CN108107947A - Electronic equipment and its temperature adjusting method - Google Patents
Electronic equipment and its temperature adjusting method Download PDFInfo
- Publication number
- CN108107947A CN108107947A CN201810094384.6A CN201810094384A CN108107947A CN 108107947 A CN108107947 A CN 108107947A CN 201810094384 A CN201810094384 A CN 201810094384A CN 108107947 A CN108107947 A CN 108107947A
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- China
- Prior art keywords
- electronic equipment
- temperature
- wall
- interlayer area
- main control
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
- H04M1/72454—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions according to context-related or environment-related conditions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Environmental & Geological Engineering (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to electronic device fields, disclose a kind of electronic equipment and its temperature adjusting method.In the present invention, electronic equipment includes：Housing includes inner wall, the outer wall being oppositely arranged with inner wall, and interlayer area is formed between inner and outer wall；Temperature-detecting device is arranged in interlayer area, the temperature in detection interlayer area；Heating component is arranged in interlayer area；Cooling assembly is arranged in interlayer area；Main control unit is electrically connected with temperature-detecting device, heating component and cooling assembly；Main control unit opens cooling assembly when the temperature value received is higher than upper limit threshold；Main control unit also when the temperature value received is less than lower threshold, opens heating component.Compared with prior art so that the elements such as the temperature adjustable in electronic equipment, protection battery are not damaged; extend the service life of electronic equipment; and ensure that electronic equipment can work normally under different ambient temperatures, so as to enhance user experience, increase use scope.
Description
Technical field
The present invention relates to electronic device fields, more particularly to electronic equipment and its temperature adjusting method.
Background technology
Electronic equipment generally comprises mobile phone, camera, tablet computer etc., these equipment are typically necessary at a suitable temperature
Normal work could be kept, under too high or too low limiting temperature, some elements in equipment can be subject on language function
It influences.By taking camera as an example, camera forms image and using the equipment of negative writing image using optical imaging concept.It much can be with
Recording image equipment all possesses the feature according to electronic equipment.Medical imaging devices, astronomical observation equipment etc..It is according to electronic equipment
For the optical instrument of photography.After the light that subject reflects is focused on by the shutter of photographic film and control light exposure,
Subject forms sub-image on the photosensitive material in camera bellows, forms permanent image through rinsing processing, this technology is known as
Photography.Camera needs to shoot the scene recorded under a variety of environment, weather, when outside air temperature is too high or too low, camera internal
Battery will be affected, make camera shut down or partial function can not normal use, influence user at a temperature of otherwise limit
It is also affected using the battery life of the user experience of camera, and camera.Likewise, existing electronic equipment is in limiting temperature
The elements such as the battery of lower inside are similarly subjected to influence so that external temperature environment range shorter workable for equipment influences to use
Rate, and internal element is easily damaged by limiting temperature, influences service life.
The content of the invention
It is an object of the invention to provide a kind of electronic equipment and its temperature adjusting methods so that the temperature in electronic equipment
Controllable, the protection elements such as battery are not damaged, and extend the service life of electronic equipment, and ensure electronic equipment different outer
It can be worked normally at a temperature of boundary, so as to enhance user experience, increase use scope.
In order to solve the above technical problems, embodiments of the present invention provide a kind of electronic equipment, including：Housing, including
Inner wall, the outer wall being oppositely arranged with the inner wall, form interlayer area between the inner wall and the outer wall；
Temperature-detecting device is arranged in the interlayer area, for detecting the temperature in the interlayer area；
Heating component is arranged in the interlayer area；
Cooling assembly is arranged in the interlayer area；
Main control unit is electrically connected respectively with the temperature-detecting device, the heating component and the cooling assembly, and
The main control unit is used to receive the temperature value that the temperature-detecting device detects；
Wherein, the main control unit is additionally operable to, when the temperature value received is higher than upper limit threshold, open the refrigeration train
Part；The main control unit is additionally operable to, when the temperature value received is less than lower threshold, open the heating component.
The invention further relates to the temperature adjusting method of above-mentioned electronic equipment, the outer wall and inner wall of the housing of the electronic equipment it
Between form interlayer area, and be equipped with cooling assembly and heating component, the temperature adjusting method of the electronic equipment is comprising such as in interlayer the area in
Lower step：
Detect the temperature in interlayer area between electronic equipment casing inner wall and outer wall；
Detected temperature value with lower threshold is compared, judges the temperature value whether less than lower threshold；
Such as judge that detected temperature value less than after lowest threshold, opens the heating group being arranged in the interlayer area
Part；Such as judge that higher than after lowest threshold, detected temperature value is compared again with upper limit threshold for detected temperature value
It is right, judge the temperature value whether higher than upper limit threshold；
As judged, detected temperature value higher than after upper limit threshold, opens the refrigeration train being arranged in the interlayer area
Part.
Embodiment of the present invention in terms of existing technologies, due to be equipped with housing, temperature-detecting device, heating component,
Cooling assembly and main control unit, housing include inner and outer wall, form interlayer area between inner and outer wall, temperature-detecting device,
Heating component and cooling assembly are arranged in interlayer, and main control unit and temperature-detecting device, heating component, cooling assembly are equal
It is electrically connected, temperature sensing device is used to detect the temperature in interlayer area.Main control unit receives what temperature sensing device detected
Temperature value, when temperature value is higher than upper limit threshold, main control unit opens cooling assembly, reduces temperature in interlayer area.Work as master control
When the temperature value that unit receives is less than lower threshold, main control unit opens heating component, raises temperature in interlayer area.So as to
The temperature inside interlayer area is adjusted by heating component and cooling assembly so that the temperature of electronic equipment entirety is adjusted so that
Electronic equipment is integrally constantly in suitable operating temperature, and the elements such as battery can be protected to be not damaged, and extending electronic equipment makes
With the service life, and ensure that electronic equipment can work normally under different ambient temperatures, so as to enhance user experience, increase makes
Use scope.
In addition, the heating component includes：The first heating element being electrically connected with the main control unit and the master control
The second heating element that unit is electrically connected, and it is remote each other between first heating element and second heating element
From setting.
In addition, first heating element and second heating element are located at arbitrarily opposite two in the interlayer area respectively
Side.So that when heating element works, interlayer uniformly heats up in area, and then the variation of electronic equipment bulk temperature is uniform.
In addition, first heating element and second heating element are heating plate.
In addition, the cooling assembly includes the first refrigeration module being electrically connected with the main control unit and the master control
The second refrigeration module that unit is electrically connected, and it is remote each other between first refrigeration module and second refrigeration module
From setting.So as to prevent electronic equipment local overcooling, temperature is uneven.
In addition, first refrigeration module and second refrigeration module are located at arbitrarily opposite two in the interlayer area respectively
Side.So that when refrigeration module works, uniform decrease in temperature in interlayer area, and then the variation of electronic equipment bulk temperature is uniform.
In addition, first refrigeration module and second refrigeration module are semiconductor refrigerating module.
In addition, the temperature-detecting device is temperature sensor.
In addition, the housing is polycarbonate shell or PC composite shells.So that the shell of the electronic equipment
Body more drop resistant, strength and toughness be good and heatproof.
Description of the drawings
Fig. 1 is first embodiment of the invention electronic devices structure schematic diagram；
Fig. 2 is first embodiment of the invention electronic equipment internal structure diagram；
Fig. 3 is first embodiment of the invention electronic device circuitry module map；
Fig. 4 is second embodiment of the invention electronic devices structure schematic diagram；
Fig. 5 is the temperature regulation and control flow chart of second embodiment of the invention electronic equipment.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to each reality of the present invention
The mode of applying is explained in detail.However, it will be understood by those skilled in the art that in each embodiment of the present invention,
In order to make the reader understand this application better, many technical details are proposed.But even if without these technical details and base
Many variations and modification in following embodiment can also realize each claim of the application technical side claimed
Case.
The first embodiment of the present invention is related to a kind of electronic equipment.As shown in figures 1 and 3, electronic equipment includes housing
1st, temperature-detecting device 2, heating component 3, cooling assembly 4 and main control unit 6.Housing 1 includes inner wall 11, is set relatively with inner wall 11
The outer wall 12 put forms interlayer area 13 between inner wall 11 and outer wall 12.Temperature-detecting device 2 is arranged in interlayer area 13, is used for
Detect the temperature in interlayer area 13.Heating component 3 and cooling assembly 4 are also disposed in interlayer area 13.Main control unit 6 respectively with temperature
Degree detection device 2, heating component 3 and cooling assembly 4 are electrically connected, and main control unit 6 detects for receiving temperature-detecting device 2
The temperature value arrived.Main control unit 6 is additionally operable to, when the temperature value received is higher than upper limit threshold, open cooling assembly 4；Master control list
Member 6 is additionally operable to, when the temperature value received is less than lower threshold, open heating component 3.In the electronic equipment of actual use, electricity
Low temperature lithium-cell plate 5 is additionally provided in sub- equipment, which is used to make electronic device works to power electronic equipment,
Also temperature-detecting device 2, heating component 3, cooling assembly 4 and main control unit 6 are powered simultaneously.In actual use, should
Electronic equipment can be camera, mobile phone or apparatus such as computer.
Through the above it is not difficult to find that due to being equipped with housing 1, temperature-detecting device 2, heating component 3, cooling assembly 4
With main control unit 6, housing 1 includes inner wall 11 and outer wall 12, and interlayer area 13, temperature detection dress are formed between inner wall 11 and outer wall 12
Put 2, heating component 3 and cooling assembly 4 be arranged in interlayer, and main control unit 6 and temperature-detecting device 2, heating component 3,
Cooling assembly 4 is electrically connected, and temperature sensing device is used to detect the temperature in interlayer area 13.Main control unit 6 receives temperature sense
The temperature value that device detects is answered, when temperature value is higher than upper limit threshold, main control unit 6 opens cooling assembly 4, makes interlayer area 13
Interior temperature reduces.When the temperature value that main control unit 6 receives is less than lower threshold, main control unit 6 opens heating component 3, makes
Temperature raises in interlayer area 13.So as to adjust the temperature inside interlayer area 13 by heating component 3 and cooling assembly 4 so that electricity
The temperature of sub- equipment entirety is adjusted so that electronic equipment is integrally constantly in suitable operating temperature, can protect battery etc.
Element is not damaged, and extends electronic equipment service life, and ensures that electronic equipment can be normal under different ambient temperatures
Work so as to enhance user experience, increases use scope.
Further, as shown in Fig. 2, heating component 3 include with main control unit 6 be electrically connected the first heating element 31,
The second heating element 32 being electrically connected with main control unit 6, and between the first heating element 31 and the second heating element 32 each other
It is located remotely from each other setting.First heating element 31 and the second heating element 32 are located at the arbitrary opposite both sides in interlayer area 13 respectively.System
The second refrigeration that cold component 4 includes the first refrigeration module 41 being electrically connected with main control unit 6, is electrically connected with main control unit 6
Module 42, and setting away from each other to each other between the first refrigeration module 41 and the second refrigeration module 42.First refrigeration module, 41 He
Second refrigeration module 42 is located at the arbitrary opposite both sides in interlayer area 13 respectively.First heating element 31 and the first refrigeration module 41
In the same side, the second heating element 32 and the second refrigeration module 42 are located at the same side.Temperature-detecting device 2 is located at the first refrigeration mould
Between 41 and second refrigeration module 42 of block, it also is located between the first heating element 31 and the second heating element 32.It is so that electric
The temperature of each place is uniform in sub- equipment interlayer area 13, and temperature-detecting device 2 detect be also interlayer area 13 in it is suitable
Temperature will not be heating element or refrigeration module periphery overheat or the temperature of supercooling.
It will be further appreciated that as shown in Figure 1, for so that housing 1 more drop resistant, strength and toughness be good and heatproof, housing 1
For polycarbonate shell or PC composite shells.
Second embodiment of the present invention is related to the temperature adjusting method of a kind of electronic equipment.As shown in Figure 4 and Figure 5, should
Interlayer area 13 is formed between the outer wall 12 of the housing 1 of electronic equipment and inner wall 11, and cooling assembly 4 and system are equipped in interlayer area 13
Hot component, the temperature adjusting method of the electronic equipment comprise the following steps：
Temperature between step 501 detection electronic equipment casing inner wall 11 and outer wall 12 in interlayer area 13；
Whether detected temperature value is compared step 502 with lower threshold, judge the temperature value less than lower limit
Threshold value；
Step 503 as judge detected temperature value less than after lowest threshold, open it is being arranged in interlayer area 13 plus
Hot component 3；
Step 504 as judged detected temperature value higher than after lowest threshold, by detected temperature value again with it is upper
Whether limit threshold value is compared, judge the temperature value higher than upper limit threshold；
As judged, detected temperature value higher than after upper limit threshold, opens the refrigeration being arranged in interlayer area 13 to step 505
Component 4.
Through the above it is not difficult to find that due to being equipped with housing 1, temperature-detecting device 2, heating component 3, cooling assembly 4
With main control unit 6, housing 1 includes inner wall 11 and outer wall 12, and interlayer area 13, temperature detection dress are formed between inner wall 11 and outer wall 12
Put 2, heating component 3 and cooling assembly 4 be arranged in interlayer, and main control unit 6 and temperature-detecting device 2, heating component 3,
Cooling assembly 4 is electrically connected, and temperature sensing device is used to detect the temperature in interlayer area 13.Main control unit 6 receives temperature sense
The temperature value that device detects is answered, when temperature value is higher than upper limit threshold, main control unit 6 opens cooling assembly 4, makes interlayer area 13
Interior temperature reduces.When the temperature value that main control unit 6 receives is less than lower threshold, main control unit 6 opens heating component 3, makes
Temperature raises in interlayer area 13.So as to adjust the temperature inside interlayer area 13 by heating component 3 and cooling assembly 4 so that electricity
The temperature of sub- equipment entirety is adjusted so that electronic equipment is integrally constantly in suitable operating temperature, can protect battery etc.
Element is not damaged, and extends electronic equipment service life, and ensures that electronic equipment can be normal under different ambient temperatures
Work so as to enhance user experience, increases use scope.
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiments of the present invention,
And in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (10)
1. a kind of electronic equipment, which is characterized in that including：
Housing, the outer wall being oppositely arranged including inner wall, with the inner wall form interlayer area between the inner wall and the outer wall；
Temperature-detecting device is arranged in the interlayer area, for detecting the temperature in the interlayer area；
Heating component is arranged in the interlayer area；
Cooling assembly is arranged in the interlayer area；
Main control unit is electrically connected respectively with the temperature-detecting device, the heating component and the cooling assembly, and described
Main control unit is used to receive the temperature value that the temperature-detecting device detects；
Wherein, the main control unit is additionally operable to, when the temperature value received is higher than upper limit threshold, open the cooling assembly；Institute
Main control unit is stated to be additionally operable to, when the temperature value received is less than lower threshold, open the heating component.
2. electronic equipment according to claim 1, which is characterized in that the heating component includes：With the main control unit
The first heating element being electrically connected, the second heating element being electrically connected with the main control unit, and first heating unit
Setting away from each other to each other between part and second heating element.
3. electronic equipment according to claim 2, which is characterized in that first heating element and second heating unit
Part is located at the arbitrary opposite both sides in the interlayer area respectively.
4. electronic equipment according to claim 2, which is characterized in that first heating element and second heating unit
Part is heating plate.
5. electronic equipment according to claim 1, which is characterized in that the cooling assembly includes and main control unit electricity
Property the first refrigeration module of connection, the second refrigeration module for being electrically connected with the main control unit, and first refrigeration module
The setting away from each other to each other between second refrigeration module.
6. electronic equipment according to claim 5, which is characterized in that first refrigeration module and the second refrigeration mould
Block is located at the arbitrary opposite both sides in the interlayer area respectively.
7. electronic equipment according to claim 5, which is characterized in that first refrigeration module and the second refrigeration mould
Block is semiconductor refrigerating module.
8. electronic equipment according to claim 1, which is characterized in that the temperature-detecting device is temperature sensor.
9. electronic equipment according to claim 1, which is characterized in that the housing is compound for polycarbonate shell or PC
Material shell.
10. the temperature adjusting method of a kind of electronic equipment forms interlayer area between the outer wall and inner wall of the housing of the electronic equipment,
And cooling assembly and heating component are equipped in interlayer area, the temperature adjusting method of the electronic equipment comprises the following steps：
Detect the temperature in interlayer area between electronic equipment casing inner wall and outer wall；
Detected temperature value with lower threshold is compared, judges the temperature value whether less than lower threshold；
Such as judge that detected temperature value less than after lowest threshold, opens the heating component being arranged in the interlayer area；Such as
Judge that detected temperature value higher than after lowest threshold, detected temperature value with upper limit threshold is compared again, is sentenced
Whether the temperature value break higher than upper limit threshold；
As judged, detected temperature value higher than after upper limit threshold, opens the cooling assembly being arranged in the interlayer area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094384.6A CN108107947A (en) | 2018-01-31 | 2018-01-31 | Electronic equipment and its temperature adjusting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810094384.6A CN108107947A (en) | 2018-01-31 | 2018-01-31 | Electronic equipment and its temperature adjusting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108107947A true CN108107947A (en) | 2018-06-01 |
Family
ID=62221465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810094384.6A Pending CN108107947A (en) | 2018-01-31 | 2018-01-31 | Electronic equipment and its temperature adjusting method |
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| Country | Link |
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| CN (1) | CN108107947A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108958313A (en) * | 2018-09-10 | 2018-12-07 | 天津大学 | Mobile phone portable formula temperature controller |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751451A (en) * | 2012-07-05 | 2012-10-24 | 同济大学 | Auxiliary constant-temperature battery box |
| CN204465031U (en) * | 2014-12-31 | 2015-07-08 | 梁晓琴 | A kind of portable power source automatic safety device |
| CN105489791A (en) * | 2016-02-03 | 2016-04-13 | 杭州务实科技有限公司 | Low-temperature resistant lithium battery housing |
| CN206471461U (en) * | 2017-03-01 | 2017-09-05 | 无锡南洋职业技术学院 | New-energy automobile battery temp control device |
| CN107249061A (en) * | 2017-05-24 | 2017-10-13 | 天津工业大学 | A kind of semiconductor chilling plate controls the canning of mobile phone temp |
-
2018
- 2018-01-31 CN CN201810094384.6A patent/CN108107947A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751451A (en) * | 2012-07-05 | 2012-10-24 | 同济大学 | Auxiliary constant-temperature battery box |
| CN204465031U (en) * | 2014-12-31 | 2015-07-08 | 梁晓琴 | A kind of portable power source automatic safety device |
| CN105489791A (en) * | 2016-02-03 | 2016-04-13 | 杭州务实科技有限公司 | Low-temperature resistant lithium battery housing |
| CN206471461U (en) * | 2017-03-01 | 2017-09-05 | 无锡南洋职业技术学院 | New-energy automobile battery temp control device |
| CN107249061A (en) * | 2017-05-24 | 2017-10-13 | 天津工业大学 | A kind of semiconductor chilling plate controls the canning of mobile phone temp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108958313A (en) * | 2018-09-10 | 2018-12-07 | 天津大学 | Mobile phone portable formula temperature controller |
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Application publication date: 20180601 |
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