CN108134896A - A kind of camera module pedestal and camera module - Google Patents
A kind of camera module pedestal and camera module Download PDFInfo
- Publication number
- CN108134896A CN108134896A CN201711450427.1A CN201711450427A CN108134896A CN 108134896 A CN108134896 A CN 108134896A CN 201711450427 A CN201711450427 A CN 201711450427A CN 108134896 A CN108134896 A CN 108134896A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- camera module
- bulge
- pcb board
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
Abstract
The embodiment of the invention discloses a kind of camera module pedestal and camera modules.Wherein, camera module pedestal, the bulge-structure including being arranged on base bottom；Gap of the bulge-structure between the position of pedestal and electronic component each on printed circuit board is corresponding so that pedestal with printed circuit board match assembling when, bulge-structure is located in the gap on printed circuit board between each electronic component.The technical solution of the application in the bottom of camera module base by setting bulge-structure, when pedestal and PCB assemble, gap of the bulge-structure between pcb board component, the contact area being effectively increased using bulge-structure between pedestal and pcb board, ensure between pedestal and pcb board when having enough contacts area, the thickness of pedestal wall thickness can be reduced to the greatest extent, and then reduce the volume of entire camera module, be conducive to developing towards miniaturization, portability for camera module.
Description
Technical field
The present embodiments relate to photographic equipment technical field, more particularly to a kind of camera module pedestal and camera
Module.
Background technology
With user to daily necessities, knickknack electric appliance, the miniaturization of digital electronic goods, the requirement of portability increasingly
Height, the volumes of the products such as all kinds of mobile phones, smart machine constantly do it is small do it is thin, correspondingly, forcing camera module also towards small-sized
Change development, how to reduce volume shared by camera, it has also become be badly in need of a great problem captured.
In camera module, in order to ensure the pedestal of camera module and pcb board (Printed Circuit Board,
Printed circuit board) between binding force, need between pedestal and pcb board be equipped with certain contact area, in the prior art, one
As the increase of contact area is realized by increasing the thickness of base wall, for example, for by the camera module of fixed-focus type, pedestal
Wall thickness is designed as 0.3mm.
But pedestal wall thickness directly affects the volume of entire camera module, cause the volume of entire camera module without
Method reduces, and is unfavorable for camera module towards miniaturization, portability development.
Therefore how improving the understructure of camera module, the miniaturization for realizing camera module is people in the art
Member's urgent problem to be solved.
Invention content
The purpose of the embodiment of the present invention is to provide a kind of camera module pedestal and camera module, reduces camera shooting head mould
The volume of group, is advantageously implemented the miniaturization of camera module.
In order to solve the above technical problems, the embodiment of the present invention provides following technical scheme：
On the one hand the embodiment of the present invention provides a kind of camera module pedestal, including：
It is arranged on the bulge-structure of base bottom；
Gap of the bulge-structure between the position of the pedestal and electronic component each on printed circuit board is opposite
Should so that the pedestal with the printed circuit board match assembling when, the bulge-structure is located at the printed circuit board
In gap between upper each electronic component.
Optionally, the bulge-structure is multiple.
Optionally, the material of the bulge-structure is rubber.
Optionally, the wall thickness of the pedestal is 0.1mm.
Optionally, the bulge-structure is cuboid.
On the other hand the embodiment of the present invention provides a kind of camera module, including the camera as described in preceding any one
Module base.
An embodiment of the present invention provides a kind of camera module pedestal, the bulge-structure including being arranged on base bottom；It is convex
Rise gap of the structure between the position of pedestal and electronic component each on printed circuit board it is corresponding so that pedestal with printing
Circuit board match assembling when, bulge-structure is located in the gap on printed circuit board between each electronic component.
The advantages of technical solution that the application provides, is, by setting bulge-structure in the bottom of camera module base,
When pedestal and PCB assemble, gap of the bulge-structure between pcb board component is effectively increased bottom using bulge-structure
Seat pcb board between contact area, ensure between pedestal and pcb board when having enough contacts area, can reduce to the greatest extent
The thickness of pedestal wall thickness, and then reduce the volume of entire camera module, be conducive to camera module towards miniaturization, portable
Change development.
In addition, the embodiment of the present invention provides application scenarios also directed to camera module pedestal, further such that the bottom
With more practicability, the camera module has the advantages that corresponding seat.
Description of the drawings
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing is briefly described needed in technology description, it should be apparent that, the accompanying drawings in the following description is only this hair
Some bright embodiments, for those of ordinary skill in the art, without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 provides a kind of specific embodiment structure chart of camera module pedestal for the embodiment of the present invention；
Fig. 2 provides the structure diagram of pcb board for the embodiment of the present invention.
Specific embodiment
In order to which those skilled in the art is made to more fully understand the present invention program, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiment be only part of the embodiment of the present invention rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
Term " first ", " second ", " third " " in the description and claims of this application and above-mentioned attached drawing
Four " etc. be for distinguishing different objects rather than for describing specific sequence.In addition term " comprising " and " having " and
Their any deformations, it is intended that cover non-exclusive include.Such as contain the process of series of steps or unit, method,
The step of system, product or equipment are not limited to list or unit, but the step of may include not listing or unit.
After the technical solution of the embodiment of the present invention is described, the various nonrestrictive realities of detailed description below the application
Apply mode.
Referring first to Fig. 1, Fig. 1 is a kind of specific embodiment knot of camera module pedestal provided in an embodiment of the present invention
Composition, the embodiment of the present invention may include the following contents：
Camera module pedestal is included in the bulge-structure of base bottom setting.Bulge-structure is in the position of pedestal and printing
Gap on circuit board between each electronic component is corresponding so that pedestal with printed circuit board match assembling when, protrusion
Structure is located in the gap on printed circuit board between each electronic component.
Multiple components, such as capacitance, EEPROM etc. on pcb board are set, when pcb board designs, existed between each component
Certain gap, referring to Fig. 2, each box in Fig. 2 represents component, it is the gap of component between box.
Bulge-structure is arranged on base bottom, since bulge-structure is the contact area in order to increase pedestal and pcb board, i.e.,
After pedestal and pcb board are completed, bulge-structure is located at the interstitial site between component on pcb board, therefore bulge-structure
It is determined in the specific location of pedestal by the interstitial site of component on pcb board.
The number of bulge-structure can be 1 or multiple, the number of bulge-structure, by the gap between PCB components and
The Maximum Contact area that pcb board is needed with pedestal is determined, and during enough more in the gap between PCB components, can set several more
Bulge-structure until meeting the needs of pcb board and pedestal contact area, can thus reduce pedestal wall thickness to the greatest extent
Thickness reduces the volume of camera module to the greatest extent.
In order to ensure to have between pcb board and pedestal enough adhesive forces, the thickness of base wall is designed as 0.3mm.Work as increase
During multiple bulge-structures, the wall thickness of pedestal can be 0.1mm, can ensure there is sufficiently large contact surface between pcb board and pedestal
Product, i.e., there are sufficiently large adhesive forces.
Since bulge-structure is in contact with pcb board, and between the gap of each component, in order to protect each component and
Pcb board, the material of bulge-structure can be rubber.Certainly or other materials, the application do not do this any restriction.
The shape of bulge-structure can be any shape, and the application does not do this any restriction, but with the contact site of pcb board
Divide the interval area that may not exceed between corresponding component, in a kind of specific embodiment, bulge-structure can be cuboid.
In technical solution provided in an embodiment of the present invention, by setting bulge-structure in the bottom of camera module base,
When pedestal and PCB assemble, gap of the bulge-structure between pcb board component is effectively increased bottom using bulge-structure
Seat pcb board between contact area, ensure between pedestal and pcb board when having enough contacts area, can reduce to the greatest extent
The thickness of pedestal wall thickness, and then reduce the volume of entire camera module, be conducive to camera module towards miniaturization, portable
Change development.
In addition, present invention also provides a kind of camera module, including the camera described in as above any one embodiment
Module base specifically describes the description that can refer to the various embodiments described above, and details are not described herein again.
Using the gap between component on pcb board, increase projective structure in the corresponding position of base bottom, bottom can be expanded
Contact area between seat and pcb board.In this way, after the thickness for reducing base wall, the contact area between pedestal and pcb board
It will not reduce, it is ensured that the binding force between pedestal and PCB.And after pedestal wall thickness is reduced, the size of entire camera module
It can become smaller accordingly, save the occupied space of camera module.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with it is other
The difference of embodiment, just to refer each other for same or similar part between each embodiment.For embodiment disclosed device
For, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related part is said referring to method part
It is bright.
Professional further appreciates that, with reference to each exemplary list of the embodiments described herein description
Member can realize with the combination of electronic hardware, computer software or the two, can in order to clearly demonstrate hardware and software
Interchangeability generally describes each exemplary composition and step according to function in the above description.These functions are actually
It is performed with hardware or software mode, specific application and design constraint depending on technical solution.Professional technician
Described function can be realized using distinct methods to each specific application, but this realization is it is not considered that exceed
The scope of the present invention.
A kind of camera module pedestal provided by the present invention and camera module are described in detail above.Herein
In apply specific case the principle of the present invention and embodiment be expounded, the explanation of above example is only intended to sides
Assistant solves the method and its core concept of the present invention.It should be pointed out that for those skilled in the art, not
Be detached from the principle of the invention under the premise of, can also to the present invention some improvement and modification can also be carried out, these improvement and modification are also fallen into
In the protection domain of the claims in the present invention.
Claims (6)
1. a kind of camera module pedestal, which is characterized in that including：
It is arranged on the bulge-structure of base bottom；
Gap of the bulge-structure between the position of the pedestal and electronic component each on printed circuit board is corresponding, with
Make the pedestal with the printed circuit board match assembling when, the bulge-structure is located at each electricity on the printed circuit board
In gap between sub- component.
2. camera module pedestal according to claim 1, which is characterized in that the bulge-structure is multiple.
3. camera module pedestal according to claim 2, which is characterized in that the material of the bulge-structure is rubber.
4. the camera module pedestal according to claims 1 to 3 any one, which is characterized in that the wall thickness of the pedestal
It spends for 0.1mm.
5. camera module pedestal according to claim 4, which is characterized in that the bulge-structure is cuboid.
6. a kind of camera module, which is characterized in that including the camera module bottom as described in claim 1-5 any one
Seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711450427.1A CN108134896A (en) | 2017-12-27 | 2017-12-27 | A kind of camera module pedestal and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711450427.1A CN108134896A (en) | 2017-12-27 | 2017-12-27 | A kind of camera module pedestal and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108134896A true CN108134896A (en) | 2018-06-08 |
Family
ID=62393605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711450427.1A Pending CN108134896A (en) | 2017-12-27 | 2017-12-27 | A kind of camera module pedestal and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108134896A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1199870A (en) * | 1997-02-20 | 1998-11-25 | 松下电器产业株式会社 | Camera shooting element installation structural component for camera |
| CN102946512A (en) * | 2012-11-30 | 2013-02-27 | 信利光电(汕尾)有限公司 | Camera module base |
| CN203722700U (en) * | 2014-01-27 | 2014-07-16 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module thereof |
| CN106817515A (en) * | 2015-11-30 | 2017-06-09 | 宁波舜宇光电信息有限公司 | Camera module and its structure and assemble method |
-
2017
- 2017-12-27 CN CN201711450427.1A patent/CN108134896A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1199870A (en) * | 1997-02-20 | 1998-11-25 | 松下电器产业株式会社 | Camera shooting element installation structural component for camera |
| CN102946512A (en) * | 2012-11-30 | 2013-02-27 | 信利光电(汕尾)有限公司 | Camera module base |
| CN203722700U (en) * | 2014-01-27 | 2014-07-16 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module thereof |
| CN106817515A (en) * | 2015-11-30 | 2017-06-09 | 宁波舜宇光电信息有限公司 | Camera module and its structure and assemble method |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180608 |
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| RJ01 | Rejection of invention patent application after publication |