete meaning of the term in the invention.
The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments creates.
As shown in Figure 1, Figure 2 and Figure 3, it is a kind of to be used for the molding refrigeration equipment of material, including：Mold case 1, refrigeration mechanism 2,
Heat dissipation tank 3；Mold case 1 includes two full symmetric babinets 11, is divide into upper part and lower part inside babinet 11 by partition board 16, on
Side is cold water storage cistern 12, and lower section is equipment box 13, and cold water storage cistern 12 is internally provided with heat transferring medium；Mold is equipped in the side of babinet 11
Slot 113, side of the two tanks 11 with mold slot 113 fit, and form mold space 4, and the internal box wall in mold space 4 is equipped with 3 °
Demoulding oblique angle, contribute to the demoulding of finished product；The fitting position of two tanks 11 is equipped with sealing strip 112, is additionally provided on babinet 11
With 112 matched groove 111 of sealing strip；Sealing strip 112 is placed in groove 111, can guarantee the leakproofness of the present apparatus；Mold case
1 top is equipped with injecting hole 14, and injecting hole 14 is through the upper end of mold case 1 and connects mold space 4；Heat dissipation tank 3 includes two
Full symmetric L-type babinet 31, L-type babinet 31 are internally provided with heat transferring medium, horizontal segment bottom surface and the mold case 1 of L-type babinet 31
Top be connected, thermal insulation board 7 is equipped between the top of mold case 1 and 3 horizontal ends of heat dissipation tank, thermal insulation board 7 can prevent heat dissipation tank 3 and modeling
The heat exchange of moulding box 1；Channel slot 33 is equipped on one end of 31 horizontal segment of L-type babinet, two L-type babinets 31 carry channel slot 33
It fits on one side, forms injection channel 32, injection channel 32 is connected with injecting hole 14, the side wall and vertical plane of injection channel 32
There are 10 ° of inclinations angle, and injection raw material can be facilitated to enter mold space 4；The cold end of refrigeration mechanism 2 is inserted from the outside of cold water storage cistern 12
Enter cold water storage cistern 12, L-type babinet 31 is inserted into the hot junction of refrigeration mechanism 2 from the inside of 31 vertical section of L-type babinet；Refrigeration mechanism 2 it is cold
End can absorb the heat in environment, be the heat transferring medium refrigeration inside cold water storage cistern 12, the hot junction of refrigeration mechanism 2 can be to Environment release
Heat is the heat transferring medium heating inside L-type babinet 31；Front and rear two surface of mold case 1 is equipped with fixed lock 15, fixing lock
Button 15 can play position-limiting action in the injection molding process of the present apparatus.
To accelerate heat exchange process, equipment box 13 is internally provided with first circulation pipeline 5, and the both ends of first circulation pipeline 5 are equal
It is inserted into inside cold water storage cistern 12, first circulation pump 51 is additionally provided on first circulation pipeline 5, first circulation pump 51 can promote cold water storage cistern
Heat transferring medium flowing in 12, accelerates process of refrigerastion；The top of 31 horizontal segment of L-type babinet is equipped with second circulation pipeline 6, and second follows
The both ends in endless tube road 6 are inserted into inside L-type babinet 31, and second circulation pump 61, second circulation are additionally provided on second circulation pipeline 6
Pump 61 can promote the heat transferring medium in L-type babinet 31 to flow, and accelerate heat transfer process.
As shown in fig. 6, refrigeration mechanism 2 includes protective shell 21, semiconductor chilling plate 22 and heat-conducting silicone grease 23, semiconductor refrigerating
The overlapping of piece 22 is positioned in protective shell 21, and the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate 22 is towards previous semiconductor chilling plate 22
Hot face is equipped with heat-conducting silicone grease 23 between two adjacent semiconductor chilling plates 22；The inner wall of protective shell 21 is equipped with grooving, grooving
Semiconductor chilling plate 22 can be limited；The inner wall size of protective shell 21 is less than 22 size of semiconductor chilling plate, can prevent from making
Short circuit occurs for 2 inner inlet of cold structure.
Fig. 4 and Fig. 5 is used to help understand the structure of babinet 11 and L-type babinet 31.
In the present embodiment semiconductor chilling plate be TEC1-12706 type semiconductor chilling plates, heat-conducting silicone grease Noctua-NT-
H1, first circulation pump and second circulation pump are conventional centrifugal pump.The composition of above equipment be connected as it is big well known, therefore not
It repeats herein.
Before start-up operation, present apparatus assembly is finished, and fastens fixed lock 15.During start-up operation, refrigeration mechanism is opened
2, since cold end and the hot junction of semiconductor chilling plate 22 are sequentially connected, so the hot and cold side temperature difference of refrigeration mechanism is very big, such one
Just cold can be provided for the cooling of mold by the cold end of refrigeration mechanism 2, the hot junction of refrigeration mechanism 2 is provided for injection channel 32
Heat.The plastics of thawing are poured into from injection channel 32, plastics enter mold space 4 by injecting hole 14.It opens after cooling solid
Lock button 15, you can take out molding workpiece.
The foregoing is merely the preferred embodiments of the invention, are not intended to limit the invention creation, all at this
Within the spirit and principle of innovation and creation, any modification, equivalent replacement, improvement and so on should be included in the invention
Protection domain within.
Claims (7)
1. one kind is used for the molding refrigeration equipment of material, it is characterised in that：Including：Mold case (1), refrigeration mechanism (2), heat dissipation tank
(3)；The mold case (1) includes two full symmetric babinets (11), is divided into inside the babinet (11) by partition board (16)
Upper and lower two parts, top are cold water storage cistern (12), and lower section is equipment box (13), and cold water storage cistern (12) is internally provided with heat transferring medium；
The side of babinet (11) is equipped with mold slot (113), and two sides of the babinet (11) with mold slot (113) fit, shape
Into mold space (4)；The top of the mold case (1) is equipped with injecting hole (14), and the injecting hole (14) is through mold case (1)
Upper end simultaneously connects mold space (4)；The heat dissipation tank (3) includes two full symmetric L-type babinets (31), the L-type babinet
(31) heat transferring medium is internally provided with, the horizontal segment bottom surface of L-type babinet (31) is connected with the top of the mold case (1)；In L-type case
One end of body (31) horizontal segment is equipped with channel slot (33), the two one side phases of the L-type babinet (31) with channel slot (33)
Fitting, forms injection channel (32), and the injection channel (32) is connected with injecting hole (14)；The refrigeration mechanism (2) includes
Protective shell (21), semiconductor chilling plate (22) and heat-conducting silicone grease (23), semiconductor chilling plate (22) overlapping are positioned over protection
In shell (21), the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate (22) is towards the hot face of previous semiconductor chilling plate (22), adjacent
Two semiconductor chilling plates (22) between be equipped with the heat-conducting silicone grease (23)；The cold end of the refrigeration mechanism (2) is from cold water storage cistern
(12) cold water storage cistern (12) is inserted into outside, and L is inserted into the hot junction of the refrigeration mechanism (2) from the inside of L-type babinet (31) vertical section
Molding box body (31)；Front and rear two surface of the mold case (1) is equipped with fixed lock (15).
It is 2. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The equipment box (13)
First circulation pipeline (5) is internally provided with, cold water storage cistern (12) inside is inserted at the both ends of the first circulation pipeline (5), first
First circulation pump (51) is additionally provided on circulating line (5)；The top of L-type babinet (31) horizontal segment is equipped with second circulation pipeline
(6), L-type babinet (31) inside is inserted at the both ends of the second circulation pipeline (6), is additionally provided on second circulation pipeline (6)
Second circulation pumps (61).
It is 3. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The mold case (1)
Thermal insulation board (7) is equipped between top and heat dissipation tank (3) horizontal ends.
It is 4. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The two tanks (11)
Fitting position be equipped with sealing strip (112), be additionally provided on babinet (11) with sealing strip (112) matched groove (111), institute
Sealing strip (112) is stated to be placed in groove (111).
It is 5. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The injection channel
(32) there are 10 ° of inclinations angle for side wall and vertical plane.
It is 6. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The mold space
(4) internal box wall is equipped with 3 ° of demoulding oblique angle.
It is 7. according to claim 1 a kind of for the molding refrigeration equipment of material, it is characterised in that：The protective shell (21)
Inner wall be equipped with grooving, the grooving can limit semiconductor chilling plate (22)；The inner wall ruler of the protective shell (21)
It is very little to be less than semiconductor chilling plate (22) size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711362745.2A CN108145931A (en) | 2017-12-18 | 2017-12-18 | One kind is used for the molding refrigeration equipment of material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711362745.2A CN108145931A (en) | 2017-12-18 | 2017-12-18 | One kind is used for the molding refrigeration equipment of material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108145931A true CN108145931A (en) | 2018-06-12 |
Family
ID=62467459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711362745.2A Withdrawn CN108145931A (en) | 2017-12-18 | 2017-12-18 | One kind is used for the molding refrigeration equipment of material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108145931A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648815A (en) * | 2019-01-21 | 2019-04-19 | 昆山市麦杰克精密模具有限公司 | A kind of injection mould cooling system |
-
2017
- 2017-12-18 CN CN201711362745.2A patent/CN108145931A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648815A (en) * | 2019-01-21 | 2019-04-19 | 昆山市麦杰克精密模具有限公司 | A kind of injection mould cooling system |
| CN109648815B (en) * | 2019-01-21 | 2022-01-28 | 昆山市麦杰克精密模具有限公司 | Injection mold cooling system |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180612 |