CN108098628B - Clamping device for die bonding of sensor chip - Google Patents
Clamping device for die bonding of sensor chip Download PDFInfo
- Publication number
- CN108098628B CN108098628B CN201711352846.1A CN201711352846A CN108098628B CN 108098628 B CN108098628 B CN 108098628B CN 201711352846 A CN201711352846 A CN 201711352846A CN 108098628 B CN108098628 B CN 108098628B
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- Prior art keywords
- groove
- limiting plate
- placing
- sensor chip
- pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Abstract
The invention relates to the field of sensor production equipment, in particular to a clamping device for die bonding of a sensor chip, which comprises a placing bottom plate, wherein a limiting plate is arranged on the placing bottom plate, a material returning through groove is arranged on the placing bottom plate, a placing groove is arranged on the limiting plate, and the diameter of the placing groove is larger than that of the material returning through groove; the material returning through groove penetrates through the placing bottom plate. The invention provides a fixing device for the die bond pad of the sensor chip, which facilitates the taking and the use of the sensor chip on the die bond pad, and meanwhile, the arrangement of the shape and the size of the placing groove also plays a certain limiting role in the whole die bond pad, so that the chip selection is more convenient.
Description
Technical Field
The invention relates to the field of sensor production equipment, in particular to a clamping device for die bonding of a sensor chip,
background
The traditional chip is arranged on a die bonding pad after being finished and is a whole, when a chip is required to be taken, a certain chip needs to be taken down from the die bonding pad, and in order to take the chip conveniently, a clamping device capable of fixing the pad is required at present.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a clamping device for clamping a chip die bonding pad.
In order to achieve the purpose, the invention adopts the technical scheme that:
a clamping device for die bonding of a sensor chip comprises a placing bottom plate, wherein a limiting plate is arranged on the placing bottom plate, a material returning through groove is formed in the placing bottom plate, a placing groove is formed in the limiting plate, and the diameter of the placing groove is larger than that of the material returning through groove; the material returning through groove penetrates through the placing bottom plate.
And at least two clamping assemblies for pressing the chip are arranged on the limiting plate.
The clamping assembly comprises a pressing block, a pressing groove is formed in the pressing block, and the end part of the pressing groove is attached to the upper end face of the limiting plate; be equipped with straining spring in compressing tightly the inslot, straining spring one end is connected with the limiting plate, and the other end is connected with compressing tightly inslot wall.
And the placing bottom plate is provided with positioning holes matched with the positioning pins on the die bonding gasket, and the positioning holes are distributed on the inner side of the placing groove.
And the limiting plate is provided with a guide post matched with the pressing groove.
The guide post cross-section is the rectangle, compress tightly the groove cross-section and also be the rectangle.
The outer diameter of the limiting plate is larger than that of the placing bottom plate.
The limiting plate is provided with a communicating groove, and the side surface of the placing groove is communicated with the outer side of the limiting plate through the communicating groove.
The number of the clamping devices is not less than that of the positioning holes.
The invention has the advantages that:
the invention provides a fixing device for the die bond pad of the sensor chip, which facilitates the taking and the use of the sensor chip on the die bond pad, and meanwhile, the arrangement of the shape and the size of the placing groove also plays a certain limiting role in the whole die bond pad, so that the chip selection is more convenient.
Drawings
The contents of the expressions in the various figures of the present specification and the labels in the figures are briefly described as follows:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
Figure 3 is a top view of the hold down assembly of the present invention.
The labels in the above figures are:
1. the device comprises a placing bottom plate, 2, a limiting plate, 3, a material returning through groove, 4, a positioning hole, 5, a clamping assembly, 51, a pressing block, 52, a pressing groove, 53, a tensioning spring, 54, a guide column, 6, a placing groove and 7, and a communicating groove.
Detailed Description
The following description of preferred embodiments of the invention will be made in further detail with reference to the accompanying drawings.
A clamping device for die bonding of a sensor chip comprises a placing bottom plate 1, a limiting plate 2 is arranged on the placing bottom plate 1, a material returning through groove 3 is formed in the placing bottom plate 1, a placing groove 6 is formed in the limiting plate 2, and the diameter of the placing groove 6 is larger than that of the material returning through groove 3; the material returning through groove 3 penetrates through the placing bottom plate 1; firstly, the placing bottom plate 1 and the limiting plate 2 are arranged in a superposed mode, a place is provided for the arrangement of a later-stage clamping device, meanwhile, the placing groove 6 is arranged on the limiting plate 2, the placing groove 6 is arranged to provide a place for placing a sensor chip, and the arrangement of the material returning through groove 3 provides a material returning port for the material returning of the sensor chip, so that the material returning operation of the device is facilitated, and meanwhile, as a greater preference, a clamping assembly 5 matched with the placing bottom plate 1 and used for pressing the sensor chip is arranged on the limiting plate 2, the clamping assembly 5 comprises a pressing block 51, a pressing groove 52 is arranged on the pressing block 51, and the end part of the pressing groove 52 is attached to the upper end face of the limiting plate 2; a tension spring 53 is arranged in the pressing groove 52, one end of the tension spring is connected with the limiting plate 2, and the other end of the tension spring is connected with the inner wall of the pressing groove 52; the pressing block 51 is made of flexible material; under the action of a tension spring 53, the pressing block 51 extrudes the limiting plate 2, preferably, in order to better realize the pressing and fixing of the chip, the pressing block 51 comprises a vertical block, a transverse block is arranged on the vertical block, the lower end face of the transverse block is flush with the upper end face of the limiting plate 2, the vertical block is perpendicular to the transverse block, the distance from the lower end face of the vertical block to the placing bottom plate 1 is the same as the thickness of the sensor chip or is slightly smaller than the thickness of the sensor chip, and the purpose of the arrangement is to ensure that the clamping device presses and fixes the sensor chip; according to the invention, the sensor chip is fastened on the placing bottom plate 1 through the arrangement of the clamping component 5, so that the subsequent assembly of the sensor chip is facilitated.
Preferably, at least two clamping assemblies 5 for pressing the chip are arranged on the limiting plate 2, so that the stress of the sensor chip is more uniform, the number of the clamping assemblies 5 is preferably three, and the three clamping assemblies 5 are distributed in an equilateral triangle, so that the clamping force applied to the sensor chip is more uniform, and the probability of damage to the sensor chip is reduced, meanwhile, the number of the clamping assemblies 5 is three, and the cost increase caused by excessive arrangement of the clamping assemblies 5 is avoided while fixation is realized.
Preferably, the placing bottom plate 1 is provided with positioning holes 4 matched with the positioning pins on the die bonding gasket, the positioning holes 4 are distributed on the inner side of the placing groove 6, and when the die bonding gasket is clamped, the positioning pins on the die bonding gasket are matched with the positioning holes 4, so that the initial positioning of the fixed gasket is realized.
Preferably, the limiting plate 2 is provided with a guide post 54 matched with the pressing groove 52, the guide post 54 is arranged to play a role in guiding, the using effect of the pressing assembly is optimized, and meanwhile, as a greater preference, the section of the guide post 54 is rectangular, and the section of the pressing groove 52 is also rectangular; the section of the guide post 54 is square, the section of the pressing groove 52 is also square, and through the arrangement of the guide post 54 and the pressing groove 52, the pressing block 51 can be positioned due to the arrangement of the guide post 54, because the guide post 54 is square and has edges and corners, and meanwhile, the pressing groove 52 is square and also has edges and corners, so that a positioning effect is achieved, when the sensor chip taking device is used, one end of the pressing block 51 is positioned above the placing groove 6, and the other end of the pressing block 51 is positioned above the limiting plate 2, as shown in the position shown in fig. 1, after the sensor chip taking device is used, when the sensor chip needs to be taken out, the pressing block 51 rotates ninety degrees, so that the position of the pressing block 51 moves, namely, the pressing block 51 above the placing groove 6 is; certainly as bigger preferred, be equipped with the stopper at limiting plate 2 edge, the setting of stopper can avoid the compact heap 51 return to influence taking out of sensor chip to a certain extent.
Preferably, the outer diameter of the limiting plate 2 is larger than that of the placing bottom plate 1, the limiting plate 2 is larger than the placing bottom plate 1 due to the arrangement, the limiting plate 2 and the placing bottom plate 1 are provided with platforms, the platforms are limited, the device and a working platform on working equipment can be conveniently connected and installed, meanwhile, the platforms are limited, the platforms correspond to the fixing positions of the working equipment, and the device is better convenient to fix.
Preferably, the limiting plate 2 is provided with a communicating groove 7, the side surface of the placing groove 6 is communicated with the outer side of the limiting plate 2 through the communicating groove 7, and the communicating groove 7 provides a space for manually taking and placing the die bonding gasket.
Preferably, the number of the clamping devices is not less than 4 positioning holes; the clamping device is optimized and is favorable for fixation.
It is clear that the specific implementation of the invention is not restricted to the above-described embodiments, but that various insubstantial modifications of the inventive process concept and technical solutions are within the scope of protection of the invention.
Claims (3)
1. The clamping device for die bonding of the sensor chip is characterized by comprising a placing bottom plate, wherein a limiting plate is arranged on the placing bottom plate, a material returning through groove is formed in the placing bottom plate, a placing groove is formed in the limiting plate, and the diameter of the placing groove is larger than that of the material returning through groove; the material returning through groove penetrates through the placing bottom plate;
the side surface of the placing groove is communicated with the outer side of the limiting plate through the communicating groove;
the limiting plate is at least provided with two clamping assemblies for pressing the chip;
the clamping assembly comprises a pressing block, a pressing groove is formed in the pressing block, and the end part of the pressing groove is attached to the upper end face of the limiting plate; a tension spring is arranged in the pressing groove, one end of the tension spring is connected with the limiting plate, and the other end of the tension spring is connected with the inner wall of the pressing groove;
the limiting plate is provided with a guide post matched with the pressing groove; the section of the guide post is rectangular, and the section of the compaction groove is also rectangular;
the placing bottom plate is provided with positioning holes matched with the positioning pins on the die bonding gasket, and the positioning holes are distributed on the inner side of the placing groove;
when the die bonding gasket is used, the positioning hole is connected with the positioning pin on the die bonding gasket firstly, so that the primary positioning of the die bonding gasket is realized;
when in use, one end of the pressing block is positioned above the placing groove, and the other end is positioned above the limiting plate;
after the sensor chip is used, when the sensor chip needs to be taken out, the pressing block rotates ninety degrees, so that the position of the pressing block moves, and the pressing block is prevented from being arranged above the mounting groove to influence the taking-out of the sensor chip.
2. The clamping device for die bonding of a sensor chip as claimed in claim 1, wherein the outer diameter of the limiting plate is larger than that of the mounting base plate.
3. The clamping device for die bonding of a sensor chip as claimed in claim 1, wherein the number of the clamping device is not less than the number of the positioning holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352846.1A CN108098628B (en) | 2017-12-15 | 2017-12-15 | Clamping device for die bonding of sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352846.1A CN108098628B (en) | 2017-12-15 | 2017-12-15 | Clamping device for die bonding of sensor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108098628A CN108098628A (en) | 2018-06-01 |
| CN108098628B true CN108098628B (en) | 2020-10-27 |
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ID=62216381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711352846.1A Active CN108098628B (en) | 2017-12-15 | 2017-12-15 | Clamping device for die bonding of sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108098628B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050035514A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| CN202871767U (en) * | 2012-10-17 | 2013-04-10 | 志圣科技（广州）有限公司 | Wafer bearing assembly |
| CN105643706A (en) * | 2014-11-12 | 2016-06-08 | 西安志越机电科技有限公司 | Double-station quick-pressing device used for PCB perforating machine |
| CN205212075U (en) * | 2015-11-26 | 2016-05-04 | 上海与德通讯技术有限公司 | Card carrier |
| CN206024274U (en) * | 2016-08-30 | 2017-03-15 | 佛山市北川电子科技有限公司 | A kind of circuit board mounting and fixing support |
| CN206312121U (en) * | 2016-12-08 | 2017-07-07 | 杭州亘弘科技有限公司 | A kind of device for being easy to burning chip |
-
2017
- 2017-12-15 CN CN201711352846.1A patent/CN108098628B/en active Active
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| Publication number | Publication date |
|---|---|
| CN108098628A (en) | 2018-06-01 |
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