CN108145320A - A kind of cutting method of decorative adhesive film of digital product - Google Patents
A kind of cutting method of decorative adhesive film of digital product Download PDFInfo
- Publication number
- CN108145320A CN108145320A CN201711484303.5A CN201711484303A CN108145320A CN 108145320 A CN108145320 A CN 108145320A CN 201711484303 A CN201711484303 A CN 201711484303A CN 108145320 A CN108145320 A CN 108145320A
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- cutting method
- film
- decorative
- decorative adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to Filming Technology field, especially a kind of cutting method of decorative adhesive film of digital product；It the described method comprises the following steps：（1）It by attachment film on bonding sheet, is bonded between pad pasting and bonding sheet by ultraviolet-curing adhesive, ultraviolet light irradiation is carried out to the ultraviolet-curing adhesive, has a circle cut mark on the side of bonding sheet,（2）Pad pasting is irradiated using laser beam to cut the decorative adhesive film, laser beam flying energy is 0.12 to 0.167J/mm, and the Continuous irradiation time is 0.1 millisecond；The cutting method of the present invention, good cutting effect, the side of the decorating film after cutting will not swell, and defect rate is low.
Description
Technical field
The present invention relates to Filming Technology field, especially a kind of cutting method of decorative adhesive film of digital product.
Background technology
In order to cut various optical films such as polarizing coating, there is the mechanical cutting method cut with punch die or cutter,
And the laser cutting method of optical film is irradiated with laser beam.
On the contrary, in the case of laser cutting method, because cutting bits are difficult to generate during optical film is cut thus, so
Productivity of liquid crystal display panel etc. is many without declining compared with above-mentioned mechanical cutting method, therefore, it is considered that laser cutting method is excellent
In mechanical cutting method.
For example, the method that JP-A-2005-189530 discloses production laminated-type polarization plates, laminate passes through following
Step is formed：Polarization plates and the resin film with more than 80% light transmission rate and 100 DEG C or more glass transition temperatures are laminated,
Then layered product is cut by using the resin film side of laser irradiation layered product.
According to the production method of above-mentioned laminated-type polarization plates, the tree in layered product that can be by irradiating polarization plates and resin film
Adipose membrane side prevents from generating protrusion and protuberance on the cut surface of polarization plates.
Invention content
The purpose of the present invention is：Overcome deficiency of the prior art, provide a kind of cutting effect good digital product decoration
The cutting method of pad pasting.
In order to solve the above technical problems, the technical solution adopted by the present invention is as follows：
A kind of cutting method of decorative adhesive film of digital product, the described method comprises the following steps：
(1) attachment film is bonded on bonding sheet between pad pasting and bonding sheet by ultraviolet-curing adhesive, it is right
The ultraviolet-curing adhesive carries out ultraviolet light irradiation, has a circle cut mark on the side of bonding sheet,
(2) pad pasting is irradiated using laser beam to cut the decorative adhesive film, laser beam flying energy is 0.12 to 0.167J/
Mm, Continuous irradiation time are 0.1 millisecond.
Preferably, the membrane material of the decorative adhesive film be polyimide resin and acrylic resin, the thickness of decorative adhesive film
Spend is 15-20 microns.
Preferably, the membrane material of the decorative adhesive film be polyimide resin and acrylic resin, the thickness of decorative adhesive film
Spend is 18 microns.
Preferably, the laser beam flying energy is 0.15J/mm, and the Continuous irradiation time is 0.1 millisecond.
Preferably, the laser is carbon dioxide laser.
The advantageous effect of technical solution using the present invention is：
The cutting method of the present invention, good cutting effect, the side of the decorating film after cutting will not swell, and defect rate is low.
Specific embodiment
With reference to specification, the invention will be further described.
A kind of cutting method of decorative adhesive film of digital product, includes the following steps：
(1) attachment film is bonded on bonding sheet between pad pasting and bonding sheet by ultraviolet-curing adhesive, it is right
The ultraviolet-curing adhesive carries out ultraviolet light irradiation, has a circle cut mark on the side of bonding sheet,
(2) pad pasting is irradiated using laser beam to cut the decorative adhesive film, laser beam flying energy for 0.12 to
0.167J/mm, Continuous irradiation time are 0.1 millisecond.
Membrane material as a preferred embodiment of the present invention decorative adhesive film is polyimide resin and acrylic acid series tree
Fat, the thickness of decorative adhesive film is 15-20 microns.
Membrane material as a preferred embodiment of the present invention decorative adhesive film is polyimide resin and acrylic acid series tree
Fat, the thickness of decorative adhesive film is 18 microns.
It is 0.15J/mm as a preferred embodiment of the present invention laser beam flying energy, the Continuous irradiation time is 0.1
Millisecond.
It is carbon dioxide laser as a preferred embodiment of the present invention laser.
Using above-mentioned desirable embodiment according to the present invention as enlightenment, by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the content on specification, it is necessary to determine its technical scope according to right.
Claims (5)
1. a kind of cutting method of decorative adhesive film of digital product, it is characterised in that：It the described method comprises the following steps：
（1）It by attachment film on bonding sheet, is bonded between pad pasting and bonding sheet by ultraviolet-curing adhesive, to described
Ultraviolet-curing adhesive carries out ultraviolet light irradiation, has a circle cut mark on the side of bonding sheet,
（2）Pad pasting is irradiated using laser beam to cut the decorative adhesive film, laser beam flying energy is 0.12 to 0.167J/mm,
The Continuous irradiation time is 0.1 millisecond.
2. a kind of cutting method of decorative adhesive film of digital product according to claim 1, it is characterised in that：The decorative paste
The membrane material of film is polyimide resin and acrylic resin, and the thickness of decorative adhesive film is 15-20 microns.
3. a kind of cutting method of decorative adhesive film of digital product according to claim 2, it is characterised in that：The decorative paste
The membrane material of film is polyimide resin and acrylic resin, and the thickness of decorative adhesive film is 18 microns.
4. a kind of cutting method of decorative adhesive film of digital product according to claim 1, it is characterised in that：The laser beam
Scanning energy is 0.15J/mm, and the Continuous irradiation time is 0.1 millisecond.
5. a kind of cutting method of decorative adhesive film of digital product according to claim 1, it is characterised in that：The laser is
Carbon dioxide laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484303.5A CN108145320A (en) | 2017-12-29 | 2017-12-29 | A kind of cutting method of decorative adhesive film of digital product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711484303.5A CN108145320A (en) | 2017-12-29 | 2017-12-29 | A kind of cutting method of decorative adhesive film of digital product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108145320A true CN108145320A (en) | 2018-06-12 |
Family
ID=62460010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711484303.5A Pending CN108145320A (en) | 2017-12-29 | 2017-12-29 | A kind of cutting method of decorative adhesive film of digital product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108145320A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110271175A (en) * | 2019-06-21 | 2019-09-24 | 深圳市能佳自动化设备有限公司 | A kind of processing method that 3D glass pastes decorating film |
| CN111098487A (en) * | 2019-12-31 | 2020-05-05 | 青岛歌尔声学科技有限公司 | Lens film pasting method and film pasting equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653387A (en) * | 2002-05-21 | 2005-08-10 | 3M创新有限公司 | Method for subdividing multilayer optical film cleanly and rapidly |
| CN101505909A (en) * | 2006-08-23 | 2009-08-12 | 日东电工株式会社 | Optical film cutting method and optical film |
| CN103972171A (en) * | 2014-05-28 | 2014-08-06 | 江苏联恒物宇科技有限公司 | Chip cutting process for stainless steel substrate based on liquid silicon printing |
-
2017
- 2017-12-29 CN CN201711484303.5A patent/CN108145320A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653387A (en) * | 2002-05-21 | 2005-08-10 | 3M创新有限公司 | Method for subdividing multilayer optical film cleanly and rapidly |
| CN101505909A (en) * | 2006-08-23 | 2009-08-12 | 日东电工株式会社 | Optical film cutting method and optical film |
| CN103972171A (en) * | 2014-05-28 | 2014-08-06 | 江苏联恒物宇科技有限公司 | Chip cutting process for stainless steel substrate based on liquid silicon printing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110271175A (en) * | 2019-06-21 | 2019-09-24 | 深圳市能佳自动化设备有限公司 | A kind of processing method that 3D glass pastes decorating film |
| CN111098487A (en) * | 2019-12-31 | 2020-05-05 | 青岛歌尔声学科技有限公司 | Lens film pasting method and film pasting equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103687725B (en) | The manufacture method of light-transmissive hard substrate laminate and light transmission hard Base Plate Lamination Device | |
| WO2009057460A1 (en) | Processes for producing glass/resin composite | |
| CN102725241A (en) | Process for producing laminate of light-transmitting rigid plates and device for laminating light-transmitting rigid plates | |
| CN108145320A (en) | A kind of cutting method of decorative adhesive film of digital product | |
| CN110628339A (en) | OCA optical cement production process | |
| CN108667958A (en) | A kind of preparation method of mobile phone faceplate frame porose area substratum transparent | |
| JP2013216013A (en) | Method of manufacturing foil-decorated base material product | |
| CN103801482A (en) | Glue coating and fitting process | |
| CN106698957A (en) | OLED single-face thinning method | |
| JP2011178636A (en) | Method for dividing brittle material substrate, and brittle material member | |
| CN206579248U (en) | A kind of high-speed intelligent pad pasting robot | |
| CN106549115B (en) | The stripping means of anisotropic conductive film and anisotropic conductive film | |
| TW200720061A (en) | Apparatus and method for manufacturing a photosensitive laminated body | |
| TW200700210A (en) | Method for producing transparent film | |
| CN208682263U (en) | A kind of ventilative release film of 3D printing | |
| CN110531546B (en) | Cutting method of liquid crystal handwriting film and liquid crystal handwriting film | |
| TWI521037B (en) | Optical adhesive composition, optical adhesive film and optical laminate | |
| CN100439976C (en) | Dimmer and laminated glass | |
| CN102873868A (en) | Manufacturing method for resin film gamete | |
| RO129866A0 (en) | Process and equipment for making a flexible material from a rigid material | |
| CN113290325A (en) | Laser processing method | |
| TWI354654B (en) | Method for cutting glass | |
| CN107117803A (en) | Scribing equipment and dicing method | |
| CN111045125A (en) | Method for manufacturing large-size slit glass grating | |
| JP7378853B1 (en) | Method for manufacturing a peelable functional seal and functional seal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180612 |