CN108120371A - Sub-wavelength dimensions microelectronic structure optical critical dimension method for testing and analyzing and device - Google Patents

Sub-wavelength dimensions microelectronic structure optical critical dimension method for testing and analyzing and device Download PDF

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CN108120371A
CN108120371A CN201611079665.1A CN201611079665A CN108120371A CN 108120371 A CN108120371 A CN 108120371A CN 201611079665 A CN201611079665 A CN 201611079665A CN 108120371 A CN108120371 A CN 108120371A
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sample
far field
spectrum
tested
lens
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邓浩
李雯
陈树强
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Fujian Institute of Research on the Structure of Matter of CAS
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Fujian Institute of Research on the Structure of Matter of CAS
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques

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Abstract

This application discloses a kind of sub-wavelength dimensions microelectronic structure optical critical dimension analysis methods, which is characterized in that includes step:A) sample to be tested surface is placed in by far field super lens are parallel, the far field super lens surface for the combining structure that far field super lens and sample to be tested are formed is irradiated with light source, measure sample actual measurement Zero-order diffractive spectrum;B) based on vector analysis algorithm, initial critical size parameter is set, the simulation Zero-order diffractive spectrum of the combining structure is calculated in simulation;C) above-mentioned spectrum is compared:As consistent, then simulation is calculated and compared again again after critical size parameter described in amendment step b);As consistent, then with reference to the current critical size parameter simulated Zero-order diffractive spectrum and the parameter of the far field super lens, sample to be tested is calculated.Disclosed herein as well is the devices that the above method uses.

Description

Sub-wavelength dimensions microelectronic structure optical critical dimension method for testing and analyzing and device
Technical field
The invention belongs to optical engineering fields, are related to a kind of sub-wavelength period microelectronic structure optical critical dimension test point Analysis method.
Background technology
In semiconductor and other microelectronic industrys, chip structure is crucial to its microelectronic structure in design and manufacture The fast and effective detection of size (CD) is to control the important means of chip yields and volume production efficiency.Chip integration is high, passes through After the series of process such as plate-making, photoetching, etching, the structure (Pattern) on chip will form periodic arrangement.Periodic arrangement The size detecting method of micro-structure is more, such as conventional optical microscope technology, microscopy (EM), probe microscopy (SPM).But It is that these detection methods either need complicated microscope device that high vacuum environment is either needed to test or can only realize table Facial contour pattern test can damage micro-structure, therefore all be difficult to realize the on-line quick detection during volume production. Can then on-line checking be realized to microelectronic structure CD, it is simple to test environment requirement, can also divide using optical diffraction principle The dimensional parameters of structure non-surface layer are analysed, therefore as technological means important in CD tests/analysis.The technology originates from grating Design and the diffraction measurement art in preparation process, by obtaining structure feature to periodic structure far field construction specificity analysis Parameter.
In semiconductor microelectronic field, due to laying particular emphasis on the measurement to chip critical size, which is more claimed (OCD) is detected for optical critical dimension.The technology has more than 30 years development history in the world, and the OCD detections of early stage are using mark Electromagnetic field is to realize CD tests/analysis in amount diffraction model simulation micro-structure.But with manufacturing process in semiconductor industry Constantly upgrading, scalar diffraction model have been difficult in adapt to the required precision in OCD detections, more accurate microelectronic structure critical size Detection technique becomes the problem of urgently final result.
The content of the invention
According to the one side of the application, a kind of sub-wavelength dimensions microelectronic structure optical critical dimension analysis side is provided Method, this method are based on test/analysis system of far field super lens (abbreviation FSL) improving optical critical size (being abbreviated as OCD) Measurement accuracy, and smaller optical critical dimension can be measured, the method includes the steps of:
A) sample to be tested surface is placed in by far field super lens are parallel, irradiate far field super lens with light source and sample to be tested is formed Combining structure far field super lens surface, measure sample actual measurement Zero-order diffractive spectrum;
B) based on vector analysis algorithm, initial critical size parameter is set, the combining structure is calculated in simulation Simulate Zero-order diffractive spectrum;
C) the simulation Zero-order diffractive spectrum that step b) is obtained is compared with the obtained measured spectras of step a):It is such as right More inconsistent than result, then described in amendment step b) after critical size parameter, the combining structure is calculated in simulation again Zero-order diffractive spectrum is simulated, and the measured spectra with being measured in step a) compares;If comparing result is consistent, then combines and work as The critical size parameter of sample to be tested is calculated in preceding simulation Zero-order diffractive spectrum and the parameter of the far field super lens.
Preferably, the far field super lens are made of one-dimensional metal silver-glass raster and metallic silver thin plate.
It is further preferred that metallic silver thin plate one side of the sample to be tested in the far field super lens.Its is beneficial Have the technical effect that first pass through metallic silver thin plate realize to sample diffraction generate evanescent wave enhancing, then pass through metal grating Evanescent wave is converted into transmission wave to be received in far field by the diffraction of structure, to obtain high-precision sub-wavelength dimensions microelectronic structure Structure optical critical dimension analysis result.The structural parameters of metallic silver-glass raster and metallic silver thin plate in the far field super lens (including metal grating cycle, grating thickness, sheet metal thickness etc.) can be carried out according to specimen material and its critical size scope Design, to obtain high-precision sub-wavelength dimensions microelectronic structure optical critical dimension analysis result.
It is further preferred that the grating period A of the metallic silver-glass raster2With the screen periods of the sample to be tested Λ1Difference be misplace cycle of parameter δ, δ be ε, wherein:ε is │ liΛ1-piΛ2Minimum values of the │ in addition to 0, liFor 1 to l it is just whole Number, piFor 1 to p positive integer, l and p is positive integer and greatest common divisor is 1 and meets l Λ1=p Λ2
The FSL of said structure is added on sample to be tested surface, existing simulation algorithm need not be changed, it is not required that existing Some measuring devices make too big change, you can obtain the very high sub-wavelength dimensions microelectronic structure optical critical dimension point of precision Analyse result.
Preferably, the light source in the step a) is parallel TM polarised lights.It is incident as optics incidence mould using directional light Type can reduce the influence of converged light in Systems for optical inspection device.It is further preferred that the light source in the step a) is flat The detection of the TM polarised light Systems for optical inspection device realization diffraction light concern parameter curve capable, hot spot is less than 100 microns.
Preferably, the vector analysis algorithm in the step b) is rigorous couple-wave analysis method (being abbreviated as RCWA) or layer Absorption process (is abbreviated as SAM).It is further preferred that the vector analysis algorithm in the step b) is rigorous couple-wave analysis side Method.
Preferably, the comparison algorithm in the step c) (is abbreviated as Levenberg- for row text Burger-Ma Kuaertefa Marquardt)。
Those skilled in the art can need to select the light source to irradiate according to RCWA or other vector analysis algorithms State the incident angle on combining structure surface.
Preferably, it is air layer between the far field super lens and the sample surface.The thickness h of air layer is certain In the range of have significant impact, especially h near 0.5 micron to each order of diffraction reflectivity and diffraction spectra, have the shadow of mutation formula It rings:After air layer thickness h is more than 0.5 micron, cyclically-varying is presented with h in reflectivity;And it is less than 0.5 micron of scope in h Interior, the variation of each order of diffraction reflectivity is aperiodic, and diffraction spectra has one-to-one relation with h.Therefore as air layer thickness h During less than 0.5 micron, the technical solution of the application, can precision it is high and be quickly obtained very much sub-wavelength dimensions microelectronic structure Structure optical critical dimension analysis result.
It is further preferred that the thickness of the air layer is less than 0.5 micron.
It is further preferred that the thickness of the air layer is 0.02 micron to 0.5 micron.
According to further aspect of the application, a kind of sub-wavelength dimensions microelectronic structure optical critical dimension test is provided Analytical equipment, which is characterized in that described device includes:Wide spectrum light source, control device of light beam, far field super lens, detecting lenses, spectrum Instrument and software analysis platform, the far field super lens are parallel to be placed in sample to be tested surface;
After the light beam that the wide spectrum light source is launched is by the control device of light beam, it is super that the far field is incided into successively The surface of mirror and the sample to be tested simultaneously generates emergent light, and emergent light is detected to obtain outgoing spectrum by spectrometer by detecting lenses Signal, outgoing spectral signal input the critical size parameter of output sample to be tested after the software analysis platform.
Preferably, the far field super lens are made of one-dimensional metal silver-glass raster and metallic silver thin plate.
Preferably, the metallic silver thin plate one side in the far field super lens close to the sample to be tested and with the sample It is air layer between surface.
It is further preferred that the thickness of the air layer is less than 0.5 micron.
It is further preferred that the thickness of the air layer is 0.02 micron to 0.5 micron.
As a specific embodiment, the objective table that height coordinate is accurately controlled with one surpasses the far field Air layer thickness between lens and the sample to be tested is controlled within 0.5 micron.
Preferably, the grating period A of the metallic silver-glass raster2With the grating period A of the sample to be tested1Difference Cycle for misplace parameter δ, δ is ε, wherein:ε is │ liΛ1-piΛ2Minimum values of the │ in addition to 0, liFor 1 to l positive integer, piFor 1 to p positive integer, l and p are positive integer and greatest common divisor is 1 and meets l Λ1=p Λ2
It is clear to describe, above-mentioned dislocation parameter δ is defined as follows:Using the central axes of lower floor's grating some grid ridge as original Point, the x-axis coordinate of some grid chi chung axis of upper strata grating are to misplace parameter δ, δ with periodically.If two screen periods are expired Sufficient l Λ1=p Λ2, wherein l, p are positive integer, and greatest common divisor is 1.│ l are represented with εiΛ1-piΛ2Minimums of the │ in addition to 0 It is worth (liFor 1 to l positive integer, piPositive integer for 1 to p), then the cycle of δ is ε.
Preferably, the light beam that the wide frequency light source is sent is converging beam;It is further preferred that the wide frequency light source is The light source introduced by fibre-optical splice coupled into optical fibres.
Preferably, the control device of light beam includes pin hole or fibre-optical splice, the first collimation lens group, polarizer, tunable optical Door screen and the first convergence lens set, the control device of light beam are used to implement with special polarization state, polarization direction, convergence angle and most The detection light beam of small detection hot spot;The first collimation lens group can be the broad-spectrum beam of 190nm-1100nm to spectral range Carry out achromatism collimation;The first convergence lens set can disappear to the broad-spectrum beam that spectral range is 190nm-1100nm Aberration converges;The polarizer adjusts the polarization direction of light beam for obtaining linearly polarized light;Adjustable diaphragm is used to adjust light beam Diameter, beam diameter determine the convergence angle of detection light beam, and influence the size of minimum convergence hot spot.
Preferably, the detecting lenses include the second collimation lens group and the second convergence lens set;Second collimating mirror Piece group can carry out the broad-spectrum beam that spectral range is 190nm-1100nm achromatism collimation, and the second convergence lens set can Achromatism convergence is carried out to the broad-spectrum beam that spectral range is 190nm-1100nm and is coupled into the spectrometer.
Preferably, the spectral range of the spectrometer detection is 190nm-1100nm.
The advantageous effect that the application can generate includes:The method and apparatus that the application provides are improved based on far field super lens Test/analysis precision of optical critical dimension, and smaller optical critical dimension can be measured.The application provide method and Device can obtain high order diffraction spectrum, can further obtain finer and more accurately optical critical dimension analysis knot Fruit.
Description of the drawings
Fig. 1 is the application optical critical dimension method for testing and analyzing principle schematic.
Fig. 2 is the application optical critical dimension method for testing and analyzing logical flow chart.
Fig. 3 is the application optical critical dimension device for testing and analyzing schematic diagram.
Fig. 4 is FSL and sample relation schematic diagram in the application optical critical dimension method for testing and analyzing and device.
Fig. 5 is FSL structural profile illustrations in the application optical critical dimension method for testing and analyzing and device.
Fig. 6 is a kind of obtained diffraction light spectrogram of embodiment of the application.
Fig. 7 is the obtained diffraction light spectrogram of the application comparative example.
Mark in attached drawing 3 is entitled:1. wide spectrum light source;2. control device of light beam;3. detecting lenses;4. spectrometer;It is 5. soft Part analysis platform.
Specific embodiment
To make the technical solution of the embodiment of the present application and advantage clearer, below in conjunction with attached in the embodiment of the present application Figure, is clearly and completely described the technical solution in the embodiment of the present application, it is clear that described embodiment is the application Part of the embodiment, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not having All other embodiments obtained under the premise of creative work are made, shall fall in the protection scope of this application.
Embodiment
Fig. 1 is the optical schematic diagram of the application optical detection detection method.Wherein wide spectrum light sourceIt is incident by free space Onto sample, space geometry characteristic is limited by three angles:(0 °≤θ of incidence angle θ<90 °), (0 °≤φ of azimuth φ< 360 °), (0 °≤ψ of angle of polarization ψ<360°).As shown in Fig. 2, incidence angle is the wide spectrum light source of θ in the apparatus and method of the present embodiment Zero-order diffractive spectrum is formed after inciding into combining structure, the Zero-order diffractive curve of spectrum is then detected by micro spectrometer, most Afterwards detection is worth to by calculating the ratio of Zero-order diffractive spectrum and wide spectrum light source spectral intensity on software analysis platform 5 in Fig. 1 Zero-order diffractive rate curve.Detection and analysis software establishes the mathematics physics model of sample, first sets the initial knot of mathematics physics model Structure parameter (structural cycle, optical grating construction thickness, duty cycle, dislocation parameter, air layer thickness etc.) is starting point, by RCWA or Person SAM parsers (Fig. 6 and Fig. 7 are the result obtained by taking RCWA as an example) simulation calculates the zero of sample initial mathematical physical model Order diffraction rate curve, then the Zero-order diffractive rate curve by Levenberg-Marquardt optimization algorithm comparative simulations and detection Zero-order diffractive rate curve between difference size, judge whether that changing mathematics physics model structural parameters carries out simulative optimization point again Analysis.Zero-order diffractive rate curve such as simulation can be fitted with the Zero-order diffractive rate curve detected, then be not required to change, with current mathematics Physical model critical size structural parameters are as sample critical size structural parameters;Zero-order diffractive rate curve and detection such as simulation Zero-order diffractive rate curve cannot be fitted, then need the structural parameters that first set of modification mathematics physics model, repeat above-mentioned fitting point Analysis process, until the final Zero-order diffractive rate curve (simulating Zero-order diffractive spectrum) for realizing simulation and the Zero-order diffractive rate of detection are bent Line (actual measurement Zero-order diffractive spectrum) can be fitted.With reference to the FSL's for being fitted successful mathematics physics model structural parameters and use The structural parameters of sample are calculated in structural parameters, the final inverting detection for realizing sample structure critical size and precision it is high and It is quickly obtained very much sub-wavelength dimensions microelectronic structure optical critical dimension analysis result.Logic in its specific implementation process Decision flow chart is as shown in Figure 2.
Sub-wavelength dimensions microelectronic structure optical critical dimension test analysis fills in a kind of specific embodiment of the application It puts as shown in figure 3, including wide spectrum light source 1, control device of light beam 2, detecting lenses 3, spectrometer 4 and software analysis platform 5.Wide spectrum optical Source 1 can emission spectrum scope be 190nm~1100nm parallel TM light beams, this light beam successively pass through Beam Control portion Pin hole, the first collimation lens group, polarizer, adjustable diaphragm and the first convergence lens set in 2, are converged on far field super lens surface Into a hot spot, then the diffraction light of generation is converged by detecting lenses 3, the diffraction light after convergence is passed through spectrometer 4 and obtains actual measurement zero Order diffraction is composed, by obtained actual measurement Zero-order diffractive spectrum Input Software analysis platform 5.
Wherein the first collimation lens group includes a piece of quartz lens and a piece of balsaming lens, and wherein balsaming lens is by a piece of near The magnesium fluoride eyeglass of the fused silica glass of light source side and a piece of distance light source forms, and possesses so that incident light collimation and achromatic light Learn performance.The composition of first convergence lens set is identical with the first collimation lens group.Detecting lenses 3 include the second collimation lens group and Second convergence lens set, collimation convergence is carried out to diffraction light.Detecting lenses 3 are by diffraction light directive spectrometer 4, and by spectrometer 4 Electric signal transmission is converted into be handled to software analysis platform 5.Software analysis platform 5 is NVIDIA companiesGPU The computing platform of the GPU/CPU frameworks of accelerator and the polycaryon processor of Intel Company composition.
In order to more intuitively embody the spy of the super-resolution of optical critical dimension device for testing and analyzing of the present invention and method Point, embodiment selection cycle are that silicon/air grating of 100nm is illustrated as sample, and schematic diagram is as shown in figure 4, Fig. 4 gives FSL and the sectional view of the combining structure of One Dimension Periodic grating, middle and lower part are sample, and the grating thickness of sample is 55nm, and silicon accounts for Than 0.5, substrate is silicon;The top of Fig. 4 is FSL, and Fig. 5 gives the structure diagram and relevant parameter of FSL.Sample screen periods For Λ1, the Ag screen periods of FSL are Λ2.It (is referred to as the sheet metal between upper and lower two parts in Fig. 4 and air layer Even layer), it is believed that its duty cycle and cycle are 1.The refractive index of base material silicon is ns
It is clear to describe, the dislocation parameter δ in Fig. 4 is defined as follows:With the axis of some grid ridge of lower floor's sample grating Line is origin, and the x-axis coordinate of some grid chi chung axis of upper strata FSL silver metal gratings is the parameter δ that misplaces.δ has periodically. If two screen periods meet l Λ1=p Λ2, wherein l and p are positive integer and greatest common divisor is 1.│ l are represented with εiΛ1-pi Λ2Minimum value (ls of the │ in addition to 0i=1 ..., l, pi=1 ..., p), then the cycle of δ is ε.As a kind of wherein simplest side Formula, as l=1 and p=1, then δ=│ Λ12│。
Research shows that cyclically-varying is presented with h in reflectivity after air layer thickness h is more than 0.5 micron;And it is less than in h In 0.5 micron range, the variation of each order of diffraction reflectivity is aperiodic, and diffraction spectra has one-to-one relation with h.Therefore, The objective table that height coordinate can be accurately controlled with one controls FSL and sample room air layer thickness within 0.5 μm, with Preferably, precision is higher and is quickly obtained very much sub-wavelength dimensions microelectronic structure optical critical dimension analysis result.
With the direct vertical irradiation FSL surfaces of TM polarised lights during test, during for TM polarized incident light vertical incidence, can swash Send out first-order diffraction light, such as Fig. 6.Optical grating construction determines its diffraction spectra, when there is the diffraction light of multiple orders of diffraction to be transmission light, just The finer structural parameters of grating can be measured, even if only having used Zero-order diffractive spectrum.According to above-mentioned specific measuring process, base The OCD measurements of higher precision, smaller critical size can be realized in optical critical dimension test/analysis system of FSL.
Comparative example
It is identical with the sample and device of embodiment 1, it differs only in and is added without FSL, directly hung down with same TM polarised lights The grating is directly irradiated, there was only Zero-order diffractive in diffraction light, without high order diffraction.Due to the presence of diffraction limit, in diffraction light Only Zero-order diffractive, and the high order diffraction for carrying the more fine structure information of sample is all evanescent wave, is limited in sample surfaces Near-field region and far field cannot be propagated to, as shown in fig. 7, first-order diffraction intensity be 0 (first-order diffraction curve and X-axis weight It is folded), so cause the loss of sample structure information.Therefore in this case, by comparing the Zero-order diffractive surveyed and simulation Zero-order diffractive be unable to inverting and obtain higher precision, the smaller critical size of sample to be tested.
The above is only several embodiments of the application, any type of limitation is not done to the application, although this Shen Please disclosed as above with preferred embodiment, however not to limit the application, any person skilled in the art is not taking off In the range of technical scheme, make a little variation using the technology contents of the disclosure above or modification is equal to Case study on implementation is imitated, is belonged in the range of technical solution.

Claims (10)

1. a kind of sub-wavelength dimensions microelectronic structure optical critical dimension analysis method, which is characterized in that comprise the steps of:
A) sample to be tested surface is placed in by far field super lens are parallel, irradiate the group that far field super lens and sample to be tested are formed with light source The far field super lens surface of structure is closed, measures sample actual measurement Zero-order diffractive spectrum;
B) based on vector analysis algorithm, initial critical size parameter is set, the simulation of the combining structure is calculated in simulation Zero-order diffractive is composed;
C) the simulation Zero-order diffractive spectrum that step b) is obtained is compared with the obtained measured spectras of step a):Such as compare knot Fruit is inconsistent, then described in amendment step b) after critical size parameter, the simulation of the combining structure is calculated in simulation again Zero-order diffractive is composed, and the measured spectra with being measured in step a) compares;If comparing result is consistent, then combine currently Zero-order diffractive spectrum and the parameter of the far field super lens are simulated, the critical size parameter of sample to be tested is calculated.
2. according to the method described in claim 1, it is characterized in that, the far field super lens are by one-dimensional metal silver-glass raster It is formed with metallic silver thin plate.
3. according to the method described in claim 2, it is characterized in that, gold of the sample to be tested in the far field super lens Belong to silver-colored thin plate one side.
4. according to the method described in claim 1, it is characterized in that, the vector analysis algorithm in the step b) is stringent coupling Wave analysis method;Comparison algorithm in the step c) is the literary Burger-Ma Kuaertefa of row.
5. according to the method described in claim 1, it is characterized in that, the light source in the step a) is parallel TM polarised lights.
6. according to the method described in claim 1, it is characterized in that, it is between the far field super lens and the sample surface Air layer, the thickness of the air layer are less than 0.5 micron;
Preferably, it is air layer between the far field super lens and the sample surface, the thickness of the air layer is 0.02 Micron is to 0.5 micron.
A kind of 7. sub-wavelength dimensions microelectronic structure optical critical dimension device for testing and analyzing, which is characterized in that described device bag It includes:Wide spectrum light source, control device of light beam, far field super lens, detecting lenses, spectrometer and software analysis platform, the far field are super Mirror is parallel to be placed in sample to be tested surface;
After the light beam that the wide spectrum light source is launched is by the control device of light beam, incide into successively the far field super lens and The surface of the sample to be tested simultaneously generates emergent light, and emergent light is detected to obtain outgoing spectrum letter by spectrometer by detecting lenses Number, outgoing spectral signal inputs the critical size parameter of output sample to be tested after the software analysis platform.
8. device according to claim 7, which is characterized in that the far field super lens are by one-dimensional metal silver-glass raster It is formed with metallic silver thin plate;The objective table for accurately controlling height coordinate with one by the far field super lens with it is described to be measured Air thickness control between sample is within 0.5 micron.
9. device according to claim 7, which is characterized in that the grating period A of the metallic silver-glass raster2With institute State the grating period A of sample to be tested1Difference be misplace cycle of parameter δ, δ be ε, wherein:ε is │ liΛ1-piΛ2│ is in addition to 0 Minimum value, liFor 1 to l positive integer, piFor 1 to p positive integer, l and p is positive integer and greatest common divisor is 1 and meets l Λ1 =p Λ2
10. device according to claim 7, which is characterized in that the light beam that the wide frequency light source is sent is converging beam; It is further preferred that the wide frequency light source is the light source introduced by fibre-optical splice coupled into optical fibres;
Preferably, the control device of light beam include pin hole or fibre-optical splice, the first collimation lens group, polarizer, adjustable diaphragm and First convergence lens set, the control device of light beam are used to implement with special polarization state, polarization direction, convergence angle and minimum inspection Survey the detection light beam of hot spot;The first collimation lens group can carry out the broad-spectrum beam that spectral range is 190nm-1100nm Achromatism collimates;The first convergence lens set can carry out achromatism to the broad-spectrum beam that spectral range is 190nm-1100nm Convergence;The polarizer adjusts the polarization direction of light beam for obtaining linearly polarized light;Adjustable diaphragm is straight for adjusting light beam Footpath, beam diameter determine the convergence angle of detection light beam, and influence the size of minimum convergence hot spot;
Preferably, the detecting lenses include the second collimation lens group and the second convergence lens set;The second collimation lens group Achromatism collimation can be carried out to the broad-spectrum beam that spectral range is 190nm-1100nm, the second convergence lens set can be to ripple The broad-spectrum beam that spectral limit is 190nm-1100nm carries out achromatism convergence and is coupled into the spectrometer;
Preferably, the spectral range of the spectrometer detection is 190nm-1100nm.
CN201611079665.1A 2016-11-30 2016-11-30 Sub-wavelength dimensions microelectronic structure optical critical dimension method for testing and analyzing and device Pending CN108120371A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111065912A (en) * 2019-12-04 2020-04-24 长江存储科技有限责任公司 Inspection system for semiconductor device and related inspection method
CN112147105A (en) * 2019-06-27 2020-12-29 深圳市帝迈生物技术有限公司 Microfluidic sample analysis device
CN113532280A (en) * 2021-06-04 2021-10-22 华南师范大学 Liquid crystal optical ruler for measuring nano-scale displacement and preparation method thereof
CN113671612A (en) * 2021-08-25 2021-11-19 浙江水晶光电科技股份有限公司 Super-surface optical element, design method and structured light projection module
CN114674240A (en) * 2022-03-25 2022-06-28 中国科学院微电子研究所 Deformation measurement method and device, electronic equipment and storage medium

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1529827A (en) * 2000-09-15 2004-09-15 �����ʼ� Generation of library of periodic grating diffraction signals
CN1705888A (en) * 2002-10-17 2005-12-07 音质技术公司 Generating simulated diffraction signals for two-dimensional structures
CN101128835A (en) * 2004-05-28 2008-02-20 东京毅力科创株式会社 Shape roughness measurement in optical metrology
CN101401080A (en) * 2006-03-08 2009-04-01 东京毅力科创株式会社 Weighting function of enhance measured diffraction signals in optical metrology
US20110188032A1 (en) * 2010-02-04 2011-08-04 Ravi Verma Far-field superlensing
CN103398666A (en) * 2013-05-27 2013-11-20 电子科技大学 Interlayer dislocation testing method for double-layer periodic microstructure
CN103940337A (en) * 2014-04-23 2014-07-23 电子科技大学 OCD testing system for critical sizes of micro-structure on basis of micro light spot parallel beam

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1529827A (en) * 2000-09-15 2004-09-15 �����ʼ� Generation of library of periodic grating diffraction signals
CN1705888A (en) * 2002-10-17 2005-12-07 音质技术公司 Generating simulated diffraction signals for two-dimensional structures
CN101128835A (en) * 2004-05-28 2008-02-20 东京毅力科创株式会社 Shape roughness measurement in optical metrology
CN101401080A (en) * 2006-03-08 2009-04-01 东京毅力科创株式会社 Weighting function of enhance measured diffraction signals in optical metrology
US20110188032A1 (en) * 2010-02-04 2011-08-04 Ravi Verma Far-field superlensing
CN103398666A (en) * 2013-05-27 2013-11-20 电子科技大学 Interlayer dislocation testing method for double-layer periodic microstructure
CN103940337A (en) * 2014-04-23 2014-07-23 电子科技大学 OCD testing system for critical sizes of micro-structure on basis of micro light spot parallel beam

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
王云新等: "突破衍射极限的远场光学成像方法", 《北京工业大学学报》 *
程琳: "远场超分辨率成像与亚波长聚焦的研究", 《中国博士学位论文全文数据库 基础科学辑》 *
邓浩: "周期结构的衍射模拟算法及其应用研究", 《中国博士学位论文全文数据库 信息科技辑》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112147105A (en) * 2019-06-27 2020-12-29 深圳市帝迈生物技术有限公司 Microfluidic sample analysis device
CN111065912A (en) * 2019-12-04 2020-04-24 长江存储科技有限责任公司 Inspection system for semiconductor device and related inspection method
US11333614B2 (en) 2019-12-04 2022-05-17 Yangtze Memory Technologies Co., Ltd. Inspection system of semiconductor device and related inspection method
CN113532280A (en) * 2021-06-04 2021-10-22 华南师范大学 Liquid crystal optical ruler for measuring nano-scale displacement and preparation method thereof
CN113671612A (en) * 2021-08-25 2021-11-19 浙江水晶光电科技股份有限公司 Super-surface optical element, design method and structured light projection module
CN114674240A (en) * 2022-03-25 2022-06-28 中国科学院微电子研究所 Deformation measurement method and device, electronic equipment and storage medium

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