CN108102565B - Insulating adhesive tape and preparation method thereof - Google Patents

Insulating adhesive tape and preparation method thereof Download PDF

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Publication number
CN108102565B
CN108102565B CN201711396589.1A CN201711396589A CN108102565B CN 108102565 B CN108102565 B CN 108102565B CN 201711396589 A CN201711396589 A CN 201711396589A CN 108102565 B CN108102565 B CN 108102565B
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dielectric layer
parts
rubber
dielectric
adhesive tape
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CN108102565A (en
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于淑会
朱晓冬
罗遂斌
孙蓉
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
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    • C09J111/00—Adhesives based on homopolymers or copolymers of chloroprene
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    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C09J171/03—Polyepihalohydrins
    • C—CHEMISTRY; METALLURGY
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    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/04—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/28—Presence of paper
    • C09J2400/283—Presence of paper in the substrate
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    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2423/00—Presence of polyolefin
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    • C09J2471/00—Presence of polyether

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Abstract

The invention provides an insulating tape and a preparation method thereof. The insulating tape comprises a base material, a first dielectric layer and a second dielectric layer which are sequentially stacked; the first dielectric layer has a negative dielectric constant, the second dielectric layer has a positive dielectric constant, and the absolute value of the dielectric constant of the first dielectric layer is greater than the dielectric constant of the second dielectric layer. The insulating tape is prepared by firstly melting and mixing the components of the first dielectric layer, then rolling the mixture on a base material, performing semi-curing treatment, then melting and mixing the components of the second dielectric layer, and then rolling the mixture on the first dielectric layer. The insulating tape provided by the invention has high dielectric constant, breakdown strength, volume resistivity and low dielectric loss, and is particularly suitable for protection of a high-voltage alternating-current circuit.

Description

Insulating adhesive tape and preparation method thereof
Technical Field
The invention belongs to the technical field of insulating materials, and particularly relates to an insulating tape and a preparation method thereof.
Background
The insulating tape is a tape specially used for preventing electric leakage and playing an insulating role, is suitable for connection of electric wires and electric insulation protection, is an indispensable article for industry, household and the like, can be used for tightly wrapping cable terminals and intermediate joints, forms certain characteristic impedance at the tail end of a cable shield, plays roles in electric stress control and sealing bonding, and is used for interlayer insulation and bundling of transformers and power transmission lines, fixing of components and parts and connection of line breakage positions.
Under the era background of rapid development of Chinese economy, contradiction between increasingly improved material demand of people and environmental resources is more excited, and due to uneven distribution of energy resources nationwide, in order to meet the national resource demand, the nation proposes development strategies of West-east gas transmission, West-east electricity transmission and the like, and effective allocation of regional power resources is a serious challenge for the power transportation industry. Various power equipment and transmission lines are in different terrain environments and have variable climatic conditions, so the power transportation industry puts higher requirements on the comprehensive physical properties of the electrical adhesive tape.
Generally, the insulating tape with a higher dielectric constant has a stronger ability to store charges, can reduce charge loss in the power transmission process, and is suitable for high-voltage power transmission. However, the dielectric constant of the material is increased along with the increase of the dielectric loss, so that not only the transmission power of a line is reduced, but also the adhesive tape is easy to generate heat under the action of high voltage electricity for a long time, the bonding performance is poor, and the safe operation of a circuit is influenced.
The performance of a high dielectric insulating tape has become one of the key factors restricting the development of power transportation, and therefore how to reduce the dielectric loss while improving the dielectric constant and breakdown strength of the insulating tape is a problem to be solved in the field.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an insulating tape and a preparation method thereof. The insulating tape has high dielectric constant, breakdown strength and volume resistivity, low dielectric loss, and good matching of high dielectric constant and high resistivity, and can effectively protect a circuit and guarantee the safety of the circuit.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an insulating tape comprising a substrate, a first dielectric layer and a second dielectric layer stacked in this order;
the first dielectric layer has a negative dielectric constant, the second dielectric layer has a positive dielectric constant, and the absolute value of the dielectric constant of the first dielectric layer is greater than the dielectric constant of the second dielectric layer.
According to the invention, the composite structure is formed by the two dielectric layers with positive and negative dielectric constants, so that the dielectric constant and the breakdown strength of the insulating tape are improved, and the dielectric loss of the insulating tape is reduced. When the absolute value of the dielectric constant of the first dielectric layer is larger than that of the second dielectric layer, the insulating tape with positive dielectric constant can be obtained after compounding; if the absolute value of the dielectric constant of the first dielectric layer is smaller than that of the second dielectric layer, the obtained adhesive tape has a negative dielectric constant, a conductive path can be formed under the conventional alternating current, and the function of a protective circuit is not achieved.
In a preferred embodiment of the present invention, the absolute value of the difference in dielectric constants between the first dielectric layer and the second dielectric layer is 35 to 60%.
In the present invention, the absolute values of the dielectric constants of the first dielectric layer and the second dielectric layer
Figure BDA0001518631020000021
Figure BDA0001518631020000022
Wherein epsilon1Is the dielectric constant of the first dielectric layer, ε2The dielectric constant of the second dielectric layer. The different materials have different dielectric properties, and in general, when the absolute values of the dielectric constants of the first dielectric layer and the second dielectric layer are different from each other by 35 to 60%, the obtained dielectric constant is different from each otherThe edge tape can simultaneously have higher dielectric constant and lower dielectric loss. When the difference between the two is too small, particularly when the difference is less than 20%, although the dielectric constant of the tape can be increased, the dielectric loss is also increased sharply; when the difference between the two is too large, especially when the difference is larger than 70%, the dielectric loss is also large, and the dielectric constant of the whole adhesive tape is small.
In the invention, the smaller the absolute value difference of the dielectric constants of the first dielectric layer and the second dielectric layer is, the larger the dielectric constant of the insulating tape is. The dielectric constants of the two dielectric layers are related to the composition and thickness thereof, but considering the practical application of the insulating tape, the thickness of the first dielectric layer in the present invention is preferably 0.2 to 0.8mm, and may be, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, or the like; the thickness of the second dielectric layer is preferably 0.2-0.6mm, and may be, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, or the like.
Preferably, the substrate is selected from paper, plastic film, cloth, metal foil or polymer composite.
As a preferred embodiment of the present invention, the first dielectric layer includes: rubber, conductive filler, a tackifier, a coupling agent and an optional antioxidant, wherein the conductive filler accounts for 2-8% of the mass of the first dielectric layer; for example, it may be 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, or the like.
When the content of the conductive filler is less than 2 wt%, the absolute value of the dielectric constant of the first dielectric layer is smaller, and the dielectric constant of the whole insulating tape is lower; when the content of the conductive filler is more than 8 wt%, the first dielectric layer may cause a large dielectric loss (> 0.5).
Preferably, the conductive filler is selected from one or a combination of at least two of carbon powder, graphene, acetylene black and polyaniline; typical but non-limiting examples of such combinations are: the carbon powder and the graphene, the acetylene black, the polyaniline, the graphene and the acetylene black, the graphene and the polyaniline, or the acetylene black and the polyaniline.
As a preferred technical scheme of the present invention, the first dielectric layer comprises the following components in parts by mass:
150-250 parts (e.g., 150 parts, 155 parts, 160 parts, 165 parts, 170 parts, 175 parts, 180 parts, 185 parts, 190 parts, 195 parts, 200 parts, 205 parts, 210 parts, 215 parts, 220 parts, 225 parts, 230 parts, 235 parts, 240 parts, 245 parts, 250 parts, etc.) of a rubber, 5-20 parts (e.g., 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, or 20 parts, etc.) of a conductive filler, 10-40 parts (e.g., 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, or 40 parts, etc.) of a tackifier, 10-20 parts (e.g., 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, or 40 parts, etc.), and 10-20 parts (e.g., 10-20 parts, 11 parts, 15 parts, 16 parts, 15 parts, 12 parts, 13 parts, 14 parts or 15 parts, etc.) of an antioxidant.
As a preferred embodiment of the present invention, the second dielectric layer includes: rubber, inorganic ceramic filler, a tackifier, a coupling agent and an optional antioxidant, wherein the inorganic ceramic filler accounts for 15-50% of the mass of the second dielectric layer; for example, it may be 15%, 18%, 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 42%, 45%, 48%, or 50%, etc.
Preferably, the inorganic ceramic filler is selected from one or a combination of at least two of barium titanate, strontium titanate, barium strontium titanate, lead zirconate titanate, silicon carbide, boron nitride, alumina, titanium dioxide, silica, zinc oxide or zinc sulfide; typical but non-limiting examples of such combinations are barium titanate and strontium titanate combinations, barium titanate and lead zirconate titanate combinations, barium titanate and silicon carbide combinations, barium titanate and boron nitride combinations, barium titanate and alumina combinations, barium titanate and silica combinations, barium titanate and zinc sulfide combinations, lead zirconate titanate and silicon carbide combinations, lead zirconate titanate and boron nitride combinations, lead zirconate titanate and titanium dioxide combinations, lead zirconate titanate and zinc oxide combinations, silicon carbide and boron nitride combinations, boron nitride and alumina combinations, alumina and titanium dioxide combinations, silica and zinc oxide combinations, and the like.
As a preferred technical scheme of the present invention, the second dielectric layer comprises the following components in parts by mass:
140 portions (e.g., 140 portions, 145 portions, 150 portions, 155 portions, 160 portions, 165 portions, 170 portions, 175 portions, 180 portions, 185 portions, 190 portions, 195 portions or 200 portions, etc.) of rubber, 65-120 portions (65 portions, 70 portions, 75 portions, 80 portions, 85 portions, 90 portions, 95 portions, 100 portions, 105 portions, 110 portions, 115 portions or 120 portions, etc.) of inorganic ceramic filler, 10-40 portions (e.g., 10 portions, 12 portions, 15 portions, 18 portions, 20 portions, 22 portions, 25 portions, 28 portions, 30 portions, 32 portions, 35 portions, 38 portions or 40 portions, etc.) of tackifier, 10-15 portions (e.g., 10 portions, 11 portions, 12 portions, 13 portions, 14 portions or 15 portions, etc.) of coupling agent, and 10-15 portions (e.g., 10 portions, 11 portions, 12 portions, 13 portions, 14 portions or 15 portions, etc.) of antioxidant.
As a preferred technical scheme of the invention, the rubber is selected from one or a combination of at least two of butyl rubber, styrene-butadiene rubber, nitrile rubber, butadiene rubber, chloroprene rubber, ethylene propylene rubber, fluorine rubber, epichlorohydrin rubber and polyurethane rubber; typical but non-limiting examples of such combinations are: a combination of butyl rubber and styrene-butadiene rubber, a combination of butyl rubber and cis-butyl rubber, a combination of butyl rubber and ethylene-propylene rubber, a combination of butyl rubber and fluororubber, a combination of butyl rubber and epichlorohydrin rubber, a combination of butyl rubber and urethane rubber, a combination of styrene-butadiene rubber and cis-butyl rubber, a combination of styrene-butadiene rubber and ethylene-propylene rubber, a combination of cis-butyl rubber and fluororubber, a combination of cis-butyl rubber and epichlorohydrin rubber, a combination of chloroprene rubber and ethylene-propylene rubber, a combination of epichlorohydrin rubber and urethane rubber, and the like.
For example, the butyl rubber in the invention can be 1045, 1240, 2030, 301# of langson, germany, IIR1751F, IIR0745 of yanshan petrochemical, and the like;
the styrene-butadiene rubber can be selected from Zelld petrochemical SBR1502 and SBR1712, Lanzhou petrochemical SBR1502E, SBR1500E, SBR1712 and the like;
the nitrile rubber can be selected from 1031, 1041, 1051M50, 1032, 1052M43, 1052M30, etc. of south emperor of Taiwan;
the butadiene rubber can be selected from Yanshan petrochemical BR9000, high bridge petrochemical BR35R, BRA50RE, BR35AE, BRA55AE, etc.;
the chloroprene rubber can be selected from CR100, CR110, CR116, CR126, CR210, CR215 and the like of Langshan Germany;
the ethylene-propylene rubber can be selected from EPM 2007, EPM 3005, EPM 4003, EPM 5005, EPM 5006 and the like of Dow;
the fluororubber can be selected from Jinmen petrochemical FPM 2301, FPM 2302, FPM 2601, FPM 2461, etc.;
the epichlorohydrin rubber may be selected from C03600, ECO 2405, ECO 2408, PECO 1206, etc. of the Japanese Ralstonia;
the polyurethane rubber can be selected from AU 1110, AU 1102, AU 2100, AU 2110, AU2200, AU 2210, AU 2300, AU 2310, AU 2400, AU 2410, AU 2500, AU 2510, AU 2600, etc. of Pasteur Germany.
Preferably, the tackifier is selected from one or a combination of at least two of rosin resin, petroleum resin or alkyl phenolic resin; typical but non-limiting examples of such combinations are: a combination of a rosin resin and a petroleum resin, a combination of a rosin resin and an alkylphenol resin, a combination of a petroleum resin and an alkylphenol resin, and the like.
The invention is not particularly limited in the kinds of rosin resin and petroleum resin, and illustratively, the rosin resin may be selected from hydrogenated rosin resin, disproportionated rosin resin, polymerized rosin resin, maleated rosin resin, hydrowhite rosin resin, or the like; the petroleum resin can be selected from aliphatic petroleum resin (C5), alicyclic petroleum resin (DCPD), aromatic petroleum resin (C9), aliphatic/aromatic copolymerized petroleum resin (C5/C9), hydrogenated petroleum resin, etc.
Preferably, the coupling agent is selected from one or a combination of at least two of organic chromium complex coupling agents, silane coupling agents, titanate coupling agents or aluminate compound coupling agents; typical but non-limiting examples of such combinations are: combinations of organochromium complex coupling agents and silane coupling agents, combinations of organochromium complex coupling agents and titanate coupling agents, combinations of organochromium complex coupling agents and aluminate coupling agents, combinations of silane coupling agents and titanate coupling agents, combinations of silane coupling agents and aluminate coupling agents, combinations of titanate coupling agents and aluminate coupling agents, and the like.
Illustratively, the silane coupling agent of the present invention may be selected from gamma-chloropropyltrichlorosilane, gamma-chloropropyltrimethoxysilane, gamma-chloropropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, beta- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane, gamma-mercaptopropyltrimethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, gamma-ureidopropyltriethoxysilane, gamma- (3, 2-epoxypropoxy) methyltrimethoxysilane, gamma-mercaptopropyltriethoxysilane, gamma- (ethylenediamine) propyltrimethoxysilane, gamma-chloropropyltrimethoxysilane, gamma, Gamma-aminopropyltriethoxysilane, bis- [3- (triethoxy) silylpropyl ] tetrasulfide, diethylenetriaminopropyltrimethoxysilane, gamma-ethylenediamine-triethoxysilane, gamma- (ethylenediamine) -methyltriethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane, bis- (3-triethoxysilylpropyl) tetrasulfide, aniline methyltriethoxysilane, aniline methyltrimethoxysilane, cyclohexyl methyldimethoxysilane, and the like.
The titanate coupling agent of the invention can be selected from isopropyl tri (dioctyl pyrophosphato acyloxy) titanate, isopropyl dioleoyloxy (dioctyl phosphato acyloxy) titanate, monoalkoxy unsaturated fatty acid titanate, bis (dioctyl oxygen pyrophosphate) ethylene titanate, tetraisopropyl bis (dioctyl phosphite acyloxy) titanate and the like.
Preferably, the antioxidant is selected from one or a combination of at least two of amine antioxidant, phenolic antioxidant or phosphite antioxidant; typical but non-limiting examples of such combinations are: combinations of amine antioxidants and phenolic antioxidants, combinations of amine antioxidants and phosphite antioxidants, combinations of phenolic antioxidants and phosphite antioxidants, and the like.
Illustratively, the amine antioxidant of the present invention may be selected from N, N '-di-sec-butyl-p-phenylenediamine, N' -bis (1, 4-dimethylpentyl) -p-phenylenediamine, N-phenyl-N '-isopropyl-p-phenylenediamine, N-phenyl-N' -alkyl-p-phenylenediamine, dioctyldiphenylamine, butyloctyldiphenylamine, dinonyldiphenylamine, dialkyldiphenylamine, alkylated N-phenyl- α -naphthylamine, sulfurized diphenylamine, and the like.
The phenolic antioxidant can be selected from 2, 6-di-tert-butyl-4-methylphenol, 2, 6-di-tert-butyl-p-cresol, 2, 6-tert-butyl-4-methylphenol, bis (3, 5-tert-butyl-4-hydroxyphenyl) thioether and pentaerythritol tetrakis [ beta- (3, 5-tert-butyl-4-hydroxyphenyl) propionate ].
The phosphite antioxidant can be selected from trioctyl phosphite, tridecyl phosphite, tridodecyl phosphite, and trihexadecyl phosphite.
The antioxidant in the invention can also be selected from other antioxidants such as thiodipropionate diester, didodecanol ester, dimyristyl ester, dioctadecyl ester and the like.
On the other hand, the invention provides a preparation method of the insulating tape, which comprises the following steps:
(1) melting and mixing the components of the first dielectric layer to form a first mixed rubber;
(2) extruding the first rubber compound through a screw extruder, performing calendaring molding on a base material, and performing semi-curing treatment to form a first dielectric layer;
(3) melting and mixing the components of the second dielectric layer to form a second mixed rubber;
(4) and extruding the second rubber compound through a screw extruder, and performing calendaring molding on the first dielectric layer to obtain the insulating adhesive tape.
As a preferred technical scheme of the invention, the melting and mixing in the step (1) and the step (3) are carried out in an internal mixer;
preferably, the temperature of the melt-kneading in the step (1) is 120-; the time is 45-60min, such as 45min, 46min, 47min, 48min, 49min, 50min, 51min, 52min, 53min, 54min, 55min, 56min, 57min, 58min, 59min or 60 min.
Preferably, the temperature of the extrusion in step (2) is 90-110 ℃; for example, the temperature may be 90 ℃, 91 ℃, 92 ℃, 93 ℃, 94 ℃, 95 ℃, 96 ℃, 97 ℃, 98 ℃, 99 ℃, 100 ℃, 101 ℃, 102 ℃, 103 ℃, 104 ℃, 105 ℃, 106 ℃, 107 ℃, 108 ℃, 109 ℃ or 110 ℃.
Preferably, the temperature of the semi-curing treatment in the step (2) is 50 to 80 ℃, for example, 50 ℃, 52 ℃, 55 ℃, 58 ℃, 60 ℃, 62 ℃, 65 ℃, 68 ℃, 70 ℃, 72 ℃, 75 ℃, 78 ℃ or 80 ℃ and the like can be achieved; the time is 1 to 2 hours, and may be, for example, 1 hour, 1.2 hours, 1.3 hours, 1.5 hours, 1.6 hours, 1.8 hours, 2 hours, or the like.
Preferably, the temperature of the melt-kneading in the step (3) is 110-; the time is 45-60min, such as 45min, 46min, 47min, 48min, 49min, 50min, 51min, 52min, 53min, 54min, 55min, 56min, 57min, 58min, 59min or 60 min.
Preferably, the temperature of the extrusion in step (4) is 90-110 ℃; for example, the temperature may be 90 ℃, 91 ℃, 92 ℃, 93 ℃, 94 ℃, 95 ℃, 96 ℃, 97 ℃, 98 ℃, 99 ℃, 100 ℃, 101 ℃, 102 ℃, 103 ℃, 104 ℃, 105 ℃, 106 ℃, 107 ℃, 108 ℃, 109 ℃ or 110 ℃.
As a preferred technical scheme of the invention, the preparation method comprises the following steps:
(1) adding the components of the first dielectric layer into an internal mixer, and melting and mixing for 45-60min at the temperature of 120-150 ℃ to form first rubber compound;
(2) adding the first rubber compound into a screw extruder, extruding at 90-110 ℃, then performing calendaring molding on a base material, and finally performing semi-curing treatment at 50-80 ℃ for 1-2 hours to form a first dielectric layer;
(3) adding the components of the second dielectric layer into an internal mixer, and melting and mixing for 45-60min at the temperature of 110-;
(4) and adding the second rubber compound into a screw extruder, extruding at 90-110 ℃, and then performing calendaring molding on the first dielectric layer to obtain the insulating tape.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the composite structure is formed by the two layers of dielectric layers with positive and negative dielectric constants, so that the dielectric constant and the breakdown strength of the insulating tape are improved, and the dielectric loss is reduced. The dielectric constant is 20-60, the dielectric loss is less than or equal to 0.1, the breakdown strength is 10-20kV/cm, and the volume resistivity is 1012-1016Omega cm, excellent comprehensive performance, and is especially suitable for protection of high-voltage AC circuit.
Drawings
Fig. 1 is a schematic cross-sectional view of an insulating tape according to an embodiment of the present invention;
wherein 11 is a substrate, 12 is a first dielectric layer, and 13 is a second dielectric layer.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It should be understood by those skilled in the art that the specific embodiments are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein, the substrate 11 is kraft paper;
the first dielectric layer 12 is composed of the following components in parts by mass: 200 parts of styrene butadiene rubber SBR1502, 18 parts of carbon powder, 15 parts of hydrogenated rosin resin, 15 parts of gamma-chloropropyltrimethoxysilane and 15 parts of butyloctyldiphenylamine, wherein the thickness of the styrene butadiene rubber SBR is 0.3 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 140 parts of butyl rubber IIR1751, 90 parts of barium titanate, 15 parts of hydrogenated rosin resin, 15 parts of vinyltrimethoxysilane and 15 parts of dioctyldiphenylamine, wherein the thickness of the butyl rubber is 0.5 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 45min at 130 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 90 ℃, then performing calendaring molding on the substrate 11, and finally performing semi-curing treatment at 80 ℃ for 1h to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 45min at 130 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 90 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Example 2
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein, the substrate 11 is a PE (polyethylene) film;
the first dielectric layer 12 is composed of the following components in parts by mass: 200 parts of butyl rubber IIR1751, 16 parts of acetylene black, 15 parts of aromatic petroleum resin (C9), 15 parts of gamma-mercaptopropyltriethoxysilane and 15 parts of alkylated N-phenyl-alpha-naphthylamine, wherein the thickness of the alkylated N-phenyl-alpha-naphthylamine is 0.3 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 140 parts of styrene butadiene rubber, 90 parts of barium strontium titanate, 15 parts of aromatic petroleum resin (C9), 12 parts of gamma-mercaptopropyltriethoxysilane and 15 parts of alkylated N-phenyl-alpha-naphthylamine, wherein the thickness of the styrene butadiene rubber is 0.5 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 60min at 130 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 100 ℃, then calendering and molding on a substrate 11, and finally performing semi-curing treatment at 80 ℃ for 1h to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 45min at 130 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 90 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Example 3
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein, the substrate 11 is a PVC (polyvinyl chloride) film;
the first dielectric layer 12 is composed of the following components in parts by mass: 200 parts of nitrile rubber 1051M50, 14 parts of polyaniline, 15 parts of disproportionated rosin resin, 15 parts of phenylaminomethyl trimethoxy silane and 15 parts of 2, 6-di-tert-butyl-4-methylphenol, wherein the thickness of the product is 0.2 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 140 parts of butadiene rubber BR9000, 90 parts of lead zirconate titanate, 15 parts of disproportionated rosin resin, 15 parts of phenylaminomethyl trimethoxy silane and 15 parts of 2, 6-di-tert-butyl-4-methylphenol, wherein the thickness of the butadiene rubber BR9000 is 0.4 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 50min at 130 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 110 ℃, then performing calendaring molding on the substrate 11, and finally performing semi-curing treatment at 80 ℃ for 1.5h to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 60min at 110 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 90 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Example 4
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein, the substrate 11 is an aluminum foil;
the first dielectric layer 12 is composed of the following components in parts by mass: 180 parts of chloroprene rubber CR100, 14 parts of graphene, 40 parts of alkyl phenolic resin, 10 parts of isopropyl tri (dioctyl pyrophosphato acyloxy) titanate and 15 parts of N, N' -di-sec-butyl p-phenylenediamine, wherein the thickness of the chloroprene rubber CR is 0.3 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 180 parts of ethylene propylene rubber EPM 2007, 90 parts of silicon carbide, 10 parts of water white rosin resin, 15 parts of bis (dioctyloxy pyrophosphate) ethylene titanate and 15 parts of N, N' -di-sec-butyl p-phenylenediamine, wherein the thickness of the ethylene propylene rubber EPM is 0.6 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 45min at 150 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 95 ℃, then performing calendaring molding on the substrate 11, and finally performing semi-curing treatment at 50 ℃ for 2 hours to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 55min at 120 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 105 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Example 5
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein the base material 11 is;
the first dielectric layer 12 is composed of the following components in parts by mass: 200 parts of fluororubber, 20 parts of carbon powder, 10 parts of hydrogenated rosin resin, 10 parts of gamma-glycidyl ether propyl trimethoxy silane and 10 parts of 2, 6-di-tert-butyl-p-cresol, wherein the thickness of the fluororubber is 0.3 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 140 parts of epichlorohydrin rubber ECO 2405, 75 parts of alumina, 30 parts of an aliphatic petroleum resin (C5), 15 parts of isopropyldioleacyloxy (dioctylphosphatoxy) titanate and 14 parts of 2, 6-di-tert-butyl-p-cresol, the thickness of which is 0.6 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 60min at 140 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 110 ℃, then performing calendaring molding on the substrate 11, and finally performing semi-curing treatment at 70 ℃ for 1.5h to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 45min at 130 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 100 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Example 6
An insulating tape comprises a substrate 11, a first dielectric layer 12 and a second dielectric layer 13 which are sequentially laminated;
wherein the base material 11 is;
the first dielectric layer 12 is composed of the following components in parts by mass: 220 parts of polyurethane rubber AU 1110, 10 parts of acetylene black, 30 parts of alkyl phenolic resin, 20 parts of gamma- (ethylenediamine) propyl trimethoxy silane and 10 parts of tetra [ beta- (3, 5-tertiary butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester, wherein the thickness of the product is 0.2 mm;
the second dielectric layer 13 is composed of the following components in parts by mass: 150 parts of nitrile rubber 1052M43, 110 parts of silicon dioxide, 10 parts of alkyl phenolic resin, 10 parts of gamma- (ethylenediamine) propyl trimethoxy silane and 10 parts of tetra [ beta- (3, 5-tertiary butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester, wherein the thickness of the product is 0.5 mm.
The preparation method of the insulating tape comprises the following steps:
(1) adding the components of the first dielectric layer 12 into an internal mixer, and melting and mixing for 60min at 120 ℃ to form a first mixed rubber;
(2) adding the first rubber compound into a screw extruder, extruding at 100 ℃, then calendaring and forming on a substrate 11, and finally performing semi-curing treatment at 60 ℃ for 2 hours to form a first dielectric layer 12;
(3) adding the components of the second dielectric layer 13 into an internal mixer, and melting and mixing for 60min at 110 ℃ to form a second rubber compound;
(4) and adding the second rubber compound into a screw extruder, extruding at 90 ℃, and then performing calendaring molding on the first dielectric layer 12 to obtain the insulating tape.
Comparative example 1
The difference from example 1 is that the insulating tape does not contain the first dielectric layer, but only contains a substrate and a second dielectric layer disposed on the substrate.
Comparative example 2
The difference from the embodiment 1 is that the mass part of the conductive filler carbon powder in the first dielectric layer is 4 parts (1.61 wt%), and other raw materials, use amounts and preparation methods are the same as those of the embodiment 1.
Comparative example 3
The difference from the embodiment 1 is that the conductive filler carbon powder in the first dielectric layer is 22 parts by weight (8.24 wt%), and other raw materials, use amounts and preparation methods are the same as those of the embodiment 1.
Comparative example 4
The difference from example 1 is that the second dielectric layer is composed of the following components in parts by mass:
140 parts of butyl rubber IIR1751, 16 parts of barium titanate, 15 parts of hydrogenated rosin resin, 15 parts of vinyltrimethoxysilane and 15 parts of dioctyldiphenylamine;
other raw materials, amounts and preparation methods were the same as those of example 1.
Comparative example 5
The difference from example 1 is that the second dielectric layer is composed of the following components in parts by mass:
140 parts of butyl rubber IIR1751, 120 parts of barium titanate, 15 parts of hydrogenated rosin resin, 15 parts of vinyltrimethoxysilane and 15 parts of dioctyldiphenylamine;
other raw materials, amounts and preparation methods were the same as those of example 1.
The performance of the insulating tapes provided in examples 1 to 6 and comparative examples 1 to 5 above was tested, the frequency of the test alternating current was selected to be 10KHz, and the test results are shown in table 1 below:
TABLE 1
Figure BDA0001518631020000161
As can be seen from the data in Table 1, the dielectric constant and the breakdown strength of the insulating tape are improved and the dielectric loss is reduced by matching the two dielectric layers with positive and negative dielectric constants and adjusting the composition and the thickness of the two dielectric layers. When the insulating tape does not contain the first dielectric layer, the dielectric constant of the insulating tape is greatly reduced, and the dielectric loss is increased; when the content of the conductive filler in the first dielectric layer is too low, the absolute value of the dielectric constant of the first dielectric layer is smaller than that of the second dielectric layer, and the obtained adhesive tape has a negative dielectric constant and does not have the function of a protective circuit; when the content of the conductive filler in the first dielectric layer is too large, the dielectric loss of the insulating tape is large. When the absolute value of the dielectric constant of the first dielectric layer is too large or too small, the dielectric loss of the obtained tape is too high.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.

Claims (17)

1. An insulating tape is characterized by comprising a base material, a first dielectric layer and a second dielectric layer which are sequentially laminated;
the first dielectric layer has a negative dielectric constant, the second dielectric layer has a positive dielectric constant, and the absolute value of the dielectric constant of the first dielectric layer is greater than the dielectric constant of the second dielectric layer;
the absolute value of the dielectric constants of the first dielectric layer and the second dielectric layer is different from 35% to 60%;
the above-mentioned
Figure FDA0002887627120000011
Wherein epsilon1Is the dielectric constant of the first dielectric layer, ε2Is the dielectric constant of the second dielectric layer;
the thickness of the first dielectric layer is 0.2-0.8mm, and the thickness of the second dielectric layer is 0.2-0.6 mm;
the first dielectric layer includes: rubber, conductive filler, a tackifier, a coupling agent and an optional antioxidant, wherein the conductive filler accounts for 2-8% of the mass of the first dielectric layer; the conductive filler is selected from one or a combination of at least two of carbon powder, graphene, acetylene black and polyaniline;
the second dielectric layer includes: the rubber, inorganic ceramic filler, tackifier, coupling agent and antioxidant, wherein the inorganic ceramic filler is selected from one or a combination of at least two of barium titanate, strontium titanate, barium strontium titanate, lead zirconate titanate, silicon carbide, boron nitride, alumina, titanium dioxide, silicon dioxide, zinc oxide or zinc sulfide.
2. The insulating adhesive tape of claim 1 wherein the substrate is selected from the group consisting of paper, plastic film, cloth, metal foil, and polymer composite.
3. The insulating adhesive tape according to claim 1, wherein the first dielectric layer comprises the following components in parts by mass:
150-250 parts of rubber, 5-20 parts of conductive filler, 10-40 parts of tackifier, 10-20 parts of coupling agent and 10-15 parts of antioxidant.
4. The insulating adhesive tape according to claim 1, wherein the inorganic ceramic filler accounts for 15 to 50% by mass of the second dielectric layer.
5. The insulating adhesive tape according to claim 1, wherein the second dielectric layer comprises the following components in parts by mass:
140-200 parts of rubber, 65-120 parts of inorganic ceramic filler, 10-40 parts of tackifier, 10-15 parts of coupling agent and 10-15 parts of antioxidant.
6. The insulating adhesive tape according to claim 1, wherein the rubber is selected from one or a combination of at least two of butyl rubber, styrene-butadiene rubber, nitrile rubber, butadiene rubber, chloroprene rubber, ethylene-propylene rubber, fluorine rubber, epichlorohydrin rubber and urethane rubber.
7. The insulating adhesive tape according to claim 1, wherein the tackifier is selected from one or a combination of at least two of rosin resin, petroleum resin, or alkyl phenol resin.
8. The insulating adhesive tape according to claim 1, wherein the coupling agent is one or a combination of at least two selected from the group consisting of an organic chromium complex-based coupling agent, a silane-based coupling agent, a titanate-based coupling agent, and an aluminate compound-based coupling agent.
9. The insulating adhesive tape according to claim 1, wherein the antioxidant is selected from one or a combination of at least two of amine antioxidants, phenolic antioxidants and phosphite antioxidants.
10. The method of manufacturing an insulating adhesive tape according to any one of claims 1 to 9, characterized in that it comprises the steps of:
(1) melting and mixing the components of the first dielectric layer to form a first mixed rubber;
(2) extruding the first rubber compound through a screw extruder, performing calendaring molding on a base material, and performing semi-curing treatment to form a first dielectric layer;
(3) melting and mixing the components of the second dielectric layer to form a second mixed rubber;
(4) and extruding the second rubber compound through a screw extruder, and performing calendaring molding on the first dielectric layer to obtain the insulating adhesive tape.
11. The method according to claim 10, wherein the melt-kneading in step (1) and step (3) is carried out in an internal mixer.
12. The method as claimed in claim 10, wherein the temperature of the melt-kneading in the step (1) is 120-150 ℃ and the time is 45-60 min.
13. The method of claim 10, wherein the temperature of the extrusion in step (2) is 90-110 ℃.
14. The method according to claim 10, wherein the temperature of the semi-curing treatment in the step (2) is 50 to 80 ℃ and the time is 1 to 2 hours.
15. The method as claimed in claim 10, wherein the temperature of the melt-kneading in the step (3) is 110-130 ℃ and the time is 45-60 min.
16. The method of claim 10, wherein the temperature of the extrusion in the step (4) is 90 to 110 ℃.
17. The method of claim 10, comprising the steps of:
(1) adding the components of the first dielectric layer into an internal mixer, and melting and mixing for 45-60min at the temperature of 120-150 ℃ to form first rubber compound;
(2) adding the first rubber compound into a screw extruder, extruding at 90-110 ℃, then performing calendaring molding on a base material, and finally performing semi-curing treatment at 50-80 ℃ for 1-2 hours to form a first dielectric layer;
(3) adding the components of the second dielectric layer into an internal mixer, and melting and mixing for 45-60min at the temperature of 110-;
(4) and adding the second rubber compound into a screw extruder, extruding at 90-110 ℃, and then performing calendaring molding on the first dielectric layer to obtain the insulating tape.
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CN107418476A (en) * 2017-08-01 2017-12-01 深圳市宏商材料科技股份有限公司 A kind of stress evacuating glue and preparation method thereof

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