CN108134003B - Blue light-proof packaging LED light-emitting device and backlight module thereof - Google Patents
Blue light-proof packaging LED light-emitting device and backlight module thereof Download PDFInfo
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- CN108134003B CN108134003B CN201711483855.4A CN201711483855A CN108134003B CN 108134003 B CN108134003 B CN 108134003B CN 201711483855 A CN201711483855 A CN 201711483855A CN 108134003 B CN108134003 B CN 108134003B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 79
- 239000000463 material Substances 0.000 claims abstract description 48
- 230000002265 prevention Effects 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 7
- 239000000084 colloidal system Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000010521 absorption reaction Methods 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 230000031700 light absorption Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 230000006378 damage Effects 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- JPOPEORRMSDUIP-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(2,3,5,6-tetrachlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C=C(Cl)C=2Cl)Cl)=C1Cl JPOPEORRMSDUIP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 206010025421 Macule Diseases 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000695 excitation spectrum Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000003053 toxin Substances 0.000 description 1
- 231100000765 toxin Toxicity 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a blue light prevention packaging LED light-emitting device and a backlight module thereof, comprising at least one LED blue light chip, wherein a fluorescent conversion layer is covered on the LED blue light chip, the fluorescent conversion layer comprises white light conversion fluorescent powder and thermosetting colloid, and the fluorescent conversion layer also comprises a fluorescent conversion material capable of absorbing blue light with peak wavelength in a 435-475nm wave band range to enable the peak wavelength of the blue light to be red shifted; the backlight module is internally provided with the blue light prevention packaging LED light-emitting device. The invention aims to provide a blue light prevention packaging LED light-emitting device and a backlight module thereof, so that the LED light-emitting device and the backlight module with the LED light-emitting device can reduce the damage of blue light and maintain the original packaging color point and brightness.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a blue light prevention packaging LED light emitting device and a backlight module thereof.
Background
Blue light prevention has become a new hot spot in the field of LEDs, and demands of markets for blue light prevention products are also increasing. The traditional blue light exists in a large amount in light rays emitted by computer displays, fluorescent lamps, mobile phones, digital products, display screens, LEDs and the like, and the blue light in the wavelength can increase the toxin amount in the macula area in eyes, so that the health of eyes is seriously threatened. Harmful blue light between 400nm and 450nm has the greatest energy and the greatest harm to human eyes.
At present, the blue light prevention technology of LEDs is mainly divided into two types: one method is a module structure, in which a specific wavelength filtering material is added to filter a specific blue light wavelength part, so that harmful blue light energy can be effectively reduced, but the reduction of blue light energy can change the module RGB proportion, so that the color point of the module is changed; another method is to use blue light chips with long wavelength to stagger 435nm part which is the most harmful to human eyes when the LED is packaged, so that short wave blue light part is effectively reduced, but the brightness of the LED package is reduced by using long wave chips.
Therefore, on the basis of the existing LED packaging technology, an LED light emitting device capable of reducing blue light hazard is developed, and the LED light emitting device can maintain the original packaging color point and brightness and realize mass production, which is obviously a technical problem to be solved in the technical field.
Disclosure of Invention
In order to solve the defects in the prior art, the invention aims to provide the blue light prevention packaging LED light-emitting device and the backlight module thereof, so that the LED light-emitting device and the backlight module with the LED light-emitting device can reduce the damage of blue light and can maintain the original packaging color point and brightness.
In order to solve the problems, the invention provides a blue light prevention packaging LED light-emitting device, which comprises at least one LED blue light chip, wherein a fluorescent conversion layer is coated on the LED blue light chip, and the fluorescent conversion layer comprises white light conversion fluorescent powder and thermosetting colloid.
Preferably, the weight percentage of the fluorescence conversion material in the fluorescence conversion layer is 2% -30%.
Preferably, the fluorescent conversion material has an emission in the wavelength band of 465-500 nm.
Preferably, the fluorescence conversion material is selected from one or more of LuAG, luGaAG, gaYAG and gamma-ALON.
Preferably, the absorption peak value of the fluorescent conversion material is in the wave band range of 410-445nm, and the half-wave width of the absorption peak value is smaller than 60nm.
Preferably, the absorption capacity of the fluorescent conversion material for blue light at 455nm wavelength is lower than 20% of the maximum peak value of the blue light absorption of the fluorescent conversion material.
Preferably, the absorption capacity of the fluorescent conversion material for blue light in a wavelength band of more than 455nm is smaller than that in a wavelength band of less than 455 nm.
Preferably, the thermosetting colloid is selected from one or more of silica gel, silicone resin or epoxy resin.
The blue light prevention packaging LED backlight module comprises an LED light emitting device, wherein the LED light emitting device is based on the blue light prevention packaging LED light emitting device.
By adopting the preferable scheme, compared with the prior art, the invention has the following advantages:
1. according to the LED light-emitting device, the fluorescent conversion material capable of absorbing blue light with the peak wavelength in the range of 435-475nm to enable the peak wavelength of the blue light to be red-shifted is added into the fluorescent conversion layer, and because the peak wavelength of harmful short-wave blue light is red-shifted, the short-wave blue light with 435nm wavelength, which has a large harm to eyes, is avoided, so that the effect of protecting eyes is achieved well.
2. The fluorescent conversion material has strong absorption in the wave band range of 410-445nm, and has little absorption to the blue light part in the wave band range above 455nm wavelength, so that the harmful short-wave blue light of the packaged LED light-emitting device is greatly reduced, and the fluorescent conversion material has emission enhancement in the wave band range of 465-500nm, can supplement blue light required by exciting the white light part of the original LED, so that RGB three colors in the LED light-emitting device are balanced, and the color point of the LED before special fluorescent powder is added is kept unchanged.
3. The LED light-emitting device can achieve the same blue light prevention effect as the blue light chip with the longer wavelength band range by using the blue light chip with the shorter wavelength band range, simultaneously avoids the problem of reduced light-emitting brightness of the LED light-emitting device when the blue light chip with the longer wavelength band range is used, and is convenient to popularize and apply.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a structure of an LED light emitting device of the present invention;
FIG. 2 is a schematic diagram of exemplary spectral contrast in accordance with the present invention;
FIG. 3 is a graph showing peak red-shift contrast of the present invention;
FIG. 4 is a schematic diagram of excitation spectra of a fluorescent conversion material of the present invention;
fig. 5 is a schematic diagram of a direct type LED backlight module according to embodiment 5 of the present invention;
fig. 6 is a schematic diagram of a side-entry LED backlight module according to embodiment 6 of the present invention.
Wherein:
100-LED light-emitting devices, 101-brackets, 102-LED blue light chips, 103-fluorescent conversion layers and 104-cups;
200-direct type backlight module, 201-optical lens, 202-first PCB board, 203-back plate, 204-diffusion plate, 205-prism sheet, 206-diffusion sheet;
300-side-in type backlight module, 301-second PCB board, 302-reflection sheet, 303-light guide plate, 304-brightness enhancement film and 305-diffusion film.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, and the described embodiments are merely some, rather than all, embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention provides a blue light prevention packaging LED light-emitting device, which comprises at least one LED blue light chip, wherein a fluorescent conversion layer is covered on the LED blue light chip, and the fluorescent conversion layer comprises white light conversion fluorescent powder and thermosetting colloid. Compared with the LED luminescent device in the prior art, the LED luminescent device is mainly improved in that the fluorescent conversion layer further comprises a fluorescent conversion material which can absorb blue light with the peak wavelength in the range of 435-475nm and enable the peak wavelength of the blue light to be red shifted.
As a preferred embodiment, the weight percentage of the fluorescent conversion material in the fluorescent conversion layer is 2% -30%. The fluorescent conversion material can be selected from one or more of LuAG, luGaAG, gaYAG and gamma-ALON. And the fluorescent conversion material has an emission in the wavelength band of 465-500nm as shown in fig. 4.
Further, the absorption peak value of the fluorescent conversion material is in the wave band range of 410-445nm, and the half-wave width of the absorption peak value is smaller than 60nm. The absorption capacity of the fluorescent conversion material for blue light at 455nm wavelength is lower than 20% of the maximum peak value of the fluorescent conversion material for blue light. The absorption capacity of the fluorescent conversion material for blue light in a wave band range with the wavelength larger than 455nm is smaller than that in a wave band range with the wavelength smaller than 455 nm.
As a preferred embodiment, the thermosetting colloid may be selected from one or more of silica gel, silicone resin or epoxy resin.
The technical scheme of the invention is further described in detail below with reference to specific embodiments and attached drawings:
example 1
The embodiment provides a blue light prevention packaging LED light-emitting device, which consists of an LED blue light chip with a peak wavelength of 445nm and a fluorescence conversion layer. The fluorescent conversion layer consists of white light conversion fluorescent powder, fluorescent conversion material and silica gel.
In this embodiment, the white light conversion phosphor absorbs yellow light within a wavelength range of 500-600nm emitted from the LED blue light chip, and the blue light emitted from the LED blue light chip is mixed with the yellow light emitted from the white light conversion phosphor to form white light. In order to reduce the harm of high-energy short-wave blue light in the wave band range of 400-450nm and avoid the deviation of color coordinates from the range of backlight requirements caused by the reduction of the content of the blue light, the fluorescent conversion material is added, and the fluorescent conversion material in the embodiment is LuAG, wherein the absorption peak wavelength is 430nm, the absorption of the blue light with 455nm wavelength is 20% of the maximum absorption peak, and the absorption capacity of the blue light with the wave band range greater than 455nm wavelength is lower than the wave band range less than 455 nm. The half-wave width of the absorption peak of the fluorescent conversion material in this example was 60nm, the emission peak thereof was 510nm, and there was emission in the wavelength band range of 465 to 500 nm. The weight percentage of the fluorescent conversion material in this example was 10%. By adding the fluorescent conversion material, the peak wavelength of the LED blue light chip is shifted by 3nm. In this embodiment, (0.27± 0.08) backlight demand color coordinates can be achieved.
Example 2
The present embodiment provides a blue light preventing packaged LED light emitting device, and the same points as those in embodiment 1 are not described in detail.
The peak wavelength of the LED blue light chip in this embodiment is 455nm, the white light conversion phosphor absorbs green light and red light emitted from the LED blue light chip, and the blue light emitted from the LED blue light chip and the green light and red light emitted from the white light conversion phosphor are mixed into white light. The fluorescent conversion material in this example was LuGaAG, and the absorption peak wavelength thereof was located at 410nm, and the absorption of blue light having a wavelength of 455nm was 15% of the maximum absorption peak. The half-wave width of the absorption peak of the fluorescent conversion material in this example was 50nm, the emission peak thereof was 500nm, and there was emission in the wavelength band of 465 to 500 nm. The weight percentage of the fluorescent conversion material in this example was 20%. By adding the fluorescent conversion material, the peak wavelength of the LED blue light chip is shifted by 5nm.
Example 3
The present embodiment provides a blue light preventing packaged LED light emitting device, and the same points as those in embodiment 1 are not described in detail.
The peak wavelength of the LED blue light chip in this embodiment is 435nm, the white light conversion phosphor absorbs green light and red light emitted from the LED blue light chip, and the blue light emitted from the LED blue light chip and the green light and red light emitted from the white light conversion phosphor are mixed into white light. The fluorescent conversion material in this example was GaYAG, which has an absorption peak wavelength of 430nm and an absorption of 455nm blue light of 5% of the maximum absorption peak. The half-wave width of the absorption peak of the fluorescent conversion material in this example was 60nm, the emission peak thereof was 520nm, and there was emission in the wavelength band range of 465 to 500 nm. The weight percentage of the fluorescent conversion material in this example was 2%. By adding the fluorescent conversion material, the peak wavelength of the LED blue light chip is shifted by 1nm.
Example 4
The embodiment provides a blue light preventing packaged LED light emitting device, and the same points as those in embodiment 1 are not described in detail.
The peak wavelength of the LED blue light chip in this embodiment is 475nm, the white light conversion phosphor absorbs green light and red light emitted from the LED blue light chip, and the blue light emitted from the LED blue light chip and the green light and red light emitted from the white light conversion phosphor are mixed into white light. The fluorescence conversion material in this embodiment is γ -ALON, and the absorption peak wavelength is 430nm, and the absorption of blue light with 455nm wavelength is 15% of the maximum absorption peak. The half-wave width of the absorption peak of the fluorescent conversion material in this example was 60nm, the emission peak thereof was 521nm, and there was emission in the wavelength band range of 465 to 500 nm. The weight percentage of the fluorescent conversion material in this example was 30%. By adding the fluorescent conversion material, the peak wavelength of the LED blue light chip is shifted by 5nm.
Red-shifting of the peak blue wavelength referring to fig. 3, it is apparent that the specific band length of red-shifting of the peak blue wavelength is related to the fluorescent conversion material of the present invention according to examples 1 to 4. The schematic structural diagrams of the LED light emitting devices manufactured in embodiments 1-4 of the present invention can be seen in fig. 1, and the LED light emitting device 100 shown in fig. 1 has an LED support 101, the top of the support is recessed inwards to form a cup 104, an LED blue light chip 102 is arranged at the bottom of the cup 104, and a fluorescent conversion layer 103 is filled in the cup 104 and covers the surface of the light emitting surface of the LED blue light chip 102. Of course, in practical application, there is also an LED light emitting device without an LED support, and at this time, a person skilled in the art can prepare an LED light emitting device without an LED support with the characteristics of the present invention according to actual needs, as long as the surface of the light emitting surface of the LED chip is coated with the fluorescent conversion layer with the characteristics of the present invention.
The blue light prevention packaging LED light emitting device provided by the invention can be applied to an LED backlight module, such as a direct type or side-in type backlight module. Further description is provided below by way of examples 5, 6:
example 5
The present embodiment provides a blue light preventing packaged LED direct type backlight module 200, and the structure of the backlight module 200 is just that of an existing LED direct type backlight module, and the main difference between the structure and the existing LED direct type backlight module is that the LED light emitting device of the backlight module adopts the blue light preventing packaged LED light emitting device 100 provided in any one of embodiments 1 to 4. Fig. 5 shows an LED direct type backlight module 200 employing the blue light preventing package LED light emitting device 100 of embodiment 1. The backlight module 200 shown in fig. 5 has a first PCB 202, an optical lens 201, a diffusion plate 204, a prism sheet 205, a diffusion sheet 206, and a back plate 203. The LED light emitting device 100 is arranged on the first PCB 202, the optical lens 201 is arranged at the top of the LED light emitting device 100, the first PCB 202 provided with the LED light emitting device 100 is fixedly arranged at the bottom of the back plate 203, the diffusion plate 204 is arranged at the top of the back plate 203, the prism sheet 205 is arranged on the upper surface of the diffusion plate 204, and the diffusion sheet 206 is arranged on the upper surface of the prism sheet 205.
Example 6
The present embodiment provides a blue light preventing packaging LED side-entering type backlight module 300, and the structure of the backlight module 300 is that an existing LED side-entering type backlight module structure is adopted, and the main difference between the structure and the existing LED side-entering type backlight module is that the LED light emitting device of the backlight module adopts the blue light preventing packaging LED light emitting device 100 provided in any one of embodiments 1 to 4. Fig. 6 shows an LED side-entry backlight module 300 employing the blue light preventing package LED light emitting device 100 of embodiment 1. The backlight module 300 shown in fig. 6 includes a light guide plate 303, a reflective sheet 302, a brightness enhancement film 304, and a diffusion film 305. The LED light emitting device 100 is connected to the second PCB 301 and disposed on one side of the light guide plate 303, the reflective sheet 302 and the brightness enhancement film 304 are disposed on the lower surface and the upper surface of the light guide plate 303, respectively, and the diffusion film 305 is disposed on the upper surface of the brightness enhancement film 304.
The present invention is not limited to the preferred embodiments, and any modifications, equivalent variations and modifications made to the above embodiments according to the technical principles of the present invention are within the scope of the technical proposal of the present invention.
Claims (9)
1. The blue light-proof packaging LED light-emitting device comprises at least one LED blue light chip, wherein a fluorescent conversion layer is covered on the LED blue light chip and comprises white light conversion fluorescent powder and thermosetting colloid, and the blue light-proof packaging LED light-emitting device is characterized in that the fluorescent conversion layer also comprises a fluorescent conversion material capable of absorbing blue light with peak wavelength in a 435-475nm wave band range to enable the peak wavelength of the blue light to be red shifted.
2. The blue light resistant packaged LED light emitting device of claim 1, wherein the fluorescent conversion material comprises 2% -30% by weight of the fluorescent conversion layer.
3. The blue light resistant packaged LED light emitting device of claim 1, wherein the fluorescent conversion material emits in the 465-500nm band.
4. A blue light protected encapsulated LED light emitting device according to any of claims 1-3 wherein said fluorescent conversion material is selected from one or more of LuAG, luGaAG, gaYAG, γ -ALON.
5. A blue light protected packaged LED light emitting device according to any one of claims 1 to 3 wherein said fluorescent conversion material has an absorption peak in the range of 410-445nm and a half-wave width of the absorption peak is less than 60nm.
6. The blue light resistant packaged LED light emitting device of claim 5, wherein the fluorescent conversion material has an absorption capacity for blue light at 455nm wavelength that is less than 20% of the maximum peak of blue light absorption by the fluorescent conversion material.
7. The blue light resistant packaged LED lighting device of claim 5, wherein said fluorescent conversion material has a blue light absorption capacity in a wavelength band greater than 455nm that is less than a wavelength band less than 455 nm.
8. The blue light resistant packaged LED light emitting device of claim 1, wherein the thermoset gel is selected from one or more of a silicone gel, a silicone resin, or an epoxy resin.
9. The blue light prevention packaging LED backlight module comprises an LED light emitting device and is characterized in that the LED light emitting device is the blue light prevention packaging LED light emitting device according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711483855.4A CN108134003B (en) | 2017-12-29 | 2017-12-29 | Blue light-proof packaging LED light-emitting device and backlight module thereof |
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| CN201711483855.4A CN108134003B (en) | 2017-12-29 | 2017-12-29 | Blue light-proof packaging LED light-emitting device and backlight module thereof |
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| CN108134003B true CN108134003B (en) | 2024-03-19 |
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| CN110687716A (en) * | 2018-07-04 | 2020-01-14 | 深圳Tcl新技术有限公司 | Backlight module |
| CN109669299A (en) | 2019-01-30 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of twin crystal chip, display device and its driving method |
| CN112029380A (en) * | 2020-09-08 | 2020-12-04 | 贵溪市清亮照明科技有限公司 | Blue light removing coating |
| CN112038465A (en) * | 2020-09-08 | 2020-12-04 | 贵溪市清亮照明科技有限公司 | Remove blue light LED chip |
| CN112029335A (en) * | 2020-09-16 | 2020-12-04 | 贵溪市清亮照明科技有限公司 | Blue-light-removing coating for LED |
| CN112126209A (en) * | 2020-09-24 | 2020-12-25 | 贵溪市清亮照明科技有限公司 | Blue light removing photodiffusion material, photocureable coating and LED light source |
| CN114141140A (en) * | 2021-11-01 | 2022-03-04 | 深圳市高展光电有限公司 | Blue light prevention display screen assembly |
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| CN104241507A (en) * | 2014-09-18 | 2014-12-24 | 晶科电子（广州）有限公司 | Wide-color-gamut LED light-emitting device and backlight module with same |
| CN204102939U (en) * | 2014-09-18 | 2015-01-14 | 晶科电子（广州）有限公司 | A kind of wide colour gamut LED and backlight assembly thereof |
| CN106356368A (en) * | 2016-11-08 | 2017-01-25 | 深圳市华星光电技术有限公司 | Quantum dot LED backlight light source structure and display device |
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| TWI243489B (en) * | 2004-04-14 | 2005-11-11 | Genesis Photonics Inc | Single chip light emitting diode with red, blue and green three wavelength light emitting spectra |
| TWI645579B (en) * | 2014-08-11 | 2018-12-21 | 佰鴻工業股份有限公司 | Light-emitting diode module with reduced blue light energy |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104241507A (en) * | 2014-09-18 | 2014-12-24 | 晶科电子（广州）有限公司 | Wide-color-gamut LED light-emitting device and backlight module with same |
| CN204102939U (en) * | 2014-09-18 | 2015-01-14 | 晶科电子（广州）有限公司 | A kind of wide colour gamut LED and backlight assembly thereof |
| CN106356368A (en) * | 2016-11-08 | 2017-01-25 | 深圳市华星光电技术有限公司 | Quantum dot LED backlight light source structure and display device |
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